JPS63117492A - Work stage structure of thick film hybrid printer - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to the structure of a work stage for positioning and suctioning and fixing a substrate in a screen printing apparatus for thick-film hybrid ICs.

(b) Prior Art As the density of thick film hybrid ICs increases, printed patterns are becoming finer. Therefore, simplification of alignment in the printing process and reproducibility of printing have become important issues.

A conventional screen printing device for a hybrid IC is equipped with a cassette capable of storing several dozen ceramic substrates to be printed, as shown in the printing process diagram of FIG.
There is a loader section that automatically feeds the substrate from the cassette, a positioning section that uses a pusher arm mechanism to position the substrate transported from the loader section and supplied to the work stage (described later), and a printing section that transfers the printed substrate. It consists of an alignment section for aligning substrates and supplying them to a drying oven, and various processing steps such as a drying oven.

As a work stage used in the above-described substrate positioning step, there is, for example, one constructed as shown in the perspective view of FIG. 7.

As shown in the side view of FIG. 8, this conventional work stage 2 has a plurality of vacuum holes 2a formed at positions where the substrate 1 is placed. The vacuum holes 2a are each connected to a suction pump (not shown). Furthermore, a two-pin reference pin A is provided on the work stage 2 for positioning by bringing two end faces forming one of the orthogonal corners of the substrate 1 into contact with each other as a reference surface.

B and an l-pin reference pin C are arranged. The substrate 1, which is positioned by pressing the reference surface against each of the reference pins, is suctioned and fixed to the work stage 2 by the suction force of the vacuum hole 2a, and is transported to the printing section.

As a method for highly accurate positioning of the substrate 1 placed on the work stage 2 by using the pusher arm mechanism, for example, the method shown in FIGS. 9(1) to (6) for explaining the substrate positioning operation is Butsusha as shown in the floor plan
Positioning was performed through an arm sequence.

In addition, in FIGS. 9(1) to (6), 1 is the substrate, A
, B are 2-pin reference pins, C is 1-pin reference pins, D and E are pusher arms, and ■ to @ each end face of the board 1.

The substrate 1 sent out from the loader section shown in FIG. 6 is transferred onto the work stage 2 which is fixed by suction as shown in FIG. 8, and the surface of the substrate 1 is polished as shown in FIG. It is placed face up. At this time, the butcher arms D and E are in the lowered state.

The substrate 1 placed on the work stage 2 is shown in FIG.
As shown in 2), the pusher arm D is used to push the end surface O and perform a pressing operation so that the end surface ■ comes into contact with the two-pin reference pins A and B.

With this kind of Butsha arm sequence,
The substrate 1 positioned at a predetermined position on the work stage 2 is suctioned and fixed to the work stage 2 by the suction action of a plurality of vacuum holes 2a formed in the work stage 2. After that, the button arm rises,
The entire work stage 2 is moved to the printing station and is configured to begin printing on the surface of the substrate 1.

On the other hand, when printing is performed on the back side of the substrate 1, as shown in FIG.
), with the board 1 turned over, remove the workpiece.
Place it on stage 2. The substrate 1 placed on the work stage 2 is placed on the workpiece stage 2, as shown in FIG. 9 (5).
The arm D pushes the end surface θ of the substrate 1 and performs a pressing operation so that the end surface ■ comes into contact with the two-pin reference pins A and B. Next, as shown in Fig. 9 (6), push the end of the board 1, surface ◎, and perform a pressing operation so that the end surface 0 contacts the 1-pin reference pin C, and the positioning is completed. do.

The substrate 1 positioned on the work stage 2 is suctioned and fixed to the work stage 2, as in the case of surface printing described above. Thereafter, the pusher arm is raised, the entire work stage 2 is moved to the printing section, and printing on the back side of the substrate 1 is started.

Furthermore, as shown in the main part cross-sectional side view of FIG. 10, a plurality of vacuum holes 2a formed in the work stage 2
are formed at a ratio of 1:1 with respect to the formation position of the through hole la formed in the substrate 1. therefore,
The printed conductive paste 3 is drawn into the through-hole a by the suction force from the vacuum hole 2a and applied, as shown in the cross-sectional side view of the main part in FIG.

