JP2002100715A - Radiating member, and attaching structure of the radiating member to electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate attachment work of a radiating member to a board or the attaching work of an electronic component to the radiating member. SOLUTION: In a radiating member (X) fastened to a board 5 by utilizing through-holes 50, 51 provided in the board 5, there are provided first and second leg portions 10, 20 of their being inserted at least partially into the through-holes 50, 51, and they are extensible elastically to each other so as to hold the radiating member X to the board 5, by their elastic restoring forces acting on each other. Also, in the structure where the radiating member X sandwiches a mounted electronic component 4 on it between its two radiating sections 1, 3 which are provided opposite to each other, at least one of the two radiating sections 1, 3 has such a protruding portion (recessed portion) 42 as to be engaged with a recessed portion (protruding section) 42 provided in the electronic component 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiating member for releasing heat from an object to the outside, for example, a heat radiating member which holds an electronic component as an object and is supported by a substrate together with the electronic component. The present invention also relates to a mounting structure of the heat radiating member to the electronic component.

[0002]

2. Description of the Related Art Conventionally, an electronic component mounted on a circuit board has been used in order to suppress the heat generated when the electronic component is driven to the outside and to prevent the electronic component from being damaged by the heat. Attachment of a heat radiation member is performed. The heat dissipating members used in such a case include those shown in FIGS.

The heat radiating member 6 shown in these figures has a base 6
A plurality of (for example, four) radiating fins 61 to 64 are formed to protrude forward from zero. In the heat radiating member 6, the electronic component 7 is held between the two heat radiating fins 62 and 63 located at the center such that the external leads 70 protrude below the heat radiating member 6. Each external lead 70
Are fixed by solder or the like in a state where they are inserted into the through holes 80 provided in the circuit board 8, whereby the electronic components 7 are
Is mounted on the circuit board 8.

The base 60 of the heat dissipating member 6 is opened forward in a region between the heat dissipating fins 61 (64) located at the end and the heat dissipating fins 62 (63) adjacent thereto, and extends vertically. An extended cylindrical hole 65 (66) is provided. The pins 67 and 68 are held in the holes 65 and 66 so that a part thereof protrudes downward. Hole 65,
The retention of the pins 67, 68 with respect to the
Is inserted into the holes 65 and 66 together with the pins 67 and 68 using a predetermined jig or tool.
This is performed by caulking 5, 66. The pins 67 and 68 held by the heat radiating member 6 connect the electronic component 7 to the circuit board 8.
When mounted on the circuit board 8, the heat radiating member 6 is also mounted on the circuit board 8 by being inserted through the through holes 81 and 82 of the circuit board 8 and fixing it with solder or the like.

[0005]

However, the above-described conventional heat radiating member 6 has the following disadvantages.

In order to mount the heat radiating member 6 on the circuit board 8, it is necessary to fix the pins 67 and 68 to the heat radiating member 6, which is disadvantageous in terms of work efficiency. A special jig or tool is required.

In order to fix the external leads 70 of the electronic component 7 and the pins 67 and 68 of the heat radiating member 6 to the circuit board 8, solder is usually used as described above. For example, the circuit board 8 on which the electronic components 7 and the heat radiating member 6 are placed is applied through a solder bath. At this time, the heat radiating member 6 may float from the circuit board 8 due to the buoyancy of the solder.

Further, if the lower end of the heat radiating member 6 contacts the circuit board 8 as shown in FIG. 12 or if the distance between the lower end of the heat radiating member 6 and the circuit board 8 is small, the following problem occurs. obtain. First, an electronic component 7 and a heat radiating member 6 are provided on the circuit board 8 in order to protect the wiring and the like formed thereon.
The insulating resin may be potted after mounting, but if the distance between the potting resin and the heat radiating member 6 is small, the potting resin may deteriorate with time due to heat from the heat radiating member 6. . Secondly, since the heat radiating member 6 is formed larger than the electronic component 7 with a metal having high thermal conductivity in order to secure a large heat radiation amount,
It is difficult to provide wiring on the mounting portion of the heat radiating member 6 or mount another electronic component, and the mounting portion of the heat radiating member 6 becomes a dead space, and the space efficiency of the circuit board 8 deteriorates. There is.

The electronic component 7 includes radiation fins 62 and 6.
3, it is difficult to position the electronic component 7. For example, in order to secure the holding of the electronic component 7, it is sufficient to increase the holding force. In this case, it becomes difficult to mount the electronic component 7 and the positioning becomes difficult, while the holding force is reduced. Then, even if the electronic component 7 is once mounted, a displacement may occur thereafter. If the displacement of the electronic component 7 occurs in this way, the electronic component 7
It is difficult to insert both the external lead 70 and the pins 67 and 68 of the heat radiation member 6 into the through holes 81 and 82 of the circuit board 8 at the same time, and the workability is further deteriorated.

The present invention has been conceived in view of the above circumstances, and facilitates the work of mounting the heat radiating member to the substrate or mounting the heat radiating member to the electronic component, and also reduces the space of the substrate. It is an object of the present invention to improve the efficiency and to make the properties of the potting resin or the like effective for a long period of time.

[0011]

DISCLOSURE OF THE INVENTION In order to solve the above problems, the present invention employs the following technical means.

That is, according to a first aspect of the present invention, there is provided a heat radiating member fixed to a substrate by using a through hole provided in the substrate, wherein at least a part of the heat radiating member is inserted through the through hole. A first leg portion and a second leg portion, and a space between the first leg portion and the second leg portion can be elastically expanded and contracted, and an elastic restoring force acting between these leg portions is provided. Thus, there is provided a heat radiating member configured to be held on the substrate.

In the heat radiating member having the above structure, the first and second heat radiating members are provided.
After applying a force to the legs in a direction to reduce the distance between them and inserting each leg into the through hole, if the force acting on each leg is removed, the heat radiating member will be released by the elastic restoring force. Fixed to the substrate. As described above, since the heat radiating member of the present invention does not need to fix pins as in the related art when fixing the heat radiating member to the substrate, workability is significantly simplified.
Further, since the work of expanding and contracting the distance between the legs and inserting the legs into the through holes is extremely simple, the heat radiation member of the present invention can be easily supported on the substrate.

In the present invention, there is no particular limitation as long as the elastic restoring force can act between the first and second legs. The following configuration is preferably adopted. That is, in a preferred embodiment, the first leg and the second leg are provided at one end of the first radiator and the second radiator, respectively. (2) The other ends of the heat radiating portions are connected to each other via a third heat radiating portion having a substantially U-shaped cross section projecting toward one end of the heat radiating portions, whereby the heat radiating member is formed as a whole. And has a substantially M-shaped cross section.

In a preferred embodiment, the first
One end of at least one of the leg and the second leg is provided with a hook bent at an acute angle.

In such a configuration, if the leg is inserted into the through-hole and the hook is projected from the substrate, the hook is locked to the peripheral edge of the through-hole so that the hook is prevented from coming off. The fixing state of the heat radiation member to the substrate can be stabilized. Then, even if the heat-dissipating member is fixed to the solder bath and passes through the substrate, the heat-dissipating member does not rise from the substrate.

The bending angle of the hook portion may be smaller than 90 degrees, but is preferably set to, for example, about 30 to 60 degrees.

The heat dissipating member of the present invention is used not only for releasing heat from a circuit board to the outside but also for mounting it on an electronic component and discharging the heat from the electronic component to the outside. Is also included. In the heat radiation member used for the latter purpose, for example, an electronic component supported by the substrate is mounted between the first heat radiation part and the third heat radiation part.

In a preferred embodiment, the first
An engagement means is provided for engaging one of the heat radiator and the third heat radiator with the electronic component.

In this configuration, when the heat radiating member is mounted on the electronic component, the electronic component is interposed between the first and third heat radiating portions, and the electronic component and the first or third heat radiating portion are engaged by the engaging means. May be engaged. If the space between them is engaged by the engaging means, the mounting position of the electronic component is uniquely determined, and the mounting state of the electronic component is stabilized.
As described above, in the heat radiating member having the above configuration, the electronic component can be accurately positioned and a stable mounting state can be easily achieved.

The engaging means can be constituted by, for example, a concave portion or a convex portion provided on the electronic component and a convex portion or a concave portion provided on the first or third heat radiating portion.
The engagement means may include a pair of guide portions provided at one of the first and third heat radiating portions at an interval corresponding to the width of the electronic component while extending toward the other heat radiating portion. The electronic component may be configured to be held between them.

In a preferred embodiment, the first
One of the heat radiating portion and the third heat radiating portion is provided with a leaf spring portion that presses the electronic component toward the other side.

In this configuration, if the electronic component is interposed between the first and third heat radiating portions, the electronic component is fixed by the urging force of the leaf spring portion. It can be more stabilized.

In a preferred embodiment, the first
A lock mechanism is provided for connecting between the heat radiating portion and the third heat radiating portion.

In this configuration, when the electronic components are interposed between the first and third heat radiating portions and are connected to each other by the lock mechanism, the first and third radiators are kept at a constant distance.
Since the electronic components are fixed between the heat radiating portions, the mounting state of the electronic components can be further stabilized.

In a preferred embodiment, the first
The leg portion and the second leg portion have a narrower width at the distal end side than the width of the through hole and a wider width at the base end side than the width of the through hole.

In this configuration, if each leg is inserted into the through hole, only the narrow portion is inserted into the through hole, and the space between the narrow portion and the wide portion (step) is the peripheral edge of the through hole. It will be locked to the part. That is, when the heat radiating member is fixed to the substrate, the height of each heat radiating portion is defined by the length of the wide portion of the leg. For this reason, by appropriately setting the length of the wide portion of each leg, each heat radiating portion can be in a state of floating at an appropriate height from the substrate. In this state, it is possible to prevent the potting resin applied to the substrate from coming into contact with the heat radiating portion, thereby reducing the amount of heat transmitted from the heat radiating member to the potting resin and deteriorating the potting resin over time. Can be suppressed. In addition, if the heat radiating portion is floating from the substrate, wiring can be formed in a region immediately below the heat radiating portion on the substrate, and electronic components other than the electronic components held by the heat radiating member can be mounted. Can be improved.

According to a second aspect of the present invention, a heat radiating member having two heat radiating portions disposed to face each other is provided.
A structure in which an electronic component is sandwiched between the heat radiating portions to be mounted on the electronic component, wherein the convex portion or the concave portion provided on at least one of the two heat radiating portions and the electronic component are provided. A mounting structure of a heat radiating member to an electronic component, wherein the concave portion or the convex portion is engaged with the electronic component.

In this configuration, the heat radiating portion and the electronic component are engaged by the convex portion (concave portion) provided on the heat radiating portion and the concave portion (convex portion) provided on the electronic component, so that the electronic component is accurately positioned. It is mounted in a stable state. In addition, the work of mounting the heat radiating member to the electronic component can be performed simply by interposing the electronic component between the heat radiating portions and engaging the concave portion and the convex portion. You.

Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

[0031]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be specifically described below with reference to the drawings. FIG. 1 is a cross-sectional view showing a state in which a heat radiating member according to the present invention is mounted on an electronic component and is supported on a substrate. FIGS. 2 and 3 are front perspective and rear side perspective views of the heat radiating member. 5 is a cross-sectional view corresponding to a portion along the line IV-IV and VV of FIG. 2, and FIG. 6 is an overall perspective view of an electronic component to which the heat radiation member shown in FIGS. 2 and 3 is attached. .

As shown in FIGS. 1 to 3, the heat radiating member X of the embodiment has two first legs 1 at its lower end (one end).
0 is provided on the first heat radiating section 1 and 1 is provided on the lower end (one end).
The second heat radiating portion 2 provided with the two second legs 20 is connected to the upper end portions (other end portions) of the heat radiating portions 1 and 2 and the lower end portions of the first and second heat radiating portions 1 and 2 are connected. And a third heat radiating portion 3 having a substantially U-shaped cross section protruding toward the side.
It has a generally M-shaped cross section as a whole.

As shown in FIGS. 1 and 2, the first heat radiating portion 1 is provided with the first two radiating portions from the lower ends at both side edges of the main body 11 having a plate shape.
A leg 10 is provided to protrude downward. Each leg 10
Is a first substrate provided on the substrate 5 supporting the heat radiating member X.
The distal end 10A side is narrower than the through hole 50 and the base end 10B side is wider than the first through hole 50, and a step 10b is formed between these portions. Each first
The distal end portion 10A of the leg portion 10 is bent outward by about 90 degrees to form a locking portion 10a. The locking portion 10a locks the peripheral portion of the first through hole 50 in a state where the distal end portion 10A of the first leg portion 10 is inserted into the first through hole 50 as well shown in FIG. Things.

From the portion adjacent to each leg 10 at the lower end of the main body 11, a hook portion 12 extending horizontally toward the third heat radiating portion 3 is provided as shown in FIGS.
One is provided. The body 11 further includes a portion at a position from the lower end of the central portion, as best seen in FIGS.
A leaf spring portion 13 whose lower end is a free end is provided. The leaf spring portion 13 is bent at a portion from the tip and has a V-shape in cross section, and holds the electronic component 4 sandwiched between the first and third heat radiating portions 1 and 3 as described later. This is for pressing against the third heat radiating section 3.

As shown in FIGS. 1 and 3, the above-mentioned second leg 20 extends downward from the center of the lower end of the main body 21 in a plate-like shape. It is provided so as to protrude. The second leg 20 has a narrower width at the distal end 20A side than the second through hole 51 provided in the substrate 5 on which the heat radiating member X is supported, and a wider width at the base end 20B side than the second through hole 51. It has a width, and a step portion 20b is formed between these portions. Tip 20A of second leg 20
Is bent outward at an acute angle, for example, about 30 to 60 degrees, to form a hook portion 20a. This hook portion 20a locks the peripheral portion of the second through-hole 51 when the distal end portion 20A of the second leg portion 20 is inserted into the second through-hole 51, as is clearly shown in FIG. It is.

As shown in FIGS. 1 and 5, the third heat radiating portion 3 has a substantially U-shaped cross section in which a pair of upright portions 31 and 32 project upward from both edges of the base 30. As shown in FIG. have. The base 30 is provided with two through-holes 34, as best seen in FIGS. These through holes 34 are provided at the tip 12 of the hook 12 of the first heat radiating section 1.
a is provided at a portion corresponding to the distal end portion 12a so that a can be locked. That is, the lock mechanism is constituted by the hook 12 and the through hole 34. In addition, one of the upright portions 31 is provided with a convex portion 33 at a portion facing the plate spring portion 13 of the first heat radiating portion 1.

The heat radiating member X having such a configuration is formed integrally by subjecting a metal plate such as a steel plate to pressing and bending. Therefore,
The first and second heat radiating portions 1 and 2 and thus the first and second radiating portions
The space between the legs 10, 20 is elastically expandable and contractable,
When the distance between them is smaller than in the natural state, an elastic restoring force acts in a direction to increase the distance between them. The magnitude of the elastic restoring force, that is, the radiation member X
As shown in FIGS. 2 and 3, the spring property of itself is a boundary portion between the first heat radiating portion 1 and the third heat radiating portion 3 and a boundary portion between the second heat radiating portion 2 and the third heat radiating portion 3. It is adjusted by forming slits S of an appropriate size and number. The heat dissipating member X is mounted on the electronic component 4 by sandwiching the electronic component 4 between the first and third heat dissipating portions 1 and 3, and radiates heat generated in the electronic component 4 to the outside. I do.

As the electronic component 4 to which the heat radiating member X is mounted, for example, an electronic element (not shown) such as a semiconductor chip is sealed in a resin package 40 as shown in FIG. A plurality of (three in the present embodiment) external leads 41 are formed so as to protrude.

The resin package 40 has a concave portion 42 which engages with the convex portion 33 provided on the third heat radiating portion 3. That is, the projection 33 of the third heat radiating section 3 and the recess 42 of the electronic component 4 constitute an engagement means. The engaging means may be configured by providing a concave portion on the third heat radiating portion 3 and providing a convex portion on the electronic component 4,
Further, a pair of guide portions is provided extending from one of the first or third heat radiating portions 1 and 3 toward the other heat radiating portion and spaced by an interval corresponding to the width of the electronic component 4. An engagement means configured to hold an electronic component between them may be employed.

The external lead 41 has a narrower width at the distal end 41A side than the third through hole 52 (see FIG. 1) provided on the substrate 5 and a third through hole at the base end 41B side (resin package side). The width is larger than 52, and a step portion 43 is formed between these portions. Such an external lead 41
Are electrically connected to the electronic elements in the resin package 40 although not shown in the drawing.

Next, with reference to FIGS. 7 to 9, the operation of attaching the heat radiating member X to the electronic component 4 and the operation of supporting the heat radiating member X on the substrate 5 will be described.

First, as shown in FIG.
The electronic components 4 are inserted between the first heat radiating portion 1 and the third heat radiating portion 3 while the second and the third heat radiating portions 3 are in the release state. At this time, the surface on which the concave portion 42 of the resin package 40 is formed is formed so that the external lead 41 projects downward from below.
The electronic component 4 is inserted so as to face the heat radiating section 3.

In the process of inserting the electronic component 4, the resin package 40 comes into contact with the leaf spring 13, and the leaf spring 13 is pushed outward. At this time, since the lock mechanisms 12 and 34 are in the released state, the first
The heat radiating portion 1 is also slightly extended outward.

When the electronic component 4 is further inserted from this state, as shown in FIG.
And the convex part 33 of the third heat radiating part 3 are engaged. And the first
The attachment of the heat radiating member X to the electronic component 4 is completed by engaging the distal end portion 12a of the hook portion 12 of the heat radiating portion 1 with the through hole 34 of the third heat radiating portion 3 to lock the lock mechanisms 12, 34. I do.

When the tip portion 12a of the hook 12 is engaged with the through hole 34, the first heat radiating portion 1 is drawn toward the third heat radiating portion 3 together with the leaf spring portion 13. Therefore, when the lock mechanisms 12 and 34 are locked, the electronic component 4 is sandwiched between the first heat radiating unit 1 and the third heat radiating unit 3. Then, since the leaf spring portion 13 remains in contact with the resin package 40 of the electronic component 4, the electronic component 4 is pressed against the third heat radiating portion 3 by the leaf spring portion 13. As described above, the electronic component 4 is sandwiched between the first and third heat radiating portions 1 and 3 whose distance is kept constant by the lock mechanisms 12 and 34, and furthermore, the plate spring portion 13 causes the third heat radiating portion 3 side. Therefore, the state inserted between the first and third heat radiating portions 1 and 3 is appropriately maintained. Then, the concave portion 42 of the electronic component 4
And the projection 33 of the third heat radiating portion 3 are engaged with each other, so that the positioning of the electronic component 4 is appropriately performed.

The electronic component 4 on which the heat radiating member X is mounted is mounted on the substrate 5 together with the heat radiating member X as shown in FIG. In this mounting operation, the external leads 41 of the electronic component 4 and the first and second legs 10 and 20 of the heat radiation member X are
It is performed by inserting them into the first to third through holes 50 to 52 corresponding thereto.

Here, the distance in the natural state between the first and second legs 10 and 20 is set so that an elastic restoring force can be appropriately applied between these legs 10 and 20 when mounted on the board 5. , Are set larger than the distance between the first and second through holes 50 and 51. For this reason, each of the through holes 50 to
The insertion of the external lead 41 and each of the legs 10 and 20 into the second leg 52 is performed in a state where the distance between the first and second legs 10 and 20 is reduced. At this time, the tip 2 of the second leg 20
Since the hook portion 20a bent at an acute angle at 0A is provided, the insertion of the second leg portion 20 into the second through hole 51 can be easily performed as expected from FIG. The external leads 41 and the legs 10 and 20 have stepped portions 43 and 10 respectively.
b, 20b, these steps 43,
10b, 20b, the external lead 41 and each leg 1
An insertion depth of 0,20 is defined. That is, the distal ends 41A, 10A,
Only 20A is inserted into each through hole 50-52.

When the force acting on each of the legs 10, 20 is released, the distance between the first and second legs 10, 20 is increased. However, since this distance is smaller than the distance in the natural state, An elastic restoring force acts between the legs 10, 20.
Due to this elastic restoring force, the heat radiating member X is fixed to the substrate 5 and brought into the state shown in FIG. At this time, the first leg 10 is provided with the locking portion 10a, and the second leg 20 is provided with the hook portion 20a.
0a and 20a are locked to the peripheral portions of the through holes 50 and 51,
The heat radiating member X is prevented from falling off.

As described above, the insertion depth of the external lead 41 and each of the legs 10 and 20 into the through holes 50 to 52 is defined. As a result, the first and second heat radiating portions 1 and 2 are defined. The main bodies 11, 21 and the third heat radiating section 3 are shown in FIG.
The external leads 41 and each leg 1
The bases 0, 20 are brought up from the substrate 5 by a height corresponding to the distance between the base ends 41B, 10B, 20B. Therefore, even if the potting resin is applied to the substrate 5 later, the potting resin and the heat dissipating members X (especially, the main bodies 11 and 21 of the first and second heat dissipating portions 1 and 2 and the third heat dissipating portion 3) are formed. Contact is avoided as much as possible, and deterioration of the potting resin due to heat from the heat radiating member X is suppressed. Further, as a result of the main bodies 11 and 21 of the first and second heat radiating portions 1 and 2 and the third heat radiating portion 3 being lifted from the substrate 5, wiring is formed in a region below these portions on the substrate 5, or other electronic components are formed. Since the components can be mounted, the space efficiency of the substrate 5 is improved.

