JPH0671633A - Manufacture of ceramic electronic parts - Google Patents

Abstract

PURPOSE:To provide a manufacturing method for ceramic electronic parts which restrain breakage and crack from occurring in cutting a bar or in handling thereafter when the ceramic electronic parts are made uniform to required dimensions from a bar shape formed by laminating ceramic sheets when the ceramic electronic parts are manufactured. CONSTITUTION:Manufacture of ceramic electronic parts is constructed as follows; a plurality of bars 1 are laminated with an adhesive sheet 2 or adhesives [figure-(b)]; cutting is performed thereafter [figure-(c)]; removing a binder or burning is carried out as they are to obtain electronic parts green materials 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a ceramic electronic component, and more particularly to a method for adjusting a bar shape to a desired size.

[0002]

2. Description of the Related Art Circuit boards and chip parts are changed from a bar shape to
Conventionally, this is done by cutting the bars one by one when aligning them to a desired size.

[0003]

In recent years, ceramic electronic parts have become lighter, thinner and smaller, and the thickness of each part has become thinner. For this reason, the thickness of the bar before cutting has become thin, and there has been a problem that cracks and chips frequently occur at the time of cutting and during handling thereafter, which causes a phenomenon that yield is deteriorated.

Therefore, an object of the present invention is to provide a method of manufacturing a ceramic electronic component which suppresses the generation of cracks and chips by cutting the bar or handling it thereafter.

[0005]

Means for Solving the Problems As a result of research to achieve the above object, the inventors of the present invention have studied the fact that conventionally, each bar is cut individually, and handle a plurality of bars together. Attention has been paid to increasing the thickness in the case of the above, and the inventors have found that the problem can be solved by sticking the bars together with a pressure-sensitive adhesive sheet or the like as a means for bringing them together, and arrived at the present invention.

Therefore, according to the present invention, a ceramic green sheet obtained by mixing a ceramic material powder with a binder solution to form a slurry, printing a conductor paste obtained by kneading metal powder and a binder solution on the sheet,
After laminating printed sheets, cutting the bar obtained by thermocompression bonding to a desired dimension, in a method for manufacturing a ceramic electronic component to be an electronic component element body through the steps of binder removal and firing, The bars are attached to each other with a sheet-like adhesive tape placed between them or an adhesive applied on each bar, and the multiple integrated bars are cut according to the dimensions of the electronic component body, and then removed. The present invention provides a method for manufacturing a ceramic electronic component characterized by a binder and firing.

[0007]

In the handling, the bar can be handled while it is still thick during the steps of bar cutting, binder removal and firing, so that it is strong against external force and cracking and chipping can be suppressed.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic sectional view for explaining the procedure of a method of handling a bar used in this embodiment, which will be described below with reference to the drawing.

In accordance with a commonly used method, a dielectric material powder is mixed with a binder solution consisting of an organic binder, a dispersant, a plasticizer, and a solvent to form a slurry, and a green sheet is prepared. An internal electrode made of a conductor paste obtained by kneading with a binder solution was printed, laminated and thermocompression bonded to form a bar.

Then, as shown in FIGS. 3A and 3B, three bars 1 were attached to each other with an adhesive sheet 2 and then cut as shown in FIG. After that, binder removal and main firing were performed, and the occurrence rate of cracking and chipping in each step of the electronic component element body was examined. FIG. 3D shows the component body 3 after firing.

[0011]

[Comparative Example] After the bars were prepared in the manner shown in the examples, the bars were cut one by one, then the binder was removed and the firing was performed, and the cracking rate and chipping occurrence rate for each step were examined in the same manner as in the examples. The results are shown in Table 1.

[0012]

[Table 1]

[0013]

As described above, according to the method of the present invention, since the bar can be handled while it is still thick, it is possible to prevent cracks and chipping defects in the handling and to handle a plurality of sheets at a time. Since it can be cut, productivity is improved.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view for explaining the procedure of a bar handling method according to an embodiment of the present invention.

[Explanation of symbols]

 1 bar 2 Adhesive sheet 3 Electronic component body

Claims (1)

[Claims] 1. A ceramic green sheet obtained by mixing a ceramic material powder with a binder solution to form a slurry, printing a conductor paste prepared by kneading a metal powder and a binder solution on the sheet, and printing In the method for manufacturing a ceramic electronic component, which is obtained by laminating sheets and cutting a bar obtained by thermocompression bonding into a desired dimension, and then removing the binder and firing to form an electronic component element body, between each of the plurality of bars. After sticking the bars together with the sheet-shaped adhesive tape placed on the or adhesive applied on each bar, cut the integrated bars according to the dimensions of the electronic component body, remove the binder and fire A method of manufacturing a ceramic electronic component, comprising: