JPH0677076A - Manufacture of coil part - Google Patents

Abstract

PURPOSE:To provide a method of manufacturing a coil part applicable to a magnetic head, an inductor, or a transformer, where the coil part can be formed into a fine pattern, lessened in size, enhanced in characteristics, and efficiently manufactured. CONSTITUTION:By the use of a photolithography technique comprising application of photoresist, exposure, and development, a coil conductor 6 or an insulator forming photoresist removing pattern is formed. The coil conductor 6 or an insulator is printed on all the surface, and then a photoresist 8g and the coil conductor 6 or the insulator 5 located on the photoresist 8g are removed at a time so as to form the coil conductor 6 or the insulator of deposited pattern.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a coil component used in a magnetic head, an inductor, a transformer or the like.

[0002]

2. Description of the Related Art A method of manufacturing a coil component such as a magnetic chip, an inductor, or a laminated chip component used in a transformer or the like is known as a conductive coil in a magnetic material by a thick film forming technique by a printing method or a sheet method. There is a method of forming a coil by integrally laminating a coil and a method of forming a magnetic thin film and thin-film copper coils in multiple stages by a thin film forming technique such as sputtering.

FIG. 5 is a manufacturing process drawing of a coil component by a conventional thick film forming technique. As shown in FIGS. 5 (a) to 5 (i), this method is applied to magnetic layers 5f to 5 such as magnetic ferrite.
j and a coil conductor layer 6g of silver, copper, gold, aluminum, etc.
By alternately laminating 6 to 6j by a printing method or a sheet method, a coil component in which a conductive coil including a lead electrode portion is integrally formed in a magnetic body is manufactured.

[0004]

However, in the manufacturing method by the thick film forming technique, it is difficult to form a fine line pattern having a width of 100 μm or less in the pattern formation of each layer, and It was difficult to form a sharp edge pattern with no bleeding and a film thickness of about 10 μm. Therefore, the pattern cannot be made finer, and there is a limit to the miniaturization of the coil component. Further, in the printing method, since a mask made of a mesh material is used, a pattern shift occurs due to the expansion of the mask, a short circuit occurs in the coil conductor layer, and electrical characteristics and reliability are deteriorated. There was a point.

Further, in the manufacturing method by the thin film forming technique,
Since the number of films that can be formed at one time is limited and it takes time, there is a problem that work efficiency is poor.

In view of the above-mentioned circumstances, the present invention is capable of forming a fine pattern in a coil component used in a magnetic head, an inductor, or a transformer, which can be miniaturized, improved in characteristics, and efficiently manufactured. An object of the present invention is to provide a method of manufacturing a coil component that can be manufactured.

[0007]

In order to achieve the above-mentioned object, the present invention provides a photolithography method by applying a photoresist, exposing and developing in producing a coil component in which a coil conductor and an insulator are laminated in layers. Using the technique, apply photoresist to the entire surface, through the photoresist for forming the coil conductor or insulator, after exposure and development, print the coil conductor or insulator on almost the entire surface, and then on the photoresist and the photoresist The coil conductor or insulator is removed at the same time to form a laminated pattern of the coil conductor or insulator. Further, the coil component obtained by the present invention is not limited to one in which the entire insulator is made of a magnetic material or a non-magnetic material, but may be one in which the coil core is made of a magnetic material and the outside of the coil is made of a non-magnetic material. .

[0008]

As described above, the pattern of the coil conductor or the insulator can be formed as a fine pattern by photolithography, and the film can be formed efficiently by the printing method.

[0009]

EXAMPLE FIG. 4A is a perspective view of a coil component manufactured by the method of the present invention, and FIG. 4B is a sectional view taken along line EE of FIG. As shown in FIGS. 4A and 4B, this coil component includes a magnetic body 5 such as magnetic ferrite, silver, copper,
The coil conductors 6 made of metal such as gold or aluminum are alternately laminated, and the outer peripheral portion of the coil is formed by laminating the non-magnetic material 7.

1 to 3 are views showing manufacturing steps of an embodiment of a coil component according to the present invention (upper side of each step is a plan view and lower side is a side view). First, in FIG. 1, a magnetic material layer 5g on one end face and a non-magnetic material layer 7g are formed on the outer periphery of the magnetic material layer 5g by paste printing and drying (hereinafter, these are referred to as "printing").
(A), a photoresist 8g is applied on the entire surface (b), and the photoresist 8g is exposed with a pattern 1W of a coil conductor layer that serves as one of the extraction electrodes (c). The photosensitive solution exposed with 1 W is removed (d).

Then, the coil conductor layer 6 is printed from the removed portion of the photoresist 8g to the inside thereof (e), and then the photoresist 8g and the coil conductor layer 6 on the photoresist 8g are removed at the same time by etching. The conductor 6 has the shape of the pattern 1W and the magnetic layer 5
A coil conductor layer 6g which remains on g and serves as one of the lead electrodes is formed (f).

Subsequently, a photoresist 8h is applied over the entire surface (g), and the photoresist 8h is exposed by the nonmagnetic layer pattern 1X on the outer periphery (h).

