JPH0697329A - Ic socket - Google Patents

Abstract

PURPOSE:To provide an inspection technique that can prevent the deformation of external leads of a surface mount type semiconductor device in an inspection process, and to improve a yield in the inspection process by means of that inspection technique. CONSTITUTION:When a semiconductor device 15 is positioned, contact points 14 of a surface contact type IC socket in an inspection equipment are made flush with the upper surface of a partition section 11 of a support member 10 which is adjacent to the contact points 14. When the semiconductor device 15 is measured, the support member 10 moves downward. This makes small a difference in level between the contact points of the IC socket and the upper surface of the support member that has electrical insulating characteristics and supports a connection pin, and hence it can prevent external leads of the semiconductor device from dropping off the contact points.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the field of semiconductor device manufacturing, and more particularly to a technique effective for use in semiconductor device inspection and testing (hereinafter referred to simply as "inspection").

[0002]

2. Description of the Related Art A wafer completed in a wafer processing process for forming a plurality of integrated circuits on a semiconductor wafer and a semiconductor device completed in an assembling process usually have sufficient semiconductor devices in a wafer inspection process and a final inspection process, respectively. Get inspected for characteristics and quality. FIG. 1 shows the basic configuration of inspection equipment for performing these inspections. The semiconductor device 1 set at the contact of the measurement auxiliary circuit unit 2 is
The measuring unit 3 measures the circuit function and characteristics. The control unit 4 stores, stores, and executes a program for measuring the semiconductor device 1. The result of executing the program is output to the display unit 5 and a good product or a defective product is identified. In addition, when it is connected to a sorting device, it is sorted into good products and defective products.

When a semiconductor device is set at the contact of the measurement auxiliary circuit section, usually, the measurement parts corresponding to the types are exchanged and used so that a plurality of types of semiconductor devices can be performed by one device. . Particularly, in the final inspection process, the number of pins and the shape of the lead-out leads of the package of the semiconductor device are various, and it is necessary to replace the measurement component depending on the number and the shape of the lead-out leads. IC sockets are often used as measuring components used in the final inspection process of semiconductor devices. The shape of the outside of the package derivation leads of the semiconductor device, for example, DIP (D ual I n-line P ac
Insertion and like kage), SOP (S mall O utline P ack
age) and QFP (are classified into a surface-mounted, such as Q uad F lat P ackage), IC socket also has as one of the insertion type according to the shape of the leads and the surface contact. A top view of the surface contact type IC socket 41 is shown in FIG. 44
Is a contact with which the external lead of the package contacts.
The contact point 44 normally projects in a convex shape from the upper surface of the support member 42 and has an elastic force so as to make good contact with the external lead-out lead 46. FIG. 7 is a sectional view taken along the line DD ′ of FIG. The upper surface of the connection pin 43 serves as a contact 45, and the connection pin 43 is curved in the support member 42 so as to have an elastic force. IC socket 4 having the above configuration
1 is connected to the circuit board of the measurement auxiliary circuit unit 2 shown in FIG. The semiconductor device 45 is positioned and then set in the IC socket 41 and measured.

A technique relating to the measurement of a semiconductor device is disclosed in, for example, Japanese Patent Application Laid-Open No. 63-293482, Japanese Patent Application Laid-Open No. 1-140748 and the like.

[0005]

In the assembling process, after cutting and forming, since the reinforcing means (tie bar or dam bar) of the externally derived lead of the semiconductor device has already been cut, the probability of lead deformation occurs. Grows larger. In particular, in the final inspection step, mechanical stress is directly applied to the externally drawn lead in order to reduce the contact resistance, so that the lead is most likely to be deformed. Of the semiconductor devices, the surface-mounting type semiconductor device has a lead width and a lead-to-lead lead-out which are generally narrow, so the strength of the lead is weak and the lead is easily deformed. Therefore, when the semiconductor device is pressed by contacting the convex contact of the IC socket with the lead bent slightly, the lead falls off from the contact, and the external lead 46 becomes larger as shown in FIG. It will be transformed. If the lead is greatly deformed in this way, it will be defective due to insufficient contact with the contact, and even if the deformed lead 46 comes into contact with the adjacent contact or the lead, it will be a defective product in the inspection process.
In addition, the appearance is defective. That is, even if the product is a good product in the inspection process, a defective product is produced, and the yield in the final inspection process may be significantly reduced.

