JPH06833Y2 - 透明樹脂で封止される光半導体装置の高耐湿性リ−ドフレ−ム - Google Patents

透明樹脂で封止される光半導体装置の高耐湿性リ−ドフレ−ム

Info

Publication number
JPH06833Y2
JPH06833Y2 JP1986160173U JP16017386U JPH06833Y2 JP H06833 Y2 JPH06833 Y2 JP H06833Y2 JP 1986160173 U JP1986160173 U JP 1986160173U JP 16017386 U JP16017386 U JP 16017386U JP H06833 Y2 JPH06833 Y2 JP H06833Y2
Authority
JP
Japan
Prior art keywords
die pad
lead frame
semiconductor chip
moisture
transparent resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1986160173U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6367259U (cs
Inventor
俊彦 南
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP1986160173U priority Critical patent/JPH06833Y2/ja
Publication of JPS6367259U publication Critical patent/JPS6367259U/ja
Application granted granted Critical
Publication of JPH06833Y2 publication Critical patent/JPH06833Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1986160173U 1986-10-21 1986-10-21 透明樹脂で封止される光半導体装置の高耐湿性リ−ドフレ−ム Expired - Lifetime JPH06833Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986160173U JPH06833Y2 (ja) 1986-10-21 1986-10-21 透明樹脂で封止される光半導体装置の高耐湿性リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986160173U JPH06833Y2 (ja) 1986-10-21 1986-10-21 透明樹脂で封止される光半導体装置の高耐湿性リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS6367259U JPS6367259U (cs) 1988-05-06
JPH06833Y2 true JPH06833Y2 (ja) 1994-01-05

Family

ID=31085307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986160173U Expired - Lifetime JPH06833Y2 (ja) 1986-10-21 1986-10-21 透明樹脂で封止される光半導体装置の高耐湿性リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPH06833Y2 (cs)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4918591U (cs) * 1972-05-19 1974-02-16
JPS6136993Y2 (cs) * 1978-06-30 1986-10-27

Also Published As

Publication number Publication date
JPS6367259U (cs) 1988-05-06

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