JPH0697252B2 - Semiconductor device test handler - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a test handler for a semiconductor device that carries the semiconductor device to a test box.

[Conventional technology]

FIG. 5 is a partial sectional view showing a conventional test handler disclosed in, for example, Japanese Utility Model Laid-Open No. 60-56285.
(1) is an IC package, (2) is a substrate part provided with a measuring terminal (3) for testing this IC package (1), (4) is a lead terminal of the IC package (1) (5) Is a pressing portion that presses against the measurement terminal (3).

In the structure as described above, the IC package (1) is preliminarily positioned on the substrate portion (2) via the transport means (not shown), and then the lead terminal ( By pressing 5), the lead terminal (5) contacts the measuring terminal (3) and the measurement is started. In other words, the lead terminal (5) is kept pressed by the holding portion (4) during the measurement.

[Problems to be solved by the invention]

Since the conventional semiconductor device test handler is configured as described above, apart from the vacuum suction device that conveys the IC package to the test position, a pressing device that presses the lead terminals of the IC package at the test position is configured. However, there is a problem in that the transfer mechanism is required for each and the structure becomes complicated.

The present invention has been made to solve the above problems, and an object thereof is to obtain a test handler for a semiconductor device in which the transfer mechanism of the pressing device can be eliminated and the structure is simplified.

[Means for solving problems]

A test handler for a semiconductor device according to the present invention is detachably vacuum-adsorbed by a collet capable of vacuum-adsorbing a semiconductor device at a tip portion and a hand portion of a transfer means, and detached from the hand portion on a test box, A vacuum suction device is constituted by a pressing jig that can press the lead portion of the semiconductor device in part.

[Action]

In the test handler of the semiconductor device according to the present invention, the semiconductor device is conveyed onto the test box at the tip of the collect, the pressure jig is released from the vacuum suction by the hand portion at this position, and the pressure jig is released from the hand portion. Since the lead terminal of the semiconductor device is detached and presses the lead terminal of the semiconductor device, the semiconductor device can be pressed by the vacuum suction device that is the transfer means.

Example of Invention

An embodiment of the present invention will be described below with reference to FIGS. In the figure, (10) is a hand of a robot (not shown), (11) is a spindle fitted in this hand (10), and has a hole (11a). (12) is this hole (11a)
A through-hole (12a) communicating with the hole (11a), which is a freely slidably fitted sleeve. (13) is the collect (1
2) A spring that biases the tip toward the tip side, (14) is an O-ring that seals between the collet (12) and the spindle (11), (1
5) is a retaining ring for positioning the collet (12), (16) is a flange connected to the outer periphery of the spindle (11) in a flange shape, and has a ring-shaped groove (16a) into which a vacuum is introduced. , Step (11b) of spindle (11) and retaining ring (1
7) Positioned with. (18) is a flange (16)
The pressing jig is vacuum-adsorbed on the four ends, and the pressing parts (18a) made of an insulating material are fixed to the four surfaces at the ends by screws (18b). (18c) is a pair of supports joined to the outer circumference of the pressure jig (18), and is provided on both the left and right sides. (18d) is a roller positioned between a pair of supports (18c), and is a shaft (1
It is rotatably supported by 8e). Reference numeral (19) denotes a semiconductor device which is attached to the tip of the collect (12), and the lead terminal (19a) is positioned at the holding portion (18a). (20)
Is a test box, and is provided with a measuring terminal (20a) connected to the lead terminal (19a). Reference numeral (21) is a pair of levers for pressing the roller (18d) of the pressure jig (18) toward the measurement terminal (20a) side, which is driven by the cylinder (22).
(23) is a pipe for introducing the vacuum into the hole (11a) of the spindle (11), (24) is a pipe for introducing the vacuum into the groove (16a) of the flange (16), and (25) is a table of the test handler. The test box (20), the lever (21), etc. described above are arranged. (26) is the semiconductor device before the test (19)
The array of pallets, (27) is the semiconductor device (1
9) Arranged pallet.

