JP2000015467A - Working method of workpiece by beam and its working device - Google Patents
Working method of workpiece by beam and its working deviceInfo
- Publication number
- JP2000015467A JP2000015467A JP10186264A JP18626498A JP2000015467A JP 2000015467 A JP2000015467 A JP 2000015467A JP 10186264 A JP10186264 A JP 10186264A JP 18626498 A JP18626498 A JP 18626498A JP 2000015467 A JP2000015467 A JP 2000015467A
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- light
- cooling medium
- processing
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ガラス等の被加工
材を、光を照射することによって加工する加工方法およ
び加工装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing method and a processing apparatus for processing a workpiece such as glass by irradiating light.
【０００２】[0002]
【従来の技術】レーザー光等の光源を用いたガラス等の
切断や穴開け等の加工が従来より行われているが、近年
液晶用のガラス基板に見られるように、より高精度に加
工されること等、高品質に仕上げられることが要請され
る。2. Description of the Related Art Processing such as cutting and drilling of glass using a light source such as a laser beam has been conventionally performed, but recently, as seen in a glass substrate for liquid crystal, processing has been performed with higher precision. It is required to be finished with high quality.
【０００３】そして、例えば、ガラスを切断加工するの
であれば、特開平１−２７１０８４に見られるように、
従来用いられた炭酸ガスレーザー光による、該レーザー
光に対する高い吸収による溶融を生じて所定の切断幅と
なることに起因する切断加工精度の低下を防ぐため、光
源として吸収の少ないＹＡＧレーザー光が用いられる。[0003] For example, if glass is cut, as disclosed in Japanese Patent Application Laid-Open No. 1-271084,
Conventionally used carbon dioxide laser light, YAG laser light with low absorption is used as a light source to prevent a decrease in cutting accuracy caused by melting due to high absorption of the laser light and a predetermined cutting width. Can be
【０００４】そして、ＹＡＧレーザー光によりガラスを
切断すると、レーザー光がガラスを略透過し、レーザー
光がガラスに吸収されることによる溶融を生じ難いこと
から、一定の切断幅に伴う切断加工精度の低下を防ぐこ
とはできる（特開平１−２７１０８４）。When the glass is cut with a YAG laser beam, the laser beam substantially penetrates the glass, and the laser beam is hardly melted by being absorbed by the glass. The drop can be prevented (Japanese Patent Laid-Open No. 1-271084).
【０００５】[0005]
【発明が解決しようとする課題】ここで、前記ＹＡＧレ
ーザー光によりガラスを切断する場合のように、光の吸
収の少ないガラス等の被加工材にレーザー光を照射して
切断等の加工を行う場合には、照射されたレーザー光を
吸収して発熱し、被加工材に対して熱源として作用させ
ることが必要とされた。即ち、被加工材を一定の温度勾
配による熱応力を生ぜしめて切断するべく、レーザー光
を吸収して発熱する部分を設け、かかる発熱源よりガラ
スに熱を作用させることが必要とされた。そのため、例
えば、特開平５−２３７６８６や特開平５−３０５４６
７に見られるように、レーザー光を吸収する吸収剤をガ
ラスの切断したい経路に沿って塗布し、該吸収剤が塗布
された経路に沿ってレーザー光を走査することによって
切断していた。Here, as in the case where the glass is cut by the YAG laser light, a material such as glass having little light absorption is irradiated with the laser light to perform processing such as cutting. In such a case, it is necessary to absorb the irradiated laser beam and generate heat, thereby causing the workpiece to act as a heat source. That is, in order to cut the workpiece by generating thermal stress due to a constant temperature gradient, it is necessary to provide a portion that absorbs laser light and generate heat, and apply heat to the glass from the heat source. Therefore, for example, Japanese Patent Application Laid-Open Nos. Hei 5-237686 and Hei 5-30546
As shown in FIG. 7, an absorbent for absorbing laser light was applied along a path of the glass to be cut, and cutting was performed by scanning the laser light along the path on which the absorbent was applied.
【０００６】しかし、かかる吸収剤を塗布してから切断
することは、予め吸収剤を塗布する工程を必要とし、ま
た、切断後にガラス等の被加工材に残された吸収剤を除
去する工程が必要となることもあり、加工に伴って余分
な作業工程を要することになるので、作業時間や作業コ
ストの増大を招く。また、かかる吸収剤の塗布を、特開
平５−２３７６８６のように自動運転により行うとする
と、被加工材を加工するための装置全体の複雑化を招
く。However, cutting after applying such an absorbent requires a step of applying the absorbent in advance, and a step of removing the absorbent remaining on the workpiece such as glass after cutting is required. In some cases, it is necessary, and an extra operation step is required in association with the processing, which leads to an increase in operation time and operation cost. Further, if the application of the absorbent is performed by automatic operation as disclosed in Japanese Patent Application Laid-Open No. 5-237686, the entire apparatus for processing the workpiece is complicated.
【０００７】また、被加工材の加工を再現性良く安定し
て高精密に行えることも要請される。[0007] It is also required that a workpiece can be processed stably with high reproducibility and with high precision.
【０００８】そこで、本発明はガラス等の被加工材の光
の照射による加工を、余分な作業工程を必要とせず、ま
た、装置の複雑化を招くこともなく、安定して高精密に
行うことを目的とする。Therefore, the present invention stably and precisely processes a workpiece such as glass by irradiating light without requiring an extra operation step and without complicating the apparatus. The purpose is to:
【０００９】[0009]
【課題を解決するための手段】上記課題を解決するた
め、本発明は、被加工材を、その加工位置に光を照射す
ることによって加工する加工方法であって、冷却媒質
を、少なくとも、前記被加工材の前記光が出射する側に
おける加工位置の部分に接触させることを特徴とする光
による被加工材の加工方法である（請求項１）。According to the present invention, there is provided a method for processing a workpiece by irradiating a processing position with light, wherein the cooling medium comprises at least the cooling medium. A method of processing a workpiece using light, wherein the workpiece is brought into contact with a portion of a processing position on a side from which the light is emitted of the workpiece (claim 1).
【００１０】前記被加工材に光を照射すると、被加工材
は光を吸収することにより加熱される。そして、被加工
材の内部における前記光の最も強い部分が最も高温とな
る。そして、少なくとも前記被加工材の前記光が出射す
る側における加工位置の部分は前記冷却媒質により冷却
されるので、被加工材により吸収される光が少ないこと
により強い加熱を行えない場合でも、前記被加工材の内
部の最も高温の部分と前記光が出射する側の加工位置の
部分との間に被加工材の切断等の加工に必要な熱応力を
生ぜしめることができる。これにより、被加工材を切断
する等の加工を行うことができる。そして、前記加工位
置の部分の冷却は、冷却媒質を接触させることにより行
われるので、該冷却を安定して確実に行うことができ
る。When the work is irradiated with light, the work is heated by absorbing the light. Then, the strongest part of the light inside the workpiece has the highest temperature. And since at least the portion of the processing position on the side where the light is emitted of the workpiece is cooled by the cooling medium, even when strong heating cannot be performed due to the small amount of light absorbed by the workpiece, the Thermal stress required for processing such as cutting of the workpiece can be generated between the hottest part inside the workpiece and the processing position on the side where the light is emitted. Thereby, processing such as cutting the workpiece can be performed. Since the cooling of the portion at the processing position is performed by bringing the cooling medium into contact, the cooling can be stably and surely performed.
【００１１】これにより、被加工材自体の内部の加熱
と、前記加工位置の部分の冷却とを安定して行えるの
で、再現性の良い安定した高精密の加工を行うことがで
きる。また、余分な作業工程を必要とすることもなく、
作業時間や作業コストの増加を防ぐこともできる。[0011] Thus, since the heating of the inside of the workpiece itself and the cooling of the portion at the processing position can be performed stably, stable and high precision processing with good reproducibility can be performed. Also, without the need for extra work steps,
It is also possible to prevent an increase in work time and work cost.
