JPH0814604B2 - IC test equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of use] The present invention relates to an improvement of an IC test apparatus for testing with an IC test box.

[Conventional technology]

FIG. 6 is a partial sectional view showing a conventional test handler disclosed in, for example, Japanese Utility Model Laid-Open No. 60-56285, in which (1) is an IC package and (2) is a test for this IC package (1). In order to do so, a substrate portion provided with a measurement terminal (3), (4) is a pressure jig for pressing the lead terminal (5) of the IC package (1) against the measurement terminal (3), and a pressure device (not shown) Is pressurized with.

In the structure as described above, the IC package (1) is preliminarily positioned on the substrate part (2) via the transport means (not shown), and then the lead is made by the pressing jig (4). By pressing the terminal (5), the lead terminal (5) comes into contact with the measuring terminal (3) and the measurement is started. That is, the lead terminal (5) is kept pressed by the pressing jig (4) during the measurement.

[Problems to be solved by the invention]

Since the conventional semiconductor device test handler is configured as follows, since the pressure jig and the pressure device for pressing the IC lead terminal at the test position are arranged above the test position, When the IC is transported, the transport device must be configured so as not to interfere with these pressure devices,
A moving mechanism or the like for moving the pressurizing device to another position is required, and the device becomes complicated.

The present invention has been made to solve the above problems, and an object thereof is to obtain an IC test device in which the moving mechanism of the pressure device can be eliminated and the structure can be simplified.

[Means for Solving Problems] The present invention provides an IC test including a pressing jig for pressing an IC mounted on a test box to bring the lead terminal of the IC into contact with the measurement terminal of the test box. In the apparatus, a pair of rollers rotatably supported on both sides of the pressure jig and facing each other, and a horizontal direction toward the pair of rollers on the side opposite to the pressure jig side of the pair of rollers. And a pair of levers for rolling the rollers, the lower surfaces of which are brought into contact with the upper surfaces of the pair of rollers when driven, and the pair of levers are synchronized in opposite directions. It is provided with a driving means for horizontally driving.

[Operation] In the IC test apparatus according to the present invention, when the pressure jig is arranged above the IC arranged in the test box and the pair of levers are horizontally driven in synchronization with each other in opposite directions by using the driving means, The pair of levers are horizontally driven toward the pair of rollers rotatably supported by the pressure jig, and the lower surfaces of the pair of levers come into contact with the upper surfaces of the pair of rollers to move the respective rollers. It is driven while rolling.

[Embodiment of the Invention] An embodiment of the present invention will be described below with reference to FIGS. 1 to 4. In the figure, (10) is a hand of a robot (not shown), (11) is a spindle fitted in this hand (10), and has a hole (11a). (12) is this hole (11
It is a collet loosely fitted in a) and has a through hole (12a) communicating with the hole (11a). (13) is a spring that biases the collet (12) toward the tip side, (14) is an O-ring that seals between the collet (12) and the spindle (11),
(15) is a retaining ring for positioning the collet (12), (16)
Is a flange connected to the outer periphery of the spindle (11) in a flange shape, and has a ring-shaped groove (16a) in which a vacuum is introduced. The step (11b) of the spindle (11) and the retaining ring (1
7) Positioned with. (18) is a flange (16)
The pressing jig is vacuum-adsorbed on the four ends, and the pressing parts (18a) made of an insulating material are fixed to the four surfaces at the ends by screws (18b). (18c) is a pair of supports joined to the outer circumference of the pressure jig (18), and is provided on both the left and right sides. (18d) is a roller positioned between a pair of supports (18c), and is a shaft (1
It is rotatably supported by 8e). (19) is a semiconductor adsorbed on the tip of the collect (12), and is a lead terminal (19
a) is positioned by the presser section (18a). Reference numeral (20) is a test box provided with a measuring terminal (20a) to which the lead terminal (19a) is connected. Reference numeral (21) is a pair of levers for pressing the roller (18d) of the pressure jig (18) toward the measuring terminal (20a) side, and is supported by a linear guide (not shown) so as to be slidable in the horizontal direction. (21a) is a taper portion formed at the tip of each of the pair of levers, (22) is a pair of cylinders that drive the lever (21), (23) is a vacuum in the hole (11a) of the spindle (11). Pipe to be introduced, (24) Pipe to introduce vacuum into the groove (16a) of the flange (16), (25) is a table of test handler, and the above-mentioned test box (20) and lever (21) are arranged. Has been done.
(26) is a pallet in which the semiconductor devices (19) before the test are arranged, (27) is a pallet in which the semiconductor devices (19) after the test are arranged, (50) is coupled to the lever (21) through the bolt (51) The piston shaft (22a) of the cylinder (22) is connected by the pair of attached fixtures. (51) is the piston shaft (22
A push made of an elastic body that elastically fits a) to the fixture (50), (52) a washer, (53) a piston shaft (22
(54) is a pair of racks connected to the fixture (50) through bolts (55), and (56) is a gear meshing with the pair of racks (54). It is rotatably supported by the base (25) via 57). (58)
Are a plurality of bolts for fixing the cylinder (22) to the base (25).

