JPH01239834A - Manufacture of chip type electronic component - Google Patents
Manufacture of chip type electronic componentInfo
- Publication number
- JPH01239834A JPH01239834A JP63066612A JP6661288A JPH01239834A JP H01239834 A JPH01239834 A JP H01239834A JP 63066612 A JP63066612 A JP 63066612A JP 6661288 A JP6661288 A JP 6661288A JP H01239834 A JPH01239834 A JP H01239834A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- type electronic
- chip type
- bent
- lead terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 238000005452 bending Methods 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 abstract description 7
- 238000005476 soldering Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 3
- 241000277269 Oncorhynchus masou Species 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は各種電子機器に用いるチップ形電子部品の製造
方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing chip-shaped electronic components used in various electronic devices.
従来の技術
近年の電子機器には、小形化、基板実装工数の削減、信
頼性向上等を目的としてチップ形電子部品が広く使用さ
れている。2. Description of the Related Art In recent years, chip-type electronic components have been widely used in electronic devices for the purpose of downsizing, reducing the number of board mounting steps, and improving reliability.
このチップ形電子部品の電極リード形成の一方法として
、はんだ付けを容易にするため、めっきないしディソピ
ング工法によシ、はんだで覆って、回路基板とはんだ付
けが容易な形状に折り曲げ成形したものが多く用いられ
ている。One method of forming electrode leads for chip-shaped electronic components is to use plating or dissoping methods to facilitate soldering, cover them with solder, and then bend and form them into a shape that can be easily soldered to a circuit board. It is often used.
発明が解決しようとする課題
このような従来の構成で、折り曲げ成形時には、金属材
によって構成された折曲げ治具を用いて行っていたため
、折υ曲げ部ないしはその近傍に、比較的大きな力が加
わシ、該当部分の表面のはんだがはがれ、回路基板との
はんだ付は強度を著しく低くする欠点がちった。Problems to be Solved by the Invention With such a conventional configuration, a bending jig made of a metal material was used during bending, so a relatively large force was applied to the bending part or its vicinity. As a result, the solder on the surface of the relevant part peeled off, and the soldering to the circuit board had the disadvantage of significantly lowering the strength.
本発明はこのような問題点を解決するもので、はんだ付
は強度の高いチップ形電子部品を提供することを目的と
するものである。The present invention solves these problems and aims to provide a chip-shaped electronic component with high soldering strength.
課題を解決するための手段
この課題を解決するために本発明は、折り曲げ部を有す
る板状リード端子を使用したチップ形電子部品において
、前記板状リード端子の折υ曲げ部の折り曲げ加工をプ
ラスチック材料型を用いて行うものである。Means for Solving the Problems In order to solve the problems, the present invention provides a chip-shaped electronic component using a plate-shaped lead terminal having a bent portion, in which the bent portion of the plate-shaped lead terminal is bent using a plastic material. This is done using a material mold.
作用
この方法により（折り曲げ成形時に、折り曲げ部ないし
はその近傍に加わる力が小さくなり、該当部分の表面の
はんだのはがれを防止することができる。Effect: By this method (during bending and forming), the force applied to the folded portion or its vicinity is reduced, and peeling of the solder on the surface of the corresponding portion can be prevented.
実施例
以下、本発明の一実施例について、図面を参照しながら
説明する。EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings.
第１図ａ、ｂ、ｃはチップ形電子部品の一実施例の正面
図である。Figures 1a, b, and c are front views of one embodiment of a chip-type electronic component.
第２図ａはチップ形電子部品の一実施例の板状リード端
子２を展開した平面図である。FIG. 2a is a developed plan view of a plate-shaped lead terminal 2 of an embodiment of a chip-shaped electronic component.
チップ形電子部品は電子部品本体１と板状リード端子２
とで構成されており、板状リード端子２は折り曲げ部２
ａで折り曲げられ、回路基板とのはんだ付けが容易な形
状に成形されている。The chip-type electronic component consists of an electronic component body 1 and a plate-shaped lead terminal 2.
The plate-shaped lead terminal 2 has a bent portion 2.
It is bent at point a and shaped into a shape that can be easily soldered to a circuit board.
