JPH0247855A - Semiconductor device - Google Patents

Abstract

PURPOSE:To facilitate the distinction of semiconductor devices and the confirmation of leads by forming a package of a plurality of the same circuits packaged in series in one resin mold and arranging marks corresponding to each circuit on the package to be cut by one or a plurality of circuits. CONSTITUTION:A semiconductor device comprises a package 1 in which, for example, the same six circuits are arranged in series and integrally molded. Cutting the package 1 at the broken lines provides up to six semiconductor devices. Marks 3 are formed at the parts, corresponding to each circuit, of the upper surface of the package 1. For example, when the package 1 is cut by one circuit, one mark 3 exists on the upper surface of each package, and when the package 1 is cut by two circuits, two marks 3 exist on the upper surface of each package. The number of the circuits can be confirmed by confirming the number of the marks 3 to enable the judgement of the sort thereof.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resin molded semiconductor device, and particularly to a semiconductor device having a multi-circuit configuration having a plurality of identical circuits.

[Prior Art] Conventionally, a semiconductor device with a multi-circuit configuration has a configuration in which a plurality of identical circuits are connected in series and integrally molded with resin, and by cutting this into one or more circuits as a unit, Each of the semiconductor devices is configured as a semiconductor device including one circuit or a plurality of circuits. In this case, conventional semiconductor devices do not provide marks or the like corresponding to each circuit, and the circuit configuration is determined based on the cut length of the package or the like.

[Problem to be solved by the invention]

In the conventional multi-circuit configuration semiconductor device described above, there are no external features, so after cutting one circuit or multiple circuits as a unit, it is necessary to stamp the cut semiconductor device. In order to identify each semiconductor device, it is extremely difficult to make a judgment based on the length of the semiconductor device and the number of leads, and requires skill to make the judgment. It is also difficult to confirm the position of the lead.

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor device that allows easy identification of the semiconductor device and confirmation of lead positions at a glance.

[Means to solve the problem]

In the semiconductor device of the present invention, a plurality of identical circuits are connected in series.
A plurality of marks corresponding to each circuit are arranged on a package of a semiconductor device in which a package is integrally formed with one molded resin and the package is cut into one or more circuits.

[Function] With the above configuration, even when the package is cut, marks corresponding to each circuit can be confirmed on the package surface, and the number of circuits included in the cut semiconductor device can be confirmed to identify the semiconductor device and lead. It becomes possible to easily confirm the following.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 shows an embodiment of the present invention, and FIG. 1(a)
is a plan view, and FIG. 1(b) is a side view thereof. This semiconductor device has a package 1 in which six identical circuits are arranged in series and integrally molded with resin.
A plurality of leads 2 corresponding to each circuit protrude from the side. In this example, a maximum of six semiconductor devices can be obtained by cutting the package 1 at the positions indicated by broken lines in the figure. A mark 3 is formed on the top surface of the package 1 at a position corresponding to one circuit. Here, the mark 3 is configured so that a part of the upper surface of the package 1 is recessed so that it can be distinguished from other surfaces.

The mark 3 can also be formed by forming the mark 3 flush with the top surface of the package 1 and then making the surface roughness of the mark 3 different from that of other parts.

For example, the entire surface of the package 1 may be mirror-finished, and the surface of the mark 3 may be formed roughly. Of course, the surface state may be reversed.

According to this configuration, when the package 1 is cut into one circuit unit, for example, as shown in FIG. 2(a),
One mark 3 is present on the top surface of the package of the semiconductor device 11. Furthermore, when the package 1 is cut into two circuits, the semiconductor device 1 is cut as shown in FIG.
There are two landmarks on the top of the 12 packages. Therefore, by checking the number of marks 3 on a semiconductor device after it has been cut, the number of circuits included in the semiconductor device can be immediately confirmed, and the type of semiconductor device can be quickly determined. can.

Furthermore, it is also possible to confirm the positions of the plurality of leads 2 by the positions of the marks 3.

Note that in order to identify the semiconductor device and confirm the lead position using the mark 3, it is preferable that the mark 3 is formed with a size of 174 mm or less of the package of the semiconductor device including one circuit. Further, the mark 3 may be provided on the back side of the package.

〔Effect of the invention〕

As explained above, in the present invention, a plurality of marks corresponding to each circuit are arranged on the package of a semiconductor device, so even when the package is cut, the marks corresponding to each circuit can be confirmed on the package surface. This has the advantage that it is possible to easily identify the semiconductor device by checking the number of circuits included in the cut semiconductor device and to check the lead positions.

[Brief explanation of the drawing]

FIG. 1 shows an embodiment of the present invention, and FIG. 1(a)
is a plan view, FIG. 1(b) is a side view, FIG. 2(a) is a plan view of the semiconductor device cut into one circuit unit, and FIG.
b) is a plan view of the semiconductor device cut into two circuit units; 1...Package, 2...Lead, 3...Mark,
11゜12...Semiconductor device. Ward C

Claims (1)

[Claims] 1. Multiple identical circuits are integrally formed in one molded resin package, and this package is
1. A semiconductor device that is cut into one or more circuits as a unit, characterized in that a plurality of marks corresponding to each circuit are arranged on the package.