JPH0677317A - Assembly of semiconductor device - Google Patents

Abstract

PURPOSE:To provide an assembling method in which a large number of LD chips are bonded to a submount at one time while they are lined up in the same direction. CONSTITUTION:A method for assembling a semiconductor device is provided with steps of: joining, to an adhesive film 9, an LD bar 7 having scribing lines 8 on which a number of LD chips 1 are formed; and expanding the adhesive film 9 in the lengthwise direction of the LD bar 7. This assembling method is also provided with the steps of: vacuum-chucking each of the LD chips 1 that are separated from each other and lined up at constant intervals in the same direction as a result of the expansion by an array of chuction collets arranged on the same pitches as the LD chips 1 and bonding the chips to the bonding surface of a submount 10 to which a solder 5 is applied; separating, chip by chip, the submount 10 to which the LD chips 1 are adhered along dicing lines 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for assembling a semiconductor device, and in particular, a semiconductor having a plurality of elements is attached to an adhesive film, and the separated semiconductor elements face the same direction at regular intervals. The present invention relates to a method of assembling a semiconductor device in which the adhesive film is expanded so as to be positioned at a predetermined position and then adhered to the submount material.

[0002]

2. Description of the Related Art FIG. 6 shows an LD in a bonding apparatus.
FIG. 3 is a perspective view showing a conventional bonding method for adhering a chip to a submount; 1 is an LD chip, 2 is a light emitting end face corresponding to the front end face of the LD chip 1, and 3 is the LD chip 1 in a chip tray (not shown). No.) and a suction collet 4 for carrying the LD chip 1 to the submount material and bonding the LD chip 1 with solder 5. Further, FIG. 6 shows a state in which one LD chip 1 is vacuum-sucked by the suction collet 3 and moved to a position above the submount 4, and then the suction collet 3 is lowered and bonded to the upper surface of the submount 4. is there.

Next, a conventional assembling method will be described. A wafer on which a plurality of laser elements are manufactured is cleaved in a bar shape and separated into one LD chip 1, and then each chip is assembled.

In the assembly, first, the suction collet 3 of the bonding apparatus is brought onto the chip tray, and one LD chip 1 arranged in advance on this chip tray is vacuum-sucked. The LD chip 1 sucked by the suction collet 3 is slid and carried to the submount 4 placed on the heating plate. After that, the suction collet 3 is positioned so that the light emitting end face 2 of the LD chip 1 is flush with one end face of the submount 4 or is parallel to the one end face and is bonded to the submount 4 with solder 5. . At that time, for adhesion, solder such as vapor deposited in advance on the submount or ribbon solder placed in advance at the adhesion position is used.

[0005]

Since the conventional bonding apparatus assembles the semiconductor device as described above, the LD chips 1 separated for each chip have their light emitting end faces 2 aligned. I have to put them in a tray. As described above, it is not efficient to arrange the separated LD chips 1 in the same direction, and it is necessary to assemble each chip one by one, which is time-consuming.

The present invention has been made to solve the above problems, and provides a method of assembling a semiconductor device capable of die-bonding a large number of chips to a submount at the same time in the same direction. With the goal.

[0007]

A method for assembling a semiconductor device according to the present invention is a method for assembling a semiconductor laser device, wherein semiconductors having a plurality of laser elements are separated and die-bonded to a submount material. Laser element was produced, the adhesive film to which the scribe line-containing semiconductor was attached, the step of expanding so that each of the separated elements were oriented in the same direction at regular intervals, and separated at regular intervals The method further comprises a step of separately adhering each of the elements to a submount material that is on standby, and a step of separating the submount material to which the elements are adhered for each chip.

In the method of assembling the above semiconductor device,
The semiconductor in which a plurality of laser elements are manufactured is a semiconductor cleaved in a bar shape, and the step of adhering to the submount material is such that each element manufactured in this semiconductor is positioned in the same direction at regular intervals. It is a process of linearly separating it, adsorbing it with an array-shaped adsorption collet, and then adhering it to the submount material.

