CN215527698U - Wafer clamping device of single-chip process cavity - Google Patents
Wafer clamping device of single-chip process cavity Download PDFInfo
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- CN215527698U CN215527698U CN202121053783.1U CN202121053783U CN215527698U CN 215527698 U CN215527698 U CN 215527698U CN 202121053783 U CN202121053783 U CN 202121053783U CN 215527698 U CN215527698 U CN 215527698U
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Abstract
The utility model discloses a wafer clamping device of a single-chip process cavity, which comprises: a plurality of thimbles and thimble state control components; the thimble has a clamping state and an opening state; the thimble state control part comprises a cylinder, a piston in the cylinder divides the cylinder into a first cavity and a second cavity, the first cavity is connected with a driving gas pipeline, a spring is arranged in the second cavity, a driving rod penetrates through the second cavity, and the driving rod is connected between the piston and the thimble; a first normally-closed valve is arranged on the driving gas pipeline, a gas release pipeline is connected to the driving gas pipeline between the first normally-closed valve and the cylinder, and a second normally-open valve is arranged on the gas release pipeline; when the first normally-closed valve is opened and the second normally-opened valve is closed, the ejector pin is in a clamping state; when the first normally-closed valve is closed and the second normally-opened valve is opened, the ejector pin is in an open state. The utility model can ensure that the thimble is completely reset in the open state and prevent the wafer placement position from deviating due to incomplete resetting of the thimble.
Description
Technical Field
The present invention relates to semiconductor integrated circuit manufacturing equipment, and more particularly, to a wafer chucking apparatus for a single wafer processing chamber.
Background
In the single-chip process chamber, a wafer clamping device is often needed to fix the wafer, and the wafer clamping mode includes vacuum adsorption, electrostatic adsorption, thimble clamping and the like. In a single wafer process chamber similar to a single wafer wet cleaning machine, a thimble is often used to clamp the wafer from the edge of the wafer to fix the wafer.
The single-wafer wet cleaning machine can clean and Etch one surface of the wafer, such as back etching (BSE) of the wafer. After the wafer is clamped by the ejector pin, the wafer can be prevented from irregular shaking in the cleaning and etching process.
As shown in fig. 1, it is a schematic structural diagram of a conventional monolithic process chamber when a wafer is placed normally; the single-wafer process chamber in fig. 1 is a single-wafer wet cleaning process chamber, which includes 6 ejector pins 102, and a wafer 103 is clamped by the ejector pins 102 after being placed. The wafer 103 is placed on the stage structure 101 of the wafer chucking apparatus, a first surface of the wafer 103 is an etched surface, and a second surface of the wafer 103 is an opposite surface of the first surface.
When the wafer 103 is mounted on the wafer chucking apparatus, a gap is formed between the second surface of the wafer 103 and the top surface of the stage structure 101.
An air cushion is formed in the gap region between the second surface of the wafer 103 and the top surface of the platen structure 101. Preferably, the gas cushion is a nitrogen gas cushion.
A liquid supply nozzle is further arranged in the single-chip wet cleaning process cavity and is positioned at the top of the platform structure 101; during etching, the liquid supply nozzle sprays cleaning liquid to the first surface of the wafer 103 to etch the first surface of the wafer 103.
Fig. 2A is a schematic structural view of an ejector pin and an ejector pin state control member of a wafer chucking apparatus of a conventional single-wafer process chamber in an open state of the ejector pin; fig. 2B is a schematic structural view of an ejector pin and an ejector pin state control member of a wafer chucking apparatus of a conventional single-wafer process chamber in an ejector pin clamping state; the wafer clamping device of the existing single-chip process cavity comprises: a plurality of pins 102 and a pin status control section.
The thimble 102 has a clamping state and an opening state; in the clamping state, each thimble 102 clamps the wafer 103 from the edge of the wafer 103 and fixes the wafer 103 on a wafer clamping device; in the open state, the pins 102 are out of contact with the edge of the wafer 103.
The thimble state control part comprises a cylinder 104, a piston 105 in the cylinder 104 divides the cylinder 104 into a first chamber and a second chamber, the first chamber is connected with a driving gas pipeline 107, a spring 106 is arranged in the second chamber, a driving rod 109 passes through the second chamber, a first side of the driving rod 109 is connected with the piston 105, and a second side of the driving rod 109 is connected with the thimble 102. In fig. 2A, a bracket 110 is also shown, and a bottom portion through which the driving rod 109 passes is provided on the bracket 110; the thimble 102 is fixed to the support 110 by a bearing 111, and the thimble 102 rotates along the bearing 111.
