JPH0663358U - IC card module fixing structure - Google Patents
IC card module fixing structureInfo
- Publication number
- JPH0663358U JPH0663358U JP009025U JP902593U JPH0663358U JP H0663358 U JPH0663358 U JP H0663358U JP 009025 U JP009025 U JP 009025U JP 902593 U JP902593 U JP 902593U JP H0663358 U JPH0663358 U JP H0663358U
- Authority
- JP
- Japan
- Prior art keywords
- liquid adhesive
- module
- recess
- substrate
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 97
- 230000001070 adhesive effect Effects 0.000 claims abstract description 97
- 239000007788 liquid Substances 0.000 claims abstract description 78
- 239000000758 substrate Substances 0.000 claims abstract description 61
- 238000003860 storage Methods 0.000 abstract description 25
- 230000000694 effects Effects 0.000 abstract description 3
- 230000001965 increasing effect Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 229920001756 Polyvinyl chloride acetate Polymers 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000011111 cardboard Substances 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
(57)【要約】
【目的】 ＩＣカード基板に液状接着剤を用いてＩＣモ
ジュールを収納固着する際、液状接着剤がＩＣカード基
板表面にはみ出て印刷する面を汚すことなく、更に接着
強度を増し、ＩＣカードの品質向上と低コストを図る。
【構成】 ＩＣカード基板１の基板収納凹部２の底面に
網目状の液状接着剤溜め溝５を形成し、ＩＣカード基板
１にＩＣモジュールを収納固着する際、前記基板収納凹
部２の底面に塗布した液状接着剤は、底面に均一に拡散
し余分な液状接着剤はＩＣカード基板１の表面に流出す
ることなく、前記網目状の液状接着剤溜め溝５に逃げて
溜まり、食いつきを強くし、接着表面積が拡大する。
【効果】 外観品質が優れ、接着強度が強く安定し、廉
価なＩＣカードモジュールの固定構造が得られる。
(57) [Abstract] [Purpose] When an IC module is housed and fixed by using a liquid adhesive on the IC card substrate, the liquid adhesive does not run over the surface of the IC card substrate and stain the surface to be printed, and the adhesive strength is further improved. To improve the quality of IC cards and lower costs. [Structure] A liquid adhesive reservoir groove 5 having a mesh shape is formed on the bottom surface of the substrate storage recess 2 of the IC card substrate 1, and when the IC module is stored and fixed to the IC card substrate 1, the liquid adhesive storage groove 5 is applied to the bottom surface of the substrate storage recess 2. The liquid adhesive thus spreads evenly on the bottom surface, and the excess liquid adhesive does not flow out to the surface of the IC card substrate 1, but escapes and collects in the mesh-shaped liquid adhesive reservoir groove 5 to strengthen the bite, Adhesive surface area increases. [Effect] An inexpensive fixing structure for an IC card module having excellent appearance quality, strong adhesive strength and stability, can be obtained.
Description
【０００１】[0001]
本考案はＩＣカード基板に形成されたＩＣモジュール収納凹部にＩＣモジュー ルを液状接着剤により収納固着するＩＣカードモジュールの固定構造に関する。 The present invention relates to an IC card module fixing structure in which an IC module is housed and fixed by a liquid adhesive in an IC module housing recess formed in an IC card substrate.
【０００２】[0002]
近年、キャッシュカードやクレジットカードをはじめ各種メンバーズカード、 病院の診察券など様々な種類のカードが流通し、われわれの日常生活には欠かせ ないものになりつつある。現在これらのカードは磁気カードが主流となっている が、磁気カードは、その記憶容量が少ないために機能拡大に限界があり、またセ キュリティ機能を有する多機能カードとして、ＣＰＵ、メモリチップ等を搭載し たカードが登場してきたことは周知の通りである。 In recent years, various types of cards such as cash cards, credit cards, various members' cards, and medical examination tickets for hospitals have been distributed, and are becoming indispensable to our daily lives. Currently, magnetic cards are the mainstream of these cards, but there is a limit to the expansion of functions of magnetic cards due to their small storage capacity, and CPUs, memory chips, etc. are provided as multifunction cards with security functions. It is well known that the installed cards have appeared.
【０００３】 従来のＩＣカードは、ＩＣデバイスを内蔵したＩＣモジュール相当の厚さを有 する積層ＰＶＣ（ポリ塩化ビニル）またはＰＶＣＡ（ポリ塩化ビニル・アセテー ト）等の所定の位置に、打ち抜き、エンドミル、ドリル等によりＩＣモジュール 大の埋設孔を設けたのち、ＩＣモジュール支持用の積層用シートを仮貼り積層し 、その後、ＩＣモジュールをその埋設孔中に埋設し、プレスラミネートする方法 や、ＰＶＣ等の一枚シートにＩＣモジュール収納凹部をエンドミルによりザグリ 加工を施す方法等があるが、これらの方法では、多量の削りかすを出し高品質の ＩＣカードを製造するのは困難であるばかりでなく、製造コストが高く、そこで 上記ＰＶＣに代わり、ＡＢＳ（アクリルニトリル／ブタジエン／スチレン共重合 樹脂）等を射出成形することで、ＩＣカード基板にＩＣモジュール収納凹部を形 成し、ＩＣカードを廉価に製造する技術は周知の通りである。A conventional IC card is punched and end milled at a predetermined position such as a laminated PVC (polyvinyl chloride) or PVCA (polyvinyl chloride acetate) having a thickness equivalent to an IC module containing an IC device. After making a large hole for the IC module with a drill, etc., a lamination sheet for supporting the IC module is temporarily attached and laminated, and then the IC module is embedded in the embedding hole and press laminated, PVC, etc. There is a method of counterboring the recess of the IC module storage on one sheet with an end mill, but with these methods, it is not only difficult to produce a large amount of shavings and to manufacture a high quality IC card, The manufacturing cost is high, and therefore ABS (acrylonitrile / butadiene / styrene copolymer resin) is used instead of PVC. It is well known in the art that an IC module housing recess is formed in an IC card substrate by injection molding an oil or the like to manufacture an IC card at a low cost.
【０００４】 前記ＩＣカード基板に形成されたＩＣモジュール収納凹部にＩＣモジュールを 接着剤により収納固着するＩＣカードモジュールの固定構造に関する技術は特公 昭６３−４２３１４号公報及び特開平１−２６３０９１号公報等に開示されてい る。A technique relating to a fixing structure of an IC card module in which an IC module is housed and fixed by an adhesive in an IC module housing recess formed in the IC card substrate is disclosed in JP-B-63-42314 and JP-A-1-263091. Etc.
【０００５】 前記特公昭６３−４２３１４号公報及び特開平１−２６３０９１号公報等に開 示されているＩＣカードモジュールの固定構造の技術の概要は、図５に示すよう にＩＣカード基板１０にはＩＣチップ収納凹部１１と基板収納凹部１２とよりな る段付きのＩＣモジュール収納凹部１３が形成されている。一方ＩＣモジュール １４は回路基板１５上にＩＣチップ１６がボンディングされ、該ＩＣチップ１６ を封止する樹脂により封止部１７が形成されている。前記ＩＣチップ収納凹部１ １と基板収納凹部１２の底面１１ａ及び１２ａにはそれぞれ液状接着剤１１ｂ及 び１２ｂが塗布され、ＩＣモジュール１４の回路基板１５及び封止部１７がそれ ぞれ前記ＩＣチップ収納凹部１１と基板収納凹部１２の底面１１ａ及び１２ａで 接着されており、前記液状接着剤を硬化させるために加熱する。このように塗布 した液状接着剤によりＩＣモジュール１４をＩＣカード基板１０に形成したＩＣ モジュール収納凹部１３に安定した状態で固定することができる。次に前記ＩＣ カード基板１０の表裏面にオフセット印刷等で印刷１８を施し、その上に透明な ハードコート１９を形成する。更に前記ハードコート１９面に静電気処理をして ＩＣカード２０が完成せれる。