JP2014065614A - Method for thermally cutting brittle plate - Google Patents
Method for thermally cutting brittle plate Download PDFInfo
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本発明は、極薄ガラス板などの脆性板を熱割断する方法に関するものである。 The present invention relates to a method for thermally cleaving a brittle plate such as an ultrathin glass plate.
従来、脆性板をダイヤモンドカッターによる傷入れ加工で切断する方法においては、傷入れ加工後にブレイク工程を加工後の後処理として必要とするばかりではなく、ブレイク工程により切断縁にクラックが発生する。 Conventionally, in a method of cutting a brittle plate by scratching with a diamond cutter, not only is a break process required as a post-processing after the scratch processing, but cracks are generated at the cutting edge by the break process.
脆性板をダイヤモンド砥石により切断する方法においては、高精度な切り出しが可能であるが、切断面及び切断端面にマイクロクラックが無数に発生するために次工程で端面研削及び面取りを加工後の後処理として必要とし、また、ウエット加工であるために洗浄工程と乾燥工程を加工後の後処理として必要とし、最終製品単価を高騰させる。 In the method of cutting a brittle plate with a diamond grindstone, high-accuracy cutting is possible, but countless microcracks occur on the cut surface and cut end surface, so post-processing after end face grinding and chamfering in the next process Moreover, since it is a wet process, a washing process and a drying process are required as post-processing after processing, and the final product unit price is increased.
脆性板をレーザー光によるアブレーション加工で切断する方法においても、高精度な切り出しが可能であるが、切断面及び切断端面にマイクロクラックが無数に発生するために次工程にて端面研削及び面取りを加工後の後処理として必要とし、また、設備価格が高価になるばかりではなく、プラズマ化したデブリの処理のために洗浄工程と乾燥工程を加工後の後処理として必要とし、最終製品単価を高騰させる。 Even in the method of cutting a brittle plate by laser beam ablation, high-precision cutting is possible, but endless grinding and chamfering are processed in the next process because countless microcracks occur on the cut surface and cut end surface. Necessary as a post-treatment for the post-processing, and not only the equipment price becomes expensive, but also a cleaning process and a drying process are necessary for the post-processing post-treatment for the treatment of the plasma debris, so that the final product cost increases. .
そこで、例えば下記の特許文献１に示すように、脆性板に対しレーザー光により切断縁に沿う熱衝撃を与えて脆性板を熱割断する方法が開発されている。この熱割断方法においては、レーザー光により切断縁の両側に生じる熱応力（圧縮応力や引張応力）が不均一となって安定しないために切断縁の直進性に劣るとともに、設備価格が高価となって最終製品単価を高騰させる。 Thus, for example, as shown in Patent Document 1 below, a method has been developed in which a brittle plate is thermally cleaved by applying a thermal shock along the cutting edge to the brittle plate with a laser beam. In this thermal cleaving method, the thermal stress (compressive stress and tensile stress) generated on both sides of the cutting edge by the laser beam is not uniform and unstable, so that the straightness of the cutting edge is inferior and the equipment cost is expensive. To increase the final product unit price.
この発明は、レーザー光による熱割断方法に代わる新たな熱割断方法を提供して、脆性板における切断縁の直進性を向上させることを主目的としている。 The main object of the present invention is to provide a new thermal cleaving method that replaces the thermal cleaving method using laser light, and to improve the straightness of the cutting edge in the brittle plate.
後記実施形態の図面（図１）の符号を援用して本発明を説明する。
請求項１の発明にかかる脆性板の熱割断方法においては、加熱ブロック（７）に設けた加熱縁（８）を脆性板（５）の厚み方向（Ｚ）の両面のうち一方の面（５ａ）に当てがって、その一方の面（５ａ）側より低温の他方の面（５ｂ）側とその一方の面（５ａ）側との間の温度差により、一方の面（５ａ）側の膨張と他方の面（５ｂ）側の圧縮とにより生じる熱応力を原因として発生する曲げモーメントにより、脆性板（５）を加熱ブロック（７）の加熱縁（８）に沿って一方の面（５ａ）側から他方の面（５ｂ）側へ向けて熱割断する。
The present invention will be described with reference to the reference numerals of the drawings (FIG. 1) of the embodiment described later.