【００１２】また、前記被加工材が照射された前記光を
略透過する光透過性材料からなる場合には（請求項
２）、光は被加工材を略透過するが、被加工材によるい
くらかの光の吸収は生ずるので、被加工材を加熱するこ
とはできる。そして、前記被加工材の前記光が出射する
側の加工位置の部分は前記冷却媒質により冷却されるの
で、前記熱応力を生ずることができ、被加工材を切断す
る等の加工を行うことができる。これにより、被加工材
が光透過性材料からなる場合でも、光の吸収剤の塗布等
を要さず、光を照射することにより被加工材の切断等の
加工を行うことができる。これにより、加工に伴う作業
時間や作業コストの増加を防ぎつつ、安定した高精密の
加工を行うことができる。In the case where the workpiece is made of a light-transmitting material that substantially transmits the irradiated light (claim 2), the light substantially transmits through the workpiece, but some light is transmitted by the workpiece. Therefore, the work material can be heated. Then, since the portion of the processing material on the processing position on the side where the light is emitted is cooled by the cooling medium, the thermal stress can be generated, and processing such as cutting the processing material can be performed. it can. Accordingly, even when the workpiece is made of a light-transmitting material, it is possible to perform processing such as cutting of the workpiece by irradiating light without applying a light absorber or the like. Thereby, stable high-precision processing can be performed while preventing an increase in operation time and operation cost associated with the processing.
【００１３】また、前記冷却媒質が液体である場合には
（請求項３）、前記被加工材の切断等の加工に伴い生ず
る被加工材の粉塵を、冷却媒質としての液体により容易
かつ速やかに除去することができ、前記粉塵の被加工材
への付着を防ぐことができる。これにより、切断等の加
工に伴う被加工材の品質の低下を防ぐことができる。Further, when the cooling medium is a liquid (claim 3), the dust of the workpiece caused by processing such as cutting of the workpiece is easily and promptly removed by the liquid as the cooling medium. The dust can be removed and the adhesion of the dust to the workpiece can be prevented. As a result, it is possible to prevent a decrease in quality of the workpiece due to processing such as cutting.
【００１４】また、前記冷却媒質が水である場合には
（請求項４）、水は入手が容易であり、水の取り扱いは
過去の各種のプラント等による技術蓄積が豊富であるの
で、冷却媒質の取り扱いが容易である。これにより、本
発明の加工を行うにあたり、設備の複雑化を招くことが
なく設備コストの低減を図ることができる。In the case where the cooling medium is water (claim 4), the water is easily available, and the handling of water is abundant in technology accumulated in various past plants and the like. Is easy to handle. Thereby, in performing the processing of the present invention, it is possible to reduce the equipment cost without causing the equipment to be complicated.
【００１５】また、前記冷却媒質が前記光を吸収する色
水である場合には（請求項５）、被加工材に照射された
光のうち被加工材を透過する等により出射した光を、色
水により吸収し消失させることができる。これにより、
被加工材を出射した光の処理を色水を調整するのみで簡
易に行うことができ、かかる光による装置の破損等のト
ラブル防止のための複雑な機構や光学系等を用いずに済
む。特に、前記光としてレーザー光を用いる場合には
（請求項１２）、被加工材を出射したレーザー光による
トラブル対策が重要であるが、色水のみにより簡易に処
理することができる。In the case where the cooling medium is colored water absorbing the light (claim 5), of the light applied to the work material, the light emitted by transmitting the work material or the like may be used. It can be absorbed and eliminated by colored water. This allows
The processing of the light emitted from the workpiece can be easily performed only by adjusting the color water, and it is not necessary to use a complicated mechanism or an optical system for preventing trouble such as breakage of the apparatus due to the light. In particular, when a laser beam is used as the light (claim 12), it is important to take measures against troubles caused by the laser beam emitted from the workpiece, but it is possible to easily process the laser beam only with color water.
【００１６】ここで、色水とは、前記照射される光に対
して特有の高い吸収率を示す液体であり、該液体に特有
の色を呈しており、該特有の色を呈する物質と通常の水
とを含んで調整されるものである。Here, the colored water is a liquid exhibiting a specific high absorptance to the irradiated light, has a specific color to the liquid, and is usually defined as a substance exhibiting the specific color. It is adjusted to include water.
【００１７】この色水が呈する色と、該色水に高い吸収
率で吸収される光の波長との関係は、例えば、可視領域
の特定の波長の光と、該光に対する補色をなす色との関
係のごときものである。The relationship between the color exhibited by the color water and the wavelength of the light absorbed by the color water at a high absorption rate is, for example, a relation between the light having a specific wavelength in the visible region and the color forming a complementary color to the light. It's like a relationship.
【００１８】また、前記被加工材の全体が前記冷却媒質
の中に浸けられる場合には（請求項６）、前記被加工材
の光が出射する側における加工位置の部分のみならず、
被加工材の光が入射する側における加工位置の部分も含
めて冷却媒質により冷却できるので、被加工材を加工す
るための所要の熱応力をより短時間内に得ることがで
き、被加工材の加工を短時間で速やかに行える。In the case where the whole of the workpiece is immersed in the cooling medium (claim 6), not only the portion of the workpiece on the side where light is emitted but also the processing position,
Since the cooling medium including the processing position on the light incident side of the workpiece can be cooled by the cooling medium, the required thermal stress for processing the workpiece can be obtained in a shorter time. Can be processed quickly in a short time.
【００１９】また、被加工材の全体が冷却媒質の中にあ
るので、加工の際に生ずる前記被加工材の粉塵を確実に
取り除くことができる。Further, since the whole work material is in the cooling medium, dust of the work material generated at the time of working can be reliably removed.
【００２０】また、前記被加工材の前記光が入射する部
分が、前記冷却媒質の外部に晒されている場合には（請
求項７）、被加工材に合わせるのみにより光を照射する
ことができ、光の照射を冷却媒質との関係も含めて行う
必要がなく、被加工材に光を照射するための光学系等を
簡易にでき、光の照射を容易とできる。Further, when the portion of the workpiece to which the light is incident is exposed to the outside of the cooling medium (claim 7), the light can be irradiated only by adjusting to the workpiece. It is not necessary to irradiate the light including the relationship with the cooling medium, so that an optical system for irradiating the workpiece with light can be simplified, and the light irradiation can be facilitated.
【００２１】特に、色水を用いる場合に、被加工材の光
が入射する側が色水の外部に晒されるので、光の照射が
容易である。In particular, when using colored water, the light incident side of the workpiece is exposed to the outside of the colored water, so that light irradiation is easy.
【００２２】また、前記冷却媒質が、前記被加工材の前
記光が出射する側において、少なくとも、被加工材の加
工位置の部分に接触するように配設された氷点下以下の
温度にある固形物である場合には（請求項８）、被加工
材の前記光が出射する側における、少なくとも被加工材
の加工位置の部分を、前記固形物の氷点下以下の温度に
よってより強く冷却できるので、被加工材を加工するた
めの熱応力をより短時間内に得ることができ、被加工材
の加工をより短時間で速やかに行える。Further, the cooling medium is a solid substance at a temperature below the freezing point, which is disposed at least on a side of the workpiece to which the light is emitted, at a position where the workpiece is processed. In the case of (claim 8), at least the processing position of the workpiece on the side from which the light is emitted of the workpiece can be more strongly cooled by a temperature below the freezing point of the solid material, The thermal stress for processing the processed material can be obtained in a shorter time, and the processed material can be processed in a shorter time and more quickly.
【００２３】ここで、氷点下以下の温度にある固形物と
は、氷やドライアイスのごときものであり、常温に一定
時間放置しておくと融解等を生じて固形物の状態を維持
できないものである。Here, the solid at a temperature below the freezing point is such as ice or dry ice, and when left at room temperature for a certain period of time, melting occurs and the solid cannot be maintained. is there.
【００２４】また、前記氷点下以下の温度にある固形物
がドライアイスである場合には（請求項９）、極めて低
温であるドライアイスによってより一層強い冷却が可能
となり、被加工材の加工をより短時間で速やかに行え
る。また、かかる冷却媒質として優れたドライアイス
は、その入手や冷却媒質としての調整も容易である。In the case where the solid at a temperature below the freezing point is dry ice (claim 9), the extremely low temperature of the dry ice makes it possible to further cool the solid material, thereby making it possible to process the workpiece more efficiently. It can be done quickly and quickly. In addition, dry ice excellent as such a cooling medium can be easily obtained and adjusted as a cooling medium.
【００２５】また、前記冷却媒質が、前記被加工材の前
記光が出射する側において、少なくとも、被加工材の加
工位置を含む部分に接触するように配設された氷点下以
下の温度にある、前記光を吸収する色付き固形物である
場合には（請求項１０）、被加工材のより強い冷却が可
能であるとともに、被加工材を出射した光の処理を該色
付き固形物により簡易に処理できる。[0025] The cooling medium is at a temperature below the freezing point provided at least on a side of the workpiece to which the light exits, the part including a processing position of the workpiece. When the solid is a colored solid that absorbs the light (claim 10), the work material can be cooled more strongly, and the light emitted from the work material can be easily processed by the colored solid material. it can.
【００２６】また、前記氷点下以下の温度にある色を有
する固形物が、色付きドライアイスである場合には（請
求項１１）、色付きドライアイスによる被加工材の一層
強い冷却が可能であるとともに、被加工材を出射した光
を簡易に処理することもできる。Further, when the solid having a color at a temperature below the freezing point is colored dry ice (claim 11), the material to be processed can be more strongly cooled by the colored dry ice, Light emitted from the workpiece can be easily processed.
【００２７】また、前記光がレーザー光である場合には
（請求項１２）、被加工材に照射する光の制御を行い易
く、熱源としての光の照射が容易である。When the light is laser light (claim 12), it is easy to control the light applied to the workpiece, and it is easy to apply light as a heat source.
【００２８】以上の被加工材の加工は、前記被加工材の
加工位置に光を照射する光照射装置と、前記冷却媒質
を、少なくとも、前記被加工材の前記光が出射する側に
おける加工位置の部分に接触させるように供給すること
ができる冷却媒質供給装置とを備えてなる加工装置（請
求項１３）を用いて実施することができる。そして、前
記冷却媒質供給装置は、冷却媒質を貯蔵することができ
る冷却媒質槽を備えることができ（請求項１４）、ま
た、前記被加工材の前記光が出射する側における加工位
置の部分に液体を噴射することができる噴射ノズルを備
えることができる（請求項１９）。The processing of the workpiece is performed by irradiating a light irradiating device for irradiating the processing position of the workpiece and the cooling medium with at least a processing position on the side of the workpiece from which the light is emitted. And a cooling medium supply device capable of supplying the cooling medium so as to contact the portion. The cooling medium supply device may include a cooling medium tank capable of storing the cooling medium (Claim 14). The cooling medium supply device may be provided at a processing position on the light emitting side of the workpiece. An ejection nozzle capable of ejecting a liquid can be provided (claim 19).
【００２９】そして、前記冷却媒質槽には冷却媒質とし
て液体を貯蔵することができ（請求項１５）、該液体と
して色水を貯蔵することもできる（請求項１６）。ま
た、前記冷却媒質槽には冷却媒質として氷点下以下の温
度にある固形物を貯蔵することができ（請求項１７）、
かかる固形物として色付き固形物を貯蔵することもでき
る（請求項１８）。In the cooling medium tank, a liquid can be stored as a cooling medium (claim 15), and colored water can be stored as the liquid (claim 16). Further, the cooling medium tank can store a solid substance at a temperature below freezing as a cooling medium (claim 17).
Colored solids can be stored as such solids (claim 18).
【００３０】また、前記噴射ノズルにより色水を噴射す
ることもできる（請求項２０）。Further, color water can be jetted by the jet nozzle (claim 20).
【００３１】[0031]
【発明の実施の形態】本発明の実施の形態について、図
１乃至図９に基づいて説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIGS.
【００３２】図１は、本発明にかかる加工装置の一例で
ある加工装置１の斜視図を示している。この加工装置１
により本発明の加工方法を実施することができる。FIG. 1 is a perspective view of a processing apparatus 1 which is an example of a processing apparatus according to the present invention. This processing device 1
Thereby, the processing method of the present invention can be carried out.
【００３３】加工装置１は、レーザー装置に冷却媒質槽
１５が設けられた構成とされており、後に説明する支持
部材１６により冷却媒質槽１５中に支持される被加工材
３０にレーザ光を照射し、被加工材３０を所望の経路に
沿って切断加工できるように構成されている。この図１
に示される例にあっては、被加工材３０として、光を略
透過する光透過性材料からなるものとして典型的な透明
のガラス板が配置されている。The processing apparatus 1 has a configuration in which a cooling medium tank 15 is provided in a laser apparatus, and irradiates a workpiece 30 supported in the cooling medium tank 15 by a support member 16 described later with laser light. The workpiece 30 is configured to be cut along a desired path. This figure 1
In the example shown in (1), a typical transparent glass plate is disposed as the workpiece 30 as being made of a light-transmitting material that substantially transmits light.
【００３４】加工装置１を構成するレーザー装置は、該
レーザー装置により切断加工される被加工材に対して、
所望の位置へのレーザトーチ９の位置決めが可能な公知
のレーザー装置である。即ち、基台２上にＸ方向に移動
可能な作業テーブル３が設けられ、作業テーブル３を挟
んで門型の枠体４が立設されている。枠体４の上辺には
移動体５がＹ方向に移動可能に設けられており、移動体
５にはＺ方向に昇降可能な昇降体６が設けられている。
また、昇降体６の下端部には旋回体７がＺ方向に沿った
垂直軸回りに旋回可能に設けられており、旋回体７の下
端部にはＹ方向に沿った水平軸回りに回動可能な回動体
８が設けられている。The laser device constituting the processing device 1 is used for a workpiece cut by the laser device.
This is a known laser device capable of positioning the laser torch 9 at a desired position. That is, a work table 3 that is movable in the X direction is provided on the base 2, and a gate-shaped frame 4 is erected on the work table 3. A moving body 5 is provided on the upper side of the frame body 4 so as to be movable in the Y direction, and the moving body 5 is provided with an elevating body 6 that can move up and down in the Z direction.
A revolving body 7 is provided at the lower end of the elevating body 6 so as to be rotatable about a vertical axis along the Z direction, and at the lower end of the revolving body 7 is rotated about a horizontal axis along the Y direction. A possible rotating body 8 is provided.
【００３５】そして、回動体８には、その先端よりレー
ザー光を出射するレーザトーチ９が取り付けられてい
る。そして、レーザー発振器１０より出射されたレーザ
ー光は、レーザー光案内筒１１ａ、１１ｂの内部を通っ
てレーザトーチ９へと導かれ、レーザトーチ９より被加
工材３０に向かって照射される。The rotating body 8 is provided with a laser torch 9 for emitting a laser beam from its tip. Then, the laser light emitted from the laser oscillator 10 is guided to the laser torch 9 through the inside of the laser light guide cylinders 11a and 11b, and is irradiated from the laser torch 9 toward the workpiece 30.