A first normally closed valve 108 is provided on the driving gas line 107. When the first normally-closed valve 108 is opened, the driving gas is filled into the second chamber to compress the spring 106, so that the piston 105 moves to the second side, i.e. the right side in fig. 2A, and the piston 105 moves to drive the driving rod 109 to move, so that the thimble 102 is clamped. In FIG. 2A, the drive gas is shown as N2, the direction of flow of the drive gas being shown by the arrowed line at the entrance of the drive gas line 107. In other embodiments, this can also be: the driving gas adopts inert gas or CDA.
When the first normally-closed valve 108 is closed, the spring 106 is reset to move the piston 105 to a first side, i.e., to the left side in fig. 2A, and the piston 105 moves to drive the driving rod 109 to move, so that the thimble 102 is in an open state.
In fig. 2A, the ejector pin 102 is in an open state, and this state is used for realizing the taking and placing of the wafer 103. When a new wafer 103 is placed, the thimble 102 is switched to a clamping state to fix the wafer 103, and when clamping is performed, the piston 105 moves to the second side, the thimble 102 rotates counterclockwise by an angle, and the thimble 102 in the clamping state is shown in fig. 2B.
In the conventional wafer chucking apparatus, the ejector pin 102 may not be completely restored to the open state when the first normally-closed valve 108 is closed, that is, may not be completely reset in the open state. This is because, although the first normally-closed valve 108 is closed and no new driving gas enters the first chamber, the driving gas line 107 between the first normally-closed valve 108 and the first chamber are in a sealed state, and the driving gas still remains, and the remaining driving gas may not completely return the spring 106, and thus may not completely open the spike 102.
The failure of the thimble 102 to open may cause the next wafer 103 to be placed with a displacement. FIG. 3 is a schematic diagram of a wafer placement offset in a monolithic process chamber; it can be seen that the thimble corresponding to the mark 102a is not completely reset in the open state, which causes the wafer 103 to directly abut against the thimble 102a when being put in, so that the thimble 102a cannot clamp the edge of the wafer 103, and thus the wafer 103 cannot be clamped, which obviously adversely affects the process.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem of providing a wafer clamping device of a single-chip process cavity, which can ensure that an ejector pin is completely reset in an open state and prevent the wafer placement position from deviating due to incomplete reset of the ejector pin.
In order to solve the above technical problem, the wafer chucking device of a single-wafer process chamber provided by the utility model comprises: a plurality of thimbles and thimble state control parts.
The thimble has a clamping state and an opening state; under the clamping state, each thimble clamps the wafer from the edge of the wafer and fixes the wafer on the wafer clamping device; in the open state, the ejector pins are out of contact with the edge of the wafer.
The thimble state control part comprises a cylinder, a piston in the cylinder divides the cylinder into a first cavity and a second cavity, the first cavity is connected with a driving gas pipeline, a spring is arranged in the second cavity, and a driving rod penetrates through the second cavity, the first side of the driving rod is connected with the piston, and the second side of the driving rod is connected with the thimble.
The air cylinder is characterized in that a first normally-closed valve is arranged on the driving air pipeline, an air discharging pipeline is connected between the first normally-closed valve and the air cylinder, and a second normally-opened valve is arranged on the air discharging pipeline.
When the first normally-closed valve is opened and the second normally-opened valve is closed, driving gas is filled into the second chamber to compress the spring, so that the piston moves towards the second side, and the piston moves to drive the driving rod to move, so that the ejector pin is in a clamping state.
When the first normally-closed valve is closed and the second normally-opened valve is opened, the spring is reset to enable the piston to move towards the first side, the piston moves to drive the driving rod to move so as to enable the ejector pin to be in an open state, and the driving gas in the second chamber is discharged from the gas discharge pipeline to enable the spring to be completely reset and to enable the ejector pin to be in the open state.
In a further improvement, each thimble shares one thimble state control part; or, one thimble is provided with one thimble state control component independently.
In a further improvement, the driving gas is nitrogen, inert gas or compressed air (CDA).
In a further improvement, the first normally-closed valve adopts a pneumatic valve;
in a further improvement, the second normally open valve is a pneumatic valve.
In a further refinement, the first normally-closed valve and the second normally-open valve are both CDA driven.
In a further improvement, the first normally-closed valve and the second normally-open valve are both controlled by electromagnetic valves.