An outline of the technology of the fixing structure of the IC card module disclosed in the above Japanese Patent Publication No. 63-42314 and Japanese Patent Application Laid-Open No. 1-263091 is shown in FIG. A stepped IC module storage recess 13 including an IC chip storage recess 11 and a substrate storage recess 12 is formed. On the other hand, in the IC module 14, an IC chip 16 is bonded onto a circuit board 15, and a sealing portion 17 is formed of a resin that seals the IC chip 16. Liquid adhesives 11b and 12b are applied to the bottom surfaces 11a and 12a of the IC chip storage recess 11 and the substrate storage recess 12, respectively, and the circuit board 15 and the sealing portion 17 of the IC module 14 are respectively attached to the IC chip. The storage recess 11 and the substrate storage recess 12 are bonded at their bottom surfaces 11a and 12a, and are heated to cure the liquid adhesive. With the liquid adhesive applied in this manner, the IC module 14 can be stably fixed in the IC module housing recess 13 formed in the IC card substrate 10. Next, printing 18 is performed on the front and back surfaces of the IC card substrate 10 by offset printing or the like, and a transparent hard coat 19 is formed thereon. Further, the IC card 20 is completed by electrostatically treating the surface of the hard coat 19.
【０００６】[0006]
しかしながら、上記した従来技術には次のような問題点がある。即ち図５に示 す如く前記ＩＣカード基板１０に形成された段付き凹部、即ちＩＣチップ収納凹 部１１と基板収納凹部１２の底面１１ａ及び１２ａに塗布された液状接着剤１１ ｂ及び１２ｂの塗布量を均一に制御することが困難であり、前記ＩＣモジュール 収納凹部１３にＩＣモジュール１４を固着収納する際に、両者の接着面同志が互 いに平坦なため、塗布された余分な液状接着剤１１ｂ及び１２ｂが前記ＩＣカー ド基板１０の表面に流れ出し、印刷する面を汚してＩＣカード２０の外観品質を 低下させると言う問題があった。 However, the above-mentioned conventional technique has the following problems. That is, as shown in FIG. 5, application of the liquid adhesives 11b and 12b applied to the stepped recesses formed in the IC card substrate 10, that is, the IC chip housing recess 11 and the bottom surfaces 11a and 12a of the substrate housing recess 12 respectively. It is difficult to control the amount uniformly, and when the IC module 14 is fixedly housed in the IC module housing recess 13, the bonding surfaces of the both are flat, so that the excess liquid adhesive applied is applied. There is a problem that 11b and 12b flow out onto the surface of the IC card substrate 10 to stain the printing surface and deteriorate the appearance quality of the IC card 20.
【０００７】 本考案は上記従来の課題に鑑みなされたものであり、その目的は、ＩＣカード 基板のＩＣモジュール収納凹部にＩＣモジュールを収納固着するのに、その接着 強度を高め極めて安定した状態で固着し、外観品質の高い、しかも低コストで多 量生産ができるＩＣカードモジュールの固定構造を提供するものである。The present invention has been made in view of the above problems of the prior art, and an object thereof is to store and fix an IC module in a recess for storing an IC module of an IC card substrate, while enhancing the adhesive strength thereof and in an extremely stable state. (EN) Provided is a fixing structure for an IC card module which is fixed, has a high appearance quality, and can be mass-produced at low cost.