In the thermal cleaving method for a brittle plate according to the first aspect of the present invention, the heating edge (8) provided on the heating block (7) is attached to one surface (5a) of both surfaces in the thickness direction (Z) of the brittle plate (5). ), The temperature difference between the one surface (5a) side and the one surface (5a) side due to the temperature difference between the other surface (5b) side and the one surface (5a) side. The brittle plate (5) is moved along the heating edge (8) of the heating block (7) on one surface (5a) by a bending moment generated due to thermal stress caused by expansion and compression on the other surface (5b) side. ) The heat is cut from the side toward the other side (5b).
請求項１の発明では、ガラス板などの脆性板（５）の熱割断方法において、加熱縁（８）を有する加熱ブロック（７）を採用したので、形態を維持することができる加熱縁（８）から平均的に発生する熱により、切断縁の両側に生じる熱応力（圧縮応力や引張応力）が平均化して安定し、切断縁の直進性を高めることができる。 In the invention of claim 1, since the heating block (7) having the heating edge (8) is adopted in the thermal cleaving method of the brittle plate (5) such as a glass plate, the heating edge (8) capable of maintaining the form. ), The thermal stress (compressive stress and tensile stress) generated on both sides of the cutting edge is averaged and stabilized, and the straightness of the cutting edge can be improved.
請求項１の発明を前提とする請求項２の発明においては、前記脆性板（５）の厚み方向（Ｚ）の両面のうち一方の面（５ａ）に予備亀裂（６）を形成し、その予備亀裂（６）に加熱ブロック（７）の加熱縁（８）を当てがう。請求項２の発明では、予備亀裂（６）により脆性板（５）の熱割断を促進させることができる。 In the invention of claim 2 premised on the invention of claim 1, a preliminary crack (6) is formed on one face (5a) of both faces in the thickness direction (Z) of the brittle plate (5), Apply the heating edge (8) of the heating block (7) to the preliminary crack (6). In the invention of claim 2, the thermal cracking of the brittle plate (5) can be promoted by the preliminary crack (6).
請求項１または請求項２の発明を前提とする請求項３の発明においては、前記加熱ブロック（７）に超音波振動を付加する。請求項３の発明では、加熱ブロック（７）に伝達される超音波振動により、振動荷重負荷による高歪み速度のせん断変形で平滑な割断面を得ることができる。 In the invention of claim 3 based on the invention of claim 1 or claim 2, ultrasonic vibration is added to the heating block (7). In the invention of claim 3, a smooth split section can be obtained by shear deformation at a high strain rate due to a vibration load by the ultrasonic vibration transmitted to the heating block (7).
請求項１〜３のうちいずれか一つの請求項の発明を前提とする請求項４の発明においては、前記脆性板（５）の厚み方向（Ｚ）の両面のうち一方の面（５ａ）に加熱ブロック（７）の加熱縁（８）を当てがうばかりではなく、他方の面（５ｂ）を冷却ブロック（３）により冷却して、一方の面（５ａ）側と他方の面（５ｂ）側との間に温度差を持たせる。請求項４の発明では、冷却ブロック（３）が脆性板（５）における他方の面（５ｂ）の冷却を助長して、脆性板（５）における一方の面（５ａ）側と他方の面（５ｂ）側との間の温度差を大きくすることができる。 In the invention of claim 4 premised on the invention of any one of claims 1 to 3, on one surface (5a) of both surfaces in the thickness direction (Z) of the brittle plate (5). In addition to applying the heating edge (8) of the heating block (7), the other surface (5b) is cooled by the cooling block (3), and the one surface (5a) side and the other surface (5b) Create a temperature difference between the two sides. In the invention of claim 4, the cooling block (3) facilitates cooling of the other surface (5b) of the brittle plate (5), and the one surface (5a) side and the other surface ( 5b) The temperature difference from the side can be increased.
