JPH0657454B2 - Method of manufacturing thermal head - Google Patents
Method of manufacturing thermal headInfo
- Publication number
- JPH0657454B2 JPH0657454B2 JP60076412A JP7641285A JPH0657454B2 JP H0657454 B2 JPH0657454 B2 JP H0657454B2 JP 60076412 A JP60076412 A JP 60076412A JP 7641285 A JP7641285 A JP 7641285A JP H0657454 B2 JPH0657454 B2 JP H0657454B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- heating resistor
- conductor
- thermal head
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Description
【発明の詳細な説明】 〔発明の利用分野〕 本発明は、短作業時間で歩留りの高いサーマルヘッドの
製造方法に関する。Description: FIELD OF THE INVENTION The present invention relates to a method for manufacturing a thermal head which has a short working time and high yield.
従来のサーマルヘッドの製造方法は、例えば特公昭55−
7155号公報に記載されるように、積層形成した発熱抵抗
体層と導体配線層を、くし形のホトマスクをもちいた写
真食刻法で多数個の線分状の積層配線とし、レジストを
除去した後、前述した線分状の積層配線の導体配線の一
部を、細長形のホトマスクをもちいた写真食刻法で取り
除き発熱抵抗体とするものである。この方法では、細長
形のホトマスクの価格が安く、ホトマスクの整合も容易
であるが、導体層のエッチングを２工程に分けているた
め作業時間が長く、レジストの欠陥により導体配線の断
線が多く発生する。A conventional thermal head manufacturing method is described in, for example, Japanese Patent Publication No. 55-
As described in Japanese Patent No. 7155, the heating resistor layer and the conductor wiring layer formed in layers are formed into a number of line-segment-shaped wiring layers by a photo-etching method using a comb-shaped photomask, and the resist is removed. After that, a part of the conductor wiring of the above-mentioned line segment-shaped laminated wiring is removed by a photo-etching method using an elongated photomask to form a heating resistor. With this method, the price of the elongated photomask is low, and the photomask can be easily aligned. However, since the etching of the conductor layer is divided into two steps, the work time is long, and the conductor wiring is often broken due to the defect of the resist. To do.
本発明の目的は、作業時間が短かく歩留りの高いサーマ
ルヘッドの製造方法を提供することにある。An object of the present invention is to provide a method of manufacturing a thermal head which has a short working time and a high yield.
本発明は上記目的を達成するために、積層形成した発熱
抵抗体層と導体配線層のうち、導体配線間および、発熱
抵抗体上の導体配線層を写真食刻法の手法で同時の取り
除き、レジストを除去した後、配線間の発熱抵抗体層を
写真食刻法の手法をもちいて食刻液が、導体配線に接触
しないように食刻することにより達成させるものであ
る。In order to achieve the above object, the present invention removes the heating resistor layer and the conductor wiring layer formed in layers between the conductor wirings and the conductor wiring layer on the heating resistor at the same time by a photo-etching method. After removing the resist, the heating resistor layer between the wirings is etched by using a photo-etching method so that the etching liquid does not come into contact with the conductor wiring.
以下、本発明の実施例を第１図乃至第３図により詳述す
る。第１図乃至第３図は、本発明の一実施例を示すサー
マルヘッドの製造工程を示す斜視断平図で、先ず第１図
に示すように高抵抗の基板１の表面に、蒸着またはスパ
ッタリング等の手法で厚さ0.05〜0.2μｍのTa2N，Ta-S
i，Ta-SiO2等からなる発熱抵抗体層２を形成した後、厚
さ0.5〜２μｍのAu，Al等からなる導体層３を形成し、
さらにレジストパタン４をもちいて導体層の不用部をエ
ッチングする。Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 3 are perspective sectional views showing a manufacturing process of a thermal head showing an embodiment of the present invention. First, as shown in FIG. 1, vapor deposition or sputtering is performed on the surface of a high resistance substrate 1. Such as Ta 2 N, Ta-S with a thickness of 0.05-0.2 μm
After forming the heating resistor layer 2 made of i, Ta-SiO 2 or the like, a conductor layer 3 made of Au, Al or the like having a thickness of 0.5 to 2 μm is formed,
Further, the unnecessary portion of the conductor layer is etched by using the resist pattern 4.
次に、第２図に示すようにレジストパタン４を除去後、
レジストパタン５をもちいて発熱抵抗体層の不用部をエ
ッチングする。ここでレジストパタン５を除去すれば、
第３図に示すように発熱抵抗体を形成する。Next, after removing the resist pattern 4 as shown in FIG.
The unnecessary portion of the heating resistor layer is etched by using the resist pattern 5. If the resist pattern 5 is removed here,
A heating resistor is formed as shown in FIG.
上述の実施例は、発熱抵抗体層と導体層の２層のみの例
であるが、発熱抵抗体層と導体層の間に、蒸着またはス
パッタリング等の手法で形成した、Ti，Cr等からなる拡
散防止層を形成することが実施されており、この場合に
は、導体層の食刻後続けて拡散防止層を食刻すればよ
い。Although the above-mentioned embodiment is an example of only two layers of the heating resistor layer and the conductor layer, it is made of Ti, Cr or the like formed between the heating resistor layer and the conductor layer by a method such as vapor deposition or sputtering. Forming the diffusion prevention layer has been carried out. In this case, the diffusion prevention layer may be etched after the conductor layer is etched.
この実施例によれば、発熱抵抗体上の導体層と導体配線
間の導体層を同時に食刻することができるため、作業時
間が短縮できる。また、導体層の食刻に使用するレジス
トに欠陥があると、導体配線の断線となるが、従来２工
程あった導体層の食刻工程が１工程となり、不良率が低
減する。According to this embodiment, since the conductor layer on the heating resistor and the conductor layer between the conductor wirings can be etched at the same time, the working time can be shortened. Further, if the resist used for etching the conductor layer has a defect, the conductor wiring is disconnected, but the conductor layer etching step, which is conventionally two steps, becomes one step, and the defect rate is reduced.
また、上述の実施例では、導体層の食刻後、レジストパ
タン４を除去する例を示したが、レジストパタン４を除
去せず続けてレジストパタン５を形成することも可能で
あり、この場合さらに作業時間が短縮できる。Further, in the above-mentioned embodiment, the example in which the resist pattern 4 is removed after the etching of the conductor layer is shown, but it is also possible to continuously form the resist pattern 5 without removing the resist pattern 4. Further, the working time can be shortened.
上述の実施例では、レジストパタン５の形状を述べなか
ったが、レジストパタン５は、導体配線層３を覆う形状
が望ましい。これは、発熱抵抗体層２の食刻液として用
いられるふっ酸と硝酸の混酸により、導体配線表面にふ
っ化物が形成される場合があり、ふっ化物を形成した導
体層表面の電気的コンタクトが悪化するためである。Although the shape of the resist pattern 5 is not described in the above embodiments, the resist pattern 5 preferably has a shape that covers the conductor wiring layer 3. This is because a mixed acid of hydrofluoric acid and nitric acid used as an etching solution for the heating resistor layer 2 may form a fluoride on the surface of the conductor wiring. This is because it gets worse.
上述した実施例からも明らかなように、本発明によれ
ば、導体層のエッチングを１工程で実施することができ
るので、作業時間の短縮と不良率の低減に効果があり、
電気的なコンタクトも良好である。As is clear from the above-described examples, according to the present invention, since the conductor layer can be etched in one step, it is effective in shortening the working time and reducing the defect rate.
Good electrical contact.
図はいずれも本発明の一実施例を示すもので、第１図乃
至第３図は工程経過毎のサーマルヘッドの斜視断面図で
ある。 １…基板、２…発熱抵抗体層 ３…導体層、4,5…レジストパタン ６…発熱抵抗体Each of the drawings shows an embodiment of the present invention, and FIGS. 1 to 3 are perspective sectional views of the thermal head after each step. 1 ... Substrate, 2 ... Heating resistor layer 3 ... Conductor layer, 4,5 ... Resist pattern 6 ... Heating resistor
Claims (1)
以上の層から成り、発熱抵抗体上の導体層不用部及び導
体配線間の導体層不用部とを、レジストパタンを用いて
写真食刻法により同時に食刻し、発熱抵抗体層の食刻に
もちいるホトマスク形状を、導体層不要部の食刻に用い
るホトマスクに相似な形状と、発熱抵抗体形状とを合わ
せた形状としたことを特徴とするサーマルヘッドの製造
方法。1. A heating resistor layer 2 and a conductor wiring layer 3 including 2
It consists of the above layers, and the conductor layer unnecessary part on the heating resistor and the conductor layer unnecessary part between the conductor wiring are simultaneously etched by the photo-etching method using the resist pattern to etch the heating resistor layer. A method of manufacturing a thermal head, characterized in that the shape of the photomask used is a shape similar to the shape of a photomask used for etching a conductor layer unnecessary portion and a shape of a heating resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60076412A JPH0657454B2 (en) | 1985-04-12 | 1985-04-12 | Method of manufacturing thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60076412A JPH0657454B2 (en) | 1985-04-12 | 1985-04-12 | Method of manufacturing thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61235165A JPS61235165A (en) | 1986-10-20 |
| JPH0657454B2 true JPH0657454B2 (en) | 1994-08-03 |
Family
ID=13604515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60076412A Expired - Lifetime JPH0657454B2 (en) | 1985-04-12 | 1985-04-12 | Method of manufacturing thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0657454B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63183862A (en) * | 1987-01-27 | 1988-07-29 | Seikosha Co Ltd | Manufacture of thermal head |
| JPS63183861A (en) * | 1987-01-27 | 1988-07-29 | Seikosha Co Ltd | Manufacture of thermal head |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5780074A (en) * | 1980-11-07 | 1982-05-19 | Matsushita Electric Ind Co Ltd | Preparation of thermal head |
| JPH062414B2 (en) * | 1983-04-19 | 1994-01-12 | キヤノン株式会社 | Inkjet head |
-
1985
- 1985-04-12 JP JP60076412A patent/JPH0657454B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61235165A (en) | 1986-10-20 |
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