【００３６】そして、このレーザー装置にあっては、上
記作業テーブル３と移動体５と昇降体６と旋回体７と回
動体８とは、特に図示していないコントローラによって
上記移動等されるようになっており、レーザトーチ９を
５自由度で位置決めできるようになっている。これによ
り、被加工材３０を、レーザー光を照射しつつ所望の経
路に沿って切断することができる。In this laser apparatus, the work table 3, the moving body 5, the elevating body 6, the revolving body 7, and the revolving body 8 are moved by a controller (not shown). The laser torch 9 can be positioned with five degrees of freedom. Thereby, the workpiece 30 can be cut along a desired path while irradiating the laser beam.
【００３７】また、この加工装置１にあっては、レーザ
ー発振器１０としてＹＡＧレーザー発振器を用いてお
り、レーザトーチ９より照射されたＹＡＧレーザー光は
ガラス板３０を略透過する。Further, in the processing apparatus 1, a YAG laser oscillator is used as the laser oscillator 10, and the YAG laser light emitted from the laser torch 9 substantially transmits through the glass plate 30.
【００３８】そして、作業テーブル３には冷却媒質槽１
５が設けられている。この冷却媒質槽１５は冷却媒質供
給装置を構成する。冷却媒質槽１５について、図２にも
基づいて説明する。図２は、レーザートーチ９と冷却媒
質槽１５を含む部分を表す、Ｙ方向に沿って眺めた垂直
断面の図である。The work table 3 has a cooling medium tank 1
5 are provided. This cooling medium tank 15 constitutes a cooling medium supply device. The cooling medium tank 15 will be described also with reference to FIG. FIG. 2 is a vertical cross-sectional view showing a portion including the laser torch 9 and the cooling medium tank 15 as viewed in the Y direction.
【００３９】冷却媒質槽１５は、被加工材３０を冷却す
るための冷却媒質を貯蔵するためのものであり、冷却媒
質を被加工材３０に接触させるように供給することがで
きる。図１、図２に示される例では、冷却媒質槽１５に
は、冷却媒質として通常の水道水２１が貯えられてい
る。この冷却媒質槽１５中には、被加工材３０を支持す
るための支持部材１６が配設されている。そして、この
支持部材１６は垂直方向に昇降可能になっており、被加
工材３０を冷却槽における垂直方向の所望の高さの位置
で支持できるようになっている。The cooling medium tank 15 is for storing a cooling medium for cooling the workpiece 30, and can supply the cooling medium so as to contact the workpiece 30. In the example shown in FIGS. 1 and 2, ordinary tap water 21 is stored in the cooling medium tank 15 as a cooling medium. A support member 16 for supporting the workpiece 30 is provided in the cooling medium tank 15. The support member 16 can move up and down in the vertical direction, and can support the workpiece 30 at a desired vertical position in the cooling bath.
【００４０】図１、図２に示される例にあっては、被加
工材３０は、レーザー光が出射する側にあたる下面３０
ｂが水２１の中にあり、レーザー光が入射する側にあた
る上面３０ａが水２１の外部に晒されるように支持され
ている。In the example shown in FIGS. 1 and 2, the work piece 30 has a lower surface 30 corresponding to the side from which the laser beam is emitted.
b is in the water 21, and the upper surface 30 a on the side where the laser beam is incident is supported so as to be exposed to the outside of the water 21.
【００４１】次に、図１、図２に示される加工装置１に
おいて、被加工材３０にレーザー光が照射される状況に
ついて、図３に基づいて説明する。図３は、図２におけ
る被加工材３０とレーザートーチ９の部分を拡大して示
した部分拡大図である。Next, the situation in which the workpiece 30 is irradiated with laser light in the processing apparatus 1 shown in FIGS. 1 and 2 will be described with reference to FIG. FIG. 3 is a partially enlarged view showing the workpiece 30 and the laser torch 9 in FIG. 2 in an enlarged manner.
【００４２】図３においては、レーザー光を被加工材３
０に照射するにあたり、レーザー光を照射する方向に沿
った被加工材３０の厚さの略中心にあたる位置Ｃにレー
ザー光の焦点位置を合わせる例を示している。レーザー
光は被加工材３０を略透過するが、被加工材３０による
レーザー光のいくらかの吸収は生ずる。かかるレーザー
光の吸収に伴って被加工材３０は加熱されることになる
が、前記位置Ｃが被加工材３０の内部において最も温度
が高くなる。そして、かかる位置Ｃと、水２１の中で冷
却される下面３０ｂにおける前記Ｃに最も近い位置Ｒと
の間の温度勾配によって生じた熱応力により、被加工材
３０は前記Ｃ、Ｒを含む垂直方向の切断面により切断さ
れる。In FIG. 3, the laser beam is applied to the workpiece 3
An example is shown in which the focal position of the laser light is adjusted to a position C substantially at the center of the thickness of the workpiece 30 along the direction in which the laser light is irradiated when irradiating 0. Although the laser light is substantially transmitted through the workpiece 30, some absorption of the laser light by the workpiece 30 occurs. The workpiece 30 is heated in accordance with the absorption of the laser light, but the position C has the highest temperature inside the workpiece 30. Then, due to the thermal stress generated by the temperature gradient between the position C and the position R closest to the C on the lower surface 30b cooled in the water 21, the workpiece 30 is moved vertically including the C and R. Cut by the direction cut surface.
【００４３】このように、加工装置１によると、被加工
材３０自体の内部における切断しようとする部分の一部
を直接に加熱しつつ、切断しようとする他の部分を冷却
媒質である水により冷却するので、安定して一定の熱応
力を生ぜしめることができ、安定かつ確実に高精密に切
断することが可能である。As described above, according to the processing apparatus 1, while a part of the part to be cut in the workpiece 30 itself is directly heated, the other part to be cut is water-cooled. Since cooling is performed, a constant thermal stress can be generated stably, and cutting can be performed stably and reliably with high precision.
【００４４】なお、照射するレーザー光の焦点の位置
を、必ずしも前記被加工材３０の厚さの略中心にあたる
位置とする必要はなく、発生させたい前記熱応力との関
係により、前記被加工材３０におけるレーザー光が照射
される方向に沿って各位置が選ばれることになる。The position of the focal point of the laser beam to be irradiated does not necessarily have to be at a position substantially at the center of the thickness of the workpiece 30. Depending on the relationship with the thermal stress to be generated, Each position is selected along the direction in which the laser beam is irradiated at 30.
【００４５】また、被加工材３０が切断されると、その
切断部分から被加工材３０の粉塵を生ずる。かかる切断
に伴い生ずる粉塵は、例えば液晶パネル用のガラス基板
であればカレットと呼ばれる。このカレットを速やかに
取り除かない場合には、ガラス基板に付着して取れなく
なることにより、該カレットが後の工程で支障を起こ
し、ガラス基板の品質を損なう原因となる。When the workpiece 30 is cut, dust on the workpiece 30 is generated from the cut portion. Dust generated by such cutting is called cullet in a glass substrate for a liquid crystal panel, for example. If the cullet is not removed promptly, the cullet will adhere to the glass substrate and become unremovable, causing the cullet to hinder the subsequent steps and deteriorating the quality of the glass substrate.
【００４６】この加工装置１によると、被加工材３０の
下面３０ｂが水２１の中にあるので、切断された部分よ
り生じた被加工材３０の粉塵を水により速やかに取り除
くことができる。これにより、被加工材３０の粉塵が付
着することに伴う品質の低下を防ぐこともできる。According to the processing apparatus 1, since the lower surface 30b of the workpiece 30 is in the water 21, the dust of the workpiece 30 generated from the cut portion can be quickly removed by the water. Thus, it is possible to prevent the quality of the workpiece 30 from being deteriorated due to the adhesion of dust.
【００４７】次に、冷却媒質の供給にかかる他の例につ
いて、図４に基づいて説明する。Next, another example of the supply of the cooling medium will be described with reference to FIG.