請求項１〜４のうちいずれか一つの請求項の発明を前提とする請求項５の発明にかかる加熱ブロック（７）において、加熱縁（８）は線条に延設され、加熱縁（８）を挟む両側には加熱縁（８）を脆性板（５）に当てがった際に脆性板（５）との間に隙間（Ｓ）を生じさせる輻射面（９）を形成している。請求項５の発明では、輻射面（９）が隙間（Ｓ）を介して脆性板（５）における一方の面（５ａ）側の温度上昇を助長して、脆性板（５）における一方の面（５ａ）側と他方の面（５ｂ）側との間の温度差を大きくすることができる。 In the heating block (7) according to the invention of claim 5 based on the invention of any one of claims 1 to 4, the heating edge (8) is extended to the filament, and the heating edge (8 ) Are formed on both sides sandwiching the heating edge (8) to cause a gap (S) between the heating edge (8) and the brittle plate (5). . In the invention of claim 5, the radiation surface (9) promotes the temperature rise on the one surface (5a) side of the brittle plate (5) through the gap (S), so that one surface of the brittle plate (5). The temperature difference between the (5a) side and the other surface (5b) side can be increased.
請求項１〜５のうちいずれか一つの請求項の発明を前提とする請求項６の発明においては、前記脆性板（５）の厚み方向（Ｚ）の両面のうち他方の面（５ｂ）を粘着面（４）上に載せて脆性板（５）を固定した状態で一方の面（５ａ）に加熱ブロック（７）の加熱縁（８）を当てがう。請求項６の発明では、粘着面（４）を利用して脆性板（５）を容易に固定することができる。 In the invention of claim 6 premised on the invention of any one of claims 1 to 5, the other face (5b) of both faces in the thickness direction (Z) of the brittle plate (5) is provided. With the brittle plate (5) fixed on the adhesive surface (4), the heating edge (8) of the heating block (7) is applied to one surface (5a). In the invention of claim 6, the brittle plate (5) can be easily fixed using the adhesive surface (4).
本発明は、脆性板（５）の熱割断において、脆性板（５）における切断縁の直進性をレーザー光による熱割断方法と比較して向上させることができる。 The present invention can improve the straightness of the cutting edge in the brittle plate (5) in the thermal cleaving of the brittle plate (5) as compared with the thermal cleaving method using laser light.
以下、本実施形態にかかる脆性板の熱割断方法について図１を参照して説明する。
加工ステージ１上には直線状に延びる溝２が形成されている。溝２には直線状に延びる冷却ブロック３が嵌め込まれている。加工ステージ１上には溝２を挟む両側で粘着シート４（粘着面）が貼られている。冷却ブロック３の上面と粘着シート４の上面とは面一状態で互いに隣接している。冷却ブロック３には冷却装置（図示せず）が接続されている。
Hereinafter, a thermal cleaving method for a brittle plate according to the present embodiment will be described with reference to FIG.
A groove 2 that extends linearly is formed on the processing stage 1. A cooling block 3 that extends linearly is fitted in the groove 2. On the processing stage 1, adhesive sheets 4 (adhesive surfaces) are pasted on both sides of the groove 2. The upper surface of the cooling block 3 and the upper surface of the adhesive sheet 4 are adjacent to each other in a flush state. A cooling device (not shown) is connected to the cooling block 3.
極薄ガラス板などの脆性板５における厚み方向Ｚの両面のうち一方の面である加熱面５ａと他方の面である冷却面５ｂとのうち加熱面５ａには直線状に延びる切断予定線（図示せず）が付けられている。その切断予定線の一端が交差する加熱面５ａの端縁には予備亀裂６が形成されている。 Of the brittle plate 5 such as an ultra-thin glass plate, a predetermined cutting line extending linearly on the heating surface 5a of the heating surface 5a and the cooling surface 5b which is one surface of both surfaces in the thickness direction Z ( (Not shown) is attached. A preliminary crack 6 is formed at the edge of the heating surface 5a where one end of the planned cutting line intersects.
