JPH0678003B2 - Thermal head and manufacturing method thereof - Google Patents
Thermal head and manufacturing method thereofInfo
- Publication number
- JPH0678003B2 JPH0678003B2 JP59112385A JP11238584A JPH0678003B2 JP H0678003 B2 JPH0678003 B2 JP H0678003B2 JP 59112385 A JP59112385 A JP 59112385A JP 11238584 A JP11238584 A JP 11238584A JP H0678003 B2 JPH0678003 B2 JP H0678003B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- heat
- tape carrier
- heating resistor
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Electronic Switches (AREA)
- Facsimile Heads (AREA)
Description
【発明の詳細な説明】 （技術分野） 本発明はプリンターやファクシミリなどに使用され、送
信データを文字や画像に変換するサーマルヘッド及びそ
の製造方法に関する。TECHNICAL FIELD The present invention relates to a thermal head used for a printer, a facsimile, and the like, for converting transmission data into characters and images, and a manufacturing method thereof.
（従来技術） サーマルヘッドには発熱抵抗体素子を有する耐熱基板
と、外部回路からデータや電源を供給する配線用基板と
の間に、駆動回路素子を搭載したテープキャリアを接続
したものがある。しかし、同じく耐熱基板、配線用基板
及びテープキャリアを備えたサーマルヘッドといって
も、発熱抵抗体素子の電極のパターンや配線用基板の配
線パターンには種々のものが検討されている。(Prior Art) There is a thermal head in which a tape carrier having a drive circuit element is connected between a heat resistant substrate having a heating resistor element and a wiring substrate for supplying data and power from an external circuit. However, even in the case of a thermal head including a heat resistant substrate, a wiring substrate and a tape carrier, various patterns of electrodes of the heating resistor element and wiring patterns of the wiring substrate have been studied.
第３図は従来のサーマルヘッドの一例を表わす。FIG. 3 shows an example of a conventional thermal head.
発熱抵抗体素子２をＸ方向に列状に配列して有する耐熱
基板１と、表面に配線パターン11をＸ方向に延在させて
有する配線用基板８とが支持板14上に固着され、これら
耐熱基板１と配線用基板８との間には、駆動回路素子13
を搭載したテープキャリア４がボンディングされてい
る。A heat-resistant substrate 1 having heating resistor elements 2 arranged in a line in the X direction and a wiring substrate 8 having a wiring pattern 11 extending in the X direction on the surface thereof are fixed on a support plate 14, and A drive circuit element 13 is provided between the heat-resistant substrate 1 and the wiring substrate 8.
The tape carrier 4 on which is mounted is bonded.
耐熱基板１において、各発熱抵抗体素子２の駆動電極３
は、テープキャリアの一方のリード５と接続される部分
６ではＹ方向に延在している。７は共通電極である。In the heat-resistant substrate 1, the drive electrodes 3 of each heating resistor element 2
Extends in the Y direction at a portion 6 connected to one lead 5 of the tape carrier. 7 is a common electrode.
このサーマルヘッドでは、駆動電極３とテープキャリア
４の一方のリード５とのボンディングは、互いにＹ方向
に延在する接続部６とリード５との間で行なわれ、一
方、配線用基板８の配線パターン11とテープキャリア４
の他方のリード９とのボンディングは、逆に互いにＸ方
向に延在する配線パターン11とリード９との間で行なわ
れる。In this thermal head, the bonding of the drive electrode 3 and the one lead 5 of the tape carrier 4 is performed between the connecting portion 6 and the lead 5 extending in the Y direction, while the wiring of the wiring substrate 8 is formed. Pattern 11 and tape carrier 4
On the contrary, the bonding with the other lead 9 is performed between the wiring pattern 11 and the lead 9 which extend in the X direction.