In the configuration as described above, the pallet (2
6) Collect the semiconductor device (19) before the test (12)
Adsorb with. In this state, the groove (16a) of the flange (16)
Since a vacuum is also introduced into the device, the pressure jig (18) is attracted to the flange (16), and the lead terminal (19a) of the semiconductor device (19) is positioned by the holding portion (18a). The collet (12) is urged by a spring (13) to a position where it is positioned by a retaining ring (15) under the atmospheric pressure, and its tip projects from the pressure jig (18).
On the other hand, when the semiconductor device (19) sucks with the collet (12), the collet (12) itself is also displaced upward due to the negative pressure, and the lead terminal (19a) of the semiconductor device (19) is pressed by the pressing jig ( It is positioned by the holding part (18a) of 18). Next, the robot hand (10) is driven to convey the semiconductor device (19) to the position of the test box (20), and the pipes (23),
When the negative pressure of (24) is released, the semiconductor device (19) is positioned in the test box (20), and the holding portion (18a) of the pressure jig (18) contacts the lead terminal (19a). . here,
When the cylinder (22) is driven, each of the pair of levers (21) causes the roller (18d) of the pressure jig (18) to move to the measurement terminal (20a).
Then, the lead terminal (19a) is surely brought into contact with the measuring terminal (20a), and a predetermined test is executed. by the way,
In this state, the pressure jig (18) is separated from the spindle (11), and the collet (12) can execute the operation of the next step, for example, the transportation of the pallets (26) and (27). In other words, the robot hand (10) even during the test time.
Will be able to drive for another task. Next, when the test is completed, the spindle (11) descends together with the collet (12) and moves to the pressing jig (18), where the cylinder (22) is driven and the pair of levers (21) is moved. Retract and release the pressure jig (18), and then the groove (16a) of the flange (16).
By introducing a negative pressure to the pressure jig (18), the pressure jig (18) is sucked again, and the semiconductor device (19) after the test is sucked to the collect (12). Next, the robot hand (10) is moved to attach the semiconductor device (19) to the pallet (27).
Align on top.

By the way, in the above description, a single hand is arranged in the robot hand (10), but a plurality of hands may be arranged, and an embodiment in this case will be described with reference to FIG. In the figure, (30) has a gear (30a) which is rotatably supported horizontally on a robot hand (10) via a ball bearing (31) at approximately the center of the shaft. (32) is a mounting member connected to the end of the shaft (30), and (33) is a pair of spindles vertically connected to the shaft (30) and the mounting member (32), respectively. And pressure jig (1
8) etc. are provided. (34) is a cylinder that is connected to the hand (10), and (35) is a piston that is connected to the piston (34a) of this cylinder (34) and that engages with the gear (30a) to rotate the shaft (30). is there.

With the above-mentioned structure, when the semiconductor device is pressed by one pressurizing jig (18), another step is executed by the chuck (12) of the suction device or another suction device. It is possible and processing capacity is improved. Especially, by driving the rack (35) with the cylinder (34) and the piston (34a),
Since the upper and lower adsorption devices are changed, semiconductor devices of different types can be processed simultaneously.

〔The invention's effect〕

As described above, the present invention is such that the tip for vacuum-sucking the semiconductor device and the hand portion are detachably vacuum-sucked and detached from the hand portion on the test box.
Since the vacuum suction device was configured with a pressure jig that can press the lead portion of the semiconductor device at the tip, the pressure jig was released from the spindle during the test, and the spindle served as the means for transferring the pressure jig. It will also be used for the same purpose, which has the effect of simplifying the structure.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a sectional view showing a state before adsorption of a collect of the present invention, FIG. 3 is a sectional view showing a test state of the present invention, and FIG. Is a partial sectional side view showing another embodiment of the present invention, and FIG. 5 is a sectional view of a conventional device. In the figure, (10) is a hand, (11) is a spindle,
(12) is a collect, (18) is a pressure jig, (19) is a semiconductor device, (20) is a test box, and (20a) is a measuring terminal. The same reference numerals in the drawings indicate the same or corresponding parts.

Claims (2)

[Claims] 1. A test handler for a semiconductor device configured to suck a semiconductor device, convey the semiconductor device onto a test box, and perform a test with the vacuum suction device mounted on the hand portion of the transfer means. Is a vacuum that can be vacuum-sucked on the semiconductor device at the tip, and is removably vacuum-sucked on the hand, and is detached from the hand on the test box. A test handler for a semiconductor device, comprising a pressurizing jig capable of pressurizing. 2. The test handler for a semiconductor device according to claim 1, wherein a pair of vacuum suction devices are mounted on the hand portion.