JPH0679742U - Vacuum deposition equipment - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a vacuum vapor deposition apparatus which facilitates attachment / detachment of a substrate and cleaning of a film forming chamber. [Structure] By arranging a plurality of electrode rods in a line and mounting a substrate on a sample holding frame provided with a slit portion, attachment / detachment of the sample holding frame to / from the device is performed by passing through the slits. The sample holding frame can be attached and detached without removing.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a resistance heating type vacuum deposition apparatus.

[0002]

[Prior art]

 Vacuum evaporation systems using resistance heating have been used for thin film formation in various fields. In this device, the film formation process is performed after the film formation chamber is in a high vacuum state, but it takes a long time to evacuate, so in a mass production device, many substrates can be formed simultaneously in each film formation process. It is devised to be.

An example of a vacuum vapor deposition apparatus capable of vapor-depositing a large number of substrates for each film forming step is disclosed in Japanese Utility Model Publication No. 59-9006, for example. FIG. 5 shows a perspective view of the film forming chamber of this apparatus, and FIG. 6 shows a sectional view thereof.

In the figure, 1 is a pedestal, 2 is a chamber, 3 is a door, 4 is a hinge connecting the door and the chamber, 5 is a film forming chamber formed by the door and the chamber, 6 is a vapor deposition mechanism, and 7 is a door. A bottom plate to be mounted, 8 and 9 are rollers, 11 is a turntable, 12 is an electrode, 14 is a sample holding frame, 15 and 16 are evaporation sources, 21 is a drive disk, and 22 is a motor.

The chamber 2 is installed on a pedestal 1, and an opening 3 a of a door 3 connected by a hinge 4 is hinged to the opening 2 a. The doors 3 are attached to both left and right sides of the chamber 2, and any of the doors 3 can be connected to the chamber 2. Then, one of the doors (for example, the right side) 3 is connected to the chamber 2 and closed to form the film forming chamber 5. The inside of the film forming chamber 5 is evacuated from an exhaust port provided on the side wall of the chamber 2 by a vacuum pump (not shown) to bring the film forming chamber into a vacuum state. The other door 3 (for example, the left side) is open to the atmosphere so that the substrate can be attached / detached therebetween. The door 3 is provided with a vapor deposition mechanism 6. The vapor deposition mechanism 6 has a disk-shaped bottom plate 7 whose one half surface is fixed to the upper surface of the bottom wall 3c of the door 3, and a ring-shaped support which is supported on the bottom plate 7 via guide rollers 8 and 9 so as to be horizontally rotatable. The turntable 11 is mounted on the turntable 11 so as to surround the electrode 12 fixedly placed on the bottom plate 7 in the hollow center of the turntable 11 and the electrode rods 12a and 12b connected to the electrode 12. And a rectangular sample holding frame 14 placed. The two electrode rods 12a and 12b form a pair, and the evaporation source is attached to the conductive wires 15 and 16 stretched between the electrode rods 12a and 12b. The wire itself may be the evaporation source. Then, a power source is connected to the electrode 12 via a power introduction terminal. The substrate is attached to the sample holding frame 14 surrounding the electrode rods 12a and 12b so that the film forming surface thereof faces the evaporation sources 15 and 16.

The drive disk 21 is rotationally driven by a motor 22, and a drive pin 21 a protruding from the lower surface of the drive disk 21 presses a driven pin 14 a protruding from the upper surface of the sample holding frame 14. The sample holding frame 14 can be rotated together with the turntable 11.

In the apparatus as described above, the substrate is placed on the sample holding frame 14 attached to the door 3 with the door 3 opened and the vapor deposition mechanism 6 exposed to the outside, and the door 3 is placed after the substrate placement is completed. Is connected to the chamber 2 and is evacuated to a predetermined pressure, and then the sample holder frame 14 is rotated by the rotating mechanism, and an electric current is passed through the wires 15 and 16 to heat the evaporation source to form a film on the substrate surface. Was doing.

[0008]

[Problems to be solved by the device]

 However, the vapor deposition apparatus as described above has the following problems.

By repeating the film forming process, the vapor deposition substance adheres also to the sample holding frame, and eventually this peels off and adheres to the substrate in the film forming chamber. In order to prevent such peeling pieces from adhering to the substrate, the sample holding frame must be regularly cleaned, and the sample holding frame must be replaced for cleaning. The sample holding frame was designed to be removable from the vapor deposition mechanism, but the removal work was extremely troublesome. That is, the sample holding frame is made as large as possible in order to attach as many substrates as possible and increase the number of substrates processed in each film forming process. However, as the sample holding frame became larger, it became easier for the sample holding frame to collide with the wall surface of the door during removal, making removal very difficult. In particular, the rod-shaped electrodes inside the sample holding frame hinder the removal work. Therefore, normally, after removing this electrode, the sample holding frame was taken out, a new washed sample holding frame was attached, and then the electrode rod was attached again.

Further, after the previous film forming process is completed, when the substrate is removed and mounted for the next film formation, this work is performed with the sample holding frame still connected to the door. Has a poor workability for workers. The operator wants to remove the sample holding frame and work in a different place, but for that purpose the electrode rod must be removed, either by removing the electrode rod or by attaching or detaching the substrate with the sample holding frame attached to the door. I had to do some annoying work.

It is an object of the present invention to solve the above problems and to provide an apparatus having excellent workability for substrate attachment / detachment and maintenance.

[0012]

[Means for Solving the Problems]

 The vacuum vapor deposition apparatus of the present invention made to solve the above problem is a vacuum vapor deposition apparatus in which a sample holding frame surrounding the vapor deposition means is rotatably installed and a film is formed on a substrate placed on the sample holding frame. In, while arranging the electrode rods for energizing the evaporation source of the vapor deposition means in one row, the sample holding frame is provided with a slit portion in a part thereof, when the sample holding frame is attached to or detached from the film forming chamber, It is characterized in that the electrodes arranged in a line in the space of the slit portion can pass through.

Hereinafter, how the vacuum vapor deposition device of the present invention works will be described.

[0014]

According to the present invention, the sample holding frame is mounted at a predetermined position in the film forming chamber such that the vapor deposition means passes through the slit provided in the sample holding frame. Therefore, the sample holding frame can be attached so as to surround the vapor deposition means without removing the electrode rod attached to the center of the film forming chamber.

[0015]

【Example】

 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view of an embodiment of a vacuum evaporation apparatus according to the present invention, FIG. 2 is a view showing a round substrate placed on a sample holding frame, and FIG. It is a perspective view about a part.

In these figures, the same parts as those in the conventional example are designated by the same reference numerals, and the description thereof will be omitted. In this vapor deposition device, the electrode rods 12a and 12b are arranged in a line in a direction substantially perpendicular to the opening 3a of the door. That is, the electrode rods 12a and 12b are arranged so as to be lined up in a row when viewed from the front when the door is opened.

The electrode rods 12a and 12b are paired with two each, and the evaporation sources 15 and 16 are placed on the conductive wires 15 and 16 stretched between them. Alternatively, the wires 15, 16 themselves are used as the evaporation source. A power source (not shown) is connected to the wires 15 and 16 via the electrode rods 12a and 12b.

On the other hand, the sample holding frame 14 has a rectangular frame shape whose outer shape is substantially square, and a slit 14a is provided at one of the four corners. Sub-holders 14b to which a plurality of round substrates are attached are fixed to the four side surfaces of the sample holding frame 14 by fasteners.

