JPH0682911B2 - Substrate holding device in circuit forming device - Google Patents
Substrate holding device in circuit forming deviceInfo
- Publication number
- JPH0682911B2 JPH0682911B2 JP63135154A JP13515488A JPH0682911B2 JP H0682911 B2 JPH0682911 B2 JP H0682911B2 JP 63135154 A JP63135154 A JP 63135154A JP 13515488 A JP13515488 A JP 13515488A JP H0682911 B2 JPH0682911 B2 JP H0682911B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- intake
- circuit
- circuit forming
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、ハイブリッドIC用の回路等を基板上に描画
する回路形成装置の基板保持装置に関し、特に両面に回
路を形成し得る基板の保持に好適な基板保持装置に関す
るものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate holding device of a circuit forming device for drawing a circuit for a hybrid IC on a substrate, and more particularly to holding a substrate capable of forming circuits on both sides. The present invention relates to a suitable substrate holding device.
現在使用されている回路形成装置としては第５図に示す
ものがある。A circuit forming device currently used is shown in FIG.
図において、回路形成材Ｐを収納した収納容器１の下端
には、ノズル２が設けられており、収納容器１はモータ
３によって垂直に昇降する昇降体４に保持されている。
また、前記収納容器１の下方には、基板支持台５がＸ−
Ｙステージ６上に固定されており、この基板支持台５上
に回路形成基板Ｂを固定し、前記ノズル２を回路形成基
板Ｂに近接させて回路形成材Ｐを吐出させると共に、Ｘ
−Ｙステージ５を駆動して基板支持台５を移動させるこ
とにより基板Ｂ上には、所定の回路が形成される。In the figure, a nozzle 2 is provided at the lower end of a storage container 1 that stores the circuit-forming material P, and the storage container 1 is held by an elevator 4 that vertically moves up and down by a motor 3.
In addition, below the storage container 1, a substrate support base 5 is located at X-.
The circuit forming substrate B is fixed on the Y stage 6, the circuit forming substrate B is fixed on the substrate supporting table 5, the nozzle 2 is brought close to the circuit forming substrate B, and the circuit forming material P is ejected.
A predetermined circuit is formed on the substrate B by driving the Y stage 5 and moving the substrate support 5.
また、基板支持台５としては一般に、第６図に示すよう
な平板状のもの5Aが用いられている。Further, as the substrate supporting base 5, a flat plate-shaped member 5A as shown in FIG. 6 is generally used.
すなわち、この基板支持台5Aの端縁部には３本の係止ピ
ン6,7,8が突設されており、これら基板Ｂの２辺を当接
させることにより、基板Ｂを基板支持台5A上の所定の基
準位置に設定することができる。また、基板支持台5Aの
内部は中空となっており、吸気パイプ９を介して連結さ
れた図外の吸気源により、上面に形成された多数の吸気
孔５A1から吸気を行なうことにより、位置決めされた基
板Ｂを確固に上面に吸着・保持させることができ、回路
形成中の基板5Aのずれ等を防止し得るものである。That is, three locking pins 6, 7, 8 are provided on the edge portion of the substrate supporting base 5A so as to project the substrate B by contacting the two sides of the substrate B. It can be set to a predetermined reference position on 5A. In addition, the inside of the substrate support base 5A is hollow, and an intake source (not shown) connected through the intake pipe 9 performs intake from a large number of intake holes 5A 1 formed on the upper surface to position the substrate. The formed substrate B can be firmly adsorbed and held on the upper surface, and displacement of the substrate 5A during circuit formation can be prevented.
ところで、基板Ｂには、その一面に回路を形成するもの
（以下、片面基板と称す）と、両面に回路を形成するも
の（以下、両面基板と称す）とがある。このうち一面に
のみ回路を形成する場合には、上記基板支持台5Aを用い
て良好に回路を形成することができるが、両面に回路を
形成する場合には、第２面目の回路を形成するに際して
既に第１面に形成された回路が基板支持台5Aの上面に接
触し、損傷する虞れがあった。By the way, the board | substrate B has what forms a circuit on one surface (henceforth a single-sided board), and what forms a circuit on both surfaces (henceforth a double-sided board). If the circuit is formed only on one side of these, the circuit can be favorably formed by using the substrate support 5A, but if the circuit is formed on both sides, the circuit of the second side is formed. At that time, the circuit already formed on the first surface may come into contact with the upper surface of the substrate support 5A and be damaged.