加熱ブロックとしてのヒートナイフ７の下部には幅方向Ｙの中央部で線条の加熱縁８が長手方向Ｘへ延設されているとともに、加熱縁８を挟む幅方向Ｙの両側にはＶ状に傾斜する輻射面９が長手方向Ｘへ延設されている。加熱縁８には幅方向Ｙで小さい丸みが付けられている。加熱縁８は長手方向Ｘへ直線状に延びるか、または、長手方向Ｘで極僅かに湾曲する弓状に形成されている。ヒートナイフ７内には幅方向Ｙの中央部で加熱縁８の真上直近に加熱縁８に沿ってヒータ１０が埋設され、ヒータ１０には加熱装置（図示せず）が接続されている。また、ヒートナイフ７には各種の振動形態を発振し得る超音波振動子を有する振動発生装置（図示せず）が接続されている。 In the lower part of the heat knife 7 as a heating block, a heating edge 8 of a line is extended in the longitudinal direction X at the center in the width direction Y, and V-shaped on both sides of the width direction Y across the heating edge 8. A radiating surface 9 inclined in the direction is extended in the longitudinal direction X. The heating edge 8 is rounded in the width direction Y. The heating edge 8 extends in a straight line in the longitudinal direction X or is formed in an arc shape that is slightly curved in the longitudinal direction X. A heater 10 is embedded in the heat knife 7 along the heating edge 8 at the center in the width direction Y and immediately above the heating edge 8, and a heater (not shown) is connected to the heater 10. The heat knife 7 is connected to a vibration generator (not shown) having an ultrasonic vibrator that can oscillate various vibration modes.
次に、脆性板５の熱割断作用を説明する。
まず、脆性板５の加熱面５ａにおける切断予定線（図示せず）の両端を加工ステージ１における冷却ブロック３に合わせた状態で、脆性板５の冷却面５ｂを加工ステージ１の粘着シート４に冷却ブロック３を跨いで載せて固定する。その場合、ヒートナイフ７の両輻射面９と脆性板５の加熱面５ａとの間に隙間Ｓが生じる。
Next, the thermal cleaving action of the brittle plate 5 will be described.
First, the cooling surface 5b of the brittle plate 5 is attached to the pressure-sensitive adhesive sheet 4 of the processing stage 1 with both ends of a cutting line (not shown) on the heating surface 5a of the brittle plate 5 being aligned with the cooling block 3 of the processing stage 1. The cooling block 3 is straddled and fixed. In that case, a gap S is generated between both radiation surfaces 9 of the heat knife 7 and the heating surface 5 a of the brittle plate 5.