【００４８】図４は、冷却媒質供給装置として噴射ノズ
ル１７を備えた例を示している。即ち、冷却媒質槽１５
内に噴射ノズル１７を配設し、噴射ノズル１７により冷
却媒質である水２１を被加工材３０に向かって噴射し、
水流として供給する例である。この図４に示される例に
あっては、被加工材３０のレーザー光が出射する側であ
る下面３０ｂにおける前記切断位置Ｒの部分に、水２１
を噴射して接触させるのであり、噴射された水２１によ
り切断位置Ｒの部分を冷却することができる。また、被
加工材３０を切断する際に生ずる被加工材３０の粉塵
を、噴射された水２１の水流により取り除くこともでき
る。FIG. 4 shows an example in which an injection nozzle 17 is provided as a cooling medium supply device. That is, the cooling medium tank 15
An injection nozzle 17 is disposed in the inside, and water 21 as a cooling medium is injected toward the workpiece 30 by the injection nozzle 17,
This is an example of supplying as a water flow. In the example shown in FIG. 4, water 21 is provided at the cutting position R on the lower surface 30b of the workpiece 30 from which the laser light is emitted.
Is jetted and brought into contact, and the portion at the cutting position R can be cooled by the jetted water 21. Further, dust of the workpiece 30 generated when the workpiece 30 is cut can be removed by the jet of the jetted water 21.
【００４９】また、上記噴射ノズル１７により水２１を
供給する場合について、被加工材３０に対して図５に示
されるようにレーザー光を照射することもできる。即
ち、図５（ａ）に示されるように、被加工材３０の下面
３０ｂにおける切断位置Ｒとレーザートーチ９の位置と
が対向する位置関係になく、ずれた位置関係となるよう
にするのであってもよい。また、図５（ｂ）に示される
ように、レーザートーチ９を垂直方向に対して傾け、被
加工材３０の下面３０ｂの切断位置Ｒに向かってレーザ
ー光を照射するようにしてもよい。この図５（ａ）、
（ｂ）の例にあっては、前記切断位置Ｒを含む、垂直方
向に対して斜めをなす切断面により、被加工材３０が切
断されることになる。In the case where the water 21 is supplied by the injection nozzle 17, the workpiece 30 may be irradiated with a laser beam as shown in FIG. That is, as shown in FIG. 5A, the cutting position R on the lower surface 30b of the workpiece 30 and the position of the laser torch 9 are not in a positional relationship to face each other, but in a shifted positional relationship. You may. Further, as shown in FIG. 5B, the laser torch 9 may be inclined with respect to the vertical direction, and the laser light may be irradiated toward the cutting position R of the lower surface 30b of the workpiece 30. This FIG. 5 (a),
In the example of (b), the workpiece 30 is cut by a cut surface that is oblique to the vertical direction and includes the cutting position R.
【００５０】次に、冷却媒質のさらに異なる例につい
て、図６に基づいて説明する。Next, still another example of the cooling medium will be described with reference to FIG.
【００５１】図６は、被加工材３０を、その全体を水２
１の中に浸けて支持した例である。FIG. 6 shows that the workpiece 30 is entirely made of water 2
This is an example in which it is immersed in and supported.
【００５２】ＹＡＧレーザー光は水２１による吸収が少
ないので、照射するレーザー光を水２１中にある被加工
材３０の所望の位置に焦点を合わせれば、図６に示され
るように水２１の外部からレーザー光を照射しても、被
加工材３０を切断することが可能である。なお、レーザ
ー光を照射する条件によって水２１による光の吸収が大
きい場合には、後に説明するように、水２１中を光ファ
イバーを用いて被加工材３０の近傍までレーザー光を導
光する等の光学系を採用するとよい。Since the YAG laser light is hardly absorbed by the water 21, if the irradiation laser light is focused on a desired position of the workpiece 30 in the water 21, as shown in FIG. It is possible to cut the workpiece 30 even if the workpiece 30 is irradiated with laser light. In the case where the absorption of light by the water 21 is large depending on the conditions for irradiating the laser light, as will be described later, the laser light may be guided to the vicinity of the workpiece 30 by using an optical fiber in the water 21. It is good to employ an optical system.
【００５３】この図６に示される例によると、被加工材
３０の下面３０ｂに加えて、被加工材３０の上面３０ａ
も冷却できる。これにより、前記図３に基づいて説明し
た被加工材３０を切断するための熱応力をより短時間内
に得ることができ、被加工材３０の切断加工を短時間で
速やかに行える。According to the example shown in FIG. 6, in addition to the lower surface 30b of the workpiece 30, the upper surface 30a of the workpiece 30
Can also be cooled. Thus, the thermal stress for cutting the workpiece 30 described with reference to FIG. 3 can be obtained in a shorter time, and the cutting of the workpiece 30 can be performed quickly in a shorter time.
【００５４】また、被加工材３０の全体が水２１中にあ
るので、切断の際に生ずる前記被加工材３０の粉塵を、
確実に取り除くことができる。Further, since the whole of the work material 30 is in the water 21, the dust of the work material 30 generated at the time of cutting is removed.
Can be reliably removed.
【００５５】次に、冷却媒質として色水を用いる例につ
いて、図７に基づいて説明する。Next, an example in which colored water is used as a cooling medium will be described with reference to FIG.
【００５６】図７に示される例にあっては、冷却媒質槽
１５には冷却媒質として色水２２が蓄えられている。そ
して、被加工材３０は、その下面３０ｂが色水２２の中
にあり、上面３０ａが色水２２の外部に晒されるように
支持されている。この色水２２は、照射されるＹＡＧレ
ーザー光の波長の光に対する吸収率が高い液体であり、
該液体特有の色を呈している。In the example shown in FIG. 7, the cooling medium tank 15 stores color water 22 as a cooling medium. The workpiece 30 is supported such that the lower surface 30b is in the color water 22 and the upper surface 30a is exposed to the outside of the color water 22. The color water 22 is a liquid having a high absorptivity for light having a wavelength of the irradiated YAG laser light,
The liquid has a unique color.
【００５７】かかる色水２２を冷却媒質として用いるこ
とにより、上記切断加工に必要な熱応力を得るための被
加工材３０の冷却を行えることに加え、被加工材３０の
下面３０ｂを透過等したレーザー光を色水２２により吸
収して消失させることができる。これにより、被加工材
３０を透過等したレーザー光による装置の破損等のトラ
ブルを防ぐための該レーザー光の処理を、複雑な機構や
光学系等によらず簡易に行うことができる。また、被加
工材３０の下面３０ｂを出射したレーザー光を色水２２
により消失させることにより、不要なレーザー光の乱反
射等による被加工材３０のダメージの防止を図ることも
できる。By using the color water 22 as a cooling medium, the work material 30 for obtaining the thermal stress required for the cutting can be cooled, and the lower surface 30b of the work material 30 is transmitted. The laser light can be absorbed by the colored water 22 and eliminated. Thereby, the processing of the laser light for preventing trouble such as breakage of the apparatus due to the laser light transmitted through the workpiece 30 or the like can be easily performed without using a complicated mechanism or an optical system. The laser beam emitted from the lower surface 30b of the workpiece 30 is applied to the colored water 22.
By doing so, it is possible to prevent the workpiece 30 from being damaged by unnecessary irregular reflection of laser light or the like.
【００５８】この色水の具体的な例として、食紅と水と
によって調整される食紅水を挙げることができる。As a specific example of this color water, there is red water adjusted by red water and water.
【００５９】また、図７に示されるように、被加工材３
０のレーザー光が入射する上面３０ａが色水２２の外部
に晒されていると、レーザー光の照射を行い易い。即
ち、レーザー光が入射する被加工材３０の上面３０ａが
レーザー光を吸収する色水２２中になく外部に晒されて
いるので、レーザー光を照射するにあたって、色水によ
る吸収を考慮した光学系とする必要がないからである。Further, as shown in FIG.
