JPS6362366A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPS6362366A JPS6362366A JP20726486A JP20726486A JPS6362366A JP S6362366 A JPS6362366 A JP S6362366A JP 20726486 A JP20726486 A JP 20726486A JP 20726486 A JP20726486 A JP 20726486A JP S6362366 A JPS6362366 A JP S6362366A
- Authority
- JP
- Japan
- Prior art keywords
- molded body
- resin molded
- outer frame
- lead
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims abstract description 36
- 229920005989 resin Polymers 0.000 claims abstract description 36
- 238000000465 moulding Methods 0.000 abstract description 4
- 230000035515 penetration Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 4
- 230000003679 aging effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008733 trauma Effects 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、主に、樹脂封止型電子部品に利用することの
できるリードフレームに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention mainly relates to a lead frame that can be used for resin-sealed electronic components.
従来の技術
たとえば、半導体集積回路装置のように、複数の外部電
極端子を有し、それらの各端子面積ならびに各端子間隔
の微細な樹脂封止型電子部品では、その製造過程で、外
部電極端子を個別に分離して、電気的に機能し得るよう
な状態で樹脂成形体をリードフレームの外枠部に固定し
たまま、その電気緒特性の検査を実施することがある。2. Description of the Related Art For example, in resin-sealed electronic components such as semiconductor integrated circuit devices, which have multiple external electrode terminals, each terminal area and each terminal spacing are minute, the external electrode terminals are In some cases, the electrical properties of the resin molded body are inspected while the resin molded body is fixed to the outer frame portion of the lead frame in a state where it can function electrically.
この場合の従来例は、特定のリード構体、たとえば、半
導体チップを載置した内部支持構体とリードフレームの
外枠部とを連結するアンカーが用いられていた。In this case, a conventional example uses an anchor that connects a specific lead structure, for example, an internal support structure on which a semiconductor chip is placed, and an outer frame portion of a lead frame.
発明が解決しようとする問題点
しかしながら、上述の従来例では、アンカーの接続され
た特定のリード構体が外枠部と電気的に接続されている
ため、この特定のリード構体自体の電気特性を検査する
ことがむづかしいこと、また、最終的に、とのアンカー
を切断して、樹脂成形体を外枠部から切り離したとき、
その切断部分が樹脂成形体の外部に露出するため、この
部分からの耐湿性低下も無視できないこと、などの問題
点がある。Problems to be Solved by the Invention However, in the above-mentioned conventional example, since the specific lead structure to which the anchor is connected is electrically connected to the outer frame, the electrical characteristics of this specific lead structure itself must be inspected. In addition, when the anchors are finally cut and the resin molded body is separated from the outer frame,
Since the cut portion is exposed to the outside of the resin molded body, there are problems such as a non-negligible drop in moisture resistance from this portion.
問題点を解決するための手段
本発明は、これらの問題点を解消するもので、要約する
に、一端が樹脂成形体内に封止されるリード部、同リー
ド部の他端を連結する外枠部および前記外枠部から前記
樹脂成形体内に突入する位置まで延び、同樹脂成形体を
支承するための突起部を前記外枠部に結合してそなえた
リードフレームである。Means for Solving the Problems The present invention solves these problems.In summary, it includes a lead part whose one end is sealed in a resin molded body, and an outer frame connecting the other end of the lead part. The lead frame is provided with a protrusion coupled to the outer frame and extending from the outer frame to a position protruding into the resin molded body and for supporting the resin molded body.
作用
本発明の構成によると、外部電極端子、すなわち、リー
ドフレームのリード部が同リードフレームの外枠部から
切り離された状態でも、外枠部から延びた突起部の先端
を樹脂成形体に突入させて、同樹脂成形体を支承固定し
得る。なお、外枠部から延びる突起部はいずれの外部電
極端子とも電気的に非接触であり、この突起部が完成電
子部品の電気的諸特性に影響を及ぼすこともない。According to the structure of the present invention, even when the external electrode terminal, that is, the lead part of the lead frame is separated from the outer frame part of the lead frame, the tip of the protrusion extending from the outer frame part can be inserted into the resin molded body. By doing so, the resin molded body can be supported and fixed. Note that the protrusion extending from the outer frame is not in electrical contact with any external electrode terminal, and this protrusion does not affect the electrical characteristics of the completed electronic component.
