JPS6211013Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a heat dissipation device for heat generating components such as transistors.

A recently developed heat dissipation device is constructed as shown in FIG.

That is, a heat sink 5 to which a heat generating component 3 such as a power transistor is attached with screws 4 is incorporated into a printed circuit board 2 that incorporates various electronic components 1 to form a predetermined circuit. , an L-shaped mounting bracket 7 having several claws 6 at the lower end is joined using a coupling tool 8 such as a rivet, and the claws 6 of this mounting bracket 7 are inserted into the mounting hole 9 of the printed circuit board 2. It is designed to be fixed by soldering on the lower surface of the printed circuit board 2 at the same time as the various electronic components 1 assembled on the printed circuit board 2 are soldered.

In the above configuration, when the heat sink 5 is soldered to the printed circuit board 2, the heat sink 5 may be damaged due to the weight balance of the heat sink 5, vibration during soldering, etc.
If it is fixed with the solder 10 at an angle to the printed circuit board 2 as shown in FIG. 2, or if it is fixed with the solder 10 in a raised state as shown in FIG. Ta.

For this reason, it is necessary to perform correction work such as melting the solder 10 and resoldering the heat sink 5 while supporting it by hand, which has the drawback of greatly impeding productivity.

The present invention eliminates the above-mentioned conventional drawbacks, and improves the mounting hardware for the heat sink to prevent the heat sink from tilting or lifting up, thereby improving assembly work efficiency. It is an object of the present invention to provide a heat dissipation device that can improve heat dissipation.

In order to achieve the above object, the present invention provides a cut-out part at the bottom of the mounting bracket that is connected to the lower end of the heat sink, so that when the lower part is inserted into the mounting hole of the printed circuit board, the cut-out part is inserted into the bottom surface of the printed circuit board. It is intended to be configured to be engaged with.

Embodiments of the present invention will be described below with reference to FIGS. 4 to 8.

Reference numeral 11 denotes a printed circuit board that incorporates various electronic components 12 to form a predetermined circuit.
1 incorporates a heat sink 15 to which a heat generating component 13 such as a power transistor is attached with screws 14.

The heat sink 15 is constructed by bending an inexpensive metal plate such as aluminum into an L shape, and a solderable metal plate such as a solder-plated steel plate or a copper plate is attached to both ends of the lower part of the heat sink 15 in an L shape. The mounting bracket 16, which is bent into a shape, can be used as a connector 1 such as a rivet or screw.
7, one piece 16 of this fitting 16
The portion a is in surface contact with the heat sink 15, and the other piece 16b protrudes in a direction perpendicular to the plane of the heat sink 15.

The other piece 16b of this mounting bracket 16 extends downward and has a cut-out portion 16c at its lower part.

The lower part of the other piece 16b having the cut-out part 16c is assembled into the mounting hole 18 which is a long hole of the printed circuit board 11, and the printed board is placed between the lower side of the heat sink 15 and the upper end of the cut-out part 16c of the mounting bracket 16. 11 is being held in place. That is, this heat sink 1
The dimension b between the lower side of the cut-out portion 16c and the upper end of the cut-out portion 16c is configured to be approximately the same as the thickness of the printed circuit board 11.

Therefore, when the mounting bracket 16 is press-fitted into the mounting hole 18 of the printed circuit board 11 with the cut-out portion 16c bent, the cut-out portion 16c will be engaged with the lower surface of the printed circuit board 11, causing the heat dissipation plate 15 to be tilted and vibrations to be prevented. This prevents it from rising.

In addition, as shown in FIG. 8, three or more mounting brackets 16 are connected to the lower part of the heat sink 15, and if these are assembled into the printed circuit board 11 and held by the cut-out portions 16c, heat generated during soldering can be reduced. Printed circuit board 11
This can prevent the material from warping or deforming.

In this state, the various electronic components 12 assembled on the printed circuit board 11 are soldered using a dip method or the like, and at the same time, the lower part of the other piece 16b of the mounting bracket 16 is fixed to the lower surface of the printed circuit board 11 with solder 19.

Since the heat dissipation device of the present invention is configured as described above, the heat dissipation plate does not tilt with respect to the printed circuit board or lift up due to vibrations until it is fixed by soldering. , there is no need to resolder as in the past, significantly improving assembly work efficiency, and even if the printed circuit board warps, this fixing bracket holds the printed circuit board, preventing warping and deformation. It has the effect of increasing the bonding strength of the heat sink and making it superior in terms of quality, and is of great practical value.

[Brief explanation of drawings]

Fig. 1 is an exploded perspective view of a recently developed heat dissipation device, Figs. 2 and 3 are cross-sectional views of the main parts showing the problems of the device, and Fig. 4 is an example of the heat dissipation device of the present invention. 5 and 6 are perspective views showing examples of the fixing fittings used in the device, FIG. 7 is a cross-sectional view of the main parts showing the soldering state of the mounting fittings, and FIG. FIG. 7 is a sectional front view of a main part of a heat dissipation device according to another embodiment. 11...Printed circuit board, 12...Electronic component, 1
3... Heat generating component, 15... Heat sink, 16... Mounting bracket, 16a... 1 piece, 16b... Other piece, 16c
... cut-out part, 17 ... coupling tool, 18 ... mounting hole,
19...Handa.

Claims (1)

[Scope of utility model registration request] In addition to incorporating various electronic components into the printed circuit board, mounting brackets bent in an L shape are connected to both lower ends of the heat sink on which heat generating components such as power transistors are attached, and one piece of this mounting bracket is attached to the heat sink. The other piece protrudes in a direction perpendicular to the surface of the heat sink, and the other piece is provided with a cutout that is engaged with the lower surface of the printed circuit board by inserting it into the mounting hole of the printed circuit board. is sandwiched between the upper end of the cut edge and the lower side of the heat sink.