しかしながら、この方式のサーマルヘッドでは、テープ
キャリアのボンディング後に不良の駆動回路素子が搭載
されているテープキャリアが発見された場合、そのリプ
レイス（取替え）作業が容易でないという問題がある。However, in this type of thermal head, if a tape carrier on which a defective drive circuit element is mounted is found after the tape carrier is bonded, the replacement (replacement) work is not easy.
すなわち、駆動電極３とリード５とのボンディングは一
般に金錫共晶を形成して行なわれるので、そのボンディ
ング部を剥すと駆動電極３が耐熱基板１から剥れてしま
い、再び同じ場所にリード５をボンディングすることは
できない。また、一般に駆動電極３はパターン密度が高
く（例えば８〜12本/mm）、半田ごて等でリード５を熱
してボンディング部を溶融させて剥すことはできない。
それに対して配線用基板８上の配線パターン11とリード
９とのボンディングは、線密度も粗く（例えば１〜２本
/mm）、また、一般に半田で接合されているので、半田
ごてで１本ずつ加熱してボンディングを剥すことも可能
であり、強い力で引き離しても配線パターン11が配線用
基板８から剥がれることもない。したがって、配線パタ
ーン11とリード９とのボンディングは同一場所に再びボ
ンディングすることもできる。That is, since the drive electrode 3 and the lead 5 are generally bonded by forming a gold-tin eutectic crystal, the drive electrode 3 peels off from the heat-resistant substrate 1 when the bonding portion is peeled off, and the lead 5 is again placed at the same place. Can not be bonded. In general, the drive electrodes 3 have a high pattern density (for example, 8 to 12 / mm), and the leads 5 cannot be separated by melting them by heating the leads 5 with a soldering iron or the like.
On the other hand, the bonding between the wiring pattern 11 on the wiring substrate 8 and the leads 9 has a rough line density (for example, 1 to 2 wires).
/ mm) Moreover, since it is generally joined by solder, it is possible to heat the soldering iron one by one to peel off the bonding, and the wiring pattern 11 is peeled off from the wiring board 8 even if the wiring pattern 11 is separated by a strong force. Nothing. Therefore, the wiring pattern 11 and the lead 9 can be bonded to the same place again.
そのため、不良テープキャリアのリプレイスは、その不
良テープキャリアを取り除いた後、まず配線パターン11
上にリプレイス用テープキャリアをボンディングしてリ
ード９と配線パターン11とのボンディング位置をＹ方向
に移動させた後、良品テープキャリアをボンディングす
ることが行なわれる。Therefore, to replace a defective tape carrier, first remove the defective tape carrier and then
After the replacement tape carrier is bonded to the top and the bonding position between the lead 9 and the wiring pattern 11 is moved in the Y direction, a non-defective tape carrier is bonded.
他のリプレイス方法としては、一方のリード５の長いテ
ープキャリアを用い、リプレイスの度にリード５と駆動
電極３のボンディング位置６を変更していくものがあ
る。しかし、これはリード５が細いため、曲りやすく歩
留りが悪くなるという欠点をもっている。As another replacement method, there is a method in which a tape carrier having one lead 5 having a long length is used, and the bonding position 6 between the lead 5 and the drive electrode 3 is changed every replacement. However, this has a defect that the lead 5 is thin and thus the lead 5 is easily bent and the yield is deteriorated.
（目的） 本発明はリプレイスが容易で、製作も容易なテープキャ
リア方式のサーマルヘッド及びその製造方法を提供する
ことを目的とするものである。(Object) It is an object of the present invention to provide a tape carrier type thermal head which is easy to replace and easy to manufacture, and a manufacturing method thereof.
