JPH0685007A - Film carrier tape and its production - Google Patents

Abstract

PURPOSE:To lessen processing steps and simplify a production method by using a photosensitive resin with electrical conductivity for a wiring conductor. CONSTITUTION:A bump 21 composed of gold and solder is formed on a chip electrode 20 of a semiconductor chip 19. After the electrode 20 is aligned with a wiring conductor 2 on a polyimide tape 1, a tool 22 composed of ceramic, etc., is lowered to thermocompress the conductor 2 and the bump 21 while pressing it from above the polyimide film. After a film carrier tape and the chip 19 are bonded, a protective resin 24 is formed on the surface of the chip 19. A resin injecting hole 23 for coating the surface of the chip 19 with the resin 24 is made at the time of forming a sprocket hole. Therefore, processing steps can be lessened so as to simplify the production method.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film carrier tape and a manufacturing method thereof.

[0002]

2. Description of the Related Art A conventional film carrier tape is shown in FIG.
As shown in (A), a wiring conductor 10 made of copper is provided on an insulating tape 1 having a sprocket hole 3 and a device hole 5. 3 (B) is shown in FIG.
It is one example of the sectional view of the BB part of (A). Figure 3
The film carrier tape having the sectional structure of (B) is obtained by the process shown in FIG.

First, a flexible insulating tape 1 as shown in FIG. 5 (a) is prepared. Next, as shown in FIG. 5B, flash copper plating 7 is applied on the insulating tape 1.
The thickness of the flash copper plating 7 is usually about 0.3 μm and is usually performed by electroless plating or sputtering. Next, as shown in FIG. 5C, a photoresist 8 is applied to form a wiring pattern on the flash copper plating 7 and to form openings such as the device hole 5 and the sprocket hole 3 in the polyimide. . Next, FIG. 5 (d)
The thick copper plating 9 is selectively applied to the flash copper plating 7 other than the photoresist portion 8 by the electroplating method as shown in FIG. Next, as shown in FIG. 5E, the polyimide 8 other than the photoresist portion 8 is melted to form the opening 13 such as the device hole 5 and the sprocket hole 3.
Next, the photoresist 8 is removed as shown in FIG. Next, as shown in FIG. 5G, the entire copper is etched using a copper etching solution, and the flash copper plating 6 portion located under the photoresist 8 is eliminated, whereby the copper wiring conductor 10 is formed. Pattern is formed. This completes the production of the film carrier tape.

FIG. 3C shows a cross-sectional structure of the conventional film carrier, which is different from that of FIG. 3B in the section BB of FIG. 3A. The wiring conductor 10 of this structure is composed of the polyimide tape 1 and the adhesive 11 mainly composed of epoxy.
Is formed through. The conventional method of manufacturing a film carrier having this structure is to apply an adhesive to a polyimide tape and punch it to form openings such as device holes and sprocket holes. The foil is formed by applying resist, exposing the mask, developing, and etching to form patterns and leads.

On the other hand, a method of forming a wiring conductor on a printed circuit board or the like by screen printing is well known. Figure 6
An example of a method of forming a wiring conductor by screen printing is shown in FIG. The conductive resin 18 is extruded on the substrate 14 from between the screen mesh systems 16 by the squeegee 17, and is applied only to the portion other than the screen 15. After this, the conductive resin is thermoset to form a wiring pattern. It is also possible to manufacture a film carrier having a wiring pattern formed on polyimide by using this method.

[0006]

The conventional methods of manufacturing a film carrier tape and the carrier tape have the following problems, respectively.

The method of producing a film carrier by performing flash copper plating on polyimide and applying a photoresist after electrolytic coating, polyimide dissolution, resist stripping, and copper etching is complicated and therefore costly.

Further, since a film carrier produced by pasting a copper foil on a polyimide having openings formed by patching via an adhesive and applying resist, mask exposure, development and etching has polyimide openings. As the wiring pattern is miniaturized, lead deformation has become a problem.

Further, although the process is simple in the method of manufacturing a film carrier in which a wiring pattern is formed by screen printing, there is a problem in that the processing accuracy of the screen is limited and the conductive resin seeps out under the screen. There was a problem that it could not be miniaturized.

[0010]

The film carrier tape of the present invention comprises a wiring conductor made of a photosensitive resin having conductivity.

The film carrier tape of the present invention may be provided with a wiring conductor made of a photosensitive resin having conductivity plated with a metal such as gold, tin or solder.

The method of manufacturing a film carrier tape according to the present invention comprises a step of applying a photosensitive resin having conductivity to a flexible insulating tape, and a step of exposing and developing a wiring pattern on the applied photosensitive resin. And a step of removing an unnecessary portion of the photosensitive resin in the wiring pattern after development.

Further, in the method for manufacturing the film carrier tape according to the present invention, after removing the unnecessary portion of the photosensitive resin in the wiring pattern after the development, gold, tin,
It may include a step of plating a metal such as solder.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described with reference to the drawings.