In the method of assembling the above semiconductor device,
The step of adhering to the submount material is a step of adhering the adhered elements by junction down so that the adhering surface of the expanded adhesive film comes to the surface of the submount material.

Also, in the method of assembling a semiconductor device according to the present invention, in the method of assembling a semiconductor laser device in which a semiconductor having a plurality of laser elements is separated and die-bonded to a submount material, the plurality of laser elements are arranged vertically and horizontally. An adhesive film having a large-diameter semiconductor with a scribe line produced in a step of expanding each of the separated elements so that they are positioned in the same direction at equal intervals vertically and horizontally,
Adsorb each element with a two-dimensional array type adsorption collet,
It is provided with a step of adhering to a large-area submount material in which adhering points are arranged vertically and horizontally, and a step of separating the submount material to which the elements are adhered into chips.

Further, in the method of assembling the semiconductor device, the step of adhering to the submount material uses a large-area submount material in which a finally separated portion is half-cut, and This is a step of adhering the above elements along the above.

[0012]

According to the present invention, in assembling a semiconductor laser device, after a semiconductor having a scribe line in which a plurality of elements are manufactured is attached to an adhesive film, the separated elements are oriented in the same direction at regular intervals. Since it has a step of expanding this adhesive film in parallel so that it is lined up, each element separated through this step is lined up in the same direction on the adhesive film at a constant interval, and is attached to the submount material. When the above-mentioned elements are bonded together, they can be die-bonded at one time. Therefore, it is not necessary to re-arrange as in conventional assembly, and it is not necessary to assemble each chip.

[0013]

EXAMPLES Example 1. An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing an assembling process of a semiconductor device assembling method according to a first embodiment of the present invention.
The same reference numerals denote the same or corresponding portions, 6 is an array-shaped suction collet of the bonding apparatus of this embodiment, and 7 is an L-shaped wafer formed by cutting a plurality of LD chips 1 into a bar shape.
D bar, 8 is a scribe line, that is, LD of LD bar 7
This is a line for dividing the chip 1 into individual pieces, and in this embodiment, it is formed by cutting with a laser or the like to the extent that it can be separated. Further, 9 is an adhesive film to which the LD bar 7 is attached, 10 is a bar-shaped submount, and 11 is a dicing line showing the separation position of the submount 10.

In the assembling method according to this embodiment, the LD bar 7 having the scribe lines 8 in which a plurality of LD chips 1 are manufactured is attached to the adhesive film 9, and the adhesive film 9 is arranged in the longitudinal direction of the LD bar 7. The process of expanding,
As a result of being stretched in the expanding step, the LD chips 1 separated by the scribe line 8 and positioned in a straight line in the same direction at the same intervals are
The array-shaped suction collet 6 having the same pitch as the pitch of the chip 1 is vacuum-sucked at one time, and while maintaining this pitch, it is moved onto the submount 10 and is once attached to the bonding surface of the submount 10 to which the solder 5 is attached. It consists of a step of adhering and a step of separating the submount 10 to which the LD chip 1 is adhered by a dicing line 11 for each chip.

Next, the operation will be described based on the above steps with reference to the drawings. First, as shown in FIG. 1A, the adhesive film 9 to which the LD bar 7 having the scribe line 8 is attached is expanded in the direction of arrow A.

When the adhesive film 9 is stretched on both sides in this way, as shown in FIG. 1 (b), L on the adhesive film 9 is extended.
The D bars 7 are separated by the scribe lines 8, and the LD chips 1 are positioned on the adhesive film 9 in a straight line at equal intervals in the same direction. At this time, the space between the LD chips 1 is mechanically expanded so that the pitch of the LD chips 1 becomes equal to the pitch between the collets of the suction collet 6. The pitch between the collets corresponds to the pitch of each chip formed on the dicing line 11 of the submount 10.

As described above, the suction collets 6 are moved above the LD chips 1 arranged in the above-mentioned interval by the expansion, and positioned so that the collets face each LD chip 1, and then the suction collets 6 are lowered. Each LD chip 1 is vacuum-sucked. After that, the suction collet 6 is raised to peel the LD chip 1 from the adhesive film 9, and the submount 1 placed on a plate (not shown) having a heating device.
Slide above 0.

Then, as shown in FIG. 1C, the LD chip 1 is placed on each chip of the submount 10 formed by the dicing line 11 of the submount 10 and is bonded by the solder 5. At this time, the light emitting end face 2 of the LD chip 1 is bonded so that the light emitting end face 2 is parallel to the one end face of the submount 10 and sufficiently located near the end face.

Finally, by dicing or the like, the chips are separated along the dicing line 11 of the submount 10 chip by chip. At this time, as the adhesive material, Si, Si
AuSi, AuS on the submount such as C or the back of the chip
By pre-depositing the solder material 10 such as u, adhesion can be easily performed.

As described above, according to this embodiment, after the LD bar 7 having the scribe line 8 on which the LD chip 1 is manufactured is adhered to the adhesive film 9, the adhesive film 9 is attached to L
By the process of expanding in the longitudinal direction of the D bar 7, L
The D bar 7 is separated, the LD chips 1 spread linearly at equal intervals, and are arranged in the same direction. In addition, the LD chip 1 positioned as described above is attached to the array-shaped suction collet 6
The light is emitted from the LD chip 1 to one end face of each chip of the submount 10 with respect to all the adsorbed LD chips 1 by the process of adsorbing the LD chips 1 at once by the process of adhering onto the respective chips of the submount 10 as they are. Bond the end faces 2 so that they are aligned. This eliminates the step of arranging the LD chips 1 on the chip tray as in conventional assembly, and eliminates the need to assemble one chip at a time, which also improves the assembly work efficiency and shortens the assembly time. it can.

Example 2. A second embodiment of the present invention will be described with reference to the drawings. FIG. 2 is a perspective view showing an outline of an assembling process of a method for assembling a semiconductor device according to a second embodiment of the present invention. 12 is a large-diameter wafer in which the LD chips 1 are produced in a lattice shape in a vertical and horizontal manner, and 13 is a The two-dimensional array-shaped suction collet 14 is a large-diameter submount substrate.

In the assembling method according to this embodiment, in order to separate the LD chips 1 of the large-diameter wafer 12 at equal intervals in the vertical and horizontal directions, the adhesive film 9 is separated in the x-axis and y-axis directions, respectively. By the expanding step and the expanding step, the LD chips 1 aligned in the x- and y-axis directions at equal intervals are vacuum-sucked at once by the suction collet 13 in a two-dimensional array, and the large-diameter sub Mount board 1
4 and the step of adhering the sub-mount substrate 14 on which the LD chip 1 is adhered to the dicing line 1
1 for separating each chip.

Next, the operation will be described based on the above steps with reference to the drawings. First, as shown in FIG. 2 (a), the adhesive film 9 with the large-diameter wafer 12 containing the scribe lines 8 is expanded in the direction of arrow A, which is the x-axis direction while maintaining the parallelism, and the x-axis direction is expanded. After having a predetermined interval with respect to, the same expansion is performed in the direction of arrow B, which is the y-axis direction. Alternatively, expanding on the x and y axes is performed simultaneously. At this time, since the parallelism is maintained and expanded in the x- and y-axis directions, the surface of the adhesive film 9 becomes parallel to the suction surface of the suction collet 13 and the adhesion surface of the large-diameter submount substrate 14. There is.

By thus expanding in the x-axis and y-axis directions, the large-diameter wafer 12 is separated at the scribe line 8 as shown in FIG. 2 (b), and each LD chip 1 on the adhesive film 9 is separated. Are parallel and spread in the same direction at equal intervals vertically and horizontally. As a result, each LD chip 1 on the adhesive film 9 is attached to the suction collet 1.
3 and the submount substrate 14 respectively, the pitch of each LD chip 1 is equal to the pitch of each collet of the suction collet 13, and this pitch is on the large-diameter submount substrate 14 and the dicing line 1
It corresponds to each grid-shaped chip formed by 1.

