JP3129128B2 - IC transport mechanism by suction hand - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
This is for the C transport mechanism. Supply stage is IC
Is transported from the supply position to the IC transfer position.
The storage stage moves from the IC transfer position to the storage position.
Is transported. The suction hand moves the IC from the transfer position of the IC to the measuring section, and moves the IC to the transfer position of the IC from the measuring section.
Move C. An apparatus using such an IC transport mechanism includes, for example, an auto handler.

[0002]

2. Description of the Related Art Next, the configuration of a conventional IC transport mechanism will be described with reference to FIG. 10 in FIG. 10 is a measuring unit, 3A
Is an IC socket, 5 is an IC, 11 is a supply stage, 12
Denotes a storage stage, 13 denotes a transport mechanism, 13A denotes a suction hand, and 13B denotes a suction pad.

In FIG. 10, a supply stage 11 is arranged in a first row Y1, and moves in the Y-axis direction. Supply stage 1
1 has a recess 11A. When the IC 5 is placed in the recess 11A, the posture of the IC 5 is corrected. The accommodation stage 12 is arranged in the second row Y2 and moves in the Y-axis direction. The accommodation stage 12 has a recess 12A. When the IC 5 is placed in the recess 12A, the attitude of the IC 5 is corrected.

The recess 11A and the recess 12A in FIG. 10 have the same shape, and a rectangular groove slightly larger than the outer shape of the IC 5 is formed. Since the entrance of the groove is provided with an inclination, the inclination is guided and the posture of the IC 5 is corrected. The accurate positioning of the IC 5 facilitates positioning from the supply stage 11 to an IC socket 3A described later. Alternatively, the transfer from the storage stage 12 to the next step is facilitated.

The measuring section 3 has an IC socket 3A,
The socket 3A is arranged on a row YM equidistant from the first row Y1 and the second row Y2.

The transport mechanism 13 includes a suction hand 13A and a suction pad 13B. The suction hand 13A includes a suction pad for suctioning the upper surface of the IC 5 by a negative pressure, and a pressure contact body that comes into contact with a lead of the IC 5 is attached around the suction pad. When the suction hand 13A presses down on the IC socket 3A while holding the IC 5 by suction, the pressure contact body presses the lead of the IC 5 against the contact of the IC socket 3A. The suction pad 13B is the same as the suction pad included in the suction hand 13A.

In FIG. 10, the suction hand 13A and the suction pad 13B move up and down in the Z-axis direction. The distance between the rows of the suction hand 13A and the suction pad 13B is the same as the distance between the first row Y1 and the row YM. The transport mechanism 13 integrally moves the suction hand 13A and the suction pad 13B and moves in the X-axis direction.

Next, the operation of FIG. 10 will be described with reference to state change diagrams of FIG. 11 to FIG. FIG. 11 to FIG.
FIG. Reference numeral 60 in FIG. 11 denotes a moving body, and the moving body 60 has a cylinder 13C and a cylinder 13D.
When the cylinder 13C is driven, it is guided by a linear guide attached to the side wall of the moving body 60, and
A goes up and down. When the cylinder 13D is driven, the moving body 6
Guided by a linear guide attached to the side wall of No. 0,
The suction pad 13B moves up and down. The motor 60A is connected to a ball screw, and the ball screw is connected to a ball nut attached to the moving body 60. When the motor 60A rotates, the moving body 60 is moved in the X direction.

In the state shown in FIG. 11A, the IC 5 is conveyed to the IC socket 3A by the suction hand 13A, and the next IC 5 is waiting on the supply stage 11. The measurement of the IC 5 on the IC socket 3A has been completed.

From the state shown in FIG. 11A, the moving body 60 moves to the supply stage 11 side, and enters the state shown in FIG. FIG.
In the state (a), the suction hand 13A is located on the supply stage 11, and the suction pad 13B is located on the IC socket 3A.