FIG. 1A is a plan view showing an embodiment of the present invention, and FIG. 1B is a sectional view taken along the line AA of FIG. 1A. In FIG. 1, 1 is a flexible insulating tape and 2 is a wiring conductor made of a photosensitive resin having conductivity. The insulating tape 1 is made of resin such as polyimide, glass epoxy, polyester and BT resin. Reference numeral 3 in FIG. 1 is a sprocket hole used for tape feeding and positioning during tape production and IC assembly. The photosensitive resin having conductivity which is a material of the wiring conductor 2 includes, for example, those described in "Photopolymer Handbook" Industrial Research Committee (published June 15, 1989) P509 to P510. Table 1 shows the compounding sequence of the paste of UV copper of the silver powder kneading described (JP-B-58-22041).

[0016]

[Table 1]

FIG. 2 shows the wiring conductor of one embodiment of the present invention shown in FIG. 1 which is plated with a metal 4 such as gold, tin or solder.

Next, an example of the method for producing the film carrier tape of the present invention will be described.

FIG. 4 is a process chart showing an example of a method for manufacturing the film carrier tape of the present invention. Here, the same parts as those in FIG. 1 are designated by the same reference numerals and the description thereof will be omitted.

First, a flexible insulating tape 1 as shown in FIG. 4 (a) is prepared.

Next, as shown in FIG. 4B, a photosensitive resin 2 having conductivity is applied onto the insulating tape 1.

Next, as shown in FIG. 4 (c), in order to form a wiring pattern, the photosensitive resin 2 having conductivity is exposed by the light 12 using the mask 6 and developed.

Next, as shown in FIG. 4D, the wiring conductor 2 is removed by removing the photosensitive resin 2 unnecessary for the pattern.
Is formed, and the film carrier tape is completed.

Although not shown in FIG. 4, the wiring conductor 2 may be plated with a metal such as gold, tin, or solder after (d).

The sprocket hole 3 in FIG. 1 is formed by punching the polyimide tape 1 in advance.

Next, a method of manufacturing a semiconductor device using the film carrier tape of the present invention will be described.

FIG. 7 is a sectional view showing a method of connecting the film carrier tape of the present invention and a semiconductor chip. Bumps 21 made of gold, solder or the like are formed on the chip electrodes 20 of the semiconductor chip 19. After aligning the position of the chip electrode 20 and the wiring conductor 2 on the polyimide lap 1 as shown in FIG. 7 (A), the tool 22 made of ceramic, SUS or the like is lowered, and the polyimide film 1 is placed on the polyimide film 1 as shown in FIG. 7 (B). The wiring conductor 2 and the bumps 21 are thermocompression bonded while applying pressure. Polyimide has heat resistance and can withstand the main bonding.

FIG. 8 shows a cross-sectional view when the protective resin 24 is formed on the surface of the semiconductor chip 19 after connecting the film carrier tape of the present invention and the semiconductor chip. 23 in the figure
Is a resin injection hole provided to apply the protective resin 24 to the surface of the semiconductor chip 19. This hole can be formed at the same time as the sprocket hole is formed or after the conductor pattern is formed on the tape.

[0029]

As described above, since the film carrier tape of the present invention uses the photosensitive resin having conductivity for the wiring conductor, the number of steps is small, the manufacturing method is simple, and the cost is low. There is an effect that the lead deformation is small, the yield is high, and the wiring pattern can be miniaturized.

[Brief description of drawings]

FIG. 1 is a plan view (A) and a sectional view (B) of a film carrier tape showing an embodiment of the present invention.

FIG. 2 is a sectional view of a film carrier tape showing another embodiment of the present invention.

FIG. 3 is a plan view of a conventional film carrier tape (A).
And sectional views (B) and (C).

FIG. 4 is a cross-sectional view showing a method of manufacturing a film carrier tape according to an embodiment of the manufacturing method of the present invention.

FIG. 5 is a cross-sectional view showing an example of a conventional method for manufacturing a film carrier tape.

FIG. 6 is a sectional view showing a conductor pattern forming method by screen printing.

FIG. 7 is a sectional view showing a method of connecting the film carrier tape of the present invention and a semiconductor chip.

FIG. 8 is a sectional view showing an example of a semiconductor device using the film carrier tape of the present invention.

[Explanation of symbols]

 1 Insulating tape 2 Wiring conductor made of photosensitive resin having conductivity 3 Sprocket hole 4 Plating of gold, tin, solder, etc. 5 Device hole 6 Mask 7 Flash copper plating 8 Photoresist 9 Thick copper plating 10 Copper wiring Conductor 11 Adhesive 12 Light 13 Open hole 14 Substrate 15 Screen 16 Screen mesh system 17 Squeegee 18 Conductive resin 19 Semiconductor chip 20 Chip electrode 21 Bump 22 Tool 23 Resin injection hole 24 Protective resin

Claims (4)

[Claims] 1. A film carrier tape having a wiring conductor on a flexible insulating tape, wherein the wiring conductor is made of a photosensitive resin having conductivity. 2. The film carrier tape according to claim 1, wherein the wiring conductor is plated with a metal such as gold, tin, or solder. 3. A step of applying a photosensitive resin having conductivity to a flexible insulating tape, a step of exposing and developing a wiring pattern on the applied photosensitive resin, and a step of removing unnecessary portions of the wiring pattern after development. A method of manufacturing a film carrier tape, comprising a step of removing a photosensitive resin. 4. A step of plating a metal such as gold, tin, solder or the like on the wiring conductor after removing an unnecessary portion of the photosensitive resin in the wiring pattern after development. A method for manufacturing the film carrier tape according to.