（構成） 本発明は発熱抵抗体素子が列状に配列され各発熱抵抗体
素子の駆動電極の駆動回路素子への接続部分が前記発熱
抵抗体素子配列に直交する方向に形成されている耐熱基
板と、 配線パターンの接続部分が前記発熱抵抗体素子配列に直
交する方向に延在して形成されており、かつ、この接続
部分とコネクタとの接続は主としてスルーホールを介し
て裏面の配線パターンを経て行なわれ、前記耐熱基板に
平行に配置された配線用基板と、 駆動回路素子を搭載し、前記耐熱基板の駆動電極の接続
部分と前記配線用基板の配線パターンの接続部分との間
に接続されるテープキャリアと、を備えたサーマルヘッ
ドである。また、本発明の製造方法は、発熱抵抗体素子
が一辺に平行に列状に配列され各発熱抵抗体素子の駆動
電極の駆動回路素子への接続部分が発熱抵抗体素子配列
に直交する方向に延在して形成されている耐熱基板と、
配線パターンの接続部分が一辺に直交する方向に延在し
て形成されており、かつ該接続部分とコネクタとの接続
は主としてスルーホールを介して裏面の配線パターンを
経て行なわれる配線用基板とを、配線用基板が耐熱基板
の駆動電極側にあって配線用基板の前記一辺が発熱抵抗
体素子配列に平行になるように支持板上に固着し、駆動
回路素子を搭載して耐熱基板の駆動電極の接続部分との
間に接続されるリード線と配線用基板の配線パターンの
接続部分との間に接続されるリード線とを有し、両リー
ド線が互いに反対方向に直線状に延在して形成されてい
るテープキャリアを耐熱基板と配線用基板との間に接続
して組立てた後、不良の駆動回路素子が発見されたと
き、その不良駆動回路素子を搭載したテープキャリアを
耐熱基板及び配線用基板から取り外した後、新しい駆動
回路素子を搭載したテープキャリアを用い、テープキャ
リアのリード線と駆動電極との接続及びテープキャリア
の他のリード線と配線パターンとの接続を元の接続位置
から発熱抵抗体素子配列に直交する方向にずれた位置で
施すサーマルヘッドの製造方法である。(Structure) The present invention is a heat-resistant substrate in which heating resistor elements are arranged in a row and connecting portions of drive electrodes of each heating resistor element to drive circuit elements are formed in a direction orthogonal to the heating resistor element array. And a connection portion of the wiring pattern is formed to extend in a direction orthogonal to the heating resistor element array, and the connection portion and the connector are connected to each other mainly through the through hole by connecting the wiring pattern on the rear surface. After that, the wiring substrate arranged in parallel with the heat-resistant substrate and the drive circuit element are mounted, and the connection is made between the connection portion of the drive electrode of the heat-resistant substrate and the connection portion of the wiring pattern of the wiring substrate. And a tape carrier that is used. Further, in the manufacturing method of the present invention, the heating resistor elements are arranged in a row in parallel to one side, and the connecting portion of the drive electrode of each heating resistor element to the drive circuit element is in a direction orthogonal to the heating resistor element array. A heat-resistant substrate formed by extending,
The connection portion of the wiring pattern is formed to extend in the direction orthogonal to one side, and the connection portion and the connector are connected to the wiring substrate mainly through the through hole and via the wiring pattern on the back surface. , The wiring board is on the drive electrode side of the heat-resistant board, and is fixed on the support plate so that the one side of the wiring board is parallel to the heating resistor element array, and the drive circuit element is mounted to drive the heat-resistant board. A lead wire connected between the connection portion of the electrode and a connection portion of the wiring pattern of the wiring board, and both lead wires linearly extending in opposite directions. When a defective drive circuit element is found after the tape carrier formed by connecting the heat-resistant board and the wiring board is assembled, the tape carrier with the defective drive circuit element is mounted on the heat-resistant board. And for wiring After removing it from the board, use a tape carrier equipped with a new drive circuit element and heat the connection between the lead wire of the tape carrier and the drive electrode and the connection between the other lead wire of the tape carrier and the wiring pattern from the original connection position. It is a method of manufacturing a thermal head which is provided at a position shifted in a direction orthogonal to the resistor element array.