From the state shown in FIG. 11A, the suction hand 13A and the suction pad 13B are moved down to the state shown in FIG. In FIG. 12A, the suction hand 13 </ b> A
While adsorbing C5, the adsorption pad 13B adsorbs IC5 on the IC socket 3A. From the state of FIG.
The suction hand 13A and the suction pad 13B are each IC5.
And rises to the state shown in FIG.

The moving body 60 moves from the state shown in FIG. 12A to the accommodation stage 12, and enters the state shown in FIG. FIG.
In state A, the suction hand 13A is located on the IC socket 3A, and the suction pad 13B is located on the storage stage 12. From the state of FIG. 13A, the suction hand 13A and the suction pad 13B descend, and the state of FIG. FIG.
In B, the suction hand 13A is connected to the IC socket 3A with the IC5.
While the suction pad 13B detaches the IC 5 from / to the recess 12A on the accommodation stage 12.

When the measurement of the IC 5 on the IC socket 3A is completed from the state shown in FIG. 13A, the IC 5 on the storage stage 12 is transported to the next step, and the next IC 5 is transported to the supply stage 11, FIG. Then, the process returns to the state of FIG.

[0014]

SUMMARY OF THE INVENTION According to the configuration shown in FIG.
The C transport mechanism requires time to move from the state of FIG. 11A to the state of FIG. 11A and time to move from the state of FIG. 12A to the state of FIG. That is, the moving body 60 reciprocates on the supply stage 11 and inserts the IC 5 into the IC socket 3A.
In addition, the moving body 60 reciprocates to the accommodation stage 12 and carries out the IC 5 from the IC socket 3A, so that the processing time is wasted.

According to the present invention, the first suction mechanism is provided with a first suction hand and a second suction hand, and when the first suction hand sucks the IC of the supply stage, the second suction hand is simultaneously operated. When the IC is pressed against the IC socket and the second suction hand suctions the IC at the supply stage, the first suction hand simultaneously presses the IC against the IC socket, and the first suction hand presses the IC onto the storage stage. When releasing, at the same time, the second suction hand presses the IC against the IC socket,
When the second suction hand releases the IC to the storage stage, the first suction hand presses the IC against the IC socket at the same time to provide an IC transport mechanism for shortening the processing time of the IC.

[0016]

[0017]

SUMMARY OF THE INVENTION The present invention has a concave portion 1A in which the posture of the IC 5 is corrected when the IC 5 is mounted,
The transfer position P includes a supply stage 1 that moves between a transfer position P of the IC 5 and a supply position Q where the IC 5 is transferred from a previous process, and a concave portion 2A in which the posture of the IC 5 is corrected when the IC 5 is mounted. The storage stage 2 that moves between the storage position R where the IC 5 is transferred in the subsequent process, and the IC socket 3A that is arranged at the measurement position S that is a fixed distance L from the transfer position P without changing the attitude of the IC 5 A suction unit 4A and a suction hand 4B which suck and desorb the IC 5 and move up and down independently of each other. The suction hand 4A and the suction hand 4B are arranged at the predetermined distance L and rotated to rotate. 4A and suction hand 4
B is provided with a transfer mechanism 4 for alternately moving B to a transfer position P and a measurement position S. When the suction hand 4A suctions the IC5 of the supply stage 1 at the transfer position P, the suction hand 4B transfers the IC5 to the IC socket 3A. When the suction hand 4B is pressed and sucks the IC 5 of the supply stage 1 at the transfer position P, the suction hand 4A is attached to the IC socket 3A.
When the suction hand 4A releases the IC 5 to the storage stage 2 at the transfer position P, the suction hand 4B presses the IC 5 against the IC socket 3A, and the suction hand 4B presses the IC 5 to the storage stage 2 at the transfer position P. Is released, the suction hand 4A presses the IC 5 against the IC socket 3A.