(c) Problems to be Solved by the Invention However, in the conventional work stage 2 described above, the vacuum holes 2a are formed at a ratio of 1:1 to the formation positions of the through holes la formed in the substrate 1. Therefore, there was a compatibility problem in that it could not be used commonly for substrates with different printed patterns. In addition, the suction operation of the vacuum hole 2a is performed on the workpiece stage 2.
Since the printing process was configured to be carried out continuously from the time the substrate 1 was positioned until the printing process was completed, during printing, even before the printing of the conductive paste 3 was completed, suction was applied in the direction of the through hole la. As a result, there is a risk that the substrate 1 may be contaminated or uneven coating may occur within the through-hole a.

In addition, when printing on the front side of the board 1 and when printing on the back side, the end face of the board 1 that contacts the 1-pin reference pin C is different from ◎ or @, which has the disadvantage of affecting positioning accuracy. Ta.

That is, when printing on the surface of the substrate 1, the method shown in FIG. 9 (
3), the two orthogonal end faces ■ and O of the substrate 1 are used as the reference plane, whereas when printing on the back side, the end face of the substrate 1 is used as the reference plane, as shown in Figure 9 (6). Since the two orthogonal end faces of ■ and ◎ are used as the reference planes, the printing positioning reference planes for the 1 m front surface are different, and there is therefore a possibility that a printing position shift between the front surface and the real surface may occur.

This invention was made in view of the above points,
The purpose of this is to ensure the positioning of the substrate, as well as to perform suction operations to suction and fix the substrate onto the work stage, and suction operations to form through holes in the substrate. It is an object of the present invention to provide a work stage structure for a thick film hybrid printing apparatus that is configured to be able to perform operations independently.

(d) Means for Solving the Problem The work stage structure of the thick film hybrid printing apparatus according to the present invention includes a concave vacuum chamber having an opening smaller than the size of the substrate at the position where the substrate is placed; By providing a plurality of vacuum holes formed at predetermined intervals around the opening of the vacuum chamber,
We are trying to solve the problem.

(e) Operation The positioning of the board placed on the work stage is performed by positioning the board with respect to the 2-pin reference pin placed on the work stage and the 1-pin reference pin placed perpendicular to the 2-pin reference pin. This is done by bringing the two end faces of the reference surface into contact and pressing them together.

In this way, the substrate positioned on the work stage has its rear outer peripheral edge portion suctioned and fixed to the work stage by the suction operation of the plurality of vacuum holes.

The entire work stage is then moved to the printing section and raised to print on the substrate.

After printing is completed, the vacuum chamber is operated to perform a suction operation to draw the conductive paste in the portion of the substrate that will form the through-hole into the through-hole, thereby completing the application of the conductive paste into the through-hole.

(F) Embodiment An embodiment of the work stage structure of a thick film hybrid printing apparatus according to the present invention will be described with reference to FIGS. 1 to 5. Figure 1 is a perspective view of the work stage, Figure 2 is a plan view, Figure 3 is an operation explanatory diagram for explaining the air suction path, and Figure 4 is a central cross-section of the work stage shown in Figure 2. The side views and FIGS. 5(1) to 5(6) show plan layout diagrams for explaining the positioning operation of the substrate.

In the figure, 21 is a work stage, which is composed of the following parts.

21a is a concave vacuum chamber formed at the substrate mounting position in the center of the upper surface, and has an opening slightly smaller than the size of the substrate 1;
A hole 21b is formed to lead the air inside to the outside. A plurality of vacuum holes 21c are formed at regular intervals around the opening of the vacuum chamber 21a.

This vacuum chamber 21a and vacuum hole 21c are located in the third
The suctioned air is led out from the same side surface 21d of the work stage 21 through a path as shown in FIG. 4 and FIG. Therefore, the air in the vacuum chamber 1a is led out to the outside through the hole 21b formed in the center of the bottom of the recess, as shown by arrow e in FIGS. 3 and 4. Further, the plurality of vacuum holes 21c are all connected within the work stage 21, as shown by the arrow θ in FIGS. 3 and 4,
The air sucked from each vacuum hole 21c is collectively led out to the outside.

