JPH0710598B2 - Method of manufacturing thermal head - Google Patents
Method of manufacturing thermal headInfo
- Publication number
- JPH0710598B2 JPH0710598B2 JP60095468A JP9546885A JPH0710598B2 JP H0710598 B2 JPH0710598 B2 JP H0710598B2 JP 60095468 A JP60095468 A JP 60095468A JP 9546885 A JP9546885 A JP 9546885A JP H0710598 B2 JPH0710598 B2 JP H0710598B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- resist pattern
- thermal head
- conductor
- disconnection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000004020 conductor Substances 0.000 claims description 22
- 238000009792 diffusion process Methods 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 11
- 230000002265 prevention Effects 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 4
- 230000007547 defect Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 230000002950 deficient Effects 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/485—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by the process of building-up characters or image elements applicable to two or more kinds of printing or marking processes
- B41J2/505—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by the process of building-up characters or image elements applicable to two or more kinds of printing or marking processes from an assembly of identical printing elements
- B41J2/5056—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by the process of building-up characters or image elements applicable to two or more kinds of printing or marking processes from an assembly of identical printing elements using dot arrays providing selective dot disposition modes, e.g. different dot densities for high speed and high-quality printing, array line selections for multi-pass printing, or dot shifts for character inclination
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Electronic Switches (AREA)
Description
【発明の詳細な説明】 〔発明の利用分野〕 本発明はプリンタ，ファクシミリなどの記録部に使用さ
れるサーマルヘッドの製造方法に関するものである。Description: FIELD OF THE INVENTION The present invention relates to a method for manufacturing a thermal head used in a recording unit such as a printer or a facsimile.
従来のサーマルヘッドの製造方法としては、例えば特開
昭50−54337号公報に記載されているように、くし形レ
ジストパタンで導体層、拡散防止層および発熱抵抗体層
を順次にエッチングしてレジストパタンを除去した後、
細長形レジストパタンで導体層および拡散防止層をエッ
チングして発熱抵抗体層を形成する方法が知られてい
る。As a conventional method of manufacturing a thermal head, for example, as described in JP-A-50-54337, a conductor layer, a diffusion prevention layer and a heating resistor layer are sequentially etched with a comb-shaped resist pattern to form a resist. After removing the pattern,
A method is known in which a conductor layer and a diffusion prevention layer are etched with an elongated resist pattern to form a heating resistor layer.
上記方法は、レジストパタンの形成工程が２工程である
ため、短かい工程によりサーマルヘッドの製造が可能で
あるが、その反面、１回のレジストパタンにより２層以
上の層をエッチングするため、レジストパタンの欠陥お
よび膜中異物などによる配線パタンの断線と欠損部が発
生しやすい懸念がある。In the above method, since the resist pattern is formed in two steps, the thermal head can be manufactured in a short step, but on the other hand, since one or more resist patterns etch two or more layers, the resist is There is a concern that a wiring pattern may be broken and a defective portion may easily occur due to a pattern defect or a foreign substance in the film.
本発明は上記にかんがみサーマルヘッドの断線不良を低
減すると共に、配線欠損による信頼性の低下を防止する
サーマルヘッドの製造方法を提供することを目的とする
ものである。SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of manufacturing a thermal head, which reduces the disconnection failure of the thermal head in consideration of the above and prevents the reliability from being deteriorated due to a wiring defect.
本発明は上記目的を達成するために、基板上に形成した
発熱抵抗体層、該発熱抵抗体層上に形成した導電性を有
する拡散防止層および該拡散防止層上に形成した導体層
からなる積層膜上にレジストパタンを形成し、前記導体
層のみをエッチングして前記レジストパタンを除去した
後、前記導体層のエッチングにより残存した面に前記レ
ジストパタンと相似のレジストパタンを再度形成し、つ
いで前記拡散防止層をエッチングすることを特徴とす
る。In order to achieve the above object, the present invention comprises a heating resistor layer formed on a substrate, a conductive diffusion preventing layer formed on the heating resistor layer, and a conductor layer formed on the diffusion preventing layer. After forming a resist pattern on the laminated film and removing the resist pattern by etching only the conductor layer, a resist pattern similar to the resist pattern is formed again on the surface of the conductor layer left by etching, and then, The diffusion prevention layer is etched.
以下、本発明の製造方法の一実施例を図面について説明
する。An embodiment of the manufacturing method of the present invention will be described below with reference to the drawings.