[0018]

[0019]

According to the structure of the present invention, the suction hand 4A is
When the IC 5 is pressed against the C socket 3A, the supply stage 1 and the storage stage 2 can be alternately moved to the IC transfer position P.
Is released to the accommodation stage 2, and the unmeasured ICs 5 are sequentially sucked from the supply stage 1.

The suction hand 4B is connected to the IC socket 3A by an IC.
5, the supply stage 1 and the storage stage 2 can be alternately moved to the IC transfer position P, and the suction hand 4A releases the measured ICs 5 to the storage stage 2 and sequentially supplies the supply stages 1 Since the unmeasured IC 5 is adsorbed, the processing time of the IC can be shortened.

[0021]

[0022]

Next, the structure of an IC transport mechanism according to the present invention will be described with reference to FIG. 1 is a supply stage, 2 is a storage stage, 3 is a measuring unit, 3A is an IC socket, 4 is a first transport mechanism, and 4A and 4B are suction hands.

In FIG. 1, the supply stage 1 moves between a transfer position P of the IC 5 and a supply position Q where the IC 5 is transferred from the previous step. The supply stage 1 has a concave portion 1A. When the IC 5 is placed in the recess 1A, the posture of the IC 5 is corrected.

The accommodation stage 2 is at the transfer position P of the IC 5
And the accommodation position R where the IC 5 is transferred to the subsequent process. The accommodation stage 2 has a recess 2A. IC in recess 2A
When the IC 5 is mounted, the attitude of the IC 5 is corrected.

The recesses 1A and 2B in FIG. 1 have the same shape as the recesses 11A and 12A in FIG. 10 to facilitate positioning of the IC 5.

In FIG. 1, the IC 5 is supplied to the concave portion 1A of the supply stage 1 at the IC supply position Q. Further, the IC 5 housed in the recess 2A of the housing stage 2 at the IC housing position R is taken out and transported to the next step.

The measuring section 3 has an IC socket 3A to which the IC 5 is pressed. The IC socket 3A is arranged at a measurement position S at a fixed distance L from the transfer position P without changing the attitude of the IC 5.

The first transport mechanism 4 includes a suction hand 4A and a suction hand 4B. The suction hands 4A and 4B are shown in FIG.
Of the suction hand 13A. Suction hand 4A
4B adsorbs or desorbs IC5. Suction hand 4A
The suction hand 4B moves up and down independently of each other. The first transport mechanism 4 arranges the suction hand 4A and the suction hand 4B at the predetermined distance L, and rotates the suction hand 4A.
And suction hand 4B are alternately delivered and received at position P and measurement position S
Move to

Next, the configuration of a general example of the first transport mechanism 4 will be described with reference to FIG. 2A and 2A are side views of FIG. In FIG. 2, 4C is a rotary shaft, 4D and 4E are cylinders, 4F and 4G are linear guides, 4H is a rotating body, 4J is a motor, and the others are the same as those in FIG.

In FIG. 2, a rotating body 4H is attached to a rotating shaft 4C. The cylinder 4D and the cylinder 4E are mounted on the rotating body 4H symmetrically about the rotation axis 4C. When the cylinder 4D is driven, it is guided by the linear guide 4F attached to the side wall of the rotating shaft 4C, and the suction hand 4A moves up and down. When the cylinder 4E is driven, it is guided by the linear guide 4G attached to the side wall of the rotating body 4C, and
Goes up and down.

The motor 4J is connected to the rotating shaft 4C. When the motor 4J is driven, the rotating body 4H rotates about the rotating shaft 4C. When the motor 4J connected to the rotating shaft 4C is driven, the suction hand 4A and the suction hand 4B alternately change positions between the transfer position P and the measurement position S.

Next, the operation of FIG. 1 will be described with reference to FIGS. In the state of FIG. 2A, the supply stage 1 has been moved to the transfer position P, and the storage stage 2 has been moved to the storage position R. Suction hand 4B descends to IC5
The suction hand 4 is in pressure contact with the socket 3A.
A sucks the unmeasured IC 5 of the supply stage 1 and rises, and waits until the measurement of the IC 5 on the suction hand 4B ends.

