JPH0684721A - Irregular shaped parts with mold for positioning lead inserted into substrate and its taping method - Google Patents

Abstract

PURPOSE:To accurately insert the leads of irregular shaped parts which are easily deformable and hard to be automatically inserted into a substrate and to solder the leads in a preceding process by providing molds for positioning the leads below the leads. CONSTITUTION:The title taping method consists of an irregular shaped parts taping process 11 in which the leads 15a of irregular shaped parts 15 are taped, irregular shaped parts leads inserting mold process 12 in which molds 17 for positioning the leads 15a to the leads 15a, mold bonding agent applying process 13 in which a bonding agent 18 is applied to the substrate inserting contact surfaces of the molds 17, and cutting and substrate inserting process 14 in which the leads 15a are cut and inserted into a substrate 19. Since the parts 15 are not held, but the molds 17, the leads 15a can be accurately inserted into the holes of the substrate 19 including the inserting depth. In addition, since the parts 15 are fixed to the substrate 19 with the bonding agent 18, the leads can be soldered in a preceding process using a solder bath similarly to other standard mounting parts.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a deformed part, and more particularly to a deformed part provided with a mold for locating leads for inserting a board and a taping method therefor.

[0002]

2. Description of the Related Art A conventional deformed part is, as shown in FIG.
It has a deformed component body 21 and a lead 22 extending downward from the lower surface of the deformed component body 21. In addition, as shown in FIGS. 4A and 4B, the conventional deformed part taping method includes a deformed part taping step 31 of taping the lead 15a of the deformed part, and the deformed part 15 by cutting a part of the lead 15a. And a cutting / board inserting step 32 of inserting the board into the board 19.

[0003]

In the above-mentioned conventional odd-shaped component, the lead is easily bent, and when the odd-shaped component is inserted into the substrate, the bending of the lead is first corrected, and the odd-shaped component main body is gripped. However, there is a problem in that the image recognition device must recognize and correct the position and the bending of the lead with respect to the outer shape of the main body of the odd-shaped component, and correct and insert the lead into the board.

In addition, in the conventional taping method for deformed parts,
After the deformed parts taping process, the leads of the deformed parts were cut by the cutting / board insertion process, and the deformed parts body was gripped and inserted into the board. There was a problem. or,
Due to the above reasons and the like, there is a problem that the soldering of the odd-shaped component to the substrate is a post-mounting unlike the standard mounting component by another component inserting machine.

[0005]

According to another aspect of the present invention, there is provided a deformed component with a mold for locating leads for insertion into a substrate, wherein the deformed component main body portion has an outwardly extending lead, and the lead is housed outside the lead. A board insertion lead positioning mold formed according to the lead standard while leaving the ends of the leads.

Further, according to the present invention, the method of taping a deformed component with a mold for positioning the board-inserted lead is performed by taping the deformed component taping the lead extending to the outside of the deformed component and leaving the tip on the lead. Deformed component lead insert molding process in which a mold for board insertion lead positioning is attached by molding based on the lead.
It includes a mold adhesive applying step of applying an adhesive to the board insertion contact surface of the mold, and a cutting / board inserting step of cutting the taped portion of the lead and inserting it into the board.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of an embodiment of a deformed part according to the first invention, FIG. 2 is a view showing an embodiment of a taping method according to the second invention, and FIG. Flowchart, (b) is a perspective view showing the situation of each step of (a).

In the embodiment shown in FIG. 1, a lead 2 for inputting and outputting an electric signal extends downward on the lower surface of the main body 1 of the odd-shaped component. A mold 3 is attached to the lower center of the lead 2 so as to include the lead, leaving only the board insertion portion of the lead 2. The lower surface of the mold 3 is flat so as to be fixed in parallel with the substrate. Mold 3
The outer shape of is shaped so that it is located accurately on the horizontal and vertical axes with respect to the lead 2.