実施例
第１図は本発明実施例のリードフレームとこれを用いて
形成した電子部品の半製品を示す一部破断斜視図であり
、第２図はその一部拡大図である。この実施例のリード
フレームは、リード部１を四囲の外枠部２から内側に向
って多数配列した構造であり、同リード部１の内側先端
部分には、電子部品の主部、たとえば、半導体集積回路
のチップを載置し、その各電極部を外部電極端子、すな
わち、この多数のリード部１に接続した結線部を有し、
そして、この部分を樹脂成形体３で封止して用いるもの
である。このリードフレームには、外枠部２から樹脂成
形体３に向って延びる突起部４をそなえ、この突起部４
は先端の一部が樹脂成形体４の中に突入して埋まる位置
まで延長されている。経験によると、樹脂封止型半導体
集積回路装置の場合、その樹脂封止成形体３の四隅に、
この突起部４が突入される構成にするとき、その突入部
の形状は幅０．０５ｍｎ＋〜５．０調、同深さ０．０５
ｎ＋ｎ＋〜５．０開の範囲に設定するとよく、また、深
さ方向の幅員を順次径小な構造にすることが好適である
。Embodiment FIG. 1 is a partially cutaway perspective view showing a lead frame according to an embodiment of the present invention and a semifinished electronic component formed using the lead frame, and FIG. 2 is a partially enlarged view thereof. The lead frame of this embodiment has a structure in which a large number of lead parts 1 are arranged inward from a surrounding outer frame part 2, and the inner tip part of the lead part 1 contains the main part of an electronic component, such as a semiconductor. It has a connection part on which an integrated circuit chip is mounted, and each electrode part thereof is connected to an external electrode terminal, that is, a large number of lead parts 1,
Then, this portion is sealed with a resin molded body 3 for use. This lead frame is provided with a protrusion 4 extending from the outer frame 2 toward the resin molded body 3.
is extended to a position where a part of the tip protrudes into the resin molded body 4 and is buried therein. According to experience, in the case of a resin-sealed semiconductor integrated circuit device, the four corners of the resin-sealed molded body 3 are
When the protrusion 4 is configured to be inserted, the shape of the protrusion is 0.05 mm+ to 5.0 mm wide and 0.05 mm deep.
It is preferable to set the width in the range of n+n+ to 5.0 openings, and it is also preferable to have a structure in which the width in the depth direction becomes gradually smaller in diameter.
電子部品としては、樹脂封止成形後に、リード部１は、
外枠部２から切り離すと共に、各リード部を橋絡したタ
イバー５も切断して、それぞれ、単位の外部電極端子と
して分離する。この段階では、樹脂成形体３が突起部４
の先端突入によって外枠部２に支承されており、外枠部
２と一体で移送ならびに固定して取扱うことができ、外
枠部２に配設されたパイロット穴６は、そのまま、外部
電極端子の位置合せにも用いることができる。したがっ
て、この状態で、外部電極端子の成形、電気的諸特性の
検査ならびに、必要に応じて、この電子部品をプリント
配線基板に実装の各工程を遂行することができる。As an electronic component, after resin sealing molding, the lead part 1 is
At the same time as being separated from the outer frame part 2, the tie bars 5 bridging each lead part are also cut to separate them into unit external electrode terminals. At this stage, the resin molded body 3 is
It is supported by the outer frame part 2 by inserting the tip of the outer frame part 2, and can be transported and fixed together with the outer frame part 2 and handled. It can also be used for alignment. Therefore, in this state, the steps of molding the external electrode terminals, inspecting various electrical characteristics, and, if necessary, mounting the electronic component on the printed wiring board can be performed.
樹脂成形体３から突起部４の突入部分を分離するには、
同突起部４を引き抜く方向に移動させればよい。To separate the projecting portion of the protrusion 4 from the resin molded body 3,
What is necessary is just to move the protrusion 4 in the direction to pull it out.
第３図ａ、ｂは、樹脂成形体３から突起部４を引き抜く
過程を示す一例の断面図であり、まず、第３図ａのよう
に、樹脂成形体３および突起部４を含む外枠部２を、保
持手段（上型１０．下型１１）で保持し、次に、この保
持手段に具備されたポンチ１２を矢印の方向に押し下げ
ることにより、第３図すのように、突起部４が湾曲して
、その突入部は樹脂成形体３から引き離される。このよ
うにすれば、樹脂成形体３に損傷を与えることなく、容
易に分離することが可能であり、また、その突入部を引
き抜いた跡に小さな窪みは残るものの、樹脂成形体３の
封止機能は完全に維持されており、耐湿性などの経時特
性に影響を及ぼすことはない。FIGS. 3a and 3b are cross-sectional views of an example showing the process of pulling out the protrusion 4 from the resin molded body 3. First, as shown in FIG. 3a, the outer frame including the resin molded body 3 and the protrusion 4 is The part 2 is held by the holding means (the upper die 10 and the lower die 11), and then, by pushing down the punch 12 provided on this holding means in the direction of the arrow, the protrusion is removed as shown in Fig. 3. 4 is curved, and its protruding portion is separated from the resin molded body 3. In this way, it is possible to easily separate the resin molded body 3 without damaging it, and although a small depression remains after the protruding part is pulled out, the resin molded body 3 can be sealed. Functionality is fully maintained and aging properties such as moisture resistance are not affected.