In a further improvement, the first normally-closed valve and the second normally-opened valve are controlled by the same electromagnetic valve, so that the opening and closing states of the first normally-closed valve and the second normally-opened valve are opposite.
The further improvement is that the thimbles are distributed on the edge of the wafer corresponding to the wafer after the wafer is placed at equal intervals.
In a further refinement, the monolithic process chamber comprises a monolithic wet clean process chamber.
In a further improvement, the number of the thimbles in the single-piece wet cleaning process cavity comprises 6.
The wafer clamping device further comprises a platform structure;
the first surface of the wafer is an etched surface, and the second surface of the wafer is the reverse surface of the first surface;
when the wafer is fixed on the wafer clamping device, a distance is formed between the second surface of the wafer and the top surface of the platform structure.
In a further refinement, an air cushion is formed in a gap region between the second surface of the wafer and the top surface of the mesa structure.
In a further improvement, the gas cushion is a nitrogen gas cushion.
The further improvement is that a liquid supply nozzle is also arranged in the single-chip wet cleaning process cavity and is positioned at the top of the platform structure; and during etching, the liquid supply collision nozzle sprays cleaning liquid to the first surface of the wafer to realize etching of the first surface of the wafer.
The ejector pin state control component is provided with the air release pipeline on the driving gas pipeline and the normally open valve, namely the second normally open valve, on the air release pipeline, and the second normally open valve can control the driving gas in the first cavity of the cylinder to be released from the air release pipeline when the ejector pin is switched to the open state, so that the spring can be completely reset, the ejector pin is ensured to be in the open state, namely the ejector pin can be completely reset in the open state, the clamping is avoided in the open state, and the position deviation caused when the next wafer is placed when the ejector pin is incompletely reset in the open state can be prevented.
Drawings
The utility model is described in further detail below with reference to the following figures and detailed description:
FIG. 1 is a schematic diagram of a wafer placement process in a monolithic process chamber;
FIG. 2A is a schematic structural diagram of a thimble and a thimble state control member of a wafer chucking apparatus of a conventional single wafer processing chamber in a state where the thimble is open;
FIG. 2B is a schematic structural diagram of a thimble and a thimble state control member of a wafer chucking apparatus of a conventional single-wafer process chamber in a thimble clamping state;
FIG. 3 is a schematic diagram of a wafer placement offset in a conventional monolithic process chamber;
fig. 4 is a schematic structural diagram of a thimble and a thimble state control member of a wafer chucking apparatus of a single wafer processing chamber according to an embodiment of the present invention.
Detailed Description
Fig. 4 is a schematic structural diagram of a thimble 102 and a thimble state control member of a wafer chucking apparatus of a single wafer processing chamber according to an embodiment of the present invention; referring to fig. 1, a structure of a single wafer process chamber according to an embodiment of the present invention is also shown, and a wafer chucking apparatus of a single wafer process chamber according to an embodiment of the present invention includes: a plurality of pins 102 and a pin status control section.
The thimble 102 has a clamping state and an opening state; in the clamping state, each thimble 102 clamps the wafer 103 from the edge of the wafer 103 and fixes the wafer 103 on a wafer clamping device; in the open state, the pins 102 are out of contact with the edge of the wafer 103.
The thimble state control part comprises a cylinder 104, a piston 105 in the cylinder 104 divides the cylinder 104 into a first chamber and a second chamber, the first chamber is connected with a driving gas pipeline 107, a spring 106 is arranged in the second chamber, a driving rod 109 passes through the second chamber, a first side of the driving rod 109 is connected with the piston 105, and a second side of the driving rod 109 is connected with the thimble 102. In fig. 4, a bracket 110 is also shown, said bracket 110 being provided with a bottom portion through which said driving rod 109 passes; the thimble 102 is fixed to the support 110 by a bearing 111, and the thimble 102 rotates along the bearing 111.
A first normally closed valve 108 is provided in the drive gas line 107, a gas release line 201 is connected to the drive gas line 107 between the first normally closed valve 108 and the cylinder 104, and a second normally open valve 202 is provided in the gas release line 201.
When the first normally-closed valve 108 is opened and the second normally-open valve 202 is closed, the driving gas is filled into the second chamber to compress the spring 106, so that the piston 105 moves to the second side, and the piston 105 moves to drive the driving rod 109 to move, so that the thimble 102 is clamped. In fig. 4, the drive gas is shown as N2, the direction of flow of the drive gas being shown by the arrowed line at the inlet of the drive gas line 107. In other embodiments, this can also be: the driving gas adopts inert gas or CDA.