Next, the operation of this embodiment will be described. When the outer shape of the mold 3 is gripped by a robot hand or the like, the deformed component can be gripped on the basis of the lead 2. Therefore, it is not necessary to correct the position of the lead 2 with respect to the outer shape of the deformed component body 1 by an image recognition device or the like. , Can be inserted into the board. Further, when the lead 2 is pushed into the lower surface of the mold 3 at the time of inserting the substrate, it is possible to incorporate a deformed component having a constant insertion depth. When the substrate is inserted, if an adhesive is applied to the lower surface of the mold 3 to fix the odd-shaped component to the substrate, soldering in the previous step of passing through the solder bath is also possible because the mold 3 is provided.

In the process of the embodiment shown in FIG. 2, a deformed component taping step 11 of taping the leads 15a of the deformed component 15 onto the tape 16 and the lead 1 of the deformed component.
5a, a lead insert molding process 12 for deforming the odd-shaped component, in which a board insertion lead positioning mold 17 is attached to 5a;
The deformed component taping method of this embodiment is composed of a mold adhesive applying step 13 of applying an adhesive 18 to the board insertion contact surface of the mold 17 and a cutting / board inserting step 14 of cutting the leads 15a and inserting them into the board 19. Has been done.

Next, the operation will be described. In the deformed component lead insert molding step 12, since the lead can be grasped only by grasping the outer shape of the mold 17, the lead 15a can be accurately inserted into the hole of the substrate 19. The adhesive 18 is applied to the board insertion contact surface of the mold 17 by the mold adhesive application step 13, and the leads 15a of the odd-shaped component 15 are applied by the cutting / board insertion step 14.
When the component is cut and inserted into the hole of the substrate 19, the odd-shaped component 15
Is inserted with an accurate insertion depth, and is fixed to the substrate 19 without tilting even during the transfer of the substrate. In this state, it becomes possible to perform soldering in the previous process using the solder bath, as in the case of standard components inserted by another component insertion machine.

[0013]

As described above, in the odd-shaped component according to the present invention, since the mold for board insertion lead positioning is attached at an accurate position based on the lead reference, it is possible to insert the odd-shaped component into the substrate hole in the image processing apparatus or the like. It can be easily carried out without using, and has an effect that the insertion depth can be kept constant by inserting it to the lower surface of the mold.

Further, according to the process of the present invention, a deformed component lead insert molding process for mounting a mold for positioning the substrate insertion lead in the deformed component taping process, and a mold adhesive application process for applying an adhesive to the substrate contact surface of the mold. With the addition of, there is an effect that it is possible to easily insert the odd-shaped component into the board hole based on the lead reference of the odd-shaped component. There is an effect that the odd-shaped component, which tends to be apt to be soldered, can be soldered in the previous process like other insertion components in the previous process of passing the solder bath.

[Brief description of drawings]

FIG. 1 is a perspective view of an embodiment of a deformed component according to the first invention.

2A and 2B are views showing an embodiment of a taping method according to the second invention, wherein FIG. 2A is a flow chart of steps, and FIG. 2B is a perspective view showing the state of each step of FIG. 2A.

FIG. 3 is a perspective view of an example of a conventional odd-shaped component.

4A shows an example of a conventional taping method, FIG. 4A is a flowchart of steps, and FIG. 4B is a perspective view showing a situation of each step in FIG. 4A.

[Explanation of symbols]

 1,21 Deformed parts body 2,15a, 22 Leads 3,17 Mold 11,31 Deformed parts taping process 12 Deformed parts lead insert molding process 13 Mold adhesive application process 14,32 Cutting / board insertion process 15 Deformed parts 16 Tape 18 Adhesive 19 Substrate

Claims (2)

[Claims] 1. A deformable component main body having an outwardly extending lead, and a substrate insertion lead positioning member formed by a lead reference, which includes the lead outside the lead and leaves the tip of the lead. A deformed component with a mold for positioning a lead for inserting a board, comprising a mold. 2. A deformed component taping step of taping a lead extending outward of the deformed component, and a deformed component to which a mold for board insertion lead positioning is attached by molding with the lead as a lead leaving the tip of the lead. The method comprises a lead insert molding step, a mold adhesive applying step of applying an adhesive to the board insertion contact surface of the mold, and a cutting / board inserting step of cutting the taped portion of the lead and inserting it into the board. A taping method for irregularly shaped parts with a mold for locating leads for board insertion.