Note that this vacuum chamber 21a and vacuum hole 21
The air outlet section c is connected to a suction pump (not shown) through an air pipe, and the suction operations thereof are controlled so that they can be performed independently.

21e is an L-shaped notch provided at the upper edge of each side wall surface of the work stage 21;
G places the substrate 1 placed on the work stage 21,
This is formed in order not to obstruct the operation of pushing in the direction of the 2-pin reference pins A, B and 1-pin reference pin C, or of carrying or mounting the substrate 1 while holding it therebetween. Reference numeral 21f denotes a plurality of holes formed at predetermined intervals on the bottom surface of the vacuum chamber 21a to erect pillars 21g for supporting the back side of the substrate 1 placed so as to cover the vacuum chamber 21a. 21h is a screw hole for fixing the work stage 21.

In this case, the 1-pin reference pin C provided on the work stage 21 can be set as the 1-pin reference pin F by pulling it out and inserting it into a pre-formed hole on the opposite side at a 180 degree position. It is configured so that it can be done. Further, two-pin reference pins A and B are provided on the upper surface of the work stage 21. In addition, Butsha Arm D, E.

Of the buttons G, the pusher arms E and G also serve as transport arms for transporting the substrate 1 onto the work stage 21 and placing it on the work stage 21 while holding the end faces ◎ and ■. 1 to 2 indicate each end surface of the substrate 1, and the intersections of the end surfaces 1 to 2 are formed at right angles.

As described above, according to the above embodiment, substrate positioning and printing can be performed as follows.

First, the substrate 1 sent out from the loader section is conveyed onto the work stage 21, and is placed in the direction in which the surface of the substrate 1 will be printed, as shown in FIG. 5(1). At this time, Butsha Arm D, E.

G is in a descending state.

The substrate 1 placed on the work stage 21 is moved by the pusher arm D as shown in FIG. 5(2).
Press the end face ○ of the board 1, and insert the end face ■ into the 2-pin reference pin A,
Perform a pressing operation to bring it into contact with B.

Subsequently, as shown in FIG. 5(3), the pusher arm E is used to push the end face ■ of the board 1, and performs a pressing operation so that the end face ◎ comes into contact with the 1-pin reference pin C.

With this kind of Butsha arm sequence,
After the substrate 1 is positioned at a predetermined position on the work stage 21, the outer peripheral edge of the back surface of the substrate 1 is suctioned and fixed to the upper surface of the work stage 21 by the suction operation of each vacuum hole 21c.

Thereafter, the pusher arm is raised, the entire work stage 21 is moved to the printing section, and printing on the surface of the substrate 1 is started.

After the printing on the substrate 1 is completed, the vacuum chamber 21a is operated for suction, and as shown in FIG. 4, the conductive paste 3 printed on the substrate 1 can be drawn into the through hole la and applied. At this time, the vacuum chamber 21a is
A plurality of through-holes la formed in the substrate 1 can be collectively operated for suction at the same time.

On the other hand, when printing on the back side of the substrate 1, first remove the 1-pin reference pin C of the work stage 21 from the work stage 21, and insert it into the hole provided on the opposite side after changing the position 180 degrees. , 1 pin is set as the reference pin F. Thereafter, as shown in FIG. 5(4), the substrate 1 is turned over and placed on the work stage 21. As shown in FIG. 5 (5), the substrate 1 placed on the work stage 21 pushes the end surface θ of the substrate 1 by the pusher arm D, and moves the end surface ■ to the two-pin reference pins A and B. Perform a pressing motion to bring them into contact. Next, Figure 5 (6
), the pusher arm G pushes the end face ■ of the board 1, and performs a pressing operation so that the end face ◎ comes into contact with the 1-pin reference pin F, and the positioning is completed.

With this kind of Butsha arm sequence,
After the substrate 1 is positioned at a predetermined position on the work stage 21, the outer peripheral edge of the back surface of the substrate 1 is suctioned and fixed to the upper surface of the work stage 21 by the suction operation of each vacuum hole 21c.