Therefore, the present invention provides an inspection technique capable of preventing the external leads of a surface-mount type semiconductor device from being deformed in the inspection process, thereby improving the yield in the inspection process. To aim.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0008]

The outline of the representative one of the inventions disclosed in the present application will be briefly described as follows. That is, in the inspection, the contact of the surface contact type IC socket and the upper surface of the adjacent supporting member which separates the plurality of contacts from each other are flush with each other when the semiconductor device is positioned, and Even at the time of measurement, a part or all of the support member moves downward, and means for constantly reducing the step between the contact point and the upper surface of the support member is provided.

[0009]

According to the above means, the step between the contact of the IC socket and the upper surface of the insulating support member supporting the connection pin is small or eliminated not only when the semiconductor device is positioned but also when the semiconductor device is measured. Therefore, the lead-out lead of the semiconductor device does not drop off from the contact, and even if it falls off, the deformation of the lead due to the drop-out is minimized.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

FIG. 2 is a top view of the IC socket 9 used in the semiconductor device measuring apparatus of the present invention. FIG. 3 shows a cross section of AA ′ of the IC socket 9 when the semiconductor device 15 is positioned. Reference numeral 10 denotes a support member, which is made of an insulating material, for example, resin such as plastic. A sealing body mounting portion 12 is provided in the central portion of the support member 10, the sealing portion of the semiconductor device 15 is mounted, and the sealing body mounting portion 12 is pressed from above via the semiconductor device 15. By doing so, the entire supporting member 10 is pressed. Reference numeral 13 is a connection pin, which is supported by the support member 10 in accordance with the lead row of the external lead 16 of the semiconductor device 15. The upper surface of the connection pin 13 serves as a contact 14 for contacting the external lead 16 and is arranged in the same plane as the upper surface of the partition 11 of the support member 10 that separates the contact 14 from each other. As a result, when the semiconductor device 15 is positioned in the IC socket 9, the lead-out lead 16 does not fall off from the contact 14, and thus the lead can be prevented from being deformed. Inside the support member 10, the connection pin 13 has a curved portion so that the contact point of the external lead 16 and the contact point 14 of the connection pin 13 have an elastic force so as to press each other. The lower portion of the curved portion is formed substantially perpendicular to the downward direction of the connecting pin 13.
It acts as a downward stopper of the connecting pin 13.
A portion below the curved portion penetrates the through hole 17 perpendicularly to the lower surface portion of the support member 10. The connection pin 13 penetrating the through hole 17 is not fixed to the support member 10 at the through hole 17 but is vertically movable. Further, a connection pin fixing member 18 made of an insulating material is provided below the connection pin 13 and serves as a stopper when the connection pin 13 is inserted into the circuit board 20. An elastic member, for example, a spring 19 is provided between the support member 10 and the connection pin fixing member 18 to apply an elastic force to the support member 10.

Next, the state of the IC socket 9 during measurement will be described with reference to FIG.

The semiconductor device 15 positioned in the IC socket 9 has its sealing portion pressed from above by the pressing member 22. The support member 10 is pressed by the sealing body mounting portion 12 via the pressed sealing portion,
The entire support member 10 is pressed downward. The pressed support member 10 sinks downward, but since the connection pin 13 is fixed to the circuit board 20, the curved portion of the connection pin 13 is raised from the support member 10 inside the support member 10. Therefore, the contact point 14 of the connecting pin 13 in the floating state and the contact point of the external lead 16 of the semiconductor device 15 being pressed are in a state of pressing each other. Therefore, the semiconductor device 15 can be measured while the shape of the external lead 16 is maintained and the contact state of the contact of the connection pin 13 and the contact of the external lead 16 is kept good.