次に、ヒートナイフ７の加熱縁８を脆性板５の切断予定線及びその予備亀裂６に当てがう。直線状の加熱縁８では、加熱縁８の全体が切断予定線に同時に接触する。弓状の加熱縁８では、加熱縁８の一端側から他端側へ湾曲に沿って順次接触する。そして、脆性板５の加熱面５ａの切断予定線で加熱縁８がヒータ１０により加熱されるとともに、脆性板５の冷却面５ｂで加熱縁８の真下域が冷却ブロック３により冷却されると、加熱面５ａ側と冷却面５ｂ側との間の温度差により、切断予定線の真下域で加熱面５ａ側の膨張と冷却面５ｂ側の圧縮とによる熱応力（圧縮応力や引張応力）が生じる。その熱応力を原因として発生する曲げモーメントにより、脆性板５がヒートナイフ７の加熱縁８に沿って加熱面５ａ側から冷却面５ｂ側へ向けて熱割断される。ちなみに、ガラス板を熱割断する際には圧縮力と比較して引張力に対し弱い特性を生かすことができる。 Next, the heating edge 8 of the heat knife 7 is applied to the planned cutting line of the brittle plate 5 and its preliminary crack 6. In the linear heating edge 8, the entire heating edge 8 is simultaneously in contact with the planned cutting line. In the arcuate heating edge 8, the heating edge 8 sequentially comes into contact along the curve from one end side to the other end side. Then, when the heating edge 8 is heated by the heater 10 along the planned cutting line of the heating surface 5a of the brittle plate 5, and the area directly below the heating edge 8 is cooled by the cooling block 3 on the cooling surface 5b of the brittle plate 5, Due to the temperature difference between the heating surface 5a side and the cooling surface 5b side, thermal stress (compression stress or tensile stress) due to expansion on the heating surface 5a side and compression on the cooling surface 5b side occurs in the region immediately below the planned cutting line. . Due to the bending moment generated due to the thermal stress, the brittle plate 5 is thermally cleaved along the heating edge 8 of the heat knife 7 from the heating surface 5a side to the cooling surface 5b side. Incidentally, when the glass plate is cleaved by heat, it is possible to take advantage of the weakness against the tensile force as compared with the compressive force.
その熱割断の際、脆性板５の切断予定線における予備亀裂６は、亀裂の発生を促進させる。また、超音波振動子によりヒートナイフ７を介して脆性板５に伝達される超音波振動は、振動荷重負荷による高歪み速度のせん断変形により割断面を平滑にする。加熱縁８を加熱面５ａの切断予定線に当てがった際に加熱面５ａとヒートナイフ７の輻射面９との間に隙間Ｓが生じるため、輻射面９は隙間Ｓを介して加熱面５ａの温度上昇を助長する。 At the time of the thermal cleaving, the preliminary crack 6 in the planned cutting line of the brittle plate 5 promotes the generation of the crack. Further, the ultrasonic vibration transmitted to the brittle plate 5 via the heat knife 7 by the ultrasonic vibrator smoothes the fractured surface by shear deformation at a high strain rate due to a vibration load. A gap S is formed between the heating surface 5a and the radiation surface 9 of the heat knife 7 when the heating edge 8 is applied to the planned cutting line of the heating surface 5a, so that the radiation surface 9 is heated via the gap S. Helps increase the temperature of 5a.
ちなみに、脆性板５の材質や厚みや切断長さなどに応じて、ヒートナイフ７の加熱縁８の形態や、ヒートナイフ７内のヒータ１０の加熱温度や、冷却ブロック３の冷却温度や、予備亀裂６の有無及び形態や、超音波振動の有無及び形態などを設定する。 Incidentally, depending on the material, thickness and cutting length of the brittle plate 5, the form of the heating edge 8 of the heat knife 7, the heating temperature of the heater 10 in the heat knife 7, the cooling temperature of the cooling block 3, and the reserve The presence / absence and form of the crack 6 and the presence / absence and form of ultrasonic vibration are set.
本実施形態は下記の効果を有する。
（１） 加熱縁８を有するヒートナイフ７を採用したので、形態を維持することができる加熱縁８から平均的に発生する熱により、切断縁の両側に生じる熱応力（圧縮応力や引張応力）が平均化して安定する。従って、脆性板に対しレーザー光により切断縁に沿う熱衝撃を与えて脆性板を熱割断する従来の方法と比較して、切断縁の直進性を高めることができる。
This embodiment has the following effects.
(1) Since the heat knife 7 having the heating edge 8 is employed, thermal stress (compressive stress and tensile stress) generated on both sides of the cutting edge due to heat generated on average from the heating edge 8 capable of maintaining the form. Is stabilized by averaging. Therefore, the straightness of the cutting edge can be improved as compared with a conventional method in which a thermal shock along the cutting edge is given to the brittle plate by laser light to thermally break the brittle plate.