Thereafter, the pusher arm is raised, the entire work stage 21 is moved to the printing section, and printing on the back side of the substrate 1 is started.

After the printing on the back side of the substrate 1 is completed, the vacuum chamber 21
a to draw the conductive paste 3 printed on the substrate 1 into the through hole as shown in FIG.
Can be applied. At this time, the vacuum chamber 21a can collectively perform a suction operation on the plurality of through holes 1a formed in the substrate 1 at the same time.

(G) Effects of the Invention According to the work stage structure of the thick film hybrid printing apparatus according to the present invention, there are vacuum holes for suctioning and fixing the substrate to the upper surface of the work stage, and conductive holes when forming through holes in the substrate. Since a vacuum chamber for drawing the paste into the through hole is formed, the suction operation of this vacuum hole and the vacuum chamber can be made independent, and the drawing operation of the conductive paste for forming the through hole can be performed after printing is completed. This makes it possible to prevent contamination of the board or uneven application of the conductive paste to the through-holes as in the past.

In addition, by forming a vacuum chamber, multiple through holes formed on the board can be simultaneously suctioned, unlike conventional vacuum holes and through holes that are one to one. , the work stage is not affected by the substrate pattern and can be made compatible.・Furthermore, when printing on the front and back sides of the board, both can be positioned using the reference plane consisting of the two end faces of the board as a reference, so printing can be performed without misalignment between the front and back sides of the board. can be applied.

In addition, the above effect can be obtained by simply changing the position of the 1-pin reference pin provided on the work stage by 180 degrees, so the structure is simple and can be constructed at low cost, making it easy to implement. It has excellent features such as being able to

[Brief explanation of the drawing]

1 to 5 show an embodiment of the present invention, in which FIG. 1 is a perspective view, FIG. 2 is a plan view, and FIG. 3 is a plan view for explaining the air suction path. , FIG. 4 is a central sectional side view, and FIGS. 5(1) to 5(6) are explanatory diagrams of board positioning operation. 6 to 11 show conventional examples.
The figure is a diagram of the printing process of the board, Figure 7 is a perspective view, Figure 8 is a side view, Figures 9 (1) to (6) are illustrations of board positioning operation, and Figures 1O and 11 are main parts. FIG. 3 is a cross-sectional side view. l: Board la mini through hole, 21: Work stage 21a: Vacuum chamber 21c: Vacuum hole 3: Conductive paste A, B
: 2-pin reference pin C, (F): 1-pin reference pin D,
E, G: Pusher arm ■ ~ @: Each end surface of the board 1, 3rd, 4th figure, 1; Figure 5 (+) (2) (3) 6th
Figure 7 Figure 8 Figure 9 (+) (2) (3) 1st
Figure 0Figure 11

Claims (5)

[Claims] (1) Two end faces forming one of the orthogonal corners of the substrate to be printed are arranged as reference surfaces for positioning by contacting each other, and the positioned substrate is fixed by suction. In the work stage of thick film hybrid printing equipment, a concave vacuum chamber with an opening smaller than the size of the substrate is formed at the substrate mounting position, and a predetermined interval is formed around the opening of this vacuum chamber. A work stage structure of a thick film hybrid printing device, characterized in that a plurality of vacuum holes are provided. (2) Claim 1, characterized in that the device is configured so that the suction operation by the vacuum chamber and the suction operation by the plurality of vacuum holes are performed independently.
Work stage structure of the thick film hybrid printing apparatus described in Section 3. (3) The outlet hole for the air sucked from the vacuum chamber and the outlet hole for the air sucked from the plurality of vacuum holes,
The work stage structure of a thick film hybrid printing apparatus according to claim 1, characterized in that the work stage structure is formed on the same side of the work stage. (4) The reference pin for positioning consists of a 2-pin reference pin and a 1-pin reference placed at right angles to the 2-pin reference pin. The work stage structure of a thick film hybrid printing apparatus according to claim 1, wherein the work stage structure is configured such that the arrangement positions thereof are changed by 180 degrees. (5) A work stage structure for a thick film hybrid printing apparatus according to claim 1, wherein a hole is formed in the bottom of the vacuum chamber for erecting a support supporting the back surface of the substrate.