JPH0685131A - Device package - Google Patents

Abstract

PURPOSE:To provide a device package with improved reliability in circuits, by making good use of a sealed semiconductor device so as not to increase its mounting area. CONSTITUTION:A device package 10 is provided in the middle of a plurality of boards placed opposite to each other. A plurality of leads 16 are connected to each board for each divided part of connection.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device package in which a semiconductor element is encapsulated.

[0002]

2. Description of the Related Art In order to prevent failure and deterioration of semiconductor elements,
The semiconductor element is enclosed in a container called a package and shielded from the outside air. One end of each of a plurality of lead wires is connected to the semiconductor element enclosed in this package. The other end of each of the plurality of lead wires is connected to an external substrate. Conventionally, it has been assumed that one package in which a semiconductor element is encapsulated is mounted on one substrate, and the lead wire exposed from the package is connected to one substrate.

[0003]

By the way, in recent years, the density of LSIs has been increasing in order to prevent an increase in the mounting area due to the increase in the size of LSIs. Therefore, the number of lead wires for connection with peripheral circuits is reduced. In some cases, the number of peripheral circuits cannot be mounted on one board due to increase in the number. Therefore, the L
The SI and the peripheral circuit may be mounted separately. Since data is transmitted / received between the LSIs mounted on the plurality of boards via a bus line, there are problems such as the speed of data transmission / reception and transmission / reception errors.

In view of the above circumstances, it is an object of the present invention to provide a device package in which the enclosed semiconductor element is effectively used to prevent an increase in the mounting area and improve the reliability of the circuit.

[0005]

The device package of the present invention for achieving the above object is arranged by being sandwiched between a plurality of substrates arranged to face each other, and is connected to each of the substrates in a shared manner. It is characterized by having a plurality of lead wires.

[0006]

The device package of the present invention is sandwiched between a plurality of substrates which are arranged so as to face each other, and the lead wires are connected to the respective substrates in a shared manner. To be done. Therefore, the number of device packages can be reduced and the mounting area can be reduced as compared with the case where device packages are arranged on each of a plurality of substrates. In addition, the overall cost can be reduced and the device package can be effectively used.

In addition, data is not transferred between a plurality of device packages via a bus line, but 1
Consistent handling of data in one device package improves circuit reliability.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a first embodiment of the device package of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a schematic configuration of the device package of the first embodiment.
The device package 10 includes a semiconductor element 1 inside.
A package 14 in which 2 is enclosed is provided. In addition, a plurality of lead wires 16 connecting the semiconductor element 12 and a plurality of external substrates (not shown) are provided in the package 14.
Is exposed from the two surfaces 14a and 14b in the two vertical directions, and one end of the lead wire 16 is connected to the semiconductor element 12. External substrates are arranged, for example, above and below the package 14, respectively, and lead wires exposed in the upward direction on the board placed above and lead wires exposed in the downward direction on the board placed below. Be connected.

In the device package of this embodiment, the lead wires are exposed in the two vertical directions, but the lead wires are exposed in any direction of 360 ° by changing the bending angle of the lead wires. be able to. next,
A second embodiment of the device package will be described with reference to the drawings. FIG. 2 is a perspective view showing a schematic configuration of the device package of the second embodiment.

In the device package shown in FIG. 2, the same elements as those of the device package shown in FIG. 1 are designated by the same reference numerals, and their description will be omitted. The feature of the device package 20 of the second embodiment is that the lead wires 16 are exposed in the vertical direction from the four surfaces of the package 14. This allows the lead wire 16 to be connected to a larger number of substrates.

Next, a method of manufacturing the device package of the first embodiment will be described with reference to the drawings. 3 to 10
[FIG. 3] is an explanatory diagram illustrating a method of manufacturing the device package of the first embodiment. First, as shown in FIG. 3, the insulating film 24 and the semiconductor element 12 are placed on the dedicated work table 22. Figure 4
4 is a plan view of the working state shown in FIG. 3, in which a central portion 28 of the insulating film 24 is cut out to accommodate the semiconductor element 12.

Next, as shown in FIG. 5, a dedicated workbench 22
The lead wire 16 and the pad 32 are formed on the insulating film 2 respectively.
4. Adhere to the surface of the semiconductor element 12 and perform the first wire bonding 34. FIG. 6 is a plan view showing a state where the pad 32 is bonded to the semiconductor element 12 and the first wire bonding 34 between the lead wire 16 (a part of which is omitted) and the semiconductor element 12 is completed. is there.

Next, as shown in FIG. 7, the package 36 is lowered from above and bonded to the lead wires 16 and the pads 32. After that, as shown in FIG. 8, the dedicated work table 22 on which the package 36 is still mounted is inverted and the dedicated work table 22 is raised. Next, as shown in FIG. 9, the lead wire 16 and the semiconductor element 1 are formed on the exposed back surface 38 of the semiconductor element 12.
The second wire bonding 34 is performed between the first and second wires.
FIG. 10 is a plan view showing a state where the second wire bonding 34 between the lead wire 16 and the semiconductor element 12 is completed. Through these series of operations, the lead wire 16
The device package 1 is exposed in two directions.
0 is obtained.

[0014]

As described above, in the device package of the present invention, the lead wires are shared among the plurality of substrates arranged to face each other, so that the device package has a plurality of leads. It is used by being shared with the substrate. As a result, the number of device packages can be reduced and costs can be reduced compared to the past.
Effective use of device packages. Further, the data is not transferred between a plurality of device packages via a bus line, but the data is handled consistently in one device package, so that the reliability of the circuit is improved.

[Brief description of drawings]

FIG. 1 is a perspective view showing a schematic configuration of a device package according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a schematic configuration of a device package of a second embodiment of the present invention.

FIG. 3 is an explanatory diagram showing a state in which an insulating film and a semiconductor element are placed on a dedicated workbench.

FIG. 4 is a plan view of the state shown in FIG.

FIG. 5 is an explanatory view showing a work of bonding the lead wire and the pad to the surfaces of the insulating film and the semiconductor element, respectively, and performing the first wire bonding on the dedicated work table.

FIG. 6 is a plan view showing a state in which a pad is bonded to a semiconductor element and a first wire bonding between a lead wire and the semiconductor element is completed.

FIG. 7 is an explanatory diagram showing an operation of unloading a package from above and adhering it to a lead wire and a pad.

FIG. 8 is an explanatory diagram showing a state in which the dedicated workbench with the package still mounted is inverted.

FIG. 9 is an explanatory diagram showing a work of raising a dedicated work table to expose a back surface of the semiconductor element and performing a second wire bonding between the lead wire and the semiconductor element on the back surface.

FIG. 10 is a plan view showing a state where the second wire bonding between the lead wire and the semiconductor element is completed.

[Explanation of symbols]

 10, 20 Device package 12 Semiconductor element 14 Package 16 Lead wire

Claims (1)

[Claims] 1. A device package comprising a plurality of lead wires which are arranged so as to be sandwiched between a plurality of substrates which are arranged to face each other, and which are shared by and connected to the respective substrates.