JPH066061A - Electrical element heat dissipating device - Google Patents

Abstract

PURPOSE:To provide an electrical element heat dissipating device where a transistor can be easily positioned, a terminal cutting process can be reduced, a printed board can be kept free from stress, and transistors can be easily mounted without using a jig. CONSTITUTION:A fixing pawl 5 fixed to a board and a positioning catch pawl 6 engaged with a mounting hole 8a of a transistor 7 are provided to a transistor mounting piece 1 of an electric element heat dissipating device, a staggered terminal hole 8 is bored in a printed board 15 to enable the transistor 7 to be biased to the transistor mounting piece 1, a heat sink 11 is equipped with a machine screw 14 to bring the transistor 7 into close contact with the sink 11, and furthermore machine screws 13 are provided to the transistor mounting piece 1 to mount the transistor mounting piece 1 and the heat sink 11 on a casing.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric element heat dissipation device such as an electric device.

[0002]

2. Description of the Related Art A conventional electric element heat dissipation device will be described below.

FIG. 3 is a perspective view of an electric device provided with an electric element heat dissipation device, and FIG. 4 is a sectional view of the same. In the figure, 1 is a transistor mounting bracket, 7 is an electric element (transistor), 1
Reference numeral 1 is a heat sink, and 15 is a printed circuit board.

The transistor mounting member 1 has a U-shaped cross section, brackets 2 having screw holes 2a are formed on the upper surfaces of both sides thereof, and guide claws 3 are formed on both sides of the bracket 2. Further, fixing claws 5 are formed on both lower ends of the transistor mounting bracket 1, and a plurality of brackets 4 having screw holes 4a are formed on the front surface.

A bracket 8 having a mounting hole 8a is projectingly provided on the upper end of the transistor 7, and a plurality of terminals 9 are provided on the lower end, and a terminal stopper 9a is formed on the terminal 9.

The heat sink 11 has an inverted L-shaped cross section,
The flange 12 at the upper end is formed with a fitting hole 12a for fitting with the guide claw 3 of the transistor mounting bracket 1 and a mounting hole 12b corresponding to the screw hole 2a of the transistor mounting bracket 1. 1 screw hole 4
A mounting hole 12c corresponding to a is formed.

The electric element heat dissipating device 10 includes the transistor mounting bracket 1, the transistor 7, the heat sink 11, and the like.
The following is a process of mounting the electric element radiator 10.

1. The transistor mounting member 1 is fixed to the printed circuit board 15 by the fixing claw 5.

2. The terminal 9 of the transistor 7 is inserted into the printed board 15 and the vertical position of the transistor 7 is determined by using the terminal stopper 9a.

3. The fitting hole 12a of the heat sink 11 is aligned with the guide claw 3 of the transistor mounting bracket 1, and the heat sink 11 is mounted.

4. Each transistor 7 is fixed to the bracket 4 of the transistor mounting bracket 1 with a screw 14.

5. Solder 19 of the terminal 9 of the transistor 7 of the above assembly is performed by an automatic soldering operation.

6. In order to prevent contact with the lower case 17, the terminal 9 of the transistor 7 is cut.

7. The above-mentioned assembly is attached to the lower case 17, the upper case 18 is attached, and fixed with the screw 13.

[0015]

However, since the stopper 9a of the terminal 9 is used when the terminal 9 of the transistor 7 is inserted into the printed circuit board 15 in the above-mentioned conventional work process, the printed circuit board 15 is not used. The length of the protruding terminal 9 is long, and it is necessary to cut the terminal 9 in a later step in order to prevent contact with the lower case 17.

In addition, the screw is always directed vertically in the automation line, and the screw is attached by turning the screw from above. The screw 14 is fastened to the transistor mounting bracket 1 of the transistor 7 in parallel with the printed circuit board 15. In this case, it is necessary to stand the printed circuit board 15 vertically and hold the transistor mounting bracket 1 horizontally. However, if it is attempted to stop the screw 14 in this state, bending stress is applied to the transistor 7, the transistor mounting bracket 1, and the printed circuit board 15, and the transistor 7 may be tilted. In the worst case, the printed circuit board 15 may be broken. It may happen.

In order to prevent this, as shown in FIG.
Between the base of the automation line and the transistor mounting bracket 1,
It is necessary to arrange a jig 20 having a predetermined shape for supporting the transistor mounting member 1. However, since various electric elements and the like other than the transistor 7 are arranged at the position of C on the printed circuit board 15, it is difficult to support the printed circuit board 15 and the transistor mounting bracket 1 by the jig 20. Had.

The present invention solves the above-mentioned conventional problems. A first object of the present invention is to prevent the transistor from collapsing and to facilitate the positioning of the transistor to reduce the step of terminal cutting. An object of the present invention is to provide an electric element heat dissipating device.

The second object of the present invention is to:
An object of the present invention is to provide an electric element heat dissipation device that prevents stress on a printed circuit board or the like and can easily attach a transistor without using a jig.

[0020]

In order to achieve this first object, in the electric element heat dissipation device of the present invention, a heat sink and an electric element arranged on a substrate and having a mounting hole are brought into contact with the heat sink. In the electric element heat dissipating device including contact means, the contact means comprises a connecting means for connecting to a substrate, a mounting member including positioning means for the electric element inserted into a mounting hole of the electric element, and the electric element, Fixing means for fixing the heat sink to the mounting metal fitting so that the electric element is closely attached to the heat sink and the terminal hole of the electric element formed in the board so as to be biased to the mounting metal fitting side. It has and.

In order to achieve the second object, the mounting member of the electric element heat dissipation device of the present invention has a structure provided with mounting means for mounting the mounting member and the heat sink to the casing of the electric device. ing.

[0022]

With this structure, by inserting the terminals of the electric element into the peg-shaped terminal holes of the substrate, the pressing force of the electric element with respect to the fitting can be obtained, and the electric element can be engaged with the positioning means of the fitting. Since the electric element can be regulated in the height direction, it is possible to prevent the electric element from collapsing and it is not necessary to disconnect the terminal.

Further, since the heat sink can be attached to the casing by the fixing means, the heat sink can be fixed to the fitting at the final stage, and stress is not generated on the printed circuit board or the like without using a jig.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. The same parts as those shown in the conventional example are designated by the same reference numerals.

FIG. 1 is a perspective view of an electric device equipped with an electric element heat dissipation device, and FIG. 2 is a sectional view of the same. In the figure, 1 is a transistor mounting bracket, 7 is an electric element (transistor), 1
Reference numeral 1 is a heat sink, and 15 is a printed circuit board.

The contact means for contacting the transistor 7 with the heat sink 11 is a transistor mounting bracket 1 and a terminal hole 16.
And fixing means.

The transistor mounting bracket 1 has a U-shaped cross section, and a bracket 2 having a screw hole 2a is formed on the upper end thereof, and a guide claw 3 is provided on one side of the bracket 2.
However, an L-shaped locking claw 3a is formed on the other side.
Further, a fixing claw 5 as a connecting means is formed at the lower end of the transistor mounting member 1, and a bracket 4 having a screw hole 4a as a fixing means and a hooking claw 6 as a plurality of positioning means are formed on the front surface. Has been done.

A bracket 8 having a mounting hole 8a is projectingly provided at the upper end of the transistor 7, and a plurality of terminals 9 are provided at the lower end. The printed circuit board 15 is provided with a puddle-shaped terminal hole 16 into which the terminal 9 of the transistor 7 is inserted.

The heat sink 11 has an inverted L-shaped cross section,
The bracket 12 at the upper end is formed with a fitting hole 12a for fitting with the guide claw 3 of the transistor mounting bracket 1 and a mounting hole 12b corresponding to the screw hole 2a. Bracket 4
The mounting hole 12c corresponding to the screw hole 4a is formed. Reference numeral 14 is a screw.

The electric element heat dissipating device 10 composed of the above parts and the like is assembled by the following working steps in the automation line.

1. The transistor mounting member 1 is fixed to the printed circuit board 15 by the fixing claw 5.

2. The terminal 9 of the transistor 7 is inserted into the printed board 15. At that time, the central terminal 9b is inserted in alignment with the peg hole 16a of the printed circuit board 15, and the hooking claw 6 of the transistor mounting member 1 is engaged with the mounting hole 8a of the transistor 7. By bending the terminals in a zigzag manner, the transistor 7 is biased toward the mounting bracket 1 side, so that the transistor 7 is positioned.

3. Solder 19 of the terminal 9 of the transistor 7 of the above assembly is performed by automatic soldering work.

4. The fitting hole 12a of the heat sink 11 is fitted into the guide claw 3 of the transistor mounting member 1, and the heat sink 11 is temporarily fixed by the locking claw 3a.

5. After the above assembly is attached to the lower case 17, the upper case 18 is placed, and the screw 13 is screwed into the screw hole 2a through the hole formed in the upper case 18 and the attachment hole 12b.
To fix.

6. The assembled electric device is set up, and the heat sink 11 is fixed to the fitting 1 by using the screw 14.

As described above, by inserting the central terminal 9a of the transistor 7 into the peg hole 16a of the printed circuit board 15 and engaging the hook 6 of the transistor mounting bracket 1 with the mounting hole 8a of the transistor 7. Since the transistor 7 can be temporarily fixed and its mounting height can be freely set, it is not necessary to disconnect the terminal 9.

Further, the heat sink 1 using the screws 14
1 and the transistor mounting bracket 1 may be fixed at the final stage after the lower casing 17 and the upper casing 18 of the electric device are attached, so that the electric device can be vertically installed and supported by the casings 17 and 18 for easy mounting. The screw 14 can be fastened, and when the screw 14 is fastened, the printed circuit board 15, the transistor 7, etc. are not overloaded.

As described above, according to this embodiment, the transistor mounting member 1 is provided with the fixing claw 5 for the substrate and the hooking claw 6 for positioning which engages with the mounting hole 8a of the transistor 7, and the printed circuit board 15 is provided. Is provided with a puddle-shaped terminal hole 16 for biasing the transistor 7 toward the mounting metal fitting 1 side, and is provided with a screw 14 for bringing the transistor 7 into close contact with the heat sink 11.
By providing the screw 13 for attaching the heat sink 11 to the casing 18, the terminal 9a of the transistor 7 is inserted into the peg-shaped terminal hole 16a of the printed circuit board 15 to obtain the pressing force of the transistor 7 against the transistor mounting bracket 1. At the same time, by engaging the transistor 7 with the hooking claw 6 of the transistor mounting member 1, the height of the transistor 7 can be regulated.

Therefore, due to this pressing force, the transistor 7 is fixed to the transistor mounting bracket 1 without mounting the heat sink 11, and before the heat sink 11 is fixed to the transistor mounting bracket 1 by the screw 14, the transistor 7 is fixed. Can be soldered 19
Moreover, it is not necessary to cut the terminal 9 of the transistor 7.
Further, the electric device can be vertically installed and supported by the casings 17 and 18, and the screw 14 can be easily stopped, and no stress is generated.

In this embodiment, the heat sink 11 and the transistor mounting bracket 1 are attached to the casing 18 with one screw 13, but two screws may be used as in the conventional structure. .

[0042]

As described above, the electric element heat dissipation device of the present invention is an electric element heat dissipation device comprising a heat sink and contact means for contacting an electric element arranged on a substrate and having an attachment hole with the heat sink. The contact means is a connecting means for connecting to the substrate, and a mounting member made up of positioning means for positioning the electric element inserted into the mounting hole of the electric element, and the electric element is biased toward the mounting metal side. The terminal holes of the electric element formed in the board in a puddle shape, and the electric element so as to be in close contact with the heat sink,
By including the fixing means for fixing the heat sink to the fitting, the spring force of the terminal can be used to obtain a pressing force against the fitting, so that the electric element can be prevented from collapsing and the electric element can be prevented. Since the mounting height of can be set freely, there is no need to cut the terminals.

Further, since the mounting metal fitting is provided with mounting means for mounting the mounting metal fitting and the heat sink to the casing of the electric device, the work of fixing the heat sink to the mounting metal fitting can be performed after mounting the casing. Therefore, even if the electric device is placed vertically, there is no stress on the surface of the board, soldering can be easily performed, and no jig is required.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of an electric element radiator according to an exemplary embodiment of the present invention.

FIG. 2 is a sectional view taken along the line AA of FIG.

FIG. 3 is an exploded perspective view of a conventional electric element radiator.

4 is a cross-sectional view taken along the line BB of FIG.

FIG. 5 is a schematic assembly procedure diagram of a conventional electric element heat dissipation device using a jig.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Transistor mounting bracket 4 Bracket (fixing means) 5 Fixing claw (connecting means) 6 Hooking claw (positioning means) 7 Transistor (electric element) 8 Mounting hole 9 Terminal 10 Electric element heat dissipation device 13 Screw (mounting means) 14 Screw ( Fixing means) 16 Terminal hole 18 Casing

Claims (2)

[Claims] 1. An electric element radiator comprising a heat sink and a contact means for bringing an electric element arranged on a substrate and having a mounting hole into contact with the heat sink, wherein the contact means comprises a connecting means for connecting to the substrate, and A mounting bracket consisting of an electric element positioning means to be inserted into a mounting hole of the electric element, and the electric element is biased toward the mounting bracket side,
An electric device comprising: a board-like terminal hole of the electric element formed in a puddle shape; and a fixing means for fixing the heat sink to the mounting metal fitting so that the electric element is in close contact with the heat sink. Element heat dissipation device. 2. The electric element heat dissipation device according to claim 1, wherein the mounting member further comprises mounting means for mounting the mounting member and the heat sink to a casing of the electric device.