When the upper surface 30a on which the 0 laser light is incident is exposed to the outside of the color water 22, the laser light is easily irradiated. That is, since the upper surface 30a of the workpiece 30 on which the laser light is incident is not in the color water 22 that absorbs the laser light but is exposed to the outside, the optical system that takes the absorption by the color water into consideration when irradiating the laser light is used. It is not necessary to do so.
【００６０】なお、被加工材３０の上面３０ａが色水２
２の中にあっても、上面３０ａを僅かの色水が覆う程度
であり、該色水によるレーザー光の減衰が僅かにすぎ
ず、被加工材３０を加熱して切断できるのであれば構わ
ない。The upper surface 30a of the workpiece 30 is colored water 2
2, the upper surface 30 a is covered with a small amount of color water, the laser light is only slightly attenuated by the color water, and the work material 30 can be cut by heating. .
【００６１】また、色水２２を冷却媒質として用いる場
合についても、図８に示されるように、被加工材３０
を、その全体を色水２２中に浸けるように支持すること
も可能である。この場合には、図８に示されるように、
レーザートーチ９より出射されたレーザー光を光ファイ
バー１９により被加工材３０の上面３０ａの近傍まで導
光する等、レーザー光が被加工材３０に至るまでに色水
２２によって減衰することを防止できる光学系を採用す
るとよい。Also, when the color water 22 is used as the cooling medium, as shown in FIG.
Can be supported so as to be entirely immersed in the color water 22. In this case, as shown in FIG.
Optics that can prevent the laser light from being attenuated by the colored water 22 before reaching the workpiece 30, such as guiding the laser light emitted from the laser torch 9 to the vicinity of the upper surface 30 a of the workpiece 30 by the optical fiber 19. It is good to adopt a system.
【００６２】そして、図８に示されるように、被加工材
３０の全体を色水２２中に浸けると、色水により被加工
材３０を透過等したレーザー光の処理を簡易に行えるこ
とに加え、前記図６により説明したように、より短時間
で所要の熱応力を得ることができ、被加工材３０の切断
加工を短時間で速やかに行える。As shown in FIG. 8, when the entire workpiece 30 is immersed in the color water 22, the processing of the laser beam transmitted through the workpiece 30 by the color water can be easily performed. As described with reference to FIG. 6, the required thermal stress can be obtained in a shorter time, and the cutting of the workpiece 30 can be performed quickly in a short time.
【００６３】また、前記図４に示されたように、色水２
２を前記噴射ノズル１７により噴射することにより被加
工材３０に接触させるのであってもよい。即ち、少なく
とも被加工材３０の下面の切断位置Ｒの部分には色水２
２を水流として接触させるのである。また、図５に示さ
れたように、被加工材３０の下面３０ｂにおける切断位
置Ｒとレーザートーチ９の位置とがずれた位置関係とな
るようにし、また、レーザートーチ９を垂直方向に対し
て傾けるのであっても構わない。Further, as shown in FIG.
Alternatively, the workpiece 2 may be brought into contact with the workpiece 30 by injecting the workpiece 2 through the injection nozzle 17. That is, at least the portion of the lower surface of the workpiece 30 at the cutting position R is colored water 2
2 is brought into contact as a water stream. Further, as shown in FIG. 5, the cutting position R on the lower surface 30b of the workpiece 30 and the position of the laser torch 9 are shifted from each other, and the laser torch 9 is vertically moved. It can be tilted.
【００６４】また、冷却媒質として、氷点下以下の温度
にある固形物を用いることもできる。該固形物を用いる
例について、図９により説明する。As the cooling medium, a solid substance at a temperature below freezing can be used. An example using the solid will be described with reference to FIG.
【００６５】図９（ａ）は、冷却媒質槽１５中に、被加
工材３０の下面３０ｂに接触するように固形物２３を設
置した例を示している。かかる固形物２３により、被加
工材３０の下面３０ｂを、切断位置Ｒの部分を含めてよ
り強い冷却ができるので、必要な熱応力をより短時間内
に得ることができ、被加工材３０の切断加工をより短時
間で速やかに行える。FIG. 9A shows an example in which a solid substance 23 is set in the cooling medium tank 15 so as to contact the lower surface 30b of the workpiece 30. The solid material 23 allows the lower surface 30b of the workpiece 30 to be more strongly cooled, including the portion at the cutting position R, so that the necessary thermal stress can be obtained in a shorter time. Cutting can be performed quickly in a shorter time.
【００６６】かかる氷点下以下の温度にある固形物の具
体例として、氷やドライアイスを挙げることができる。
この氷やドライアイスは容易に入手し得るものである。
特に、ドライアイスを用いると、より強い冷却が可能で
あるので好ましい。Specific examples of the solid at a temperature below the freezing point include ice and dry ice.
This ice or dry ice is readily available.
In particular, it is preferable to use dry ice because stronger cooling is possible.
【００６７】また、氷点下以下の温度にある固形物を、
図９（ｂ）に示されるように被加工材３０に接触させる
のであってもよい。図９（ｂ）は、被加工材３０の下面
の切断位置Ｒを含む狭い部分に限って、固形物２３を接
触させた例を示している。かかる図９（ｂ）に示される
場合についても、被加工材３０の下面３０ｂの切断位置
Ｒの部分を前記固形物２３によって強く冷却することが
可能である。この図９（ｂ）に示されるように固形物２
３を接触させる場合について、図５に示されたように、
被加工材３０の下面３０ｂの切断位置Ｒとレーザートー
チ９の位置とがずれた位置関係となるようにし、また、
レーザートーチ９を垂直方向に対して傾けるのであって
も構わない。Further, a solid substance at a temperature below the freezing point is
The workpiece 30 may be brought into contact with the workpiece 30 as shown in FIG. FIG. 9B shows an example in which the solid material 23 is brought into contact with only a narrow portion including the cutting position R on the lower surface of the workpiece 30. Also in the case shown in FIG. 9B, the portion at the cutting position R on the lower surface 30 b of the workpiece 30 can be strongly cooled by the solid substance 23. As shown in FIG.
As shown in FIG. 5 for the case where 3 is brought into contact,
The cutting position R of the lower surface 30b of the workpiece 30 and the position of the laser torch 9 are shifted from each other, and
The laser torch 9 may be inclined with respect to the vertical direction.
【００６８】また、図９（ａ）、（ｂ）に示される場合
において、氷点下以下の温度にある固形物２３を色付き
固形物とし、該色付き固形物により被加工材を透過等し
たレーザー光を吸収させるようにしてもよい。かかる色
付き固形物を用いると、前記被加工材３０を強く冷却で
きることに加え、被加工材３０を透過等したレーザー光
の処理を簡易に行うこともできる。In the case shown in FIGS. 9 (a) and 9 (b), the solid material 23 at a temperature below the freezing point is regarded as a colored solid material, and the laser light transmitted through the workpiece by the colored solid material is used. You may make it absorb. When such a colored solid is used, the workpiece 30 can be strongly cooled, and processing of laser light transmitted through the workpiece 30 can be easily performed.
【００６９】かかる色付き固形物の具体例として、色付
きドライアイスを挙げることができる。この色付きドラ
イアイスは、例えば、以下のようにして製造することが
できる。即ち、ＣＯ2 液化ガスと、アイスクリーム等に
使用される食カラーとを噴射することにより得られた色
付きの綿状ドライアイスをプレスし、所望の形状に成形
すればよい。Specific examples of such colored solids include colored dry ice. This colored dry ice can be manufactured, for example, as follows. That is, colored cotton-like dry ice obtained by injecting a CO 2 liquefied gas and a food color used for ice cream or the like may be pressed and formed into a desired shape.