以下、実施例により本発明を詳細に説明する。Hereinafter, the present invention will be described in detail with reference to examples.
第１図は本発明の一実施例の一部分を分解して表わすも
のである。なお、第１図〜第３図において、同一又は同
等の部材には同一記号を付す。FIG. 1 is an exploded view of a part of an embodiment of the present invention. In addition, in FIGS. 1 to 3, the same or equivalent members are denoted by the same symbols.
図において、１は耐熱基板で、例えばセラミック基板、
好ましくは表面に保温層としてガラス層が被覆されたグ
レーズドセラミック基板、が用いられる。耐熱基板１上
には発熱抵抗体がパターン化されて形成された発熱抵抗
体素子２が列状にＸ方向に配列されており、各発熱抵抗
体素子２を個別に駆動するために設けられている駆動電
極３は適当な数、例えば、16,32というような２のべき
乗数を単位としてグループに分割され、各クループの駆
動電極３とテープキャリア20の一端のリード線21との接
続部分６が発熱抵抗体素子２の配列方向Ｘと直交するＹ
方向に延在して形成され、Ｘ方向に配列されている。７
は各発熱抵抗体素子２に共通に接続される共通電極であ
る。In the figure, 1 is a heat-resistant substrate, such as a ceramic substrate,
It is preferable to use a glazed ceramic substrate whose surface is covered with a glass layer as a heat retaining layer. On the heat-resistant substrate 1, the heating resistor elements 2 formed by patterning the heating resistors are arranged in rows in the X direction, and are provided to individually drive each heating resistor element 2. The drive electrodes 3 are divided into groups by an appropriate number, for example, a power of 2 such as 16,32, and a connecting portion 6 between the drive electrode 3 of each group and the lead wire 21 at one end of the tape carrier 20. Is Y which is orthogonal to the arrangement direction X of the heating resistor elements 2.
Are formed so as to extend in the X-direction and are arranged in the X-direction. 7
Is a common electrode commonly connected to each heating resistor element 2.
30は配線用基板で、ベースとしてガラスエポキシなどの
絶縁板が用いられ、その上の配線パターンとテープキャ
リア20の他端のリード22との接続部分31もＹ方向に延在
して形成され、Ｘ方向に配列されている。そしてこの配
線用基板30においてコネクタにつながる配線パターン32
はその殆んどのものがこの配線用基板30の裏面に形成さ
れており、表面の接続部分31との間はスルーホール33を
介して接続が施されている。Reference numeral 30 denotes a wiring substrate, an insulating plate such as glass epoxy is used as a base, and a connection portion 31 between the wiring pattern and the lead 22 at the other end of the tape carrier 20 is also formed to extend in the Y direction. They are arranged in the X direction. The wiring pattern 32 connected to the connector on the wiring board 30
Almost all of them are formed on the back surface of the wiring substrate 30, and the connection with the connection portion 31 on the front surface is made through a through hole 33.
テープキャリア20はフレシキブルな絶縁フイルムにてな
り、IC化された駆動回路素子23を搭載し、絶縁フイルム
の一端から突出したリード21と駆動電極３間、及び他端
から突出したリード22と配線パターンの接続部分31との
間は熱圧着により接続されている。駆動回路素子23はバ
イポーラトランジスタとCMOSトランジスタが混載された
Bi-CMOS ICである。The tape carrier 20 is made of a flexible insulating film, and is mounted with an IC drive circuit element 23. Between the lead 21 and the drive electrode 3 protruding from one end of the insulating film, and the lead 22 and wiring pattern protruding from the other end. The connection portion 31 is connected by thermocompression bonding. The drive circuit element 23 has a bipolar transistor and a CMOS transistor mounted together.
It is a Bi-CMOS IC.
14は耐熱基板１と配線用基板30とが接着されている支持
板である。Reference numeral 14 is a support plate to which the heat resistant substrate 1 and the wiring substrate 30 are bonded.
