JPH10289971A - Led fixing device - Google Patents
Led fixing deviceInfo
- Publication number
- JPH10289971A JPH10289971A JP9880097A JP9880097A JPH10289971A JP H10289971 A JPH10289971 A JP H10289971A JP 9880097 A JP9880097 A JP 9880097A JP 9880097 A JP9880097 A JP 9880097A JP H10289971 A JPH10289971 A JP H10289971A
- Authority
- JP
- Japan
- Prior art keywords
- led
- height
- spacer
- lead
- fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント基板上に
実装され、所定の高さを必要とするＬＥＤの固定、及び
倒れ防止用のスペーサに関する。[0001] 1. Field of the Invention [0002] The present invention relates to a spacer for mounting an LED, which is mounted on a printed circuit board and requiring a predetermined height, and for preventing the LED from falling down.
【０００２】[0002]
【従来の技術】近年、電気機器の表示に用いるＬＥＤを
プリント基板上に実装して使用する場合が増えている。2. Description of the Related Art In recent years, the use of LEDs used for displaying electric equipment mounted on a printed circuit board has been increasing.
【０００３】従来のＬＥＤスペーサを図３に基づいて説
明する。プリント基板２５に基板上から所定の高さを必
要とするＬＥＤ２６を実装する場合、所定の高さＨでリ
ード２２を曲げ２４等でクランプされたＬＥＤ２６を使
用する。A conventional LED spacer will be described with reference to FIG. When mounting an LED 26 that requires a predetermined height from above the printed board 25, the LED 26 in which the lead 22 is bent at a predetermined height H and clamped by 24 or the like is used.
【０００４】さらに、ＬＥＤ２６が倒れないようにＬＥ
Ｄスペーサ２３を用いる。そして、ＬＥＤスペーサ２３
の高さをＬＥＤ素子２１までの高さＪと同じにすること
によって、ＬＥＤ素子２１をささえて倒れを防止する構
造になっている。[0004] Further, in order to prevent the LED 26 from falling down, LE
D spacer 23 is used. Then, the LED spacer 23
Is set to be the same as the height J up to the LED element 21 so as to prevent the LED element 21 from falling down.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、このＬ
ＥＤスペーサ２３では、プリント基板２５に実装された
状態でＬＥＤスペーサ２３の高さＨに対してリード２２
を緊張して沿わせるので、ＬＥＤ素子２１に既に初期応
力が掛かっていた。However, this L
In the ED spacer 23, the lead 22 is mounted on the printed circuit board 25 with respect to the height H of the LED spacer 23.
Are tensioned along, so that the initial stress has already been applied to the LED element 21.
【０００６】この初期応力に加えて、周囲温度の上昇に
より金属材のリード２２よりも樹脂材のＬＥＤスペーサ
２３の方が大きく熱膨張して、ＬＥＤ素子２１が上方へ
押され、リード２２が下方へ引っ張られたときの応力に
よって、ＬＥＤ素子２１の中でのリード２２の接合箇所
（図示していない）が破壊されてしまうという課題があ
った。In addition to the initial stress, the LED spacer 23 made of a resin material expands more thermally than the lead 22 made of a metal due to a rise in the ambient temperature, so that the LED element 21 is pushed upward, and the lead 22 is moved downward. There is a problem that the joint (not shown) of the lead 22 in the LED element 21 is broken by the stress when the lead 22 is pulled.
【０００７】[0007]
【課題を解決するための手段】本発明ではＬＥＤスペー
サの高さを低くすることによって、ＬＥＤ素子部に掛か
る応力をなくして、周囲温度の上昇によるＬＥＤの故障
を防止できる。According to the present invention, by reducing the height of the LED spacer, the stress applied to the LED element portion can be eliminated, and the failure of the LED due to an increase in the ambient temperature can be prevented.
【０００８】[0008]
【発明の実施の形態】上記課題を解決するための本発明
の第一の手段によるＬＥＤスペーサは、ＬＥＤ素子の高
さよりも低くし、プリント基板にそれ自身を固定するた
めの爪を備えることによって、ＬＥＤ素子部に応力が掛
からなくしたものである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An LED spacer according to a first means of the present invention for solving the above-mentioned problems has a height lower than the height of an LED element and is provided with claws for fixing itself to a printed circuit board. In addition, no stress is applied to the LED element portion.
【０００９】本発明の第二の手段によるＬＥＤスペーサ
は、ＬＥＤ素子の高さよりも低くし、ＬＥＤのリードを
利用してプリント基板に固定することによって、ＬＥＤ
素子部に応力が掛からなくしたものである。[0009] The LED spacer according to the second means of the present invention is lower than the height of the LED element, and is fixed to a printed circuit board using LED leads.
In this case, no stress is applied to the element portion.
【００１０】以下、本発明の実施例について、図１から
図２を用いて説明する。以下、本発明のＬＥＤの固定装
置の実施例について、図１から図２を用いて説明する。An embodiment of the present invention will be described below with reference to FIGS. Hereinafter, an embodiment of the LED fixing device of the present invention will be described with reference to FIGS.