From the state shown in FIG. 2A, the supply stage 1 moves to the supply position Q , and the storage stage 2 moves to the transfer position P and waits. When the measurement is completed from the state of FIG.
The suction hand 4B ascends while holding the IC 5 of the measuring unit 3 by suction, and reaches the state shown in FIG.

From the state shown in FIG. 2A, the rotating body 4H rotates by 180 degrees, and becomes the state shown in FIG. 3A. In the state of FIG. 3A, the suction hand 4A is located on the IC socket 3A,
B is located on the transfer position P, that is, on the storage stage 2.

From the state shown in FIG. 3A, the suction hand 4A descends and presses against the IC socket 3A.
B releases the IC 5 to the accommodation stage 2 and enters the state of FIG.

From the state shown in FIG. 3A, the accommodation stage 2 moves to the accommodation position R, and the supply stage 1 is moved to the next IC to be measured.
5 is moved to the delivery position P, and the state shown in FIG. In FIG. 4A, since the measurement of the IC 5 is not completed, the suction hand 4A presses the IC 5 with pressure.

From the state shown in FIG. 4A, the suction hand 4B descends, sucks the IC 5 of the supply stage 1, and enters the state shown in FIG. From the state shown in FIG.
Is held up by suction. After the measurement of the IC5 is completed, the suction hand 4A suction-holds the IC5 and moves upward.

Next, the rotating body 4H rotates 180 degrees, and the suction hand 4A detaches the IC 5 after the completion of the measurement to the accommodation stage 2. At the same time, the suction hand 4B presses the IC 5 against the IC socket 3A.

Next, the storage stage 2 moves to the storage position R, the supply stage 1 moves to the transfer position P holding the IC 5 to be measured next, and the suction hand 4A descends, The IC 5 is sucked and held and rises, returning to the state of FIG.

Next, an embodiment of the IC transport mechanism 4 according to the present invention will be described with reference to FIG. 4K in FIG.
1 is an upper plate, 62A and 62B are ball splines, 63A
And 63B are compression coil springs; 64A and 64B are retainer blocks; 65A and 65B are joints;
Is the same as Although not specifically shown, the embodiment shown in FIG. 5 is provided with the same accommodation stage 2 as in FIG.

The ball splines 62A and 62B can be used as a linear guide having a rotation preventing function even with one axis. The housings of the ball splines 62A and 62B are fixed to the rotating body 4K. Also, the ball spline 62
The suction hands 4A and 4B are connected to the lower ends of the slide shafts A and 62B, respectively. Ball spline 6
A retainer block 64 is provided at the upper end of each of 2A and 62B.
A. Install 64B. Compression coil spring 63A / 63
B encloses the ball splines 62A and 62B, is held between the retainer blocks 64A and 64B and the rotator 4K, and urges the force to raise the ball splines 62A and 62B. The suction hands 4A and 4B are normally held at the raised position.

The cylinders 4D and 4E are arranged at a fixed distance L about the rotation shaft 4C, and are fixed on the upper plate 61. Cylinders 4D and 4E and retainer blocks 64A and 6
4B, the flanges 65C of the joint block 65 are connected to the concave portions 64C of the retainer block 64 with a clearance therebetween, as shown in the detailed view of the connecting portion in FIG. Therefore, the suction hands 4A and 4B can be raised and lowered at the IC transfer position P and the measurement position S without hindering the rotation of the rotating body 4K.

In the examples of FIGS. 2 to 4, the suction hands 4A
Although the cylinders 4D and 4E for raising and lowering the 4B are arranged on the rotating body 4H, as shown in FIG.
Even if E is separated from the rotating body 4H and arranged on the upper plate 61, the IC transport mechanism according to the present invention can be realized.