ここで、耐熱基板１上の駆動電極３は金で形成され、配
線用基板30の配線パターン接続部31では銅パターンに半
田メッキが施され、テープキャリア20のリード21,22に
は錫メッキ又は半田メッキが施されている。Here, the drive electrodes 3 on the heat-resistant substrate 1 are formed of gold, the copper patterns are solder-plated at the wiring pattern connection portions 31 of the wiring substrate 30, and the leads 21, 22 of the tape carrier 20 are tin-plated or Solder plating is applied.
本実施例において、組立て後に不良の駆動回路素子IC23
が発見され、それが第２図でのＢの位置にあったテープ
キャリアであるとする。その不良ICをテープキャリアと
ともに剥す。リード21と駆動電極３のボンディング部
は、例えばリード21又は駆動電極３をレーザ光で切断す
ればよい。そして、新しいICを搭載した同一寸法のテー
プキャリア20を第２図のテープキャリアＢのようにもと
の位置からＹ方向にずらしてボンディングすればよい。
この場合、テープキャリアＢのリード21,22とそれぞれ
ボンディングされる駆動電極３の接続位置６、及び配線
パターンの接続部分31との接続位置はそれぞれ元の位置
からＹ方向へ移動する。したがって、このボンディング
は故障なく行なうことができる。In this embodiment, the defective drive circuit element IC23 after assembly
Is found, and it is assumed that it is the tape carrier located at position B in FIG. Peel off the defective IC together with the tape carrier. The bonding portion between the lead 21 and the drive electrode 3 may be formed by cutting the lead 21 or the drive electrode 3 with a laser beam, for example. Then, the tape carrier 20 having the same size as the new IC mounted thereon may be bonded by shifting it from the original position in the Y direction as in the tape carrier B of FIG.
In this case, the connection positions 6 of the drive electrodes 3 to be bonded to the leads 21 and 22 of the tape carrier B and the connection positions 31 of the connection portions 31 of the wiring pattern respectively move in the Y direction from their original positions. Therefore, this bonding can be performed without failure.
また、本実施例では、駆動回路素子にBi-CMOS ICを使用
したので、大電流が流れる発熱抵抗体素子の駆動用にバ
イポーラトランジスタを使用し、他の回路にはCMOSトラ
ンジスタを使用するようにすれば、消費電力を抑えるこ
とができる。Further, in this embodiment, since the Bi-CMOS IC is used for the driving circuit element, a bipolar transistor is used for driving the heating resistor element through which a large current flows, and a CMOS transistor is used for other circuits. If so, power consumption can be suppressed.
なお、実施例は発熱抵抗体素子が耐熱基板の片側に配列
されたエッジタイプのサーマルヘッドを示しているが、
発熱抵抗体素子が耐熱基板の中央に配列されるセンター
タイプのにも全く同様にして適用することができる。Although the embodiment shows an edge type thermal head in which the heating resistor elements are arranged on one side of the heat resistant substrate,
The same can be applied to the center type in which the heating resistor elements are arranged in the center of the heat resistant substrate.
（効果） 本発明のサーマルヘッドでは、組立て後の駆動回路素子
ICの不良などによるテープキャリアのリプレイスは、同
一寸法の新しいテープキャリアをＹ方向にずらせてボン
ディングをするだけで済むので、その作業は容易であ
る。(Effect) In the thermal head of the present invention, the drive circuit element after assembly
Replacing the tape carrier due to a defective IC or the like is easy because the new tape carrier of the same size is displaced in the Y direction and bonded.
また、耐熱基板と配線用基板を支持板上に接着する際、
接着精度が悪くて仮に配線パターンの接続部分のピッチ
で２〜３ピッチ分（約1mm）程度ずれたとしても、テー
プキャリア４を若干傾けてボンディングすることにより
その接着誤差を吸収することができるので、接着の作業
性がよい利点もある。Also, when bonding the heat resistant substrate and the wiring substrate on the support plate,
Even if the bonding accuracy is poor and the pitch of the connection portion of the wiring pattern is deviated by a few pitches (about 1 mm), the bonding error can be absorbed by slightly tilting the tape carrier 4 for bonding. There is also an advantage that the workability of adhesion is good.
