JPS60172551A - Manufacture of thermal head - Google Patents

Abstract

PURPOSE:To prevent possible deficiency due to a resistance disconnection or a change in the resistance value by forming a heat storage glass layer, a heat generating resistor, an electrode conductor and a resin insulation layer on an insulation substrate and then, a wear resistant layer as film thereon. CONSTITUTION:Tantalium pentoxide as a heat storage glass layer 2, silicon tantalium as a heat generating resistor 3 and copper-containing aluminum as an electrode conductor are laminated on an alumina substrate 1 and sputtered. Then, a pattern formation is performed by photoetching. Thereafter, a heat resistant thermosetting resin is screen printed and sintered as a resin insulation layer 6 and then, a silicon carbide is sputtered as a wear resistant layer 5 using a metal mask. Then, titanium, copper and aluminum are laminated and sputtered as a wire conductor 7 and a pattern formation is done by photoetching.

Description

[Detailed description of the invention] 〔Technical field〕 The present invention relates to a method for manufacturing a thermal head.

[Prior art]

The cross-sectional structure of a conventional thin film thermal head is shown in FIG. 1. In FIG. 1, 1 is an insulating substrate such as alumina, 2 is a heat storage glass layer formed on the insulating substrate, 3 is a heating resistor, 4 is an electrode conductor, 5 is a wear-resistant layer, 6 is a resin insulating layer, and 7 is a wiring conductor.

Generally, the wear-resistant layer 5 includes taratar pentoxide, silicon carbide,
A sputtered film of silicon dioxide or the like is used. By the way, these materials are difficult to etch, and the wear-resistant layer does not require high processing precision, so when sputtering the wear-resistant layer, it is necessary to use a metal mask to shield the parts other than the required parts on the resistor batten. By doing this, the film is formed by a so-called metal mask method that omits the etching step of the wear-resistant layer.

However, with the conventional configuration, if a foreign object is inserted between the metal mask and the thermal head substrate during wear-resistant layer sputtering, thermal expansion due to the temperature rise during wear-resistant layer sputtering, or thermal expansion during substrate setting. Due to misalignment of the metal mask, foreign objects or the metal mask may damage the electrode conductor, causing disconnection of the electrode conductor or a change in resistance value, which poses a problem in terms of manufacturing yield.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a thermal head that prevents the above-mentioned drawbacks and is less likely to cause wire breakage or change in resistance value.

[Structure of the invention]

In the present invention, the insulating substrate 1 is provided with a heat storage glass 21
Heat generating resistor 3. Electrode conductor 4. Wear-resistant layer 5゜Resin insulation layer 6
．． After forming the resin insulation in the thermal head formed by laminating the wiring conductors 7, lT1. The entire feature is that an I wear layer 5 is formed.

[Fist effect of invention]

According to the thermal head of the present invention, since the main part of the electrode conductor is protected by the resin insulating layer, foreign matter may adhere and rub between the metal mask and the thermal head substrate during wear-resistant layer sputtering, or the metal mask and the thermal head may be rubbed together. Even if the head board makes contact.

There is no possibility that the electrode conductor will be damaged.

[Implemented IJ] Hereinafter, the present invention will be described by way of examples with reference to FIG.

On an alumina substrate 1, tantalum pentoxide as a heat storage glass layer 2, tantalum silicon as a heat generating resistor 3, and aluminum containing copper as an electrode conductor 4 were laminated and sputtered, and a V pattern was formed by photolithography.

After that, the resin insulating layer 6 is made of a heat-resistant thermosetting resin.
After approximately 15 μm of p D resin (Hitachi Chemical) was screen printed and beta fired at 270° C., silicon carbide was sputtered with approximately 2.0 μm of silicon carbide as wear resistance #5 using a metal microphone.

Next, a layered layer of titanium, copper, and aluminum was sputtered as a wiring conductor, and a pattern was formed by photolithography.

〔effect〕

With the thermal head according to this embodiment, it was possible to completely prevent the occurrence of defects due to resistor disconnection or change in resistance value due to the use of a metal mask during sputtering of a wear-resistant layer, which was conventional, and it was possible to improve the manufacturing yield.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing the structure of a conventional thermal head, and FIG. 2 is a sectional view showing the structure of the thermal head of the present invention. ■... Insulating substrate, 2... Heat storage glass layer, 3... Heat generating resistor, 4... Electrode conductor, 5... Resistance wear layer. 6... Resin insulating layer, 7... Wiring conductor. ￥2＠

Claims (1)

[Claims] In the method for manufacturing a thermal head in which a heat storage glass layer 1, a heating resistor, an electrode conductor, an abrasion resistant layer, a resin insulating layer, and a wiring conductor are laminated on an insulating substrate, the abrasion resistant layer is formed after forming the resin insulating layer. A method for manufacturing a thermal head characterized by forming a film.