Next, the configuration of an IC transport mechanism for simultaneous measurement of two ICs will be described with reference to FIG. 1B of FIG.
3B is an IC socket, 4L and 4N are suction hands, and others are the same as those in FIG.

The recess 1B is the same as the recess 1A. I
The C socket 3B is the same as the IC socket 3A.
The suction hands 4L and 4N are the same as the suction hands 4A and 4B. Although not specifically shown, the example of FIG.
Is provided, and the accommodation stage 20 is provided with the same concave portion 2B as the concave portion 2A.

The distance between the centers of the recesses 1A and 1B, the distance between the centers of the recesses 2A and 2B, the IC sockets 3A and I
The center distance of the C socket 3B, the center distance of the suction hand 4A and the center of the suction hand 4L, and the distance between the suction hand 4B and the suction hand 4N are all the same. In other words, while FIG. 2 to FIG. 5 show an example in which one IC 5 is measured,
FIG. 6 shows an example in which two ICs 5 are measured simultaneously. FIG.
As shown by, even when performing multiple simultaneous measurements,
A C transport mechanism can be realized.

Next, the structure of the second transport mechanism will be described with reference to the embodiment of FIG. FIG. 7 is a plan view of the second transport mechanism. 7 is a supply stage, 2 is a storage stage, 6 is a second transport mechanism, 6A is a linear guide, 6B is a belt,
6C and 6D are pulleys, and 6E is a motor.

In FIG. 7, the supply stage 1 and the storage stage 2
Is fixed on the endless belt 6B at a position separated by the same distance L3 as the distance between the transfer position P and the supply position Q and the distance between the transfer position P and the storage position R. Pulleys 6C and 6D are attached to both ends of the belt 6B, and a motor 6E is connected to the pulley 6D.

FIG. 7 shows a state in which the supply stage 1 is located at the supply position Q and the storage stage 2 is located at the transfer position P. In this state, the motor 6E is driven to move the supply stage 1 to the transfer position P, and at the same time, the storage stage 2 moves to the storage position R. In this state, the motor 6E is driven in the reverse direction to move the supply stage 1 to the IC supply position Q. At the same time, the storage stage 2 moves to the IC transfer position P and returns to the state shown in FIG.

Next, the structure of the third transport mechanism will be described with reference to the embodiment of FIG. FIG. 8 is a plan view of an embodiment of the third transport mechanism. 8, 1 is a supply stage, 2 is a storage stage, 7 is a third transport mechanism, 7A and 7B are linear guides,
7C is a belt, 7D and 7E are sides, 7F to 7H and 7J are pulleys, and 7R is a motor.

In FIG. 8, the supply stage 1 is disposed on a linear guide 7A mounted in parallel with a straight line connecting the IC transfer position P and the IC supply position Q. The accommodation stage 2 is disposed on a linear guide 7B attached in parallel with a straight line connecting the IC transfer position P and the IC accommodation position R. When the supply stage 1 is located at the IC supply position Q, the storage stage 2 is positioned at the IC transfer position P, and when the supply stage 1 is positioned at the IC transfer position P, the storage stage 2 is endlessly positioned at the IC storage position R. Is fixed to the belt 7C.

The belt 7C includes at least the linear guide 7
A side 7D parallel to A and a side 7E parallel to the linear guide 7B
And a triangular shape including the following. The rotation center of the pulley 7F, the rotation center of the pulley 7G, and the rotation center of the pulley 7H are arranged so as to be each vertex of a triangle.

The endless belt 7C is connected to the pulley 7F.
・ Wrap around 7G ・ 7H. Pulley 7J is belt 7C
To remove the deflection. When the supply stage 1 and the storage stage 2 are attached to the belt 7C at a distance L4 and the motor 7R connected to the pulley 7H is driven in the first rotation direction, the supply stage 1 at the supply position Q moves to the transfer position P and the transfer position. The storage stage 2 of P moves to the storage position R, and when the motor 7R is driven in the second rotation direction opposite to the first rotation direction, the supply stage 1 of the delivery position P moves to the supply position Q and the storage position. The accommodation stage 2 of R moves to the transfer position P and returns to the state of FIG.

