JPH05315411A - Test head - Google Patents

Abstract

PURPOSE:To immediately check wiring conditition without repeating works such as opening and shutting operation of a head and testing operation, at the time of sample measurement fail caused by measurement system, by arranging a check terminal on an outer surface which terminal can be used for observing wiring condition under a testing state. CONSTITUTION:A test head 2 has a check terminal 1 which is connected by using a cable 4 between a tester and the test head and has a test head outer terminal 3 on the bottom surface and a plurality of contacts on the side surface. The check terminal 1 is electrically connected with the wiring from a pin card 11. A wiring 12 which enters the test head from the tester is connected with the pin card 11 in the head and reaches the outer terminal 3. The terminal of the wiring 12 is branched in front of a pogo pin of the outer terminal 3, and connected by using a copper wire 10 between the check terminal 1 arranged on the test head side surface and the output branching point of a checker. Measurement system wiring check at the time of test fail is performed by using the check terminal 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test head for electrically measuring pellets formed on a semiconductor wafer, and more particularly to a check terminal function for confirming a signal at a pin end of the test head when a measurement trouble occurs.

[0002]

2. Description of the Related Art A conventional test head 2 is shown in FIG.
As shown in (B), it is a box-shaped unit that supplies the sample power output from the tester through the cable 4 and receives the information for each pin corresponding to the input and output of the pellet to switch the measurement wiring. , One surface of which has a circular external terminal 3 for connecting the test head and the pellet.

When performing electrical measurement of pellets formed on the wafer 8, as shown in FIG. 4, a test board 5 for wiring a load circuit peculiar to the device type is attached to the external terminal 3, and a ring plate is attached. The probe card 7 is also connected via 6. The test head 2 is opened and closed in the arrow direction.

FIG. 5 is a side view showing a state in which jigs and tools are actually connected and put in a test state as shown in FIG. In FIG. 5, in the test head 2, the distance between the external terminal 3 and the prober upper surface 9 is as small as 100 mm,
You can easily see that you cannot connect a probe such as an oscilloscope.

In order to open the test head 2 from the state where the test head 2 is set on the prober, connect the probe, and set the test state again, it takes about 5 minutes in consideration of other series of operations. Takes time.

[0006]

In such a conventional test head 2, as shown in FIG. 5, the test head 2 and the probe are electrically measured while the pellets formed on the semiconductor wafer 8 are being electrically measured. A portion serving as a check terminal between the cards 7 was hidden, and it was very inconvenient to electrically check several points of the measurement wiring in the measurement state.

In other words, when the device test fails and the measurement system is wired, the test head 2 is opened every time the measurement point is changed, a probe such as an oscilloscope is connected to the test board 5, and the test board 5 is connected again. Close the head,
There is a problem that the wiring state must be checked by aligning the needle with the bonding pad of the pellet to put it in a testing state.

An object of the present invention is to solve the above problems and to provide a test head capable of immediately checking the wiring state.

[0009]

The structure of the test head of the present invention corresponds to the input / output of the pellets by supplying power when electrically measuring a large number of pellets formed on a semiconductor wafer. In the test head that receives the information for each pin and switches the measurement wiring, in addition to the external terminals,
A check terminal for monitoring the signal of each pin is provided.

[0010]

1 is a side view showing a test head according to an embodiment of the present invention, and FIG. 2 is a sectional view showing the inside of FIG.

1 and 2, the test head 2 of this embodiment is connected by a cable 4 between the tester and the test head, has a test head external terminal 3 on the bottom surface, and has 4 rows × 9 columns on the side surface. There is a check terminal 1 with contacts.
This check terminal is connected to the pin card 1 via the copper wire 10.
Each of the wirings from 1 is electrically connected.

The wiring 12 that has entered the test head from the tester is connected to the in-head pin card 11 and reaches from the pin card 11 to the external terminal 3 using pogo pins.

Therefore, the terminal is branched before the pogo pin, which is the terminal of the terminal, and the check terminal 1 provided on the side of the test head is connected to the copper wire 10 between the check and output branch points.
In FIG. 2, an example of wiring having only one pin is shown to avoid complication.

As described above, the test head of this embodiment is
In addition to dedicated external terminals for testing semiconductor pellets, check terminals are provided by branching the external terminals for each pin.

[0015]

As described above, in the test head of the present invention, the check terminals, which allow the user to see the wiring state in the test state, are attached to the outer surface, so that the head can be opened and closed when the sample measurement fails due to the measurement system. This has an effect that wiring can be checked without repeating operations such as operation and testing operation.

For example, in the prior art, when checking one measurement point, it took about 5 minutes to spend, but the test head of this embodiment takes about 30 seconds, that is, 1/10 of the conventional case.
And it will be a great reduction in time.

[Brief description of drawings]

FIG. 1 is a side view showing a test head according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing the inside of the test head of the embodiment of FIG.

3A and 3B are a side view and a front view, respectively, of a conventional test head.

FIG. 4 is an exploded side view showing a conventional jig and tool from a test head to a semiconductor wafer.

5 is a side view showing an assembled state of the test head of FIG. 4. FIG.

[Explanation of symbols]

 1 check terminal 2 test head (main body) 3 test head external terminal (pogo pin) 4 tester-test head cable 5 test board 6 ring plate 7 probe card 8 semiconductor wafer 9 prober top 10 check terminal-copper wire between output branch points 11-pin card 12 Wiring from tester

Claims (1)

[Claims] 1. When electrically measuring a large number of pellets formed on a semiconductor wafer, a power supply is supplied, and information of each pin corresponding to the input / output of the pellet is received to switch the measurement wiring. In the test head to be performed, a check terminal for monitoring a signal of each of the pins is provided outside the external terminal.