【０００８】[0008]
上記目的を達成するために、本考案におけるＩＣカードモジュールの固定構造 の構成は、ＩＣカード基板に形成されたＩＣモジュール収納凹部にＩＣモジュー ルを接着剤により収納固着するＩＣカードモジュールの固定構造において、前記 ＩＣカード基板のＩＣモジュール収納凹部底面に液状接着剤溜め凹部を形成し、 液状接着剤により前記ＩＣモジュールをＩＣカード基板のＩＣモジュール収納凹 部に収納固着することを特徴とするものである。 In order to achieve the above-mentioned object, the structure of the fixing structure of the IC card module according to the present invention is the same as the fixing structure of the IC card module in which the IC module is housed and fixed by an adhesive in the IC module housing recess formed in the IC card substrate. A liquid adhesive reservoir recess is formed on the bottom surface of the IC module housing recess of the IC card substrate, and the IC module is housed and fixed by the liquid adhesive in the IC module housing recess of the IC card substrate. .
【０００９】[0009]
従って、本考案により得られるＩＣカードモジュールの固定構造において、前 記ＩＣモジュールをＩＣカード基板の段付き凹部に収納固着する際に、前記ＩＣ モジュール収納凹部底面に塗布した液状接着剤は、接着面の全面に拡散し、余分 な液状接着剤は液状接着剤溜め凹部に逃げて溜まり、前記ＩＣカード基板の表面 に流出することはない。また一方ＩＣモジュール収納凹部底面に形成された前記 液状接着剤溜め凹部により接着表面積も拡大し、食い付きも強くなり、接着強度 を増すことができる。 Therefore, in the IC card module fixing structure obtained by the present invention, when the above-mentioned IC module is housed and fixed in the stepped recess of the IC card substrate, the liquid adhesive applied to the bottom surface of the IC module housing recess is Of the liquid adhesive, the excess liquid adhesive escapes and collects in the liquid adhesive reservoir recess, and does not flow out to the surface of the IC card substrate. On the other hand, the liquid adhesive reservoir concave portion formed on the bottom surface of the IC module accommodating concave portion also increases the adhesive surface area, strengthens the bite, and increases the adhesive strength.
【００１０】[0010]
以下図面に基づいて本考案の好適な実施例を説明する。図１は本考案のＩＣカ ードモジュールの固定構造を示す一実施例で、図１（ａ）はＩＣカード基板の斜 視図、図１（ｂ）は図１（ａ）のＡ−Ａ線断面図である。図１において、ＩＣカ ード基板１には図示しないＩＣモジュールを収納固着する基板収納凹部２とＩＣ チップ収納凹部３とよりなる段付きのＩＣモジュール収納凹部４が形成され、ま た前記基板収納凹部２の底面の全面にわたり、網目状の液状接着剤溜め溝５が形 成されている。従って前記ＩＣモジュールをＩＣカード基板１の段付き凹部に収 納固着する際に、前記基板収納凹部２の底面に塗布した液状接着剤は、接着面の 全面に均一に拡がり、余分な液状接着剤は前記網目状の液状接着剤溜め溝５に逃 げて溜まり、前記ＩＣカード基板１の表面に流出することがなく、印刷する面を 汚すことがない。また網目状の液状接着剤溜め溝５に溜まった液状接着剤により 接着表面積も拡大して、食い付きも強くなり、接着強度は増し、ＩＣモジュール の固定は極めて安定する。 A preferred embodiment of the present invention will be described below with reference to the drawings. 1 is an embodiment showing a fixing structure of an IC card module of the present invention. FIG. 1A is a perspective view of an IC card substrate, and FIG. 1B is a sectional view taken along line AA of FIG. 1A. It is a figure. In FIG. 1, a stepped IC module storage recess 4 including a substrate storage recess 2 for storing and fixing an IC module (not shown) and an IC chip storage recess 3 is formed in the IC card substrate 1, and the substrate storage A mesh-shaped liquid adhesive reservoir groove 5 is formed over the entire bottom surface of the recess 2. Therefore, when the IC module is stored and fixed in the stepped recess of the IC card substrate 1, the liquid adhesive applied to the bottom surface of the substrate storage recess 2 spreads evenly over the entire bonding surface, resulting in excess liquid adhesive. Does not flow into the mesh-shaped liquid adhesive reservoir groove 5 and collects, does not flow out to the surface of the IC card substrate 1, and does not stain the printed surface. Further, the liquid adhesive that has accumulated in the mesh-shaped liquid adhesive reservoir groove 5 expands the adhesive surface area, strengthens the bite, increases the adhesive strength, and extremely stabilizes the fixing of the IC module.