そこで、従来、両面基板に対しては、第７図に示すよう
な凹部５B1を有する基板支持台5Bを用いていた。これに
よれば、基板5Bはその周縁部のみが基板載置テーブル5B
の中空の周縁部５B2にて保持されることとなり、基板中
の回路との接触は避けられ、回路の損傷を防止すること
ができる。なお、第７図中５B3は吸気孔、10は吸気パイ
プである。Therefore, conventionally, for a double-sided substrate, a substrate support 5B having a recess 5B 1 as shown in FIG. 7 has been used. According to this, only the peripheral portion of the substrate 5B is the substrate mounting table 5B.
Hollow will be held by the peripheral portion 5B 2, contact with the circuit in the substrate is avoided, it is possible to prevent damage to the circuit. In FIG. 7, 5B 3 is an intake hole, and 10 is an intake pipe.
しかしながら、上記基板支持台5Bにあっては、一定のサ
イズの回路形成基板にしか適用できず基板のサイズ変更
に対してその都度基板支持台5Bを交換しなければならな
いという問題があった。However, the substrate support base 5B has a problem that it can be applied only to a circuit formation substrate of a certain size and the substrate support base 5B must be replaced each time the size of the substrate is changed.
例えば、基板支持台5Bの枠状の周縁部５B2の内周より小
さい基板B1を用いる場合には、第７図中の二点鎖線に示
すように、基板B1の二辺部を全く保持できず（基板B1の
状態は極めて不安定となり）、また、周縁部５B2より大
きい基板B2を用いた場合には周縁部５B2が基板B2中の裏
面に形成した回路に接触することとなり、この支持台5B
の所期の設置目的である回路の損傷防止を為し得ない。For example, when using a small substrate B 1 from the inner periphery of the peripheral portion 5B 2 frame-like substrate support table 5B, as shown in two-dot chain line in FIG. 7, any two sides of the substrate B 1 can not be maintained (the state of the substrate B 1 represents very unstable and becomes), also in the case of using a peripheral portion 5B 2 is greater than the substrate B 2 is brought into contact with the circuit periphery 5B 2 is formed on the back surface of the substrate B 2 This support 5B
It is impossible to prevent the damage of the circuit, which is the intended installation purpose.
この発明は前記問題点に着目して成されたもので、基板
のサイズに拘りなく、迅速かつ確実に基板を保持するこ
とができる回路形成装置における基板保持装置の提供を
目的とする。The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate holding device in a circuit forming device capable of holding a substrate quickly and reliably regardless of the size of the substrate.
この発明は、回路形成装置の回路形成材吐出ノズルに対
向して設けらた基板支持台に、吸気源に連結された吸気
孔を有する突面部と、この突面部にて保持された回路形
成基板の側端面に当接する係止ピンとを設ける一方、前
記基板支持台上に、前記突面部と同一平面上に保持面を
有すると共にこの保持面に係止ピンを立設して成る可動
保持体を載置し、かつ前記可動保持体の下面及び保持面
の上面に穿設された吸気孔に吸気源を連結したものであ
る。The present invention is directed to a substrate support base provided facing a circuit forming material discharge nozzle of a circuit forming device, a projecting surface portion having an intake hole connected to an intake source, and a circuit forming substrate held by this projecting surface portion. A movable holding member having a holding surface on the same plane as the projecting surface portion and having a locking pin standing on the holding surface while providing a locking pin for contacting the side end surface of the holding surface. An intake source is connected to an intake hole that is placed and that is formed in the lower surface of the movable holder and the upper surface of the holding surface.
この発明においては、可動保持体が基板支持台上のいか
なる個所へも移動可能であるため、回路形成基板の少な
くとも二辺部を基板支持台の保持面に保持させた後、他
の保持されていない周辺部分に適宜可動支持台を移動さ
せてその保持面にて保持させることができ、いかなるサ
イズの回路形成基板に対しても、その周辺部分を保持さ
せることができ、しかも、基板の側端面が突面部と、突
出部とにより少なくとも四点で係止されると共に、吸気
孔からの吸気作用により基板が可動保持及び基板支持台
に吸着され更に可動保持体自体もその下面に設けた吸気
孔からの吸気作用により基板支持台上に位置を固定し得
るため、回路形成動作中の基板支持台の水平移動により
基板がずれることもない。In the present invention, since the movable holder can be moved to any position on the substrate supporting base, after at least two sides of the circuit forming substrate are held on the holding surface of the substrate supporting base, they are held by other parts. The movable support can be moved to a peripheral part that is not present and can be held by the holding surface, and the peripheral part can be held for any size circuit formation substrate. Is locked at at least four points by the projecting surface portion and the projecting portion, and the substrate is movably held by the suction action from the suction hole and is adsorbed by the substrate support base, and the movable holding body itself is also provided on the lower surface thereof. Since the position can be fixed on the substrate support base by the suction action from the substrate, the substrate is not displaced by the horizontal movement of the substrate support base during the circuit forming operation.
以下、この発明の一実施例を第１図ないし第４図に基づ
き説明する。An embodiment of the present invention will be described below with reference to FIGS.
図において、11は駆動手段としてのＸ−Ｙステージ12上
に固定された基板支持台で、Ｘ−Ｙステージ12の駆動に
より水平面上をＸ方向およびＹ方向に移動するようにな
っている。この基板支持台11は長方形状を成し、その上
面には二辺に沿ってＬ字状に突面部11aが形成されてい
る。また、13は前記突面部11a,11bの外周縁に沿って形
成した複数の基準穴で、その基準穴には複数（この場合
３個）の基準ピン14,15,16が嵌脱可能に取付けられてい
る。17……は前記突面部11a,11bの上面から側面に亘っ
て形成された多数の吸気孔であり、これら吸気孔17……
の上面側開口部17a,……は突面部11a,11bの内縁に沿っ
て等間隔に配列されおり、また吸気孔17の側面側開口部
17bは接続部材18,…を介して吸気パイプ19……が連結さ
れ、さらにこれら吸気パイプ19,……は電磁弁20,……を
介して吸気源21（第３図参照）に連結されている。In the figure, reference numeral 11 denotes a substrate supporting base fixed on an XY stage 12 as a driving means, which is moved in the X and Y directions on a horizontal plane by driving the XY stage 12. The substrate support 11 has a rectangular shape, and an L-shaped projecting surface portion 11a is formed along the two sides on the upper surface thereof. Further, 13 is a plurality of reference holes formed along the outer peripheral edges of the projecting surface portions 11a, 11b, and a plurality of (three in this case) reference pins 14, 15, 16 are removably attached to the reference holes. Has been. Reference numeral 17 ... Indicate a large number of intake holes formed from the upper surface to the side surface of the projecting surface portions 11a and 11b.
Upper side openings 17a, ... Are arranged at equal intervals along the inner edges of the projecting surfaces 11a, 11b, and the side openings of the intake holes 17 are
17b is connected to an intake pipe 19 ... via a connecting member 18 ,. Further, these intake pipes 19 ... are connected to an intake source 21 (see FIG. 3) via a solenoid valve 20 ,. There is.
22は前記基板支持台11上に載置されたＬ字状の可動保持
体である。この可動保持体22には前記突面部11a,11bと
同一平面上に位置する保持面22aが形成され、さらにそ
の保持面22aの外側には保持面22aより上方へ突出する突
出部22bが形成されている。また、23,……及び24,……
は前記可動保持体22の下面から上面に亘って形成された
多数の吸気孔で、これら吸気孔23,……及び24,……は、
水平方向に形成された吸気流路25に連通しており、さら
に吸気流路25は接続部材26を介して吸気パイプ27に連結
され、吸気パイプ27は電磁弁28を介して吸気源21に連結
されている（第３図参照）。また、29は前記電磁弁28の
開閉指令を行なうためのスイッチ、30はスイッチ29に連
結さたリード線である。Reference numeral 22 is an L-shaped movable holder placed on the substrate support 11. A holding surface 22a located on the same plane as the projecting surface portions 11a and 11b is formed on the movable holding body 22, and a projecting portion 22b projecting upward from the holding surface 22a is formed outside the holding surface 22a. ing. Also, 23, …… and 24, ……
Is a large number of intake holes formed from the lower surface to the upper surface of the movable holding body 22, and these intake holes 23, ... And 24 ,.
It is connected to an intake passage 25 formed in a horizontal direction, and the intake passage 25 is connected to an intake pipe 27 via a connecting member 26, and the intake pipe 27 is connected to an intake source 21 via an electromagnetic valve 28. (See FIG. 3). Further, 29 is a switch for issuing an opening / closing command of the solenoid valve 28, and 30 is a lead wire connected to the switch 29.
また、第３図中、31はCPU、32はこのCPU31にI/033を介
して連結された電磁弁ドライバで、CPU31からの制御信
号に基づき前記電磁弁30,……及び28を開閉させる。34
は前記吸気孔17……からの吸気状態、すなわち、突面部
11a,11bにおける回路形成基板Ｂの吸気状態を検出する
負圧センサで、その検出出力はI/033を介してCPU31に入
力される。Further, in FIG. 3, 31 is a CPU, 32 is a solenoid valve driver connected to this CPU 31 via I / 033, which opens and closes the solenoid valves 30, ... And 28 based on a control signal from the CPU 31. 34
Is the state of intake from the intake holes 17 ...
Negative pressure sensors for detecting the intake state of the circuit-forming board B in 11a and 11b, the detection output of which is input to the CPU 31 via I / 033.
以上の構成を有する基板保持装置において、いま、描画
すべき回路形成基板Ｂが長方形状に成していたとする。
この場合、作業者は、まず基板Ｂの隣り合う二辺部8a,8
bを基板支持台11の突面部11a,11b上に載置し、二辺部B
a,Bbの側端面を基準ピン14,15,16に当接させて位置決め
を行なう。なお、基準ピン14,15,16は、使用する基板Ｂ
のサイズに応じて、予め適当な基準穴13へ嵌合させてお
く。In the substrate holding device having the above configuration, it is assumed that the circuit forming substrate B to be drawn has a rectangular shape.
In this case, the operator first of all, the two adjacent side portions 8a, 8a of the substrate B are
Place b on the projecting surfaces 11a and 11b of the substrate support base 11, and set the two sides B
The side ends of a and Bb are brought into contact with the reference pins 14, 15 and 16 for positioning. The reference pins 14, 15 and 16 are used for the board B to be used.
Depending on the size of the above, it is fitted into the appropriate reference hole 13 in advance.
次に、上記二辺部Ba,Bbと対向する二辺部Bc,Bdの下面に
可動保持体22の保持面22aを位置させて二辺部Bc,Bdを保
持させると共に、二辺部Bc,Bdの側端面と突出部22bの側
端面22b1に当接させて可動保持体22の位置決めを行な
う。Next, while holding the holding surface 22a of the movable holding body 22 on the lower surface of the two side portions Bc, Bd facing the two side portions Ba, Bb to hold the two side portions Bc, Bd, the two side portions Bc, The movable holding body 22 is positioned by bringing the side end surface of Bd into contact with the side end surface 22b 1 of the protruding portion 22b.
この後、可動保持体22上のスイッチ29を押す。すると電
磁弁ドライバ32によって電磁弁28が開となり、吸気源21
に吸気孔23,24が連通し、吸気孔23,24の吸気作用によ
り、基板Ｂは保持面22a上に吸着固定されると共に、可
動保持体22自体も吸気孔24における吸引作用によって基
板支持台11上に吸着固定される。Then, the switch 29 on the movable holder 22 is pressed. Then, the solenoid valve 28 is opened by the solenoid valve driver 32, and the intake source 21
The suction holes 23, 24 are communicated with the suction holes 23, 24, and the substrate B is sucked and fixed on the holding surface 22a by the suction action of the suction holes 23, 24, and the movable holding body 22 itself is sucked by the suction holes 24. 11 Adsorbed and fixed on.
また、先のスイッチ29の押圧により、CPU31は一旦、電
磁弁20,……を全て開とする。そして、負圧センサ34の
出力が負圧として検出されるまで、電磁弁20,……を外
側の吸気孔に対応するものから順次閉状態としてゆき、
負圧が検出された時点で所定の告知手段を作動させ、回
路形成可能状態であることを作業者に告知する。すなわ
ち、この実施例では各吸気孔11,……が同一の吸気経路
に連結されているため、この経路に形成連結された負圧
センサ34により負圧が検出されるということは、基板Ｂ
にて覆われていない吸気孔17が全て吸気源21から遮断さ
れて吸気動作が行なわれていないことを意味し、この状
態となってはじめて、基板Ｂはこれに覆われている吸気
孔17によって基板支持台11の突面部11a上に吸気・固定
される。つまり、回路形成可能状態となる。Further, by pressing the switch 29, the CPU 31 once opens all the solenoid valves 20, .... Then, the solenoid valves 20, ... Are sequentially closed from the one corresponding to the outside intake hole until the output of the negative pressure sensor 34 is detected as negative pressure,
When a negative pressure is detected, a predetermined notification means is activated to notify the operator that the circuit can be formed. That is, in this embodiment, since the intake holes 11, ... Are connected to the same intake path, the negative pressure is detected by the negative pressure sensor 34 formed and connected to this path.
It means that all the intake holes 17 not covered with are blocked from the intake source 21 and the intake operation is not performed, and the substrate B is not covered by the intake holes 17 until this state is reached. It is sucked and fixed on the projecting surface portion 11a of the substrate support 11. That is, the circuit can be formed.
この後、作業者は回路形成データを入力し、描画開始ス
イッチ（図示せず）をONすると、Ｘ−Ｙステージ12と共
に、基板支持台11が水平方向へ移動し、ノズル２から吐
出される回路形成材Ｐによって第４図に示すように基板
Ｂ上に回路が形成されてゆくが、その際、基板Ｂは、基
板支持台11上に吸着・固定されている可動保持体22の保
持面22aと基板支持台11の突面部11a,11bとに吸着し、水
平に保持・固定されており、しかも、その側端面が基準
ピン14,15,16と突出部側面22b1に当接し、略５点で水平
方向の移動を規制されているため、回路形成動作時の水
平移動及び振動等によって基板の取り付位置がずれる虞
れは全くない。After that, when the operator inputs the circuit formation data and turns on the drawing start switch (not shown), the substrate support base 11 moves in the horizontal direction together with the XY stage 12, and the circuit is ejected from the nozzle 2. As shown in FIG. 4, a circuit is formed on the substrate B by the forming material P. At this time, the substrate B is held by the holding surface 22a of the movable holding body 22 which is attracted and fixed on the substrate support base 11. a protruding surface portion 11a of the substrate support 11, adsorbed and 11b, are horizontally held and fixed, moreover, in contact with the projecting portion side 22b 1 that the side end face and the reference pin 14, 15, 16, substantially 5 Since the horizontal movement is restricted by the points, there is no possibility that the mounting position of the substrate will be displaced due to horizontal movement and vibration during the circuit forming operation.
また、基板Ｂが基板支持台11及び可動保持体22と接触す
る部分は、周縁部のみであるため、基板Ｂが両面基板で
あったとしても、その第２面に回路を形成するに際し、
既に第１面に形成されている回路を傷付けることはな
い。Further, since the portion where the substrate B contacts the substrate support 11 and the movable holding body 22 is only the peripheral portion, even when the substrate B is a double-sided substrate, when forming a circuit on the second surface thereof,
The circuit already formed on the first surface is not damaged.
なお、回路形成動作終了後は、スイッチ29を再度押すこ
とにより、CPU31が全ての電磁弁20,……及び28を閉と
し、基板Ｂ及び可動保持体22の固定状態は解除される。After the circuit forming operation is completed, by pressing the switch 29 again, the CPU 31 closes all the electromagnetic valves 20, ... And 28, and the fixed state of the substrate B and the movable holding body 22 is released.
このように、この実施例では、可動保持台22を基板支持
台11上のいかなる個所へも固定することができるため、
いかなるサイズの基板であっても、可動保持体22の固定
位置を移動させることにより容易に保持させることがで
きる。Thus, in this embodiment, since the movable holding table 22 can be fixed to any position on the substrate supporting table 11,
A substrate of any size can be easily held by moving the fixed position of the movable holder 22.
なお、上記実施例では、基板支持台11の突面部11aに形
成した吸気孔17,……を全て同一の吸気経路に連結する
ものとしたため、基板Ｂに覆われていない吸気孔に連結
されている電磁弁を閉じるようにしたが、各吸気孔17,
……をそれぞれ個々の吸気経路へ接続するようにすれ
ば、特に、上述のような不用吸気孔の選別、遮断を行な
わなくとも良い。In the above embodiment, all the intake holes 17, ... Formed in the projecting surface portion 11a of the substrate support base 11 are connected to the same intake path, so that they are connected to the intake holes not covered by the substrate B. I tried to close the solenoid valve, but each intake hole 17,
.. are connected to the respective intake paths, it is not necessary to particularly sort out and block the unnecessary intake holes as described above.
また、上記実施例においては、長方形形状の基板を使用
した場合を例にとり説明したが、平行四辺形、三角形を
はじめ、その他の多角形状を成す基板も適用可能であ
る。Further, in the above embodiments, the case where the rectangular substrate is used has been described as an example, but substrates having other polygonal shapes such as a parallelogram and a triangle are also applicable.
以上説明したとおり、この発明によれば、基板支持台と
可動保持体との組合せにより、いかなるサイズの基板に
対しても回路を損傷することなく迅速かつ確実に保持す
ることができるという効果がある。As described above, according to the present invention, the combination of the substrate supporting base and the movable holding member has an effect that the circuit can be quickly and reliably held on any size substrate without damaging the circuit. .