When the first normally-closed valve 108 is closed and the second normally-open valve 202 is opened, the spring 106 is reset to move the piston 105 to the first side, the piston 105 moves to drive the driving rod 109 to move so as to open the thimble 102, and the driving gas in the second chamber is discharged from the gas discharge pipeline 201 to completely reset the spring 106 and ensure that the thimble 102 is opened. In fig. 4, the discharge direction of the driving gas is shown by the arrowed line in the discharge line 201.
In fig. 4, the thimble 102 is in an open state. When a new wafer 103 is placed, the ejector pin 102 is switched to a clamping state to fix the wafer 103, and when the wafer is clamped, the piston 105 moves to a second side, i.e., the right side in fig. 4, and the ejector pin 102 rotates counterclockwise by an angle. Fig. 2B also shows the thimble 102 in the clamping state.
In the embodiment of the present invention, each of the pins 102 shares one pin status control component. In other embodiments can also be: one of the ejector pins 102 is provided with one of the ejector pin state control parts alone.
The first normally-closed valve 108 is a pneumatic valve; the second normally open valve 202 is a pneumatic valve. Both the first normally closed valve 108 and the second normally open valve 202 are CDA driven.
Both the first normally closed valve 108 and the second normally open valve 202 are controlled using a solenoid valve 203. Preferably, the first normally-closed valve 108 and the second normally-opened valve 202 are controlled by the same solenoid valve 203, so that the open and close states of the first normally-closed valve 108 and the second normally-opened valve 202 are opposite. In fig. 4, the compressed gas line 204 connected to the first normally-closed valve 108 and the second normally-open valve 202 is opened or closed under the control of the electromagnetic valve 203, and when CDA is input to the control ends of the first normally-closed valve 108 and the second normally-open valve 202, the states of the first normally-closed valve 108 and the second normally-open valve 202 are switched. In fig. 4, the CDA is indicated on the compressed gas line 204, indicating that the compressed gas line 204 will flow the CDA, and three triangles indicate the flow direction of the CDA.
As shown in fig. 1, the thimble 102 is distributed on the edge of the wafer 103 corresponding to the wafer 103 after the wafer 103 is placed. The single wafer process chamber comprises a single wafer wet clean process chamber.
The number of the thimbles 102 in the single-piece wet cleaning process chamber includes 6.
The wafer chucking device further includes a stage structure 101.
The first surface of the wafer 103 is an etched surface, and the second surface of the wafer 103 is the reverse surface of the first surface;
when the wafer 103 is mounted on the wafer chucking apparatus, a gap is formed between the second surface of the wafer 103 and the top surface of the stage structure 101.
An air cushion is formed in the gap region between the second surface of the wafer 103 and the top surface of the platen structure 101. Preferably, the gas cushion is a nitrogen gas cushion.
A liquid supply nozzle is further arranged in the single-chip wet cleaning process cavity and is positioned at the top of the platform structure 101; during etching, the liquid supply nozzle sprays cleaning liquid to the first surface of the wafer 103 to etch the first surface of the wafer 103.
In the embodiment of the present invention, the gas discharge pipeline 201 is disposed on the driving gas pipeline 107 of the thimble state control component, and the gas discharge pipeline 201 is disposed with the normally open valve, i.e., the second normally open valve 202 can control the driving gas in the first chamber of the cylinder 104 to be discharged from the gas discharge pipeline 201 when the thimble 102 is switched to the open state, so as to enable the spring 106 to be completely reset and ensure that the thimble 102 is in the open state, i.e., ensure that the thimble 102 is completely reset in the open state, and avoid clamping in the open state, thereby preventing the position deviation caused when the next wafer 103 is placed when the thimble 102 is incompletely reset in the open state.
The present invention has been described in detail with reference to the specific embodiments, but these should not be construed as limitations of the present invention. Many variations and modifications may be made by one of ordinary skill in the art without departing from the principles of the present invention, which should also be considered as within the scope of the present invention.
Claims (15)
1. A wafer clamping device of a single-chip process chamber is characterized by comprising: a plurality of thimbles and thimble state control components;
the thimble has a clamping state and an opening state; under the clamping state, each thimble clamps the wafer from the edge of the wafer and fixes the wafer on the wafer clamping device; under the open state, the thimbles are separated from the edge of the wafer;
the thimble state control part comprises a cylinder, a piston in the cylinder divides the cylinder into a first cavity and a second cavity, the first cavity is connected with a driving gas pipeline, a spring is arranged in the second cavity, a driving rod penetrates through the second cavity, the first side of the driving rod is connected with the piston, and the second side of the driving rod is connected with the thimble;
a first normally-closed valve is arranged on the driving gas pipeline, a gas release pipeline is connected to the driving gas pipeline between the first normally-closed valve and the cylinder, and a second normally-open valve is arranged on the gas release pipeline;
when the first normally-closed valve is opened and the second normally-opened valve is closed, driving gas is filled into the second chamber to compress the spring, so that the piston moves to the second side, and the piston moves to drive the driving rod to move, so that the ejector pin is in a clamping state;
when the first normally-closed valve is closed and the second normally-opened valve is opened, the spring is reset to enable the piston to move towards the first side, the piston moves to drive the driving rod to move so as to enable the ejector pin to be in an open state, and the driving gas in the second chamber is discharged from the gas discharge pipeline to enable the spring to be completely reset and to enable the ejector pin to be in the open state.
2. The wafer chucking apparatus of a monolithic process chamber as defined in claim 1, wherein: the ejector pins share one ejector pin state control part; or, one thimble is provided with one thimble state control component independently.
3. The wafer chucking apparatus of a monolithic process chamber as defined in claim 1, wherein: the driving gas adopts nitrogen, inert gas or CDA.
4. The wafer chucking apparatus of a monolithic process chamber as defined in claim 1, wherein: the first normally-closed valve adopts a pneumatic valve.
5. The wafer chucking apparatus of a monolithic processing chamber as defined in claim 4, wherein: the second normally-open valve adopts a pneumatic valve.
6. The wafer chucking apparatus of a monolithic processing chamber as defined in claim 5, wherein: the first normally closed valve and the second normally open valve are both CDA driven.
7. The wafer chucking apparatus of a monolithic processing chamber as defined in claim 6, wherein: the first normally-closed valve and the second normally-open valve are both controlled by electromagnetic valves.
8. The wafer chucking apparatus of a monolithic processing chamber as defined in claim 7, wherein: the first normally-closed valve and the second normally-opened valve are controlled by the same electromagnetic valve, and the first normally-closed valve and the second normally-opened valve are guaranteed to be in opposite switch states.
9. The wafer chucking apparatus of a monolithic process chamber as defined in claim 1, wherein: the thimbles are distributed on the edge of the wafer corresponding to the wafer after the wafer is placed at equal intervals.
10. The wafer chucking apparatus of a monolithic processing chamber as defined in claim 9, wherein: the single wafer process chamber comprises a single wafer wet clean process chamber.
11. The wafer chucking apparatus of a monolithic processing chamber as defined in claim 10, wherein: the number of the thimbles in the single-piece wet cleaning process cavity comprises 6.
12. The wafer chucking apparatus of a monolithic processing chamber as defined in claim 11, wherein: the wafer clamping device also comprises a platform structure;
the first surface of the wafer is an etched surface, and the second surface of the wafer is the reverse surface of the first surface;
when the wafer is fixed on the wafer clamping device, a distance is formed between the second surface of the wafer and the top surface of the platform structure.
13. The wafer chucking apparatus of a monolithic processing chamber as defined in claim 12, wherein: an air cushion is formed in a gap region between the second surface of the wafer and the top surface of the mesa structure.
14. The wafer chucking apparatus of a monolithic processing chamber as defined in claim 13, wherein: the air cushion is a nitrogen air cushion.
15. The wafer chucking apparatus of a monolithic processing chamber as defined in claim 12, wherein: a liquid supply nozzle is also arranged in the single-chip wet cleaning process cavity and is positioned at the top of the platform structure; and during etching, the liquid supply collision nozzle sprays cleaning liquid to the first surface of the wafer to realize etching of the first surface of the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121053783.1U CN215527698U (en) | 2021-05-17 | 2021-05-17 | Wafer clamping device of single-chip process cavity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121053783.1U CN215527698U (en) | 2021-05-17 | 2021-05-17 | Wafer clamping device of single-chip process cavity |
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| Publication Number | Publication Date |
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| CN215527698U true CN215527698U (en) | 2022-01-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202121053783.1U Active CN215527698U (en) | 2021-05-17 | 2021-05-17 | Wafer clamping device of single-chip process cavity |
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- 2021-05-17 CN CN202121053783.1U patent/CN215527698U/en active Active
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