【００１１】 更に図２は本考案の他の実施例で、ＩＣモジュール収納凹部の拡大断面図であ る。前述の基板収納凹部２の底面の全面に形成した網目状の液状接着剤溜め溝５ の代わりに、梨地状の液状接着剤溜めくぼみ６を全面に形成することにより、基 板収納凹部２の底面に塗布された余分な液状接着剤は梨地状の液状接着剤溜めく ぼみ６の全面に均一に溜まり、前記ＩＣモジュールをＩＣカード基板１の段付き 凹部に収納固着する際に、液状接着剤がＩＣカード基板１の表面に流出せず、接 着表面積も拡大し接着強度を増すことは言うまでもない。FIG. 2 is an enlarged cross-sectional view of an IC module accommodating recess according to another embodiment of the present invention. Instead of the mesh-shaped liquid adhesive reservoir groove 5 formed on the entire bottom surface of the substrate accommodating recess 2 described above, a satin-like liquid adhesive accumulating recess 6 is formed on the entire surface, whereby the bottom surface of the substrate accommodating recess 2 is formed. The excess liquid adhesive applied to the liquid is evenly accumulated on the entire surface of the satin-like liquid adhesive reservoir dent 6, and when the IC module is stored and fixed in the stepped concave portion of the IC card substrate 1, the liquid adhesive is applied. Needless to say, does not flow out onto the surface of the IC card substrate 1 and the contact surface area is also increased to increase the adhesive strength.
【００１２】 また更に図３は本考案の更に他の実施例で、図３（ａ）はＩＣモジュール収納 凹部の斜視図、図３（ｂ）はＩＣモジュール収納凹部の拡大断面図で、前述の基 板収納凹部２の底面の全面に形成した網目状の液状接着剤溜め溝５及び梨地状の 液状接着剤溜めくぼみ６の代わりに、円状の液状接着剤溜め穴７を前記基板収納 凹部２の底面の全面にわたり均等に形成することにより、液状接着剤は円状の液 状接着剤溜め穴７の全面に均一に溜まり、前記ＩＣモジュールをＩＣカード基板 １の段付き凹部に収納固着する際に、液状接着剤がＩＣカード基板１の表面に流 出せず、接着表面積も拡大し接着強度を増すことは上記と同様である。3 is a perspective view of an IC module accommodating recess, FIG. 3B is an enlarged sectional view of the IC module accommodating recess, and FIG. Instead of the mesh-shaped liquid adhesive reservoir groove 5 and the satin-shaped liquid adhesive reservoir recess 6 formed on the entire bottom surface of the substrate housing recess 2, a circular liquid adhesive reservoir hole 7 is provided in the substrate housing recess 2 By forming the liquid adhesive evenly over the entire bottom surface of the IC adhesive, the liquid adhesive is evenly collected on the entire surface of the circular liquid adhesive accumulating hole 7, and when the IC module is housed and fixed in the stepped concave portion of the IC card substrate 1. In addition, the liquid adhesive does not flow out to the surface of the IC card substrate 1, the adhesive surface area is increased, and the adhesive strength is increased as described above.
