JPH0661373A - Resin sealed semiconductor device and manufacturing equipment thereof - Google Patents

Abstract

PURPOSE:To enable the positions of lead pins to be visually and easily discriminated so as to realize resin scaling of high reliability by a method wherein index marks are indicated only by dents of ejector pins and projections different from each other in shape. CONSTITUTION:Ejector pin marks 1a and 1b are recessed, and as the mark 1a is mirror finished, it can be visually and clearly observed, and on the other hand, as the mark 1a is satin finished, it is hardly discriminated from its surroundings and can not be observed. By this process, the ejector pin 1a clearly observed is arranged by a terminal pin 3, and the ejector pin mark 1b is arranged by other terminal pins, whereby index marks can be indicated by only dents of elector pins. Therefore a semiconductor device can be sealed up with resin high in reliability without deteriorating resin in fluidity.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-sealed semiconductor device in which a semiconductor chip is covered with resin.

[0002]

2. Description of the Related Art In order to indicate the direction of a 1-pin terminal of a resin-sealed semiconductor device, it has been decided to put an index mark in a specific area on the package surface. There are cases where recesses or protrusions such as ejector pin marks formed on the package surface by using the ejector pin for releasing the molded product that has been stopped are used, but normally the ejector pin mark is the recess 1a in FIGS. 7 and 9. In order to use as the index mark, the ejector pin marks are used as index marks in combination with the taper cut 7 shown in FIGS. 7 and 8 and the notch 8 shown in FIG. A method of expressing intention is generally used.

[0003]

However, in the above method, the reverse side of the package is used, and in the case of the reverse type, notches and taper cuts must be made on the back side as well. There was a problem that the fluidity of the resin was deteriorated at the time of stopping, voids and unfilling were induced, and the reliability was significantly lowered.

Further, even in a thin package, there is a similar problem due to the inclusion of notches and taper cuts.

An object of the present invention is to solve the above conventional problems and to display an index mark without notches or taper cuts.

[0006]

SUMMARY OF THE INVENTION In order to solve the above problems, the present invention provides one ejector pin or one ejector pin so that an index mark can be shown only by a dent or a protrusion formed by a plurality of ejector pins or the like. It is characterized in that the ejector pin mark, which becomes an index mark by modifying a plurality of lines, is visually different from other ejector pin marks.

[0007]

With this structure, since the index mark can be displayed only by the ejector pin mark, the resin can be made highly reliable without impairing the fluidity of the resin when the resin is sealed.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view of a resin-sealed semiconductor device according to an embodiment of the present invention. In FIG. 1, 2 is a package surface (matte surface), 1a is an ejector pin mark (mirror surface), 1b is an ejector pin mark (matte surface), 3 is a 1-pin terminal, and 4 is another terminal. 2 is a plan view of FIG. 1, at this time, the ejector pin traces 1a and 1b both have depressions, but the ejector pin traces 1a are clearly visible and the ejector pin traces 1b are visible. The hollow is also a pear-skin, and is almost invisible as it is assimilated with the surrounding area. FIG. 3 shows the principle of the above phenomenon in the cross-sectional view of FIG. The bottom surface of the has a textured surface that is as rough as the surrounding surface. For this reason, the phenomenon as described above is used. By using this, if the ejector pin traces 1a clearly visible on the 1-pin terminal 3 side are arranged and the other ejector pin traces 1b are formed, only the recesses of the ejector pin traces are formed. The index can be displayed.

Although the above-mentioned embodiments have been described with the indentation, there is no problem even if this is a protrusion or a protrusion.

Next, the manufacturing apparatus for the recess will be described. FIG. 4 is a cross-sectional view of the recess manufacturing device. 5
a is an ejector pin (mirror surface), 5b is an ejector pin (matte surface), 9 is an upper die, and 10 is a lower die. 1
1 is a wire-bonded frame in which 12 semiconductor chips and 13 Au wires are connected by an upper mold 9 and a lower mold 10, and resin is poured into the 14 mold spaces formed. Ejector pins 5a, 5 to be sealed
b moves downward in the direction of A in order to release the molded product from the upper mold 9, but the bottom surface of the ejector pin 5a is mirror-finished so that the ejector pin 5b has an upper mold. Processing substantially the same as the surface of No. 9 In this case, satin processing is performed. If sealed in this state, the dent can be formed on the surface of the package. However, the ejector pin in this case is the same even if there is no ejector mechanism (a mechanism for releasing from the mold).

Second and third embodiments will be described in the same manner. In the above-mentioned embodiment, the package surface is satin-finished, but when the surface is mirror-finished as shown in FIG. 5, the recess 1b is satin-finished to show the 1-pin terminal 3, and the recess 1a is mirror-finished as an index mark. indicate. Further, as shown in FIG. 6, the shape of the indentation 6 serving as an index mark may be different from other shapes.

[0013]

According to the present invention, the index mark can be displayed only by the dents and protrusions such as ejector pin marks having different shapes, which is an inexpensive manufacturing apparatus and a resin-sealed semiconductor device excellent in moldability. Can be realized.

[Brief description of drawings]

FIG. 1 is a perspective view of a resin-sealed semiconductor device according to an embodiment of the present invention.

FIG. 2 is a plan view of FIG.

FIG. 3 is a sectional view of FIG.

FIG. 4 is a sectional structural view of a manufacturing apparatus according to an embodiment of the present invention.

FIG. 5 is a plan view of another embodiment.

FIG. 6 is a plan view of another embodiment.

FIG. 7 is a plan view of a conventional resin-encapsulated semiconductor device.

8 is a side view of FIG.

FIG. 9 is a plan view of a conventional resin-sealed semiconductor device.

[Explanation of symbols] 1a Ejector pin mark or dent (mirror finish) 1b Ejector pin mark or dent (matte finish) 2 Package surface (matte finish) 2a Package surface (mirror finish) 3 1-pin terminal 4 4 Pin other than 1 pin 5a Ejector pin (mirror finish) 5b Ejector pin (finished finish) 6 Ejector pin (different shape) 7 Tapered cut 8 Notch 9 Upper mold for sealing molding 10 Lower mold for sealing molding 11 Lead frame 12 Semiconductor chip 13 Au wire 14 Mold space (when the mold is closed)

Claims (2)

[Claims] 1. A resin-sealed semiconductor device having a plurality of depressions or protrusions on the entire surface, the depressions or protrusions being visually different. 2. A manufacturing apparatus for manufacturing the depression or the protrusion according to claim 1.