Next, the operation and operation of this embodiment will be described. In advance, the sub-holder 14b with the substrate attached is attached to the sample holding frame 14 which is newly attached to the vacuum vapor deposition apparatus. This work should be done in another place with good workability. Then, the door 3 on the side where the board is mounted (the door on the right side in FIG. 1) is fully opened so that the opening 3a comes to the front of the operator. At this time, the electrode rods 12a and 12b are aligned in a line in the vertical direction with respect to the operator. The operator holds a new sample holding frame 14 with the slit 14a provided in the sample holding frame 14 on the front side, and the electrode rods 12a and 12b arranged in a row pass through the slit 14a so that they are placed on the turntable 11. Put. At this time, if the positioning hole 22 is provided in the turntable 11 and the positioning pin 21 to be inserted into this hole is provided on the sample holding frame 14 side, accurate positioning can be performed, so that it is possible to reposition each film forming process. Reality improves. Similarly, after the film formation is completed, the sample holding frame 14 is removed so that the electrodes 12a and 12b pass through the slit 14a. By doing so, the operator can attach / detach the new holding frame 14 to / from the vacuum evaporation apparatus without removing the electrode rods 12a and 12b.

In this embodiment, the sample holding frame is detached and attached manually by an operator, but this may be an automatic operation using a robot. FIG. 4 shows the flow of the sample holding frame 14 during automatic work using a robot. In this example, the sub-holders are attached to the plurality of sample holding frames 14 in the previous step. The sample holding frame 14 to which the sub holder is attached is placed on the supply conveyor 31 and carried to the side of the robot 32. At this time, the slit portions 14a of the sample holding frame 14 are all aligned and conveyed in the same direction. The robot 32 holds the sample holding frame 14 and attaches it to the door 3. At this time, the sample holding frame 14 is moved so that the electrode rods 12a and 12b pass through the inside of the slit portion 14a, and is placed on the turntable 11. Then, the door 3 is connected to the chamber 2 and a predetermined film forming process is performed. After that, the door 3 is opened again, and the robot 32 places it on the discharge conveyor 33 and carries it to the next step.

In this embodiment, the sample holding frame has a quadrangular shape, but the sample holding frame is not limited to this, and may have a cylindrical or polygonal slit portion.

Further, in the present embodiment, the substrate is attached to the sub-holder and is attached / detached to / from the sample holding frame via the sub-holder, but the substrate may be directly attached / detached to / from the sample holding frame itself. When the sub holder is not used, for example, a wire can be attached between the frames of the sample holding frame and the substrate can be hung by a clip to easily attach and detach the substrate.

Further, in this embodiment, two doors are provided and each door has a vapor deposition mechanism. However, the present invention is not limited to this, and even if only one door is provided, this vapor deposition mechanism can be used as a door. It may be provided on the chamber side instead of on the side.

[0025]

[Effect of device]

 As described above, according to the present invention, by providing the electrode rods arranged in a line and using the sample holding frame provided with the slits, it is possible to attach and detach the substrate without removing the electrode rods one by one. Will be able to. Further, according to the present invention, the sample holding frame can be easily attached and detached by the robot, and the work efficiency is improved.

[Brief description of drawings]

FIG. 1 is a perspective view of a vacuum vapor deposition apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram when a round substrate is placed on a sample holding frame in the apparatus of FIG.

FIG. 3 is a perspective view showing a main part of the apparatus shown in FIG.

FIG. 4 is a view showing a flow of a sample holding frame when the present invention is applied to an automatic work by a robot.

FIG. 5 is a perspective view of a conventional vacuum vapor deposition device.

6 is a cross-sectional view of the conventional device of FIG. 4 when the door is closed.

[Explanation of symbols]

 2: Chamber 3: Door 6: Vapor deposition mechanism 11: Turntable 12: Electrodes 12a, 12b: Electrode rod 14: Sample holding frame 14a: Slit portion 14b: Sub-holder 15, 16: Wire (vapor deposition source) 21: Driving disk

Claims (1)

[Scope of utility model registration request] 1. A vacuum vapor deposition apparatus in which a sample holding frame surrounding the vapor deposition means is rotatably installed and a film is formed on a substrate placed on the sample holding frame, in order to energize an evaporation source of the vapor deposition means. The electrode rods are arranged in a line, and the sample holding frame is provided with a slit portion in a part thereof, and when the sample holding frame is attached to or detached from the film forming chamber, the spaces of the slit portions are arranged in a line. A vacuum vapor deposition device characterized in that the electrode rod can pass through.