【００１３】 次に図４本考案の更に他の実施例で、ＩＣモジュール収納凹部の斜視図で、基 板収納凹部２の底面がＩＣチップ収納凹部３の側壁と接する周辺の一部を切り欠 き、円弧状の液状接着剤溜め切り欠き８を設けることにより、前記基板収納凹部 ２に塗布した液状接着剤は、前記ＩＣモジュールをＩＣカード基板１の段付き凹 部に収納固着する際に、前記液状接着剤は基板収納凹部２の全面に拡がり、余分 な液状接着剤は前記円弧状の液状接着剤溜め切り欠き８に逃げてＩＣチップ収納 凹部３の底面に拡散し、ＩＣモジュール収納凹部３とＩＣモジュールの封止部と の接着にも役立つものである。従って余分な液状接着剤はＩＣカード基板１の表 面に流出せず、ＩＣモジュールはＩＣカード基板１の前記基板収納凹部２の底面 の全面及びＩＣチップ収納凹部３の底面で極めて安定した状態で収納固着される 。Next, FIG. 4 is a perspective view of an IC module accommodating recess according to another embodiment of the present invention. By providing the arc-shaped liquid adhesive reservoir cutout 8, the liquid adhesive applied to the substrate housing recess 2 is stored and fixed when the IC module is housed and fixed in the stepped recess of the IC card substrate 1. The liquid adhesive spreads over the entire surface of the substrate accommodating recess 2, and the excess liquid adhesive escapes into the arc-shaped liquid adhesive reservoir cutout 8 and diffuses to the bottom surface of the IC chip accommodating recess 3 to form the IC module accommodating recess 3. It is also useful for adhesion between the IC module and the sealing part of the IC module. Therefore, the excess liquid adhesive does not flow out to the front surface of the IC card substrate 1, and the IC module is extremely stable on the entire bottom surface of the substrate storage recess 2 and the bottom surface of the IC chip storage recess 3 of the IC card board 1. The storage is fixed.
【００１４】 上記した実施例で説明したようにうに、網目状の液状接着剤溜め溝５、梨地状 の液状接着剤溜めくぼみ６及び円状の液状接着剤溜め穴７等の液状接着剤溜め凹 部を、それぞれＩＣモジュールの回路基板と接する基板収納凹部２の底面の全面 に設けることが有効であるが、ＩＣモジュールの封止部を液状接着剤を用いて固 着する場合にも、上記した液状接着剤溜め凹部をＩＣチップ収納凹部３の底面に 設けて、余分な液状接着剤を溜めると同時に、接着表面積を拡大し、接着強度を 増大させてもよいことは言うまでもない。As described in the above embodiments, liquid adhesive reservoir grooves such as a mesh liquid adhesive reservoir groove 5, a satin-shaped liquid adhesive reservoir recess 6 and a circular liquid adhesive reservoir hole 7 are formed. It is effective to provide the parts on the entire bottom surface of the substrate housing recess 2 that contacts the circuit board of the IC module. However, even when the sealing part of the IC module is fixed by using a liquid adhesive, It goes without saying that a liquid adhesive reservoir recess may be provided on the bottom surface of the IC chip accommodating recess 3 to store excess liquid adhesive and, at the same time, increase the adhesive surface area and increase the adhesive strength.
【００１５】 以上述べたように、前記ＩＣモジュールをＩＣカード基板１の段付き凹部に収 納固着する際に、塗布した余分な液状接着剤を逃がし溜めるための網目状の液状 接着剤溜め溝５、梨地状の液状接着剤溜めくぼみ６及び円状の液状接着剤溜め穴 ７及び円弧状の液状接着剤溜め切り欠き８等の液状接着剤溜め凹部の形成は、Ｉ Ｃカード基板１を射出成形する際に容易に可能である。As described above, when the IC module is stored and fixed in the stepped recess of the IC card substrate 1, a mesh-shaped liquid adhesive reservoir groove 5 for allowing the excess liquid adhesive applied to escape and be stored. , The liquid adhesive reservoir recesses such as the satin-shaped liquid adhesive reservoir recess 6 and the circular liquid adhesive reservoir hole 7 and the arc-shaped liquid adhesive reservoir notch 8 are formed by injection molding the IC card substrate 1. This is easily possible.