第１図はこの発明の一実施例を示す斜視図、第２図は第
１図に示したものの側面図、第３図は第１図に示したも
のの電気回路および空気圧回路を示す図、第４図は第１
図に示したものの使用状態を示す斜視図、第５図は回路
形成装置および従来の基板支持台を示す斜視図、第６図
は従来の基板支持台の一例を示す斜視図、第７図は従来
の基板支持台の他の例を示す斜視図である。 ２…ノズル 11…基板支持台 11a…突面部 14…係止ピン 17…吸気孔 21…吸気源 22…可動保持体 22a…保持面 22b…突出部1 is a perspective view showing an embodiment of the present invention, FIG. 2 is a side view of what is shown in FIG. 1, FIG. 3 is a view showing an electric circuit and a pneumatic circuit of what is shown in FIG. 4 is the first
FIG. 5 is a perspective view showing a usage state of what is shown in the figure, FIG. 5 is a perspective view showing a circuit forming device and a conventional substrate support base, FIG. 6 is a perspective view showing an example of a conventional substrate support base, and FIG. It is a perspective view which shows the other example of the conventional board | substrate support stand. 2 ... Nozzle 11 ... Substrate support 11a ... Projection part 14 ... Locking pin 17 ... Intake hole 21 ... Intake source 22 ... Movable holder 22a ... Holding surface 22b ... Projection
Claims (1)
向して設けられ、所定の駆動手段により水平面上を移動
可能な基板支持台と、 回路形成基板の隣合う２辺部を保持するよう前記基板支
持台上に形成した突面部と、 前記突面部に着脱可能に支持した前記回路形成基板の隣
合う２辺部と接触する基準ピンと、 前記突面部に穿設した吸気孔に連結した吸気源と、 前記基板支持台上に載置され、前記突面部と同一平面上
の保持面を有すると共に、この保持面上に支持された回
路基板の隣合う２辺部に当接する突出部を形成して成る
可動保持体と、 前記可動保持体の下面及び保持面に穿設した吸気孔と、 前記吸気孔に連結した吸気源と、 前記吸気源を制御する可動保持体に設けたスイッチとを
備えたことを特徴とする回路形成装置における基板保持
装置。1. A substrate supporting base, which is provided so as to face a circuit forming material discharge nozzle of a circuit forming device and is movable on a horizontal plane by a predetermined driving means, and holds two adjacent side portions of the circuit forming substrate. A projecting surface portion formed on the substrate support base, a reference pin that comes into contact with two adjacent side portions of the circuit forming board that is detachably supported on the projecting surface portion, and an intake air connected to an air intake hole formed in the projecting surface portion. A source and a holding surface that is placed on the substrate support base and that is flush with the projecting surface portion, and that has a protruding portion that abuts two adjacent side portions of the circuit board supported on the holding surface. And a suction hole formed in the lower surface and the holding surface of the movable holding body, an intake source connected to the suction hole, and a switch provided in the movable holding body for controlling the intake source. A base for a circuit forming device characterized in that Plate holding device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63135154A JPH0682911B2 (en) | 1988-05-31 | 1988-05-31 | Substrate holding device in circuit forming device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63135154A JPH0682911B2 (en) | 1988-05-31 | 1988-05-31 | Substrate holding device in circuit forming device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01303788A JPH01303788A (en) | 1989-12-07 |
| JPH0682911B2 true JPH0682911B2 (en) | 1994-10-19 |
Family
ID=15145080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63135154A Expired - Lifetime JPH0682911B2 (en) | 1988-05-31 | 1988-05-31 | Substrate holding device in circuit forming device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0682911B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5591562B2 (en) * | 2010-03-10 | 2014-09-17 | 日本発條株式会社 | Positioning device |
| JP5591563B2 (en) | 2010-03-10 | 2014-09-17 | 日本発條株式会社 | Position confirmation device |
| JP5931248B1 (en) * | 2015-05-12 | 2016-06-08 | 株式会社Pfu | Inspection system and inspection method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5020505Y2 (en) * | 1971-09-22 | 1975-06-21 | ||
| JPH0780292B2 (en) * | 1986-02-17 | 1995-08-30 | 富士通株式会社 | Positioning mechanism |
| JPS63117492A (en) * | 1986-11-06 | 1988-05-21 | 株式会社ケンウッド | Work stage structure of thick film hybrid printer |
-
1988
- 1988-05-31 JP JP63135154A patent/JPH0682911B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01303788A (en) | 1989-12-07 |
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