発明の効果
本発明によれば、リードフレームの外枠部に突起部を設
け、この突起部の先端を樹脂成形体内に突入させて、外
枠部と樹脂成形体とを電気的に絶縁分離して固持し、こ
の状態で樹脂成形体から導出された外部電極端子を通じ
て、電子部品本体の電気的諸特性の検査を安定、迅速に
実施することができる。また、樹脂成形体から突起部を
分離する際にも、同突起部はその先端の一部が樹脂成形
体内に差し込まれているのみであり、分離には、それを
引き抜くだけの簡単な操作で達成でき、樹脂成形体に影
響を留めるような応力あるいは外傷を発生することもな
いので、本発明は、電子部品の品質、性能の維持向上に
有益である。Effects of the Invention According to the present invention, a protrusion is provided on the outer frame of the lead frame, and the tip of the protrusion protrudes into the resin molded body, thereby electrically insulating and separating the outer frame and the resin molded body. In this state, various electrical characteristics of the electronic component body can be stably and quickly inspected through external electrode terminals led out from the resin molded body. Furthermore, when separating the protrusion from the resin molded body, only a portion of the tip of the protrusion is inserted into the resin molded body, and separation is as simple as pulling it out. The present invention is useful for maintaining and improving the quality and performance of electronic components because it does not generate stress or trauma that would affect the resin molded body.
第１図は本発明実施例の概要を表わす電子部品（半製品
）の一部破断斜視図、第２図はその一部拡大図、第３図
ａ、ｂは突起部引き抜き工程例の工程順断面図である。
１・・・・・・（リードフレームの）リード部、２・・
・・・・同外枠部、３・・・・・・樹脂成形体、４・・
・・・・突起部、５・・・・・・タイバー。
代理人の氏名 弁理士 中尾敏男 ほか１名ｔｓ１図Fig. 1 is a partially cutaway perspective view of an electronic component (semi-finished product) showing an outline of an embodiment of the present invention, Fig. 2 is a partially enlarged view thereof, and Figs. FIG. 1...Lead part (of lead frame), 2...
...Same outer frame portion, 3...Resin molded body, 4...
...Protrusion, 5...Tie bar. Name of agent: Patent attorney Toshio Nakao and one other person ts1 diagram
Claims (2)
ード部の他端を連結する外枠部および前記外枠部から前
記樹脂成形体内に突入する位置まで延び、同樹脂成形体
を支承するための突起部を前記外枠部に結合してそなえ
たリードフレーム。(1) A lead part whose one end is sealed inside the resin molded body, an outer frame part connecting the other end of the lead part, and a lead part extending from the outer frame part to a position where it protrudes into the resin molded body, and which extends into the resin molded body. A lead frame including a protrusion for supporting coupled to the outer frame.
５ｍｍ〜５．０ｍｍの範囲に設定された特許請求の範囲
第（１）項記載のリードフレーム。(2) The depth at which the protrusion penetrates into the resin molded body is 0.0
The lead frame according to claim (1), wherein the lead frame is set in a range of 5 mm to 5.0 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20726486A JPS6362366A (en) | 1986-09-03 | 1986-09-03 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20726486A JPS6362366A (en) | 1986-09-03 | 1986-09-03 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6362366A true JPS6362366A (en) | 1988-03-18 |
Family
ID=16536911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20726486A Pending JPS6362366A (en) | 1986-09-03 | 1986-09-03 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6362366A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03105959A (en) * | 1989-09-19 | 1991-05-02 | Nec Corp | Lead frame for semiconductor device use |
| DE10109936B3 (en) * | 2001-02-26 | 2005-02-24 | Infineon Technologies Ag | Separating packaged electronic component involves pulling apart or compressing system carrier band with tool near mechanical bridges while allowing separated electronic component out of band |
| EP1329952A3 (en) * | 2002-01-21 | 2009-03-04 | W.C. Heraeus GmbH | Method for fixing chip carriers |
-
1986
- 1986-09-03 JP JP20726486A patent/JPS6362366A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03105959A (en) * | 1989-09-19 | 1991-05-02 | Nec Corp | Lead frame for semiconductor device use |
| DE10109936B3 (en) * | 2001-02-26 | 2005-02-24 | Infineon Technologies Ag | Separating packaged electronic component involves pulling apart or compressing system carrier band with tool near mechanical bridges while allowing separated electronic component out of band |
| EP1329952A3 (en) * | 2002-01-21 | 2009-03-04 | W.C. Heraeus GmbH | Method for fixing chip carriers |
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