【００１６】 従って、本実施例の特徴とするところは、前述した如く、ＩＣカード基板のＩ Ｃモジュール収納凹部にＩＣモジュールを液状接着剤を用いて収納固着するのに 、基板収納凹部に塗布した液状接着剤は、前記基板収納凹部の底面に形成した液 状接着剤溜め凹部、即ち網目状の液状接着剤溜め溝、梨地状の液状接着剤溜めく ぼみ、円状の液状接着剤溜め穴及び円弧状の液状接着剤溜め切り欠き等に逃げて 溜まり、基板収納凹部の底面に均一に拡散塗布され、接着表面積を拡大し、接着 強度を増大させる。余分な液状接着剤はＩＣカード基板の表面に流出することが ない。Therefore, the feature of this embodiment is that, as described above, when the IC module is stored and fixed in the IC module storage recess of the IC card substrate using the liquid adhesive, it is applied to the substrate storage recess. The liquid adhesive is a liquid adhesive reservoir recess formed on the bottom surface of the substrate housing recess, that is, a net-like liquid adhesive reservoir groove, a satin-like liquid adhesive reservoir recess, and a circular liquid adhesive reservoir hole. Also, it escapes and collects in a circular arc-shaped liquid adhesive reservoir cutout, etc., and is uniformly diffused and coated on the bottom surface of the substrate accommodating recess, increasing the adhesive surface area and increasing the adhesive strength. Excess liquid adhesive does not flow out to the surface of the IC card substrate.
【００１７】[0017]
以上説明したように、本考案によれば、前記ＩＣカード基板のＩＣモジュール 収納凹部底面に液状接着剤溜め凹部を形成することにより、ＩＣモジュール収納 凹部に塗布された液状接着剤は、接着に際して接着面に均一に拡散し、余分な液 状接着剤が前記液状接着剤溜め凹部に逃げてＩＣカード基板の表面に流出せず、 従って印刷する面を汚すことなく美しい外観品質のＩＣカードを得ることができ る。また前記液状接着剤溜め凹部により食いつきを増し、接着表面積を拡大し、 接着強度を高め極めて安定した状態で固着できる。外観品質の高い、しかも低コ ストで生産ができるなど多大な効果がある。 As described above, according to the present invention, the liquid adhesive reservoir recess is formed on the bottom surface of the IC module housing recess of the IC card substrate, so that the liquid adhesive applied to the IC module housing recess is bonded at the time of bonding. The surface of the IC card substrate does not flow out because the excess liquid adhesive spreads evenly over the surface and escapes to the liquid adhesive reservoir recesses, thus obtaining an IC card of beautiful appearance quality without contaminating the printed surface. You can Further, the liquid adhesive reservoir concave portion increases the bite, expands the adhesive surface area, enhances the adhesive strength, and can be fixed in an extremely stable state. It has great effects such as high appearance quality and low cost production.
【図１】本考案の一実施例に係わり図１（ａ）はＩＣカ
ード基板の斜視図、図１（ｂ）は図１（ａ）のＡ−Ａ線
断面図。1A is a perspective view of an IC card substrate according to an embodiment of the present invention, and FIG. 1B is a sectional view taken along line AA of FIG. 1A.
【図２】本考案の他の実施例に係わるＩＣモジュール収
納凹部の拡大断面図。FIG. 2 is an enlarged sectional view of an IC module housing recess according to another embodiment of the present invention.
【図３】本考案の更に他の実施例に係わり図３（ａ）は
ＩＣモジュール収納凹部の斜視図、図３（ｂ）はＩＣモ
ジュール収納凹部の拡大断面図。FIG. 3 is a perspective view of an IC module accommodating recess according to still another embodiment of the present invention, and FIG. 3B is an enlarged sectional view of the IC module accommodating recess.
【図４】本考案の更に他の実施例に係わるＩＣモジュー
ル収納凹部の斜視図。FIG. 4 is a perspective view of an IC module housing recess according to another embodiment of the present invention.
【図５】従来のＩＣカード基板の要部断面図。FIG. 5 is a sectional view of a main part of a conventional IC card substrate.