In the device constructed as described above, the semiconductor device (19) before the test is collected from the pallet (26) to the collector (1).
Adsorb in 2). In this state, the groove (16
Since a vacuum is also introduced in a), the pressure jig (18) is attracted to the flange (16), and the lead terminal (19a) of the semiconductor device (19) is positioned by the retainer (18a). It
The collet (12) has a retaining ring (15) under atmospheric pressure.
The spring (13) is urged to the position where is positioned, and the tip of the spring (13) projects beyond the pressure jig (18). On the other hand, when the semiconductor device (19) is sucked by the collect (12), the collect (12) itself is also displaced upward due to the negative pressure, and the lead terminal (19a) of the semiconductor device (19) is pressed by the pressing jig (18). ) Is pressed by the holding section (18a). Next, the robot hand (10) is driven to convey the semiconductor device (19) to the position of the test box (20), and the pipes (23),
When the negative pressure of (24) is released, the semiconductor device (19) is positioned on the test box (20) and the holding portion (18a) of the pressing jig (18) contacts the lead terminal (19a). . here,
When the cylinder (22) is driven, each of the pair of levers (21) causes the roller (18d) of the pressure jig (18) to move to the measurement terminal (20a).
Then, the lead terminal (19a) is surely brought into contact with the measuring terminal (20a), and a predetermined test is executed. by the way,
In this state, the pressing jig (18) is separated from the spindle (11), and the collet (12) can execute the operation of the next step, for example, the transportation of the pallets (26) and (27). In other words, the robot hand (10) even during the test time.
Will be able to drive for another task. Next, when the test is completed, the spindle (11) descends together with the collet (12) and moves to the pressing jig (18), where the cylinder (22) is driven and the pair of levers (21) is moved. Retract and release the pressure jig (18), and then the groove (16a) of the flange (16).
By introducing a negative pressure to the pressure jig (18), the pressure jig (18) is sucked again, and the semiconductor device (19) after the test is sucked to the collect (12). Next, the robot hand (10) is moved to attach the semiconductor device (19) to the pallet (27).
Align on top. Next, horizontal sliding of the lever (21) will be described in detail below. First, when a pair of cylinders (22) is driven, horizontal force is transmitted to the piston shaft (22a) → fixture (50) → lever (21), and the lever (21) moves horizontally to the linear guide (Fig. (Not shown).
Therefore, the lever (21) biases the roller (18d) downward while rolling the roller (18d), and the pressure jig (18) is pressed downward. On the other hand, a rack (54) is coupled to each of the pair of attachments (50), and the rack (54) is connected to the gear (5).
Since it is meshed with 6), the horizontal movement of the pair of levers (21) is synchronized by the rack (54) and the gear (56),
The pair of rollers (18d) are simultaneously pressed downward by the lever (21) to prevent the pressing jig (18) from tilting. On the other hand, since the bush (51) is made of an elastic material,
The dimensional error of the arrangement of the rack (54) and the gear (56) is absorbed, and the twisting at the time of driving both is prevented, so that the lever (21) is driven smoothly.

By the way, in the above description, a single hand is arranged in the robot hand (10), but a plurality of hands may be arranged, and an embodiment in this case will be described with reference to FIG. In the figure, reference numeral (30) is a shaft rotatably supported by a robot hand (10) through a ball bearing (31), and a gear (30a) is formed substantially at the center thereof. (32) is a mounting member connected to the end of the shaft (30), and (33) is a pair of spindles vertically connected to the shaft (30) and the mounting member (32), respectively. In addition, a pressure jig (18) and the like are provided. (34) is a cylinder that is connected to the hand (10), and (35) is a piston that is connected to the piston (34a) of this cylinder (34) and that engages with the gear (30a) to rotate the shaft (30). is there.

In the structure configured as described above, when the semiconductor is pressed by one pressing jig (18), another process can be executed by the chuck (12) of the suction device or the suction device.
The processing capacity is improved. In particular, by driving the rack (35) with the cylinder (34) and the piston (34a), the upper and lower suction devices are changed, so that different types of semiconductor devices can be processed simultaneously.

[Effects of the Invention] As described above, the present invention is an IC test apparatus equipped with a pressing jig for pressing an IC mounted on a test box to bring the lead terminals of the IC into contact with the measurement terminals of the test box. At a pair of rollers that are rotatably supported on both sides of the pressure jig and face each other, and on the side opposite to the pressure jig side of the pair of rollers, in the horizontal direction toward the pair of rollers. Each is arranged so that it can be driven,
At the time of driving, a pair of levers each of which lower surface abuts on an upper surface of the pair of rollers and rolls each roller, and a driving means for horizontally driving the pair of levers in a mutually opposite direction are provided. Interference between the pressure device that applies pressure to the pressure jig and the IC transfer device can be prevented, which not only simplifies the structure of the device, but also applies pressure when pressing the pressure jig with a pair of levers. This has the effect of reliably preventing the jig from tilting.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of the present invention, FIG. 2 is a sectional view showing a relationship with a collet of the present invention, and FIG. 3 is a sectional view showing a state before adsorption of a collet of the present invention. FIG. 4 is a sectional view showing a test state of the present invention, FIG. 5 is a partial sectional side view showing another embodiment of the present invention, and FIG. 6 is a sectional view of a conventional device. In the figure, (10) is a hand, (11) is a spindle,
(12) is a collet, (18) is a pressure jig, (19) is a semiconductor device, (20) is a test box, (20a) is a measurement terminal,
(21) is a lever, (21a) is a tapered portion, (22) is a cylinder, (54) is a rack, and (56) is a gear. The same reference numerals in the drawings indicate the same or corresponding parts.

Claims (1)

[Claims] 1. An IC test apparatus comprising a pressing jig for pressing an IC mounted on a test box to bring a lead terminal of the IC into contact with a measurement terminal of the test box,
A pair of rollers that are rotatably supported on both sides of the pressure jig and face each other, and are horizontally driven toward the pair of rollers on the side opposite to the pressure jig side of the pair of rollers. A pair of levers that are arranged so as to obtain each of the rollers, and the lower surfaces of the pair of rollers abut against the upper surfaces of the pair of rollers when driving, and the pair of levers are horizontally driven in synchronization with each other in opposite directions. IC test equipment equipped with drive means.