Next, an embodiment of an auto handler in which the first IC transport mechanism and the third IC transport mechanism 7 are combined is shown in FIG.
This will be described below. 9A to 70C are IC containers,
Reference numeral 71 denotes a supply hand, 72 denotes an accommodation hand, and others are the same as those in FIG. 1 or FIG.

Reference numerals 1 to 4 are components of the IC transport mechanism of the present invention. Reference numeral 7 denotes a component of the third IC transport mechanism 7.

Each of the IC containers 70A to 70C is a container having a plurality of concave portions 70D for accommodating the IC 5 vertically and horizontally regularly. The auto-handler is used for accommodating unmeasured IC5 and accommodating IC5 after measurement. In FIG.
An unmeasured IC is stored in the C container 70A.
The ICs after the measurement are classified and stored, for example, the non-defective IC 5 in the container 70B and the defective IC 5 in the IC container 70C.

The supply hand 71 is a robot hand having a suction pad movable in the X, Y, and Z directions, sucks the unmeasured IC 5 stored in the IC container 70A, transports it to the supply position Q, and transfers it to the supply stage 1. Supply IC5.

The accommodation hand 72 is a robot hand having a suction pad movable in the XYZ directions, and is transported to the accommodation stage 2 and transported to the accommodation position R after measurement.
C5 is adsorbed and classified and stored in the IC container 70B or the IC container 70C according to the measurement result.

[0059]

According to the present invention, the first suction hand and the second suction hand are provided in the transfer mechanism, and when the first suction hand sucks the IC of the supply stage, the second suction hand is simultaneously operated. When the IC is pressed against the IC socket and the second suction hand suctions the IC on the supply stage, the first suction hand is simultaneously pressed with the first suction hand.
When the first suction hand releases the IC to the storage stage, the second suction hand presses the IC against the IC socket, and the second suction hand stores the IC. When the IC is released to the stage, the first suction hand presses the IC against the IC socket at the same time, and the processing time of the IC can be shortened.

[0060]

[Brief description of the drawings]

FIG. 1 is a configuration diagram of an IC transport mechanism according to the present invention.

FIG. 2 is a configuration diagram of a general example of a first transport mechanism.

FIG. 3 is a state change diagram of FIG. 2;

FIG. 4 is a state change diagram of FIG. 3;

FIG. 5 is a configuration diagram of the first transport mechanism 4 according to an embodiment.

FIG. 6 is a configuration diagram of an IC transport mechanism for simultaneous measurement of two ICs.

FIG. 7 is a configuration diagram of a second transport mechanism 6 according to an embodiment.

FIG. 8 is a configuration diagram of an example of a third transport mechanism 7;

FIG. 9 is a configuration diagram of an auto handler in which the IC transport mechanism of the present invention and the third transport mechanism 7 are combined.

FIG. 10 is a configuration diagram of an IC transport mechanism according to the related art.

FIG. 11 is a state diagram illustrating the operation of FIG. 10;

FIG. 12 is a state change diagram of FIG. 11;

FIG. 13 is a state change diagram of FIG.

Claims (4)