At the end of the measurement, the pressing force from above is released, so that the support member 10 is pushed back by the action of the spring 19 and the IC socket 9 returns to the state at the time of positioning.

The IC socket 9 described above is connected to the circuit board 20 of the measurement auxiliary circuit section 2 of the measuring apparatus shown in FIG. The semiconductor device supplied from the sample supply unit 7 is positioned and then set in the IC socket and measured. For the semiconductor device whose circuit function, characteristics, and the like have been measured by the measurement unit 3, the measurement result is displayed on the display unit 5. In addition, when it is connected to the sorting device, it is sorted into good products and defective products and stored in the sample storage unit 8.

Next, the function and effect of this embodiment will be described.

According to this embodiment, the following effects can be obtained. That is, (1) since the contact with which the external lead of the surface-mount type semiconductor device comes into contact and the upper surface of the partition portion separating the contacts are flush with each other when positioning the semiconductor device, Even if the lead shifts from the contact, it does not fall off. Therefore, it is possible to prevent the lead from being deformed due to the externally derived lead coming off from the contact, and it is possible to improve the yield in the inspection process.

(2) Since the deformation of the leads can be prevented by the above (1), it is possible to prevent an electrical short circuit due to the deformed leads coming into contact with an adjacent lead or a contact.

(3) The lead-out lead of the semiconductor device is positioned without dropping from the contact, and at the time of measurement, at the same time when the supporting member sinks due to the pressing force from above, the pressing force of the contact of the connection pin from below is applied. Since it starts to work, it is possible to prevent the lead from being deformed due to dropping from the contact, and also to maintain a good contact state between the external lead and the contact.

The invention made by the present inventor has been specifically described based on the embodiments, but the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say. For example, in the above-described embodiment, the contact of the IC socket and the supporting member are made to have an elastic force independently of each other.
Further, as shown in FIG. 6, the structure in which the row of the plurality of contacts 25 of the IC socket 23 and the upper surface of the support member 24 in the peripheral portion of the row are fixed on the same plane and the support member 24 can be moved up and down. . In the case of this structure, when the semiconductor device 29 is positioned and then pressed from above, the contact 25 is pressed through the external lead 30 and sinks. Since the contact point 25 is fixed to the upper surface of the support member 24, the contact point 25 sinks together with the support member 24. At this time, inside the support member 24,
Since the curved portion of the connection pin 26 is lifted from the support member 24, elastic force is generated, and the contact state between the contact 25 and the external lead 30 can be improved. At the same time, since the contact 25 and the upper surface of the support member 24 maintain the same plane even during measurement, it is possible to prevent the external lead-out lead 30 from falling off during measurement.

Similar to the above, as a structure in which the contacts are fixed on the same plane as the supporting member in the peripheral portion thereof, as shown in FIGS. 7 and 8, only the peripheral portion of the contact row can be partially moved up and down. The same effect as described above is obtained. In the case of this structure, the partial support 35 around the contact 36 does not tilt when the semiconductor device 38 is set on the support 35 and pressed by the guide 37 of the support member 33 around the contact. The pressing force can be uniformly applied to each external lead 39.

In the above embodiment, the SOP type semiconductor device was used as the surface mount type semiconductor device measured by the inspection equipment, but another surface mount type semiconductor device, for example, Q.
FP type and SOJ (S mall O utline J -leaded Packag
e) type, PLCC (P lastic L eaded C hip C arrier)
It can be used for surface mounting type semiconductor devices such as types. Further, the present invention is used in various measuring devices such as a digital IC tester, a linear IC tester, an auto handler, etc., and exerts a sufficient effect.

[0023]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

That is, the contact of the surface contact type IC socket in the inspection equipment is formed substantially flush with the upper surface of the insulative supporting member for supporting the connection pin, so that the IC can be positioned when the semiconductor device is positioned. Since the step between the contact of the socket and the upper surface of the insulating support member that supports the connection pin is small or disappears, it is possible to prevent the external lead-out lead of the semiconductor device from falling off from the contact, and even if it falls, The deformation of the leads can be minimized. Further, when measuring the semiconductor device, the pressing force of the contact is generated due to the support member sinking downward, so that the contact state between the external lead and the contact can be well maintained, and the yield in the inspection process can be improved. It is a thing.

[0025]

[Brief description of drawings]

FIG. 1 is a diagram showing a basic configuration of inspection equipment using the present invention.

FIG. 2 is a diagram showing a top surface of an IC socket of a measuring device according to an embodiment of the present invention.

FIG. 3 is a diagram showing a cross section of AA ′ when the IC socket of FIG. 2 is positioned.

FIG. 4 is a view showing a cross section taken along the line AA ′ of the IC socket shown in FIG.

FIG. 5 is a diagram showing a top surface of an IC socket which is an application example of the present invention.

FIG. 6 is a view showing a cross section taken along the line BB ′ of the IC socket of FIG.

FIG. 7 is a diagram showing a top surface of an IC socket which is another application example of the present invention.

FIG. 8 is a view showing a cross section of CC ′ of the IC socket of FIG. 7.

FIG. 9 is a view showing a top surface of a conventional surface contact type IC socket.

FIG. 10 is a diagram showing a cross section of the IC socket of FIG. 9 taken along the line D-D ′.

FIG. 11 is a diagram showing a problem of a conventional surface contact type IC socket.

[Explanation of symbols]

1 ... Semiconductor device, 2 ... Measuring auxiliary circuit unit, 3 ... Measuring unit, 4 ... Control unit, 5 ... Display unit, 6 ... Operating unit, 7 ...
・ Sample supply unit, 8 ・ ・ Sample storage unit, 9 ・ ・ IC socket, 10 ・ ・ Supporting member, 11 ・ ・ Partitioning unit, 12 ・ ・ Sealing body mounting unit, 13 ・ ・ Connecting pin, 14 ・ ・ Contact point , 15 ...
・ Semiconductor device, 16 ・ ・ External lead, 17 ・ ・ Through hole, 18 ・ ・ Connecting pin fixing member, 19 ・ ・ Spring, 20 ・
.Circuit boards, 21 ... Board wiring, 22 ... Pressing members, 2
3 ... IC socket, 24 ... Support member, 25 ... Contact point, 26 ... Connection pin, 27 ... Through hole, 28 ... Stopper, 29 ... Semiconductor device, 30 ... External lead-out,
31..Pressing member, 32..IC socket, 33..Supporting member, 34..Connecting pin, 35..Supporting body, 36 ..
Contact 37 ... Guide, 38 ... Semiconductor device, 39 ... External lead-out, 40 ... Pressing member, 41 ... Semiconductor device, 42 ... Supporting member, 43 ... Connection pin 44 ... Contact, 45 ... Semiconductor device, 46 ...
7 ... Pressing member

Claims (3)

[Claims] 1. A surface contact type IC socket having a plurality of connection pins for electrically connecting to an external lead of a surface mount type semiconductor device and a contact on the upper surface of the connection pin, wherein the socket portion Is composed of an insulating support member that supports the connection pin, and at the time of positioning the semiconductor device, the plurality of contacts and an upper surface of a partition portion that separates the contacts form the same plane, An IC socket characterized in that at the time of measurement, a part or all of the support member is movable downward. 2. The IC socket according to claim 1, wherein the external lead-out lead and the contact point press each other when measuring the semiconductor device. 3. The IC socket according to claim 1, wherein the IC socket has an elastic member for giving the supporting member an elastic force.