Next, referring to FIG. 2, the photosensitive solution exposed by the pattern 1X is removed (a), the non-magnetic material 7 is printed around the removed portion of the photoresist 8h (b), and then the photolithography is performed by etching. When the resist 8h and the nonmagnetic material 7 on the photoresist 8h are removed at the same time, the nonmagnetic material 7 remains in the shape of the pattern 1X, and the nonmagnetic material layer 7h is formed on the outer peripheral portion (c).

Subsequently, a photoresist 8i is coated on the entire surface (d), the photoresist 8i is exposed by the magnetic layer pattern 1Y (e), and the photosensitive liquid exposed by the pattern 1Y is removed. (F), the magnetic body 5 is printed around the removed portion of the photoresist 8i (g), and then the photoresist 8i and the magnetic body 5 on the photoresist 8i are removed by etching, the magnetic body 5 is patterned. The magnetic layer 5h is formed so as to remain in the shape of 1Y and cover half of the coil conductor layer 6g (h).

Next, in FIG. 3, a photoresist 8j is applied to the entire surface (a) and exposed by the pattern 1Z of the coil conductor layer (b), and the photosensitive solution exposed by the pattern 1Z is removed ( c).

Subsequently, the coil conductor 6 is printed on the removed portion or the inside of the photoresist 8j (d), and then the photoresist 8j and the coil conductor 6 on the photoresist 8j are simultaneously removed by etching. Remains in the shape of the pattern 1Z, and the coil conductor layer 6h is formed (e).

After that, in a process similar to that shown in FIGS. 2E to 2H, a magnetic layer is formed on the side opposite to the magnetic layer 5h to cover half of the coil conductor layer 6h, and the magnetic layer shown in FIG. b) ~
In a step similar to (f), the coil conductor layer is formed by a pattern in which the leading end portion is removed from the pattern 1W.

Further, after repeating the steps from FIG. 1 (g) to the above for the required number of turns, as shown in FIG. 3 (f), a coil conductor layer 6i serving as the other lead electrode is formed, and After forming the non-magnetic layer 7i as shown in FIG. 3 (g), the magnetic layer 5i on the other end face is formed as shown in FIG. 3 (h).
To form.

As described above, a fine pattern of the photoresist removing portion is formed by using the photolithography method including the steps of applying the photoresist, masking, exposing and developing to remove the photosensitive portion, and only the removed portion is formed. The width of each layer is 100 μm because each layer printed on
It can be formed by the following fine patterns, and the coil components such as laminated chip components can be downsized.

Further, since a mesh mask for printing plate making is not used for pattern formation, a sharp edge pattern without bleeding can be formed even when the film thickness is about 10 μm. In addition, the pattern shift of each layer does not occur due to the elongation of the mask of the mesh material, and the short of the coil conductor layer can be prevented, so that the electrical characteristics and reliability are improved. Further, the mask of the mesh material used for forming the pattern of the printing plate has a limited life because it gradually expands, but the mask used in the photolithography method is economical because it can be used semipermanently because it is a film. .

[0021]

According to the first aspect of the present invention, since the pattern of each layer is formed by using the photolithography method in addition to the printing method, it is possible to form a fine pattern, and the coil can be formed. Parts can be miniaturized. Further, the manufacturing efficiency can be improved as compared with the case where only the thin film forming technique is used. Further, since it is possible to form a sharp edge pattern without bleeding, it is possible to prevent the coil conductor layer from being shorted and obtain a coil component with improved electrical characteristics and reliability. be able to.

According to the second aspect, since leakage of magnetic flux can be prevented, an efficient coil component can be obtained.

According to the third aspect, by manufacturing the laminated chip component by the above method, it is possible to obtain the laminated chip component having improved electrical characteristics, reliability and the like.

[Brief description of drawings]

FIG. 1 is a diagram showing a part of a manufacturing process of an embodiment of a method for manufacturing a coil component according to the present invention.

FIG. 2 is a diagram showing a step that follows the manufacturing step of FIG. 1 in the example.

FIG. 3 is a diagram showing the remaining steps of the manufacturing process of the example.

FIG. 4 (A) is a perspective view of an embodiment of a coil component manufactured by the manufacturing method of the present invention, and FIG. 4 (B) is EE of (A).
FIG.

FIG. 5 is a manufacturing process diagram of a coil component by a conventional thick film forming technique.

[Explanation of symbols]

 1W-1Z Exposed part 5 Magnetic substance 5g-5i Magnetic substance layer 6 Coil conductor 6g-6i Coil conductor layer 7 Non-magnetic substance 7g-7i Non-magnetic substance layer 8, 8g-8j Photoresist

Claims (3)

[Claims] 1. When manufacturing a coil component in which a coil conductor and an insulator are laminated in layers, a photoresist is applied to the entire surface by a photolithography technique such as photoresist application, exposure, and development, and the coil conductor is applied. Alternatively, after exposure and development through a photoresist for forming an insulator, a coil conductor or an insulator is printed on almost the entire surface, and then the photoresist and the coil conductor or the insulator on the photoresist are removed at the same time to obtain a coil conductor or an insulator. A method of manufacturing a coil component, which comprises forming a laminated pattern of an insulator. 2. The method for manufacturing a coil component according to claim 1, wherein a magnetic material is formed on a coil core portion and a non-magnetic material is formed outside the coil as the insulator. 3. The method for manufacturing a coil component according to claim 1, wherein the coil component is a laminated chip component.