The suction collet 13 vacuum-sucks the LD chips 1 arranged vertically and horizontally at equal intervals as in the first embodiment, and adheres them to the submount substrate 14 as shown in FIG. 2 (c).
Thereafter, the submount substrate 14 is diced or the like.
The chips are separated along the dicing line 11 for each chip.

As described above, according to this embodiment, after the large-diameter wafer 12 is attached to the adhesive film 9, the adhesive film 9 is expanded in the x and y axis directions while maintaining the parallelism. Each LD chip 1 of large diameter wafer 12
Are separated so that they are aligned in the x and y axis directions at equal intervals. The pitch of each LD chip 1 thus separated is equal to the pitch of the suction collet 13 of the two-dimensional array,
The surface of the adhesive film 9 corresponding to the pitch of each submount of the large-diameter submount substrate 14 and expanded in the x- and y-axis directions is with respect to the suction surface of the suction collet 13 and the bonding surface of the large-diameter submount substrate 14. Since the LD chips 1 are vacuum-sucked to the suction collet 13, the LD chips 1 vacuum-sucked to the suction collet 13 are bonded to the submount substrate 14 at the same time while aligning the directions of the chips of the submount. . As a result, even in the method of assembling the semiconductor device with respect to the LD chip 1 formed on the large diameter wafer 12, all or arbitrary blocks can be carried out at once, and the assembling work efficiency can be improved and the assembling time can be shortened. it can.

In the state where the chip is bonded to the large-diameter submount, the chip end face protective film is collectively formed or the submount is provided with the pattern electrode, so that the evaluation of the device characteristics and the burn-in can be performed. It is also possible to do so.

Example 3. A third embodiment of the present invention will be described with reference to the drawings. FIG. 3 is a perspective view showing an LD chip adhered to a submount material in an assembling process of a semiconductor device assembling method according to a third embodiment of the present invention.
Is a large-diameter submount substrate having a half-cut portion 15 which is half-cut in parallel.

In the assembling method according to the present embodiment, in the step of adhering to the submount material of the second embodiment, the large-diameter submount substrate 14 having the half cut portion 15 obtained by half-cutting the finally separated portion is used. Is an assembling method including a step of adhering the LD chip 1 along the half cut portion 15 by using.

In the assembling method according to this embodiment, when die-bonding to the large-diameter submount substrate 14, a parallel line is put in a position corresponding to the light emitting end face 2 of the LD chip 1 and half-cutting is performed in advance by dicing or the like. By providing the half-cut portion 15 in this manner, the light-emitting end face 2 of the LD chip 1 can be carried along the half-cut portion 15 so as to be aligned and bonded. In addition to the effect of the second embodiment, this has an effect that the light emitting end face 2 is not contaminated when the submount is separated later.

Example 4. A fourth embodiment of the present invention will be described with reference to the drawings. FIG. 4 is a perspective view showing an LD chip adhered to a submount material in an assembling process of a semiconductor device assembling method according to a fourth embodiment of the present invention.
Is a large-diameter submount substrate having grid lines 16 that are half-cut in advance in a grid shape to form a chip of one size.

In this embodiment, instead of the parallel-line half-cut portion 15 in the third embodiment, a grid-like half-cut line 16 is provided so as to form a corner of a submount having a size of one chip. . Even such a large-diameter submount substrate 14 has the same effect as that of the third embodiment, and can be easily separated later.

Example 5. FIG. 5 is a perspective view showing a method of assembling a semiconductor device according to a fifth embodiment of the present invention.
Is the back surface of the LD chip 1 adhered to the adhesive tape 18 (a part of the square is shown), and 19 is the upper surface of the LD chip 1.

The assembling method according to the present embodiment includes an assembling step of adhering at the junction down without using the suction collet in the first to fourth embodiments.
The adhesive tape 18 to which the large-diameter wafer 12 is adhered is expanded to be separated while maintaining parallelism, and the LD chip 1 is attached to the adhesive tape 18 so that the upper surface 19 of the LD chip 1 is adhered onto the large-diameter submount substrate 14. Carry with the attached
It is heated and bonded. FIG. 5 shows that in the assembly process of this embodiment, after the expanding process, the LD chip 1 attached to the adhesive tape 18 is placed above the large-diameter submount substrate 17 with the upper surface 19 of the LD chip 1 facing downward. This is the standby position, and the upper surface 19 serves as an adhesive surface.

