JPH0679490A - Wire solder - Google Patents

Abstract

PURPOSE:To improve the solder workability of the wire solder by coating the wire solder with a meshed metallic member. CONSTITUTION:The wire solder 1 is coated with the meshed metallic member 2 formed by braiding copper wires of a small diameter, etc., and forming the braided wires to a sheet shape. As a result, the excess molten solder is absorbed and held between the meshes of the meshed metallic member 2, and therefore the excessive solder supply state to the soldering point is regulated and the generation of a solder bridge is prevented. The workability is thus improved. The mesh roughness, etc., of the meshed metallic member 2 are determined, for example, empirically in such a manner that the holding power, etc., to the molten solder by capillarity attain an optimum value.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thread solder, and more particularly to a thread solder suitable for soldering to a fine portion.

[0002]

2. Description of the Related Art As is well known, a thread solder is formed by molding a solder into a thread shape, and is used by sequentially melting it from the tip thereof using a soldering iron or the like.

[0003]

However, in the above-described conventional thread solder, when soldering to a fine portion, the solder supply amount to the soldering portion tends to become excessive, so that the solder bridge And the like, and the workability of soldering is poor.

The present invention has been made to solve the above drawbacks, and an object of the present invention is to provide a thread solder having a good soldering workability.

[0005]

According to the present invention, the above object provides a thread solder in which a thread-shaped solder 1 is covered with a mesh-shaped metal member 2 as shown in FIG. 1 corresponding to an embodiment. It is achieved by

[0006]

The thread solder according to the present invention is formed by covering the thread-shaped solder 1 with the mesh-shaped metal member 2. The solder 1 melted by the soldering iron is the mesh-shaped metal member 2
It is held by the capillary phenomenon between the meshes and regulates the excessive supply of solder 1 to the soldering site.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will now be described in detail with reference to the accompanying drawings. FIG. 1 shows a first embodiment of the present invention. In this embodiment, the thread solder is formed by covering a well-known solder 1 formed into a thread shape with a mesh-shaped metal member 2.

The mesh-shaped metal member 2 is formed into a sheet by weaving a thin copper wire or the like, and the mesh roughness or the like of the mesh-shaped metal member 2 depends on the holding force of the molten solder due to the capillary phenomenon. The optimum value is obtained experimentally, for example, but in this embodiment, the number 120 to 160 is used.

Therefore, as shown in FIG. 1B, when the solder 1 is pressed against the leads 4a of the semiconductor element 4 via the mesh-shaped metal member 2 and the solder 1 is melted by the soldering iron 5, the molten solder 1 Is a mesh-shaped metal member 2
Being restrained between the meshes, only a proper amount is supplied to the soldering point. The amount of solder supplied to the soldering point is uniquely determined by the relative relationship between the holding force (due to the capillary phenomenon) of the mesh metal member 2 due to the mesh and the wetting force of the solder to the leads 4a. It is not necessary to consider the occurrence of the bridge at all, and, for example, a plurality of FIG.
As shown in (b), even if the thread solder is placed between the plurality of leads 4a and the solder 1 is melted by the soldering iron 5, the solder bridge is not generated, and the soldering workability is remarkably improved.

In this embodiment, the mesh-shaped metal material is fixed so as to wrap the solder 1, but in addition to this, a long sheet-shaped mesh-shaped metal member 2 is provided as shown in FIG. It may be formed by tightly or roughly winding around the solder 1.

FIG. 3 shows a second embodiment of the present invention. In this embodiment, the solder 1 is formed into a small diameter, and the metal thread 3
Along with that, it is woven into a sheet. Solder 1
The diameter of the metal thread 3, the diameter of the metal thread 3, the number of thread-shaped solders 1 or the like may be appropriately selected in consideration of the pitch of the leads 4a and the like.

[0012]

As is apparent from the above description, according to the thread solder according to the present invention, since the excess molten solder is absorbed and retained between the meshes of the mesh-shaped metal member, the solder is applied to the soldering point. The excessive solder supply state is regulated, and the solder bridge is prevented from occurring.

As a result, it is not necessary to care about the occurrence of the solder bridge even in a fine portion, and it is possible to solder a plurality of leads at once, so that the soldering workability can be improved.

[Brief description of drawings]

FIG. 1 is a view showing an embodiment of the present invention, (a) is a perspective view of a thread solder, and (b) is a perspective view showing a usage state thereof.

FIG. 2 is a diagram showing a modification of FIG.

FIG. 3 is a diagram showing a second embodiment of the present invention.

[Explanation of symbols]

 1 solder 2 mesh metal member 3 metal thread

Claims (2)

[Claims] 1. A thread-shaped solder (1) with a mesh-shaped metal member
Thread solder coated with (2). 2. A thread solder comprising a thread-shaped solder (1) and a thin metal thread (3) woven together in a sheet shape.