(57) [Claims] When the IC (5) is mounted, the IC (5) has a first concave portion (1A) for correcting the attitude of the IC (5). ), And a second recess (2A) in which the attitude of the IC (5) is corrected when the IC (5) is mounted, The transfer position P and the post-process
The storage stage (2) that moves between the storage positions R where the C (5) is transferred, and the transfer position P without changing the attitude of the IC (5).
IC socket placed at a measurement position S at a fixed distance L from the
(3A) having a measuring part (3), a first suction hand (4A) and a second suction hand (4B) that adsorb and desorb the IC (5) and move up and down independently of each other.
The first suction hand (4A) and the second suction hand (4B) are arranged at the predetermined distance L, and are rotated to rotate the first suction hand (4A) and the second suction hand (4B) alternately. Delivery position P
And a transfer mechanism (4) for moving to the measurement position S, and the first suction hand (4A)
When sucking the IC (5) of (1), the second suction hand (4
B) presses the IC (5) against the IC socket (3A), and the second suction hand (4B) moves the supply stage at the transfer position P.
When sucking the IC (5) of (1), the first suction hand (4
A) presses the IC (5) against the IC socket (3A) and the first suction hand (4A) moves the storage stage at the transfer position P.
When releasing the IC (5) in (2), the second suction hand (4
B) presses the IC (5) against the IC socket (3A), and the second suction hand (4B) moves the storage stage at the transfer position P
When releasing IC (5) in (2), the first suction hand (4
A) is an IC transfer mechanism using a suction hand that presses an IC (5) into an IC socket (3A). The transfer mechanism (4) includes a first suction hand (4A) and a second suction hand (4B). ), A rotating shaft (4C), a first cylinder (4D),
A second cylinder (4E), a motor (4J), a rotating body (4K),
The upper plate (61), the first ball spline (62A), the second ball spline (62B), and the first compression coil spring (63
A), a second compression coil spring (63B), a first retainer block (64A), and a second retainer block (64B).
And the first joint (65A) and the second joint (65A)
B) and a first cylinder (4D) on the upper plate (61) about the rotation axis (4C).
And the second cylinder (4E) are arranged at a fixed distance L, a rotating body (4K) is mounted on the rotating shaft (4C), and a first ball spline (62A) and a second ball are mounted on the rotating body (4K). A spline (62B) is slidably mounted, a first suction hand (4A) is mounted on a lower end of the first ball spline (62A), and a first retainer block is mounted on an upper end of the first ball spline (62A). (64A), the second suction hand (4B) is attached to the lower end of the second ball spline (62B), and the second retainer block (64B) is attached to the upper end of the second ball spline (62B). The first compression coil spring (63A) is a first ball spline.
(62A) and the first retainer block (64
A) and the first ball spline (62
A), the second compression coil spring (63B) applies a second ball spline.
(62B) and the second retainer block (64
B) and the second ball spline (62
B), the first joint (65A) is attached to the tip of the piston cylinder of the first cylinder (4D), and the second joint (65) is attached to the tip of the piston cylinder of the second cylinder (4E). When the motor (4J) connected to the rotating shaft (4C) is driven, the flanges (65C) of the joints (65A) and (65B) are attached to the retainer block.
(64A) and (64B), wherein the first suction hand (4A) and the second suction hand (4B) alternately change the position. The IC (5) has a first concave portion (1A) for correcting the posture of the IC (5) when the IC (5) is mounted. ), And a second recess (2A) in which the attitude of the IC (5) is corrected when the IC (5) is mounted, The transfer position P and the post-process
The storage stage (2) that moves between the storage positions R where the C (5) is transferred, and the transfer position P without changing the attitude of the IC (5).
IC socket placed at a measurement position S at a fixed distance L from the
(3A) having a measuring part (3), a first suction hand (4A) and a second suction hand (4B) that adsorb and desorb the IC (5) and move up and down independently of each other.
The first suction hand (4A) and the second suction hand (4B) are arranged at the predetermined distance L, and are rotated to rotate the first suction hand (4A) and the second suction hand (4B) alternately. Delivery position P
And a transfer mechanism (6) for moving to the measurement position S, and the first suction hand (4A)
When sucking the IC (5) of (1), the second suction hand (4
B) presses the IC (5) against the IC socket (3A), and the second suction hand (4B) moves the supply stage at the transfer position P.