【００７０】前記被加工材であるガラス板には、成膜ガ
ラスや液晶ガラス基板等に用いられる各種用途のガラス
板が含まれる。また、前記被加工材には、前記ガラス板
以外にも、透明なアクリル樹脂材からなるもの等、可視
領域近傍の波長の光（略５００ｎｍ〜１μｍの波長の
光）を略透過する材料からなるものは含まれる。また、
これらの材料以外の材料からなる被加工材について、照
射される光を略透過する材料からなるものは当然含まれ
るが、照射される光に対する吸収率が高い材料により形
成されるのであっても構わない。即ち、被加工材が光を
吸収することによって生ずる加熱が被加工材を溶融させ
るに至らない程度であり、かかる加熱と、被加工材に冷
却媒質を接触させることとにより、被加工材を切断する
等の加工を行えるのであればよい。The glass plate as the material to be processed includes glass plates for various uses used for a film forming glass, a liquid crystal glass substrate and the like. Further, the work material is made of a material that substantially transmits light having a wavelength near the visible region (light having a wavelength of about 500 nm to 1 μm), such as a transparent acrylic resin material, other than the glass plate. Things are included. Also,
Of course, the material to be processed made of a material other than these materials includes a material substantially transmitting the irradiated light, but may be formed of a material having a high absorptance to the irradiated light. Absent. That is, the heating caused by the absorption of light by the workpiece does not lead to the melting of the workpiece, and the heating and the contact of the cooling medium with the workpiece cause the workpiece to be cut. Any processing can be used as long as the processing can be performed.
【００７１】また、加工に用いるレーザー光としてＹＡ
Ｇレーザー光を挙げて説明したが、ガラスレーザー光や
ルビーレーザー光を用いるのであってもよく、これら以
外のレーザー光であっても、被加工材を略透過する関係
にあるものの他、被加工材を溶融させるに至らない程度
に加熱できる関係にあればよい。Further, YA is used as a laser beam for processing.
Although the description has been given with reference to the G laser light, a glass laser light or a ruby laser light may be used. It is sufficient that the material can be heated to such an extent that the material is not melted.
【００７２】また、被加工材に光を照射するための光源
としてレーザー光の例を挙げて説明したが、レーザー光
以外の光を照射するのであってもよい。即ち、被加工材
を溶融させるに至らない程度に被加工材を加熱すること
ができ、冷却媒質を接触させることによる上記切断等の
加工が可能な程度に加熱できる出力の光源を用いるので
あってもよい。例えば、赤外線ランプの光を被加工材に
照射するのであっても、これによる加熱を介して上記切
断等の加工が可能であればよい。Further, although an example has been described in which laser light is used as a light source for irradiating a workpiece with light, light other than laser light may be applied. That is, a light source is used which can heat the work material to such an extent that the work material is not melted, and can heat the work material to such an extent that the cutting or the like by contacting the cooling medium can be performed. Is also good. For example, even if the material to be processed is irradiated with the light of an infrared lamp, any processing such as the above-mentioned cutting can be performed through heating by this.
【００７３】[0073]
【発明の効果】以上に説明したように、請求項１記載の
発明は、被加工材を光の照射によって加工するにあた
り、再現性の良い安定した高精密の加工を行うことがで
きるという効果を奏する。また、余分な作業工程を必要
とすることなく、作業時間や作業コストの増加を防ぐこ
ともできるという効果も奏する。As described above, the first aspect of the present invention has an effect that when processing a workpiece by irradiating light, stable and high-precision processing with good reproducibility can be performed. Play. In addition, there is an effect that an increase in operation time and operation cost can be prevented without requiring an extra operation step.
【００７４】請求項２記載の発明は、光を略透過する被
加工材を、光の吸収剤の塗布等を要することなく加工す
ることができ、加工に伴う作業時間や作業コストの増大
を招くことがなく、容易に加工を行えるという効果を奏
する。According to the second aspect of the present invention, it is possible to process a material which substantially transmits light without the need to apply a light absorbing agent or the like, which leads to an increase in working time and working costs associated with the processing. There is an effect that processing can be performed easily without any processing.
【００７５】請求項３記載の発明は、加工に伴い生ずる
被加工材の粉塵を容易かつ速やかに除去でき、被加工材
の品質の低下を容易に防ぐことができるという効果を奏
する。According to the third aspect of the present invention, there is an effect that dust on a workpiece to be processed can be easily and promptly removed, and the quality of the workpiece can be easily prevented from deteriorating.
【００７６】請求項４記載の発明は、冷却媒質として水
を用いることにより、設備の複雑化を招くことがなく設
備コストの低減を図ることができるという効果を奏す
る。According to the fourth aspect of the invention, by using water as the cooling medium, there is an effect that the cost of the equipment can be reduced without causing the equipment to be complicated.
【００７７】請求項５記載の発明は、冷却媒質として色
水を用いるので、被加工材を出射した光によるトラブル
を防ぐための該光の処理を簡易に行えるという効果を奏
する。According to the fifth aspect of the present invention, since colored water is used as the cooling medium, there is an effect that the processing of the light for preventing trouble caused by the light emitted from the workpiece can be easily performed.
【００７８】請求項６記載の発明は、被加工材の加工に
必要である熱応力を、より短時間内に得ることができ、
被加工材の加工を短時間で速やかに行えるという効果を
奏する。また、前記被加工材の粉塵の除去をより確実に
行えるという効果も奏する。According to the sixth aspect of the present invention, it is possible to obtain a thermal stress required for processing a workpiece in a shorter time,
There is an effect that processing of the workpiece can be performed quickly in a short time. Also, there is an effect that the dust can be more reliably removed from the workpiece.
【００７９】請求項７記載の発明は、被加工材を加工す
るための光の照射を容易に行うことができ、装置の複雑
化を防ぎ得るという効果を奏する。According to the seventh aspect of the present invention, it is possible to easily irradiate light for processing a material to be processed, and it is possible to prevent the apparatus from being complicated.
【００８０】請求項８記載の発明は、被加工材のより強
い冷却が可能であり、加工に必要な熱応力をより短時間
内に得ることができ、被加工材の加工をより短時間で速
やかに行えるという効果を奏する。According to the eighth aspect of the present invention, the workpiece can be cooled more strongly, the thermal stress required for the processing can be obtained in a shorter time, and the processing of the workpiece can be performed in a shorter time. This has the effect that it can be performed quickly.
【００８１】請求項９記載の発明は、被加工材のより一
層強い冷却が可能であり、被加工材の加工をより短時間
で速やかに行えるという効果を奏する。According to the ninth aspect of the present invention, there is an effect that the work material can be cooled more strongly, and the work material can be processed more quickly in a shorter time.
【００８２】請求項１０記載の発明は、被加工材のより
強い冷却が可能であるとともに、被加工材を出射した光
を簡易に処理することもできるという効果を奏する。According to the tenth aspect of the present invention, it is possible to cool the work material more strongly and to easily process light emitted from the work material.
【００８３】請求項１１記載の発明は、被加工材の一層
強い冷却が可能であるとともに、被加工材を出射した光
を簡易に処理することもできるという効果を奏する。According to the eleventh aspect of the present invention, it is possible to cool the work material more strongly and to easily process the light emitted from the work material.
【００８４】請求項１２記載の発明は、熱源としての光
の照射が容易であるという効果を奏する。According to the twelfth aspect of the present invention, it is possible to easily irradiate light as a heat source.
【００８５】請求項１３、請求項１４記載の発明は、請
求項１記載の発明と同様の効果を奏する。The inventions of claims 13 and 14 have the same effects as the invention of claim 1.
【００８６】請求項１５、請求項１９記載の発明は、請
求項３記載の発明と同様の効果を奏する。The inventions of claims 15 and 19 have the same effects as the invention of claim 3.
【００８７】請求項１６、請求項２０記載の発明は、請
求項５記載の発明と同様の効果を奏する。The inventions of claims 16 and 20 have the same effects as the invention of claim 5.
【００８８】請求項１７記載の発明は、請求項８記載の
発明と同様の効果を奏する。The seventeenth invention has the same effect as the eighth invention.