After the heat radiating member X and the electronic component 4 are fixed to the substrate 5, the legs 10, 20 and the external leads 41 are fixed to the substrate 5 by, for example, passing them through a solder bath. At this time, since the locking portion 10a and the hook portion 20a are locked to the peripheral portions of the through holes 50 and 51, and the fixing state of the heat radiating member X to the substrate 5 is stabilized, the heat radiating member when passing through the solder bath is stabilized. X does not float from the substrate 5.

[Brief description of the drawings]

FIG. 1 shows a heat radiation member according to the present invention mounted on an electronic component;
It is sectional drawing which shows the state which supported this on the board | substrate.

FIG. 2 is an overall perspective view of the front side of the heat radiation member shown in FIG.

FIG. 3 is an overall perspective view on the rear side of the heat radiation member shown in FIG. 1;

FIG. 4 is a cross-sectional view corresponding to a portion along line IV-IV in FIG.

FIG. 5 is a sectional view corresponding to a portion along the line VV in FIG. 2;

6 is an overall perspective view of an electronic component to which the heat radiating member shown in FIGS. 2 and 3 is attached.

FIG. 7 is a cross-sectional view corresponding to FIG. 5 for explaining an operation of mounting an electronic component on the heat radiation member shown in FIGS. 2 and 3.

8 is a cross-sectional view corresponding to FIG. 4 for explaining an operation of mounting an electronic component on the heat radiation member shown in FIG.

FIG. 9 is a cross-sectional view corresponding to FIG. 1 for describing an operation of supporting a heat radiation member mounted on an electronic component on a substrate.

FIG. 10 is an overall perspective view of a conventional heat dissipation member.

FIG. 11 is a sectional view taken along the line XI-XI in FIG. 10;

FIG. 12 is a front view for explaining a state in which the heat radiating member shown in FIG. 10 is supported on a substrate.

[Explanation of symbols]

 X Heat dissipating member 1 First heat dissipating part 10 First leg 12 Hook (of first heat dissipating part constituting lock mechanism) 13 Leaf spring part 2 Second heat dissipating part 20 Second leg 20a Hook (Second leg) 3) third heat radiating portion 33 convex portion (of the third heat radiating portion constituting the engaging means) 34 through hole (of the third heat radiating portion constituting the locking mechanism) 4 electronic component 42 concave portion (forming the engaging means) Electronic component) 5 Substrate 50 First through hole (of substrate) 51 Second through hole (of substrate)

Claims (9)

[Claims] 1. A heat radiating member fixed to a substrate using a through hole provided in a substrate, the first leg and the second leg having at least a part thereof inserted through the through hole. The first leg and the second leg are elastically expandable and contractable, and are held on the substrate by an elastic restoring force acting between the legs. A heat dissipating member characterized by being constituted. 2. The first leg portion and the second leg portion are provided at one end of a first heat radiation portion and a second heat radiation portion, respectively. The heat radiating member according to claim 1, wherein the other end portions are connected via a third heat radiating portion protruding toward one end of the heat radiating portion, and have a substantially M-shaped cross section as a whole. 3. The heat dissipating member according to claim 1, wherein a hook portion bent at an acute angle is provided at one end of at least one of the first leg portion and the second leg portion. . 4. The heat dissipating member according to claim 2, wherein an electronic component supported by the substrate is mounted between the first heat dissipating portion and the third heat dissipating portion. 5. The heat dissipating member according to claim 4, further comprising an engaging means for engaging one of the first heat dissipating portion and the third heat dissipating portion with the electronic component. 6. The heat radiating device according to claim 4, wherein one of the first heat radiating portion and the third heat radiating portion is provided with a leaf spring portion for pressing the electronic component toward the other side. Element. 7. The heat dissipating member according to claim 4, wherein a lock mechanism is provided to connect between the first heat dissipating portion and the third heat dissipating portion. 8. The first leg portion and the second leg portion each have a narrower tip end side than the width of the through hole and a wider base end side than the width of the through hole. The heat radiating member according to claim 1, wherein the heat radiating member is provided. 9. A structure in which a heat dissipating member having two heat dissipating portions disposed opposite to each other is mounted on an electronic component by sandwiching the electronic component between the heat dissipating portions.
A mounting structure of a heat radiating member to an electronic component, wherein a convex portion or a concave portion provided on at least one of the two heat radiating portions is engaged with a concave portion or a convex portion provided on the electronic component. .