第１図は本発明の一実施例を示す部分分解斜視図、第２
図は同実施例においてテープキャリアをリプレイスした
状態を概略的に示す部分平面図、第３図は従来のサーマ
ルヘッドを概略的に示す部分平面図である。 １……耐熱基板、２……発熱抵抗体素子、 ３……駆動電極、６……駆動電極の接続部分、 20……テープキャリア、23……駆動回路素子IC、30……
配線用基板、31……配線パターンの接続部分、32……裏
面の配線パターン、33……スルーホール。FIG. 1 is a partially exploded perspective view showing an embodiment of the present invention, and FIG.
FIG. 3 is a partial plan view schematically showing a state in which the tape carrier is replaced in the embodiment, and FIG. 3 is a partial plan view schematically showing a conventional thermal head. 1 ... Heat-resistant substrate, 2 ... Heating resistor element, 3 ... Drive electrode, 6 ... Connection portion of drive electrode, 20 ... Tape carrier, 23 ... Drive circuit element IC, 30 ...
Wiring board, 31 …… wiring pattern connection part, 32 …… rear side wiring pattern, 33 …… through hole.
Claims (4)
抗体素子の駆動電極の駆動回路素子への接続部分が前記
発熱抵抗体素子配列に直交する方向に延在して形成され
ている耐熱基板と、 配線パターンの接続部分が前記発熱抵抗体素子配列に直
交する方向に延在して形成されており、かつ該接続部分
とコネクタとの接続は主としてスルーホールを介して裏
面の配線パターンを経て行なわれ、前記耐熱基板に平行
に配列された配線用基板と、 駆動回路素子を搭載し、前記耐熱基板の駆動電極の接続
部分との間に接続されるリード線と前記配線用基板の配
線パターンの接続部分との間に接続されるリード線とを
有し、両リード線が互いに反対方向に直線状に延在して
形成されているテープキャリアと、 を備えたことを特徴とするサーマルヘッド。1. A heating resistor element is arranged in a row, and a connecting portion of a drive electrode of each heating resistor element to a drive circuit element is formed so as to extend in a direction orthogonal to the heating resistor element arrangement. The heat-resistant substrate and the wiring pattern connecting portion are formed so as to extend in a direction orthogonal to the heating resistor element array, and the connection portion and the connector are connected mainly through the through holes to the wiring on the back surface. The wiring substrate, which is formed through a pattern and is arranged in parallel with the heat-resistant substrate, and the drive circuit element is mounted, and the lead wire connected between the drive electrode connection portion of the heat-resistant substrate and the wiring substrate. A tape carrier formed by linearly extending in opposite directions to each other, and a lead wire connected to a connection portion of the wiring pattern of Thermal head
れ、前記配線用基板の接続部分には半田メッキが施さ
れ、また前記テープキャリアのリードには錫メッキ又は
半田メッキが施されている特許請求の範囲第１項に記載
のサーマルヘッド。2. The heat-resistant substrate is made of gold, the connecting portions of the wiring substrate are plated with gold, and the leads of the tape carrier are plated with tin or solder. The thermal head according to claim 1.
素子はバイポーラトランジスタとCMOSトランジスタを混
載したBi-CMOS ICである特許請求の範囲第１項に記載の
サーマルヘッド。3. The thermal head according to claim 1, wherein the drive circuit element mounted on the tape carrier is a Bi-CMOS IC in which a bipolar transistor and a CMOS transistor are mounted together.
され各発熱抵抗体素子の駆動電極の駆動回路素子への接
続部分が発熱抵抗体素子配列に直交する方向に延在して
形成されている耐熱基板と、配線パターンの接続部分が
一辺に直交する方向に延在して形成されており、かつ該
接続部分とコネクタとの接続は主としてスルーホールを
介して裏面の配線パターンを経て行なわれる配線用基板
とを、配線用基板が耐熱基板の駆動電極側にあって配線
用基板の前記一辺が発熱抵抗体素子配列に平行になるよ
うに支持板上に固着し、駆動回路素子を搭載して耐熱基
板の駆動電極の接続部分との間に接続されるリード線と
配線用基板の配線パターンの接続部分との間に接続され
るリード線とを有し、両リード線が互いに反対方向に直
線状に延在して形成されているテープキャリアを耐熱基
板と配線用基板との間に接続して組立てた後、不良の駆
動回路素子が発見されたとき、その不良駆動回路素子を
搭載したテープキャリアを耐熱基板及び配線用基板から
取り外した後、新しい駆動回路素子を搭載したテープキ
ャリアを用い、テープキャリアのリード線と駆動電極と
の接続及びテープキャリアの他のリード線と配線パター
ンとの接続を元の接続位置から発熱抵抗体素子配列に直
交する方向にずれた位置で施すことを特徴とするサーマ
ルヘッドの製造方法。4. A heating resistor element is arranged in a row in parallel to one side, and a connecting portion of a drive electrode of each heating resistor element to a drive circuit element extends in a direction orthogonal to the heating resistor element arrangement. The heat-resistant substrate formed and the connection portion of the wiring pattern are formed to extend in a direction orthogonal to one side, and the connection portion and the connector are connected to each other mainly through the through-hole so that the wiring pattern on the back surface is formed. Then, the wiring substrate is fixed on the support plate so that the wiring substrate is on the drive electrode side of the heat-resistant substrate and one side of the wiring substrate is parallel to the heating resistor element array. And a lead wire connected between the connection part of the drive electrode of the heat-resistant substrate and a connection part of the wiring pattern of the wiring board, and both lead wires are mutually connected. Shaped by linearly extending in the opposite direction When a defective drive circuit element is found after the tape carrier is assembled between the heat-resistant board and the wiring board, the tape carrier equipped with the defective drive circuit element is used for the heat-resistant board and wiring. After removing it from the board, use a tape carrier with a new drive circuit element installed, and heat the connection between the lead wire of the tape carrier and the drive electrode and the connection between the other lead wire of the tape carrier and the wiring pattern from the original connection position. A method of manufacturing a thermal head, characterized in that the thermal head is applied at a position shifted in a direction orthogonal to the resistor element array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59112385A JPH0678003B2 (en) | 1984-06-01 | 1984-06-01 | Thermal head and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59112385A JPH0678003B2 (en) | 1984-06-01 | 1984-06-01 | Thermal head and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60255458A JPS60255458A (en) | 1985-12-17 |
| JPH0678003B2 true JPH0678003B2 (en) | 1994-10-05 |
Family
ID=14585349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59112385A Expired - Lifetime JPH0678003B2 (en) | 1984-06-01 | 1984-06-01 | Thermal head and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0678003B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2695441B2 (en) * | 1988-07-11 | 1997-12-24 | キヤノン株式会社 | Printing element driving unit, ink jet driving unit and ink jet recording apparatus using the same |
| DE3826396A1 (en) * | 1988-08-01 | 1990-02-15 | Siemens Ag | FUNCTIONAL UNIT STRUCTURED |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5636199A (en) * | 1979-08-31 | 1981-04-09 | Fujitsu Ltd | Method of forming stereoscopic wire |
| JPS57205178A (en) * | 1981-06-12 | 1982-12-16 | Toshiba Corp | Heat sensitive typing head |
-
1984
- 1984-06-01 JP JP59112385A patent/JPH0678003B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60255458A (en) | 1985-12-17 |
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