第１図(a)〜(b)は本実施例の製造工程を示す説明用斜視
図である。まず、同図(a)に示すように高抵抗基板１の
表面に、厚さ0.05〜0.2μｍのTa2N,Ta−Si,Ta,SiO2など
の発熱抵抗体層２を、蒸着またはスパッタリングなどに
より形成する。ついで、この発熱抵抗体層２上に0.05〜
0.2μｍのCr,Tiなどの拡散防止層３を形成した後、この
拡散防止層３上に厚さ0.5〜2.0μｍのAu,Alなどの導体
層４を形成する。次に前記各層２〜４により形成された
積層膜５上にレジストパタン６を形成する。1 (a) and 1 (b) are perspective views for explaining the manufacturing process of this embodiment. First, as shown in FIG. 1A, a heating resistor layer 2 such as Ta 2 N, Ta-Si, Ta, SiO 2 having a thickness of 0.05 to 0.2 μm is vapor-deposited or sputtered on the surface of the high resistance substrate 1. It is formed by Then, on this heating resistor layer 2, 0.05-
After forming the diffusion preventing layer 3 of 0.2 μm of Cr, Ti or the like, the conductor layer 4 of Au, Al or the like having a thickness of 0.5 to 2.0 μm is formed on the diffusion preventing layer 3. Next, a resist pattern 6 is formed on the laminated film 5 formed by the layers 2 to 4.
この場合、上記レジストパタン６と導体層４との間に塵
あい７が介在すると、導体層４のエッチング時に塵あい
７の周囲からエッチング液が内部に侵入するため、レジ
ストパタン６を除去した後には、第１図(b)に示すよう
な導体配線８に断線部９を発生する恐れがある。In this case, if dust 7 intervenes between the resist pattern 6 and the conductor layer 4, the etching solution enters into the interior from around the dust 7 when the conductor layer 4 is etched, and therefore, after removing the resist pattern 6. May cause a disconnection 9 in the conductor wiring 8 as shown in FIG. 1 (b).
ところが、第１図(c)に示すように導体配線８上にレジ
ストパタン６と相似のレジストパタン10を形成すれば、
断線部９にも正常なレジストパタン10が形成される。つ
いで、拡散防止層３および発熱抵抗体層２を順次にエッ
チングし、その後にレジストパタン10を除去すると、第
１図(d)に示すように導体配線８の断線部９には、導電
性を有する拡散防止層配線11が露出した状態11aで残存
するから電気的断線に至らない。前記露出部11aの長さ
は、導体層配線８の長さに比べて十分に小さいから、そ
の露出部11aの配線抵抗を無視することができる。However, if a resist pattern 10 similar to the resist pattern 6 is formed on the conductor wiring 8 as shown in FIG. 1 (c),
A normal resist pattern 10 is also formed on the disconnection portion 9. Then, the diffusion prevention layer 3 and the heating resistor layer 2 are sequentially etched, and then the resist pattern 10 is removed. As a result, as shown in FIG. 1 (d), the disconnection portion 9 of the conductor wiring 8 becomes conductive. Since the diffusion prevention layer wiring 11 that it has remains in the exposed state 11a, electrical disconnection does not occur. Since the length of the exposed portion 11a is sufficiently smaller than the length of the conductor layer wiring 8, the wiring resistance of the exposed portion 11a can be ignored.
上述した実施例では、拡散防止層３のエッチングを実施
した後、引続いて発熱抵抗体層４のエッチングを実施し
たが、これに代り拡散防止層３のエッチングを実施した
後にレジストを除去し、再度レジストパタンを形成して
もよい。In the above-described embodiment, after the diffusion prevention layer 3 is etched, the heating resistor layer 4 is subsequently etched. Instead, the diffusion prevention layer 3 is etched, and then the resist is removed. The resist pattern may be formed again.
また、上述の実施例では、導体配線８の断線部９の原因
を塵あい７としたが、これ以外、例えばレジストパタン
の欠陥と導体層内異物などの原因による断線を防止する
ことにより大幅に歩留りを向上させることが可能であ
る。Further, in the above-described embodiment, the cause of the disconnection portion 9 of the conductor wiring 8 is the dust 7, but other than that, for example, the disconnection is largely prevented by preventing the disconnection due to the defect of the resist pattern and the foreign matter in the conductor layer. It is possible to improve the yield.
第２図は従来の製造方法、すなわち導体層のエッチング
後、引続いて拡散防止層をエッチングする方法と上述し
た本発明方法の実施例の断線不良率およびショート不良
率について比較した除去を図示したもので、同図のA,B
は断線不良率およびショート不良率をそれぞれ示す。FIG. 2 illustrates a conventional manufacturing method, that is, a method of etching the conductor layer and subsequently a method of etching the diffusion prevention layer, and a removal comparing the disconnection defect rate and the short circuit defect rate of the embodiment of the method of the present invention. A and B in the figure
Indicates the disconnection defect rate and the short circuit defect rate, respectively.
この図より明らかなように、本発明の実施例の断線不良
率Aaおよびショート不良率Baは、従来方法の両不良率A
b,Bbのそれぞれの約1/4および約２倍である。このよう
に前者のショート不良率が後者のそれの約２倍であるの
は、レジストパタンの形成の増加により、レジストのパ
タンが不良となるためである。ところが、サーマルヘッ
ドの製造では、配線間隔が15μｍ以上であるため、レー
ザなどによる修正が可能であるから問題にならない。As is clear from this figure, the disconnection failure rate Aa and the short circuit failure rate Ba of the embodiment of the present invention are both the failure rate A of the conventional method.
It is about 1/4 and about 2 times that of b and Bb, respectively. Thus, the short-circuit defect rate of the former is about twice that of the latter because the resist pattern becomes defective due to the increase in the formation of the resist pattern. However, in the manufacture of the thermal head, since the wiring interval is 15 μm or more, it is possible to make corrections with a laser or the like, so there is no problem.
以上説明したように、本発明によれば、空気中の塵あ
い、導体配線層内の異物およびレジストパタンの欠陥な
どによる配線断線を約1/4に低減し、歩留りの向上をは
かることができる。また、導体層の断線および欠損部に
は導電性を有する拡散防止層が残存し、この拡散防止層
に導体の役割を付与することにより信頼性を向上させる
ことが可能である。As described above, according to the present invention, it is possible to reduce the wire disconnection due to dust in the air, foreign matter in the conductor wiring layer and the defect of the resist pattern to about 1/4 and improve the yield. . Further, the diffusion preventing layer having conductivity remains in the disconnection and the defective portion of the conductor layer, and it is possible to improve the reliability by giving the diffusion preventing layer a role of a conductor.
第１図(a)〜(b)は本発明のサーマルヘッドの製造方法の
一実施例における製造工程を説明する斜視図、第２図は
本発明および従来の各製造方法における断線不良率およ
びショート不良率の比較説明図である。 １……基板、２……発熱抵抗体層 ３……拡散防止層、４……導体層 ５……積層膜、6,10……レジストパタン。1 (a) and 1 (b) are perspective views for explaining a manufacturing process in one embodiment of a method for manufacturing a thermal head according to the present invention, and FIG. 2 is a disconnection defect rate and a short circuit in the present invention and each conventional manufacturing method. It is a comparison explanatory view of a defective rate. 1 ... Substrate, 2 ... Heating resistor layer 3 ... Diffusion prevention layer, 4 ... Conductor layer 5 ... Laminated film, 6, 10 ... Resist pattern.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｂ４１Ｊ 3/20 １１１ Ｅ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI technical display location B41J 3/20 111 E
Claims (1)
抗体層上に形成した導電性を有する拡散防止層および該
拡散防止層上に形成した導体層からなる積層膜上にレジ
ストパタンを形成し、前記導体層のみをエッチングして
前記レジストパタンを除去した後、前記導体層のエッチ
ングにより残存した前記レジストパタンと相似のレジス
トパタンを再度形成し、ついで前記拡散防止層をエッチ
ングすることを特徴とするサーマルヘッドの製造方法。1. A resist pattern on a laminated film comprising a heating resistor layer formed on a substrate, a conductive diffusion preventing layer formed on the heating resistor layer, and a conductor layer formed on the diffusion preventing layer. And etching the conductor layer only to remove the resist pattern, re-forming a resist pattern similar to the resist pattern remaining by etching the conductor layer, and then etching the diffusion prevention layer. A method of manufacturing a thermal head, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60095468A JPH0710598B2 (en) | 1985-05-07 | 1985-05-07 | Method of manufacturing thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60095468A JPH0710598B2 (en) | 1985-05-07 | 1985-05-07 | Method of manufacturing thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61254355A JPS61254355A (en) | 1986-11-12 |
| JPH0710598B2 true JPH0710598B2 (en) | 1995-02-08 |
Family
ID=14138479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60095468A Expired - Lifetime JPH0710598B2 (en) | 1985-05-07 | 1985-05-07 | Method of manufacturing thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0710598B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9206068B2 (en) | 2005-11-04 | 2015-12-08 | Ocv Intellectual Capital, Llc | Method of manufacturing S-glass fibers in a direct melt operation and products formed therefrom |
-
1985
- 1985-05-07 JP JP60095468A patent/JPH0710598B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9206068B2 (en) | 2005-11-04 | 2015-12-08 | Ocv Intellectual Capital, Llc | Method of manufacturing S-glass fibers in a direct melt operation and products formed therefrom |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61254355A (en) | 1986-11-12 |
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