JPH069517Y2 - ヒートシンク取付具 - Google Patents
ヒートシンク取付具Info
- Publication number
- JPH069517Y2 JPH069517Y2 JP5705090U JP5705090U JPH069517Y2 JP H069517 Y2 JPH069517 Y2 JP H069517Y2 JP 5705090 U JP5705090 U JP 5705090U JP 5705090 U JP5705090 U JP 5705090U JP H069517 Y2 JPH069517 Y2 JP H069517Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- semiconductor component
- heat
- pressing portion
- wire rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 22
- 230000005855 radiation Effects 0.000 claims description 15
- 238000005452 bending Methods 0.000 claims description 11
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000009191 jumping Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Closures For Containers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5705090U JPH069517Y2 (ja) | 1990-05-30 | 1990-05-30 | ヒートシンク取付具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5705090U JPH069517Y2 (ja) | 1990-05-30 | 1990-05-30 | ヒートシンク取付具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0416163U JPH0416163U (enrdf_load_stackoverflow) | 1992-02-10 |
| JPH069517Y2 true JPH069517Y2 (ja) | 1994-03-09 |
Family
ID=31581414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5705090U Expired - Lifetime JPH069517Y2 (ja) | 1990-05-30 | 1990-05-30 | ヒートシンク取付具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH069517Y2 (enrdf_load_stackoverflow) |
-
1990
- 1990-05-30 JP JP5705090U patent/JPH069517Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0416163U (enrdf_load_stackoverflow) | 1992-02-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7375965B2 (en) | Clip and heat dissipation assembly using the same | |
| JP2563182B2 (ja) | ヒートシンク取付け装置、組合わせ装置及びフレーム手段 | |
| CA1204522A (en) | Heat dissipator for semiconductor devices | |
| US4933746A (en) | Three-legged clip | |
| JP5594892B2 (ja) | 熱管理構造を有するソケット組立体 | |
| US5170325A (en) | Spring element for a group of components of an electronic control device | |
| JP2001506428A (ja) | 表面実装電子素子パッケージのヒートシンク装着体 | |
| US7385822B1 (en) | Clip assembly | |
| US4709302A (en) | Alignment apparatus for electronic device package | |
| US6249436B1 (en) | Wire heat sink assembly and method of assembling | |
| US4847449A (en) | Alignment apparatus for use in mounting electronic components and heat sinks on circuit boards | |
| US6087723A (en) | Vertical surface mount assembly and methods | |
| US6917482B2 (en) | Optical module mounted body and securing method of optical module | |
| JP2002500826A (ja) | トーションバークランプ装置および積み重ね電子部品間の熱的および機械的接触を向上させる方法 | |
| JPH069517Y2 (ja) | ヒートシンク取付具 | |
| EP0307425A1 (en) | MOUNTING ARRANGEMENT FOR CHIP SUPPORT. | |
| JPS6319900A (ja) | 電子部品用アラインメント装置 | |
| JP5117299B2 (ja) | ヒートシンク | |
| JP2005166907A (ja) | 立ち基板固定構造 | |
| JPS6329839B2 (enrdf_load_stackoverflow) | ||
| JPH0356078Y2 (enrdf_load_stackoverflow) | ||
| JP2003318340A (ja) | 冷却体 | |
| JP2681702B2 (ja) | 面実装部品の実装方法 | |
| JPH06830Y2 (ja) | トランジスタのリ−ド | |
| JPH085586Y2 (ja) | 発光ダイオード固定具 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |