JPH0660143U - Test head of semiconductor test equipment - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a test head for a semiconductor test device that is connected to the prober 4 without rotating the test head 180 degrees in the vertical direction. [Structure] The test board 2 is mounted on the upper part of the test head 1 and has a connector 1D for connecting with a pin card 1C.
The attachment board 3 is attached to the lower portion of the test head 1 and has a connector 1E for connecting to the pin card 1C. The pin card 1C includes a switch 14C that outputs a signal to either the test board 2 side or the attachment board 3 side. .

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a test head of a semiconductor test apparatus that can be easily connected to a prober when testing an IC in a wafer state.

[0002]

[Prior art]

 Next, FIG. 4 shows the configuration of a test head of a semiconductor testing device according to the conventional technique. 4A is a perspective view illustrating the appearance of the test head, 10 is the test head, and 2 is the test board. In FIG. 4A, the test board 2 is mounted on the test head 10. 4A is a side sectional view of FIG. 1A, 10A is a backboard, 10B is a connector, 10C is a pin card, and 10D is a connector.

In FIG. 4A, the backboard 10A, the connector 10B, and the pin card 10C are arranged in the test head 10. The pin card 10C is connected to the backboard 10A via the connector 10B, and the test board 2 is connected to the connector 10D. Connect through. FIG. 4C is a top view for explaining the arrangement of the pin card 10C in the test head 10. In FIG. 4C, the pin cards 10C are radially arranged in the test head 10.

Next, FIG. 5 shows a circuit block of the pin card 10C. In FIG. 5, 11 is a driver, 12 is a comparator, 13 is an output terminal, and 14A and 14B are switches. In FIG. 5, the output terminal 13 is connected to the test board 2, and when testing the IC, the IC to be measured is mounted on the test board 2, the switch 14B is first closed, and the signal from the driver 11 is output to the output terminal 13. Supply and perform function test. Next, the switch 14A is closed and the data is input to the DC parameter measuring unit 15.

Generally, the test head of the semiconductor test apparatus can easily attach and detach the test board, and the test board is exchanged depending on the type of IC to be measured. Also, by replacing the test board with an attachment board, it can be connected to a prober, and not only the IC enclosed in the package but also the individual functions can be tested with the IC chip formed on the wafer. be able to. That is, when the package IC is tested, the test board 2 is mounted on the test head 10 in FIG. 4A, and the package IC is mounted on the test board 2 to perform the test. When the test is completed, replace the package IC with another one and perform the tests in order. Such tests are called manual tests.

When testing individual IC chips formed on a wafer, an attachment board is attached to the test head 10 in place of the test board 2 in FIG. 4A, and the test head 10 is connected to a prober. The wafer is transferred by the prober and tested for each chip.

Next, the state in which the test head is connected to the prober and individual functions are tested in the state of the IC chip formed on the wafer will be described with reference to FIG. In FIG. 6, 4 is a prober, 4A is a chuck top, 4B is a probe card, 4C is a connecting ring, 5A is a support, 5B is a fulcrum, 5C is an arm, and 6 is a wafer. In FIG. 6, the attachment board 3 is attached to the test head 10.

The test head 10 is fixed to the arm 5C, the end of the arm 5C is rotatably fixed to the support 5A via a fulcrum 5B, and the support 5A is fixed to the prober 4. Therefore, as a result, the test head 10 is fixed to the prober 4. The chuck top 4A carries and carries the wafer 6, and the probe card 4B applies signals to the chips of the wafer 6. In FIG. 6, the test head 10 fixed to the arm 5C is attached with the attachment board 3, and the arm 5C is rotated 180 degrees in the vertical direction about the fulcrum 5B by the control mechanism (not shown), and the prober 4 is rotated. Connection ring 4C. Thereby, the individual IC chips formed on the wafer 6 are tested.

[0009]

[Problems to be Solved by the Invention]

 In the configuration of FIG. 4, when connecting the test head 10 to the prober 4, it is necessary to fix the test head 10 to the arm 5C and rotate 180 degrees in the vertical direction by the arm 5C as shown in FIG. When the size of the test head 10 is increased due to the increase in the number of ICs, the test head 10 has a problem that it is difficult to rotate the test head 10 by 180 degrees in the vertical direction and connect it to the prober 4. The present invention aims to provide a test head for a semiconductor test device that is connected to the prober 4 without rotating the test head 180 degrees.