１ ＩＣカード基板 ２ 基板収納凹部 ３ ＩＣチップ収納凹部 ４ ＩＣモジュール収納凹部 ５ 液状接着剤溜め溝 ６ 液状接着剤溜めくぼみ ７ 液状接着剤溜め穴 ８ 液状接着剤溜め切り欠き 1 IC card substrate 2 Substrate storage recess 3 IC chip storage recess 4 IC module storage recess 5 Liquid adhesive reservoir groove 6 Liquid adhesive reservoir recess 7 Liquid adhesive reservoir hole 8 Liquid adhesive reservoir Notch
Claims (1)
ール収納凹部にＩＣモジュールを液状接着剤により収納
固着するＩＣモジュールの固定構造において、前記ＩＣ
カード基板のＩＣモジュール収納凹部底面に液状接着剤
溜め凹部を形成し、液状接着剤により前記ＩＣモジュー
ルをＩＣカード基板のＩＣモジュール収納凹部に収納固
着することを特徴とするＩＣカードモジュールの固定構
造。1. A fixing structure of an IC module in which an IC module is housed and fixed in a recessed part for housing the IC module formed in an IC card substrate with a liquid adhesive.
A fixing structure for an IC card module, characterized in that a liquid adhesive reservoir recess is formed on a bottom surface of the IC module housing recess of the card substrate, and the IC module is housed and fixed by the liquid adhesive in the IC module housing recess of the IC card substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP009025U JPH0663358U (en) | 1993-02-09 | 1993-02-09 | IC card module fixing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP009025U JPH0663358U (en) | 1993-02-09 | 1993-02-09 | IC card module fixing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0663358U true JPH0663358U (en) | 1994-09-06 |
Family
ID=11709124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP009025U Pending JPH0663358U (en) | 1993-02-09 | 1993-02-09 | IC card module fixing structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0663358U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002062588A1 (en) * | 2001-02-02 | 2002-08-15 | Hitachi, Ltd | Electronic device and method of manufacturing the same |
| WO2012128035A1 (en) * | 2011-03-22 | 2012-09-27 | Ntn株式会社 | Rolling bearing equipped with ic tag |
-
1993
- 1993-02-09 JP JP009025U patent/JPH0663358U/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002062588A1 (en) * | 2001-02-02 | 2002-08-15 | Hitachi, Ltd | Electronic device and method of manufacturing the same |
| WO2012128035A1 (en) * | 2011-03-22 | 2012-09-27 | Ntn株式会社 | Rolling bearing equipped with ic tag |
| JP2012197855A (en) * | 2011-03-22 | 2012-10-18 | Ntn Corp | Rolling bearing equipped with ic tag |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| RU2169389C2 (en) | Electronic-module data medium and its manufacturing process | |
| JP5840115B2 (en) | Smart card with a module with an extended surface | |
| JPS63141790A (en) | Identification card | |
| EP0326822A2 (en) | Data device module | |
| JP3095766B2 (en) | Structure of IC card | |
| JPH0663358U (en) | IC card module fixing structure | |
| JPS62290594A (en) | Ic card | |
| TWI552090B (en) | Smart card fingerprint press device | |
| JP2588548B2 (en) | IC card | |
| JPH03112690A (en) | Ic card and manufacture thereof | |
| KR20220148276A (en) | Prepackage for smart card, smart card and method for forming the same | |
| CN109615055A (en) | Identification card and its manufacturing method | |
| JPS6142667U (en) | Card type electronic equipment | |
| KR100293418B1 (en) | Contactless IC card manufacturing method | |
| JPS62290593A (en) | Ic card | |
| JPS6142666U (en) | Card type electronic equipment | |
| JP2568753Y2 (en) | Charm | |
| JPH11195099A (en) | Ic card | |
| JP3401655B2 (en) | IC card | |
| JPH0227730B2 (en) | ||
| JPH01105794A (en) | Ic card | |
| KR20010070741A (en) | Method of making a card having a gold plate | |
| JPS622712Y2 (en) | ||
| JP3351827B2 (en) | Method of forming recess in card substrate | |
| JPS6377792A (en) | Thin type electronic apparatus |