As described above, according to the present embodiment, although the suction collet is not used, the LD chips 1 separated in the same direction at equal intervals are separated at a time from the submount substrate 14 described above.
Can be glued to. Although not shown, the LD bar 7 can also be similarly bonded to the submount 10. Although only the LD (laser diode) chip is shown in the first to fifth embodiments, it may be an LED (light emitting diode), a PD (photodiode) or the like.

[0036]

As described above, according to the method for assembling a semiconductor device of the present invention, a semiconductor with a plurality of laser elements and containing scribe lines is attached to an adhesive film, and the elements are arranged at equal intervals. This adhesive film is expanded so as to be separated side by side in the same direction, and each element that has undergone this process is bonded to the submount material, so a large number of elements are bonded to this submount material at one time. As a result, it is not necessary to arrange the elements on the chip tray as in the conventional assembly, and it is not necessary to assemble each chip one by one, and the working time is shortened and the work is facilitated.

[Brief description of drawings]

FIG. 1 is a perspective view showing an assembly process of an embodiment of the present invention.

FIG. 2 is a perspective view showing an assembling process of a second embodiment of the present invention.

FIG. 3 is a perspective view illustrating a submount material according to a third embodiment of the present invention.

FIG. 4 is a perspective view illustrating a submount material according to a fourth embodiment of the present invention.

FIG. 5 is a perspective view showing an outline of an assembling method according to a fifth embodiment of the present invention.

FIG. 6 is a perspective view showing a conventional bonding method.

[Explanation of symbols]

 1 LD chip 2 Light emitting end face 3 Adsorption collet 4 Submount 5 Solder 6 Array adsorption collet 7 LD bar 8 Scribe line 9 Adhesive film 10 Bar submount 11 Dicing line 12 Large diameter wafer 13 Two-dimensional array adsorption collet 14 Large Sub-mount board

Claims (6)

[Claims] 1. A method for assembling a semiconductor laser device in which a semiconductor having a plurality of laser elements is separated and die-bonded to a submount material, a scribe line semiconductor having a plurality of laser elements is attached. A step of expanding the adhesive film so that the separated elements are positioned in the same direction at regular intervals, and a step of adhering the separated elements to a sub-mount material that has been on standby separately, And a step of separating the submount material, to which the above-mentioned elements are bonded, for each chip. 2. The method of assembling a semiconductor device according to claim 1, wherein the semiconductor on which a plurality of laser elements are manufactured is a bar-shaped cleaved semiconductor, and the step of adhering to the submount material is performed at regular intervals. In the semiconductor device, each element of the semiconductor separated linearly so as to be positioned in the same direction is adsorbed by an array-shaped adsorption collet and adhered to the submount material. Assembly method. 3. The method of assembling a semiconductor device according to claim 1, wherein the step of adhering to the submount material is performed so that the adhered surface of the expanded adhesive film comes to the surface of the submount material. A method of assembling a semiconductor device, which comprises a step of adhering each element by junction down. 4. A method of assembling a semiconductor laser device, wherein semiconductors having a plurality of laser elements are separated and die-bonded to a submount material. The step of expanding the adhered adhesive film so that the above-mentioned separated elements are positioned in the same direction in the vertical and horizontal directions at regular intervals, and the elements are adsorbed by a two-dimensional array-shaped adsorption collet and adhered in the vertical and horizontal directions. A method of assembling a semiconductor device, comprising: a step of adhering to a submount material on which parts are arranged; and a step of separating the submount material to which the elements are adhered for each chip. 5. The method of assembling a semiconductor device according to claim 4, wherein, in the step of adhering to the submount material, a submount material in which a finally separated portion is halfcut is used. A method of assembling a semiconductor device, which comprises the step of adhering the above-mentioned elements along the line. 6. The method of assembling a semiconductor device according to claim 1, wherein the plurality of laser elements are photodiodes or light emitting diodes.