【００１１】（実施例１）図１は本発明の第一の手段に
よる、ＬＥＤスペーサを用いた固定装置を示す構成図で
ある。(Embodiment 1) FIG. 1 is a structural view showing a fixing device using LED spacers according to the first means of the present invention.
【００１２】本実施例と従来例との差異は、ＬＥＤスペ
ーサ３の高さＫをＬＥＤ素子１の高さＪよりも低くし、
ＬＥＤスペーサ３をプリント基板５の固定用の嵌合穴８
に嵌合し、抜け止めして固定するための固定用ツメ７を
設けたことである。The difference between the present embodiment and the conventional example is that the height K of the LED spacer 3 is lower than the height J of the LED element 1,
A fitting hole 8 for fixing the LED spacer 3 to the printed circuit board 5
And a fixing claw 7 is provided to be fitted to and to prevent it from coming off.
【００１３】これによって、従来のような初期応力はか
からなくなると共にＬＥＤ素子１に周囲温度の上昇によ
り金属材のリード２よりも樹脂材のＬＥＤスペーサ３の
方が大きく熱膨張し、高さＫが伸びても高さＪには届か
ないように考慮すると、周囲温度上昇によってＬＥＤ素
子１に応力がかからなくなる。As a result, the initial stress as in the prior art is not applied, and the LED spacer 3 made of the resin material expands more thermally than the lead 2 made of the metal material due to an increase in the ambient temperature. Considering that the height does not reach the height J even when the LED element 1 extends, no stress is applied to the LED element 1 due to an increase in the ambient temperature.
【００１４】（実施例２）図２は本発明の第二の手段に
よるＬＥＤスペーサを用いた固定装置を示す構成図であ
る。(Embodiment 2) FIG. 2 is a structural view showing a fixing device using an LED spacer according to the second means of the present invention.
【００１５】本実施例と前述した実施例１との差異は、
ＬＥＤスペーサ１３の高さＫをＬＥＤ素子１１の高さＪ
よりも低くし、さらにＬＥＤ１６のリード１２のクラン
プ部１４が、固定用突起１０でＬＥＤスペーサ１３をプ
リント基板１５に押し付け固定できる構造にしたことで
ある。The difference between this embodiment and the first embodiment is as follows.
The height K of the LED spacer 13 is changed to the height J of the LED element 11.
The structure is such that the clamp portion 14 of the lead 12 of the LED 16 can fix the LED spacer 13 against the printed board 15 by the fixing projection 10.
【００１６】上記のようにして、周囲温度の上昇により
金属材のリード１２よりも樹脂材のＬＥＤスペーサ１３
の方が大きく熱膨張しても、ＬＥＤスペーサ１３がＬＥ
Ｄ素子１１に接触しない考慮をすれば、ＬＥＤ素子１１
に応力がかかるのを防ぐことができる。しかも、クラン
プ部１４とプリント基板１５がＬＥＤスペーサ１３を挟
持するから、運搬時等にＬＥＤスペーサ１３が上方へ移
動してＬＥＤ素子１１に衝突することもない。As described above, due to the rise in the ambient temperature, the LED spacer 13 made of the resin material is replaced with the LED spacer 13 made of the metal material.
LED spacer 13 is LE even if
Considering that it does not contact the D element 11, the LED element 11
Can be prevented from being stressed. Moreover, since the clamp portion 14 and the printed circuit board 15 sandwich the LED spacer 13, the LED spacer 13 does not move upward and collide with the LED element 11 during transportation or the like.
【００１７】[0017]
【発明の効果】以上のように本発明の請求項１に係る発
明によれば、周囲温度の上昇によりＬＥＤ素子に応力が
かからなくなり、素子が破壊されることがなくなる。As described above, according to the first aspect of the present invention, no stress is applied to the LED element due to an increase in ambient temperature, and the element is not destroyed.
【００１８】また、本発明の請求項２に係る発明によれ
ば、請求項１に係る発明の効果に加えて、リードとプリ
ント基板が固定用突起を挟持することにより、プリント
基板に固定する爪が必要なくなり、従来のＬＥＤスペー
サに比べて小型化が図れる。According to the invention of claim 2 of the present invention, in addition to the effect of the invention of claim 1, the claw fixed to the printed circuit board by the lead and the printed circuit board sandwiching the fixing projection. Is not required, and the size can be reduced as compared with the conventional LED spacer.
【図１】（ａ）本発明の実施例１のＬＥＤの固定装置を
示す断面図 （ｂ）同装置の上面図 （ｃ）同装置のＡ−Ａ’線断面図FIG. 1A is a cross-sectional view illustrating an LED fixing device according to a first embodiment of the present invention. FIG. 1B is a top view of the LED fixing device. FIG.
【図２】（ａ）本発明の実施例２のＬＥＤの固定装置を
示す断面図 （ｂ）同装置の上面図2A is a cross-sectional view illustrating an LED fixing device according to a second embodiment of the present invention. FIG. 2B is a top view of the LED fixing device.
【図３】（ａ）従来のＬＥＤの固定装置を示す断面図 （ｂ）同装置の上面図3A is a cross-sectional view showing a conventional LED fixing device. FIG. 3B is a top view of the device.
１、１１ ＬＥＤ素子部 ２、１２ リード ３、１３ ＬＥＤスペーサ ４、１４ クランプ部 ５、１５ プリント基板 ６、１６ ＬＥＤ ７ 固定用ツメ Ｈ （ＬＥＤの）高さ Ｊ （ＬＥＤ素子の）高さ Ｋ （ＬＥＤスペーサの）高さ １０ 固定用突起 1,11 LED element part 2,12 Lead 3,13 LED spacer 4,14 Clamp part 5,15 Printed circuit board 6,16 LED 7 Fixing claw H (LED) height J (LED element) height K ( LED spacer) Height 10 Fixing protrusion
Claims (2)
ードを導出してプリント基板までの所定高さで略直角に
外側へ折り曲げられ、かつ再度下方へ折り曲げられてプ
リント基板にインサートされ半田付けによって固定する
ＬＥＤと、前記ＬＥＤの樹脂モールド底面からプリント
基板までの前記所定高さより低い高さを有し、前記リー
ドの内側を当接させ、この当接した面と直角な側面を嵌
合させるリード溝を有して底面がプリント基板と面接触
し、前記リード溝と平行な前記側面の前記底面から前記
プリント基板に設けた固定用嵌合穴に弾性によって挿入
嵌合する抜け止め爪を有したＬＥＤスペーサとを備えた
ＬＥＤの固定装置。1. A lead is led out from a bottom surface of a resin mold of an LED element portion, is bent outward at a predetermined height to a printed board at a substantially right angle, and is bent downward again, inserted into the printed board and soldered. An LED to be fixed, a lead having a height lower than the predetermined height from the resin mold bottom surface of the LED to the printed circuit board, making the inside of the lead abut, and fitting a side surface perpendicular to the abutted surface The groove has a groove, the bottom surface of which is in surface contact with the printed circuit board, and has a retaining claw that is elastically inserted and fitted from the bottom surface of the side surface parallel to the lead groove into a fixing fitting hole provided in the printed circuit board. An LED fixing device comprising an LED spacer.
ードを導出してプリント基板までの所定高さより一定高
さだけ短いところで略直角に外側へ折り曲げられ、かつ
再度下方へ折り曲げられプリント基板にインサートして
半田付け固定するＬＥＤと、前記ＬＥＤの所定高さより
低い高さを有し、前記リードの内側および前記外側へ折
り曲げられた部分を当接させ、この当接面側と直角な側
面を嵌合させるリード溝を有し底面が前記プリント基板
と面接触するＬＥＤスペーサとを備えたＬＥＤの固定装
置。2. A lead is led out from a bottom surface of a resin mold of an LED element portion, is bent outward at a substantially right angle at a position shorter than a predetermined height to a printed board by a certain height, and is bent downward again to be inserted into the printed board. And an LED having a height lower than a predetermined height of the LED, and a portion bent inside and outside of the lead is brought into contact, and a side surface perpendicular to the contact surface side is fitted. An LED fixing device comprising: an LED spacer having a lead groove to be fitted and a bottom surface in surface contact with the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9880097A JPH10289971A (en) | 1997-04-16 | 1997-04-16 | Led fixing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9880097A JPH10289971A (en) | 1997-04-16 | 1997-04-16 | Led fixing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10289971A true JPH10289971A (en) | 1998-10-27 |
Family
ID=14229432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9880097A Pending JPH10289971A (en) | 1997-04-16 | 1997-04-16 | Led fixing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10289971A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1333709A2 (en) * | 2002-01-30 | 2003-08-06 | Kabushiki Kaisha Tokai-Rika-Denki-Seisakusho | Supporting device for discrete electric component |
| EP1211441A3 (en) * | 2000-12-04 | 2004-01-14 | Voith Turbo GmbH & Co. KG | Push button range selector with LED indicator |
| US7766499B2 (en) | 2006-11-07 | 2010-08-03 | Samsung Electronics Co., Ltd. | Light source unit, backlight unit and liquid crystal display including the same, and method thereof |
-
1997
- 1997-04-16 JP JP9880097A patent/JPH10289971A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1211441A3 (en) * | 2000-12-04 | 2004-01-14 | Voith Turbo GmbH & Co. KG | Push button range selector with LED indicator |
| EP1333709A2 (en) * | 2002-01-30 | 2003-08-06 | Kabushiki Kaisha Tokai-Rika-Denki-Seisakusho | Supporting device for discrete electric component |
| EP1333709A3 (en) * | 2002-01-30 | 2004-12-29 | Kabushiki Kaisha Tokai-Rika-Denki-Seisakusho | Supporting device for discrete electric component |
| US7019220B2 (en) | 2002-01-30 | 2006-03-28 | Kabushiki Kaisha Tokai Rika Denki Seisakusho | Supporting device for discrete electric component |
| US7766499B2 (en) | 2006-11-07 | 2010-08-03 | Samsung Electronics Co., Ltd. | Light source unit, backlight unit and liquid crystal display including the same, and method thereof |
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