[0010]

[Means for Solving the Problems]

 In order to achieve this object, according to the present invention, in a test head of a semiconductor test device, which comprises a backboard 1A and a plurality of pin cards 1C connected to the backboard 1A via a connector 1B, and which inputs a signal to an IC to be measured. Attach the test board 2 to the upper part of the test head 1, connect the pin card 1C and the test board 2 to the connector 1D, and attach the attachment board 3 to the lower part of the test head 1 to attach the pin card 1C and the attachment board. 3 includes a connector 1E for connecting 3 and a pin card 1C having a switch 14C for outputting a signal to either the test board 2 side or the attachment board 3 side.

[0011]

[Action]

 Next, the structure of the test head of the semiconductor test apparatus according to the present invention is shown in FIG. 1A of FIG. 1 is a backboard, 1B is a connector, 1C is a pin card, 1D is a connector, and 2 is a test board. FIG. 1A shows a configuration in which the test board 1 is connected to the test head 1. The pin card 1C is connected to the backboard 1A via the connector 1B and the test board 2 is connected to the test board 2 via the connector 1D. Here, the test head of FIG. 1A differs from that of FIG. 4A in that the pin card 1C is connected to the connector 1E below the test head 1.

Next, the structure when the attachment board 2 is mounted on the test head 1 is shown in FIG. In FIG. 1A, the attachment board 2 is mounted on the lower part of the test head 1 and is connected to the pin card 1C via the connector 1E.

Next, FIG. 2 shows a circuit block of the pin card 1C. In FIG. 2, 11 is a driver, 12 is a comparator, 13A and 13B are output terminals, and 14A, 14B and 14C are switches. 2 shows the circuit of FIG. 5 with an output terminal 13B and a switch 14C added. The output terminal 13A is connected to the connector 1D on the test board 2 side, and the output terminal 14B is the connector 1E on the attachment board 3 side. Connected to.

When testing an IC, the test board 2 is mounted on the test head 1, the IC to be measured is mounted on the test board 2, and the switch 14C is connected to the output terminal 13A side by a control unit (not shown). Then, the switch 14B is closed and the signal from the driver 11 is supplied to the output terminal 13A to perform the function test. Next, the switch 14A is closed and the DC parameter measuring unit 15 is input.

When the test head 1 is connected to the prober 4 in order to individually measure the IC chips on the wafer 6, the attachment board 3 is attached to the lower portion of the test head 1 in FIG. 1, and the illustration is omitted. In the control section, the switch 14C is connected to the output terminal 13B side and is connected to the prober 4, and the same measurement is performed.

Next, FIG. 3 shows a state in which the test head 1 of FIG. 1 is connected to the prober 4. In FIG. 3, 1 is a test head, 4 is a prober, 5A is a column, and 5C is an arm. FIG. 3 is a top view of the test head 1 and the prober 4. Since the attachment board 3 for connecting to the prober 4 is attached to the lower part of the test head 1, when connecting the test head 1 to the prober 4, An example is shown in which the test head 1 is rotated 90 degrees in the lateral direction. Although this invention shows an example in which a connector is used to connect the test head or the attachment board to the test head, the same applies when a pogo pin is used.

[0017]

[Effect of device]

 According to this invention, when measuring a packaged IC, a test board is mounted on the top of the test head, and when connecting to a prober for measuring individual IC chips on the wafer, the test head is Since the attachment board is attached to the bottom, it is not necessary to rotate the test head vertically for any measurement, and the test head and prober can be easily connected.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a test head according to the present invention.

FIG. 2 is a circuit block diagram of a pin card 1C using the test head of FIG.

3 is a state diagram in which the test head 1 of FIG. 1 is connected to a prober 4. FIG.

FIG. 4 is a configuration diagram of a test head of a semiconductor testing device according to a conventional technique.

5 is a circuit block diagram of a pin card 1C using the test head of FIG.

6 is a state diagram in which the test head 1 of FIG. 4 is connected to a prober 4. FIG.

[Explanation of symbols]

 1 Test Head 2 Test Board 3 Attachment Board 4 Prober 6 Wafer 11 Driver 12 Comparator 13 Output Terminal 15 DC Parameter Measurement Unit

Claims (1)

[Scope of utility model registration request] 1. A backboard (1A) and a backboard (1A)
Multiple pin cards (1C) to connect to via connector (1B)
In the test head of the semiconductor test equipment that inputs the signal to the IC to be measured, mount the test board (2) on the upper part of the test head (1),
Connector to connect pin card (1C) and test board (2)
(1D), attach the attachment board (3) to the bottom of the test head (1), connect the pin card (1C) and the attachment board (3) to the connector (1E), and the test board (2) side to the attachment. A test head for a semiconductor test device, comprising a pin card (1C) having a switch (14C) for outputting a signal to one of the boards (3) side.