この折り曲げ成形時に、金属材料の型を使用した場合、
折り曲げの際に加えられる大きな外力は、折り曲げ部な
いしはその近傍に加わシ、折り曲げの結果、板状リード
端子２の外表面を構成しているはんだが欠落する欠点が
あったため、本発明では、板状リード端子２の折り曲げ
部の折り曲げを弾性を有するプラスチック材からなる治
具を使用して行うものである。If a metal mold is used during this bending process,
A large external force applied during bending is applied to the bent portion or its vicinity, and as a result of bending, the solder constituting the outer surface of the plate-shaped lead terminal 2 has the disadvantage of being lost. The bent portion of the shaped lead terminal 2 is bent using a jig made of an elastic plastic material.
このため、折り曲げの際に加えられる太き々外力は、弾
性体であるプラスチック材の治具に吸収され、折り曲げ
部ないしはその近傍に加わる外力を小さくすることがで
き、板状リード端子２の外表面を構成しているはんだの
欠落を防止することができる。Therefore, the large external force applied during bending is absorbed by the jig made of an elastic plastic material, and the external force applied to the bending part or its vicinity can be reduced, and the external force applied to the plate-shaped lead terminal 2 can be reduced. It is possible to prevent the solder forming the surface from missing.
発明の効果
以上のように本発明によれば、折り曲げ部を有する板状
リード端子を使用したチップ形電子部品において、前記
板状リード端子の折り曲げ部の折り曲げにプラスチック
材の治具を用いることにより、板状リード端子の折り曲
げ成形の際に必要とする力を小さくできるため、板状リ
ード端子の外表面を構成しているはんだの欠落を防止す
ることができ、回路基板とのはんだ付けを確実に行うこ
とができるチップ形電子部品が得られ、その効果は極め
て犬である。Effects of the Invention As described above, according to the present invention, in a chip-shaped electronic component using a plate-shaped lead terminal having a bent portion, by using a jig made of a plastic material to bend the bent portion of the plate-shaped lead terminal. , the force required when bending and forming plate-shaped lead terminals can be reduced, which prevents the solder that makes up the outer surface of the plate-shaped lead terminals from missing, ensuring reliable soldering to the circuit board. A chip-shaped electronic component is obtained that can be manufactured in a number of ways, and its effects are extremely impressive.
第１図ａ、ｂ、ｃは本発明の一実施例による方法によっ
て製造したチップ形電子部品を示す正面図、第２図は本
発明の一実施例によるチップ形電子部品の板状リード端
子を展開した平面図である。
１・・・・・・製品本体、２・・・・・・板状リード端
子、２＆・・・・・・折り曲げ部。
代理人の氏名 升理士 中 尾 敏 男 ほか１名１−
製品本体
２− 梳状ワード搗子
？ａ −−一 士ｒ リ 曲 １す゛ ）Ｂ第１図
／1a, b, and c are front views showing a chip-shaped electronic component manufactured by a method according to an embodiment of the present invention, and FIG. 2 is a front view showing a plate-shaped lead terminal of a chip-shaped electronic component according to an embodiment of the present invention. It is a developed plan view. 1... Product body, 2... Plate lead terminal, 2 &... Bent part. Name of agent: Masu Toshio Nakao and 1 other person 1-
Product body 2 - Worsted word comb? a - - 1st r ri song 1su゛) B Fig. 1/
Claims (1)
形電子部品において、前記板状リード端子の折り曲げ部
の折り曲げをプラスチック材の治具を用いて行うことを
特徴とするチップ形電子部品の製造方法。A method of manufacturing a chip-shaped electronic component, which uses a plate-shaped lead terminal having a bent portion, and the method includes bending the bent portion of the plate-shaped lead terminal using a jig made of a plastic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63066612A JPH01239834A (en) | 1988-03-18 | 1988-03-18 | Manufacture of chip type electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63066612A JPH01239834A (en) | 1988-03-18 | 1988-03-18 | Manufacture of chip type electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01239834A true JPH01239834A (en) | 1989-09-25 |
Family
ID=13320898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63066612A Pending JPH01239834A (en) | 1988-03-18 | 1988-03-18 | Manufacture of chip type electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01239834A (en) |
-
1988
- 1988-03-18 JP JP63066612A patent/JPH01239834A/en active Pending
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