（２） 加熱縁８を有するヒートナイフ７を採用したので、脆性破壊の原理を活用して平滑な割断面を得ることができるとともに、切断粉の発生がなく、ドライ加工である。従って、脆性板をダイヤモンドカッターによる傷入れ加工で切断する従来の方法や、脆性板をダイヤモンド砥石により切断する従来の方法や、脆性板をレーザー光によるアブレーション加工で切断する従来の方法と比較して、加工後の後処理を必要としない。 (2) Since the heat knife 7 having the heating edge 8 is employed, it is possible to obtain a smooth fractured surface by utilizing the principle of brittle fracture, and there is no generation of cutting powder, which is dry processing. Therefore, compared to the conventional method of cutting a brittle plate with a diamond cutter, the conventional method of cutting a brittle plate with a diamond grindstone, and the conventional method of cutting a brittle plate with an ablation process using a laser beam. No post-processing after processing is required.
（３） ヒートナイフ７に伝達される超音波振動により、振動荷重負荷による高歪み速度のせん断変形で平滑な割断面を得ることができる。
（４） 予備亀裂６により、脆性板５の熱割断を促進させることができる。
(3) By the ultrasonic vibration transmitted to the heat knife 7, a smooth fractured surface can be obtained by shear deformation at a high strain rate due to a vibration load.
(4) The thermal cracking of the brittle plate 5 can be promoted by the preliminary crack 6.
（５） 冷却ブロック３により、脆性板５における加熱面５ａ側と冷却面５ｂ側との間の温度差を大きくすることができる。
（６） ヒートナイフ７の輻射面９により、脆性板５における加熱面５ａ側の温度上昇を助長して、脆性板５における加熱面５ａ側と冷却面５ｂ側との間の温度差を大きくすることができる。
(5) The cooling block 3 can increase the temperature difference between the heating surface 5 a side and the cooling surface 5 b side of the brittle plate 5.
(6) The radiation surface 9 of the heat knife 7 promotes the temperature rise on the heating surface 5a side of the brittle plate 5, and increases the temperature difference between the heating surface 5a side and the cooling surface 5b side of the brittle plate 5. be able to.
（７） 粘着シート４により、脆性板５を容易に固定することができる。
前記実施形態以外にも例えば下記のように構成してもよい。
・ ガラス板以外に、サファイアやシリコンやＳｉＣやＧａＡｓなどの材料からなる脆性板５を熱割断することができる。
(7) The brittle plate 5 can be easily fixed by the adhesive sheet 4.
For example, the following embodiment may be configured as follows.
In addition to the glass plate, the brittle plate 5 made of a material such as sapphire, silicon, SiC, or GaAs can be thermally cleaved.
・ 予備亀裂６や超音波振動や冷却ブロック３については省略してもよい。
・ ヒートナイフ７において加熱縁８に対する幅方向Ｙの両側の輻射面９を省略してもよい。
The preliminary crack 6, ultrasonic vibration, and cooling block 3 may be omitted.
In the heat knife 7, the radiation surfaces 9 on both sides in the width direction Y with respect to the heating edge 8 may be omitted.
３…冷却ブロック、４…粘着シート（粘着面）、５…脆性板、５ａ…脆性板の加熱面（一方の面）、５ｂ…脆性板の冷却面（他方の面）、６…予備亀裂、７…ヒートナイフ（加熱ブロック）、８…ヒートナイフの加熱縁、９…ヒートナイフの輻射面、Ｚ…脆性板の厚み方向、Ｓ…隙間。 3 ... Cooling block, 4 ... Adhesive sheet (adhesive surface), 5 ... Brittle plate, 5a ... Heated surface (one surface) of the brittle plate, 5b ... Cooling surface (other surface) of the brittle plate, 6 ... Preliminary crack, 7 ... Heat knife (heating block), 8 ... Heating edge of heat knife, 9 ... Radiation surface of heat knife, Z ... Thickness direction of brittle plate, S ... Gap.
Claims (6)
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