When sucking the IC (5) of (1), the first suction hand (4
A) presses the IC (5) against the IC socket (3A) and the first suction hand (4A) moves the storage stage at the transfer position P.
When releasing the IC (5) in (2), the second suction hand (4
B) presses the IC (5) against the IC socket (3A), and the second suction hand (4B) moves the storage stage at the transfer position P
When releasing IC (5) in (2), the first suction hand (4
A) is an IC transfer mechanism using a suction hand for pressing the IC (5) into the IC socket (3A), and the transfer mechanism (6) transfers the IC (5) from the transfer position P of the IC (5) and the previous process. The first distance between the transfer positions Q to be transferred and the second distance between the transfer position P and the accommodation position R where the IC (5) is transferred in the subsequent process are set to the same distance L3, and the supply stage ( The distance between the center of 1) and the center of the storage stage (2) is attached to the endless first belt (6B) at the distance L3, and the first belt (6B) is attached to the first pulley (6C) and the second belt (6C). The first pulley (6D) is stretched and connected to the second pulley (6D).
When the motor (6E) is driven, the supply stage (1) and the storage stage (2) are guided by the linear guide (6A) and reciprocate in the same orbit. The IC (5) has a first concave portion (1A) for correcting the attitude of the IC (5) when the IC (5) is mounted. ), And a second recess (2A) in which the attitude of the IC (5) is corrected when the IC (5) is mounted, The transfer position P and the post-process
The storage stage (2) that moves between the storage positions R where the C (5) is transferred, and the transfer position P without changing the attitude of the IC (5).
IC socket placed at a measurement position S at a fixed distance L from the
(3A) having a measuring part (3), a first suction hand (4A) and a second suction hand (4B) that adsorb and desorb the IC (5) and move up and down independently of each other.
The first suction hand (4A) and the second suction hand (4B) are arranged at the predetermined distance L, and are rotated to rotate the first suction hand (4A) and the second suction hand (4B) alternately. Delivery position P
And a transfer mechanism (7) for moving to the measurement position S, and the first suction hand (4A)
When sucking the IC (5) of (1), the second suction hand (4
B) presses the IC (5) against the IC socket (3A), and the second suction hand (4B) moves the supply stage at the transfer position P.
When sucking the IC (5) of (1), the first suction hand (4
A) presses the IC (5) against the IC socket (3A) and the first suction hand (4A) moves the storage stage at the transfer position P.
When releasing the IC (5) in (2), the second suction hand (4
B) presses the IC (5) against the IC socket (3A), and the second suction hand (4B) moves the storage stage at the transfer position P
When releasing IC (5) in (2), the first suction hand (4
A) is an IC transfer mechanism using a suction hand that presses the IC (5) into the IC socket (3A), and the transfer mechanism (7) is connected to the first rotation center of the third pulley (7F) and the fourth rotation center. Second rotation center of pulley (7G) and fifth pulley (7H)
And the third center of rotation is arranged at each vertex of the triangle, and the endless second belt (7C) is moved from the third to fifth belts.
Around the pulleys (7F), (7G) and (7H) of the second belt
(7C), the supply stage (1) and the storage stage (2)
And the second motor connected to the fifth pulley (7H)
When (7R) is driven in the first rotation direction, the supply stage (1) at the supply position Q moves to the transfer position P, and the storage stage (2) at the transfer position P moves to the storage position R,
When the second motor (7R) is driven in the second rotation direction opposite to the first rotation direction, the supply stage (1) at the transfer position P moves to the supply position Q and the storage stage (2) at the storage position R 2. The IC transfer mechanism according to claim 1, wherein the IC moves to a transfer position P. 4. A first IC container (70A) in which a plurality of recesses (70D) for accommodating an IC (5) are formed vertically and horizontally, respectively.
The third IC container (70C), the third IC container (70C), and the unmeasured IC (5) are supplied from the first IC container (70A) to the supply position Q.
The supply hand (71) to be transferred to the supply stage (1) and the measured IC (5) from the storage stage (2) at the storage position R to the second IC container (70B) or the third IC 4. An IC transfer mechanism using a suction hand according to claim 1, further comprising a storage hand (72) to be transferred to a container (70C).