【００８９】請求項１８記載の発明は、請求項１０記載
の発明と同様の効果を奏する。The eighteenth invention has the same effect as the tenth invention.
【００９０】請求項２１記載の発明は、請求項１２記載
の発明と同様の効果を奏する。The twenty-first aspect has the same effect as the twelfth aspect.
【図１】加工装置の斜視図である。FIG. 1 is a perspective view of a processing apparatus.
【図２】加工装置の一部の垂直断面図である。FIG. 2 is a vertical sectional view of a part of the processing apparatus.
【図３】図２の部分拡大図である。FIG. 3 is a partially enlarged view of FIG. 2;
【図４】冷却媒質の供給の一例を示す垂直断面図であ
る。FIG. 4 is a vertical sectional view showing an example of supply of a cooling medium.
【図５】冷却媒質を接触させる位置と光の照射条件の一
例を示す図である。FIG. 5 is a diagram showing an example of a position where a cooling medium is brought into contact and light irradiation conditions.
【図６】被加工材を冷却媒質中に浸けた状態を示す図で
ある。FIG. 6 is a diagram showing a state in which a workpiece is immersed in a cooling medium.
【図７】冷却媒質として色水を用いた例を示す図であ
る。FIG. 7 is a diagram showing an example in which colored water is used as a cooling medium.
【図８】被加工材を色水の中に浸けた例を示す図であ
る。FIG. 8 is a diagram illustrating an example in which a workpiece is immersed in color water.
【図９】冷却媒質として氷点下以下の温度の固形物を用
いた例を示す図である。FIG. 9 is a diagram showing an example in which a solid having a temperature below freezing is used as a cooling medium.
１ 加工装置 ２ 基台 ３ 作業テーブル ４ 枠体 ５ 移動体 ６ 昇降体 ７ 旋回体 ８ 回動体 ９ レーザートーチ １０ レーザー発振器 １１ａ，１１ｂ レーザー光案内筒 １５ 冷却媒質槽 １６ 支持部材 １７ 噴射ノズル １９ 光ファイバー ２１ 水 ２２ 色水 ２３ 固形物 ３０ 被加工材 ３０ａ 被加工材の上面 ３０ｂ 被加工材の下面 DESCRIPTION OF SYMBOLS 1 Processing apparatus 2 Base 3 Work table 4 Frame 5 Moving body 6 Elevating body 7 Revolving body 8 Rotating body 9 Laser torch 10 Laser oscillator 11a, 11b Laser light guide cylinder 15 Cooling medium tank 16 Support member 17 Injection nozzle 19 Optical fiber 21 Water 22 Color water 23 Solid 30 Work material 30a Upper surface of work material 30b Lower surface of work material
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｆ２５Ｄ 3/02 Ｆ２５Ｄ 3/02 3/12 3/12 Ｆターム(参考） 3L044 AA04 BA06 CA12 DB01 DC02 FA09 KA04 4E068 AE00 CB06 CH01 CH08 CJ07 DB13 4G015 FA06 FB02 FC11 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI theme coat ゛ (reference) F25D 3/02 F25D 3/02 3/12 3/12 F term (reference) 3L044 AA04 BA06 CA12 DB01 DC02 FA09 KA04 4E068 AE00 CB06 CH01 CH08 CJ07 DB13 4G015 FA06 FB02 FC11
Claims (21)
ることによって加工する加工方法であって、 冷却媒質を、少なくとも、前記被加工材の前記光が出射
する側における加工位置の部分に接触させることを特徴
とする光による被加工材の加工方法。1. A processing method for processing a material to be processed by irradiating a light to a processing position thereof, wherein a cooling medium is formed at least in a part of the processing position on a side from which the light of the material is emitted. A method for processing a workpiece by light, characterized by contacting the workpiece.
透過する光透過性材料からなることを特徴とする請求項
１記載の加工方法。2. The processing method according to claim 1, wherein the workpiece is made of a light transmissive material that substantially transmits the irradiated light.
する請求項１または請求項２記載の加工方法。3. The processing method according to claim 1, wherein the cooling medium is a liquid.
る請求項３記載の加工方法。4. The processing method according to claim 3, wherein said cooling medium is water.
であることを特徴とする請求項３記載の加工方法。5. The processing method according to claim 3, wherein the cooling medium is colored water absorbing the light.
に浸けることを特徴とする請求項３乃至請求項５のいず
れかに記載の加工方法。6. The processing method according to claim 3, wherein the entirety of the workpiece is immersed in the cooling medium.
が、前記冷却媒質の外部に晒されていることを特徴とす
る請求項３乃至請求項５のいずれかに記載の加工方法。7. The processing method according to claim 3, wherein a portion of the workpiece to which the light is incident is exposed to the outside of the cooling medium.
る固形物であることを特徴とする請求項１または請求項
２記載の加工方法。8. The processing method according to claim 1, wherein the cooling medium is a solid substance at a temperature below freezing.
ライアイスであることを特徴とする請求項８記載の加工
方法。9. The processing method according to claim 8, wherein the solid at a temperature below the freezing point is dry ice.
ある、前記光を吸収する色付き固形物であることを特徴
とする請求項８記載の加工方法。10. The processing method according to claim 8, wherein the cooling medium is a colored solid that absorbs the light and has a temperature below freezing.
イスであることを特徴とする請求項１０記載の加工方
法。11. The processing method according to claim 10, wherein the colored solid is colored dry ice.
至請求項１１のいずれかに記載の加工方法。12. The processing method according to claim 1, wherein the light is a laser beam.
する光照射装置と、 冷却媒質を、少なくとも、前記被加工材の前記光が出射
する側における加工位置の部分に接触させるように供給
することができる冷却媒質供給装置とを備えてなる光に
よる被加工材の加工装置。13. A light irradiation device for irradiating a light to a processing position on a workpiece, and a cooling medium so as to contact at least a part of the processing position on the light emitting side of the workpiece. An apparatus for processing a workpiece by light, comprising: a cooling medium supply device capable of supplying a cooling medium.
貯蔵することができる冷却媒質槽を備えてなる請求項１
３記載の加工装置。14. The cooling medium supply device according to claim 1, further comprising a cooling medium tank capable of storing the cooling medium.
3. The processing apparatus according to 3.
記載の加工装置。15. The cooling medium according to claim 14, wherein the cooling medium is a liquid.
The processing device as described.
請求項１５記載の加工装置。16. The processing apparatus according to claim 15, wherein the liquid is colored water that absorbs light.
ある固形物である請求項１４記載の加工装置。17. The processing apparatus according to claim 14, wherein the cooling medium is a solid at a temperature below freezing.
が、光を吸収する色付き固形物である請求項１７記載の
加工装置。18. The processing apparatus according to claim 17, wherein the solid at a temperature below the freezing point is a colored solid that absorbs light.
材の前記光が出射する側における加工位置の部分に液体
を噴射することができる噴射ノズルを備えてなる請求項
１３記載の加工装置。19. The processing apparatus according to claim 13, wherein the cooling medium supply device includes an injection nozzle capable of injecting a liquid at a processing position on the light emitting side of the workpiece.
請求項１９記載の加工装置。20. The processing apparatus according to claim 19, wherein the liquid is colored water absorbing light.
するレーザー装置である請求項１３乃至請求項２０のい
ずれかに記載の加工装置。21. The processing apparatus according to claim 13, wherein the light irradiation device is a laser device that irradiates a laser beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10186264A JP2000015467A (en) | 1998-07-01 | 1998-07-01 | Working method of workpiece by beam and its working device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10186264A JP2000015467A (en) | 1998-07-01 | 1998-07-01 | Working method of workpiece by beam and its working device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000015467A true JP2000015467A (en) | 2000-01-18 |
Family
ID=16185249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10186264A Withdrawn JP2000015467A (en) | 1998-07-01 | 1998-07-01 | Working method of workpiece by beam and its working device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000015467A (en) |
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