JPH0653452A - Solid state image sensor - Google Patents

Solid state image sensor

Info

Publication number
JPH0653452A
JPH0653452A JP4206312A JP20631292A JPH0653452A JP H0653452 A JPH0653452 A JP H0653452A JP 4206312 A JP4206312 A JP 4206312A JP 20631292 A JP20631292 A JP 20631292A JP H0653452 A JPH0653452 A JP H0653452A
Authority
JP
Japan
Prior art keywords
charge transfer
section
signal
signal output
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4206312A
Other languages
Japanese (ja)
Inventor
Toshiyuki Kozono
利幸 小薗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP4206312A priority Critical patent/JPH0653452A/en
Publication of JPH0653452A publication Critical patent/JPH0653452A/en
Pending legal-status Critical Current

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  • Solid State Image Pick-Up Elements (AREA)

Abstract

PURPOSE:To reduce chip area by employing a signal output from a horizontal charge transfer section at the time of idle feeding as a reference level thereby eliminating OB section. CONSTITUTION:An optical signal is subjected to optoelectric conversion at an optoelectric converting section 11 and stored in the form of signal charge. Signal charge stored at the optoelectric converting section 11 is read out through a vertical charge transfer section 12 and sequentially output from a signal output section 14 through a horizontal charge transfer section 13. Excessive pulses employed at the horizontal charge transfer section 13 causes idle feeding and a signal output at the time of idle feeding is employed, as a reference level, in signal processing at a signal output section 14. Region 15 is an image sensing section where optoelectric converting sections and vertical charge transfer sections are arranged in matrix. This constitution eliminates the need of optoelectric converting section and vertical charge transfer section at an OB section, and a horizontal charge transfer section connected with the vertical charge transfer section at the OB section.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ビデオカメラなどに用
いられる固体撮像装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device used in a video camera or the like.

【0002】[0002]

【従来の技術】固体撮像装置はビデオカメラや監視カメ
ラなどに広く使用されている。以下、図面を参照しなが
ら、従来の固体撮像装置について説明を行う。図2は、
従来の固体撮像装置の平面模式図を示す。図2におい
て、21は光信号を信号電荷に変換し変換した信号電荷
を蓄積するする光電変換部、22は信号電荷を垂直方向
へ転送する垂直電荷転送部、23は垂直転送されてきた
信号電荷を水平方向へ転送する水平電荷転送部、24は
水平転送されてきた信号電荷を出力する信号出力部であ
る。25の領域は光電変換部21と垂直電荷転送部22
を行列状に配列した撮像部、26の領域は表面を遮光膜
で覆い遮光を行った光電変換部21と垂直電荷転送部2
2を行列状に配列したオプティカルブラック部(以下O
B部という)である。
2. Description of the Related Art Solid-state image pickup devices are widely used in video cameras, surveillance cameras and the like. Hereinafter, a conventional solid-state imaging device will be described with reference to the drawings. Figure 2
The plane schematic diagram of the conventional solid-state imaging device is shown. In FIG. 2, 21 is a photoelectric conversion unit that converts an optical signal into a signal charge and stores the converted signal charge, 22 is a vertical charge transfer unit that vertically transfers the signal charge, and 23 is a vertically transferred signal charge. Is a horizontal charge transfer unit for transferring in the horizontal direction, and 24 is a signal output unit for outputting the horizontally transferred signal charges. The area 25 is a photoelectric conversion section 21 and a vertical charge transfer section 22.
In the region of 26, the photoelectric conversion unit 21 and the vertical charge transfer unit 2 in which the surface is covered with a light shielding film to shield light
Optical black part (hereinafter referred to as O
It is called part B).

【0003】このように構成された固体撮像装置につい
て、以下その動作について説明する。まず、光電変換部
21で光信号が光電変換され信号電荷として蓄積され
る。光電変換部21に蓄積された信号電荷は垂直電荷転
送部22に読み出され、順次水平電荷転送部23を経由
して信号出力部24より出力される。この出力される信
号出力はOB部の信号出力を基準レベルにして信号処理
される。
The operation of the solid-state image pickup device configured as described above will be described below. First, the photoelectric conversion unit 21 photoelectrically converts the optical signal and accumulates it as a signal charge. The signal charges accumulated in the photoelectric conversion unit 21 are read out to the vertical charge transfer unit 22 and sequentially output from the signal output unit 24 via the horizontal charge transfer unit 23. The output signal output is signal-processed by using the signal output of the OB unit as a reference level.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、上記の
ような構成では、信号出力の基準レベルを得るために、
撮像部の約5%の面積を必要とするOB部が設けられて
おり、チップ面積が広くなるという欠点を有している。
However, in the above structure, in order to obtain the reference level of the signal output,
The OB portion, which requires about 5% of the area of the image pickup portion, is provided, which has the drawback of increasing the chip area.

【0005】本発明は、上記問題を解決するもので、撮
像部の約5%もの面積を必要とするOB部を省略し、チ
ップ面積を小さくした固体撮像装置を提供することを目
的とするものである。
An object of the present invention is to solve the above problems and to provide a solid-state image pickup device in which the chip area is reduced by omitting the OB portion which requires an area of about 5% of the image pickup portion. Is.

【0006】[0006]

【課題を解決するための手段】この目的を達成するため
に本発明の固体撮像装置は、信号出力の基準レベルとな
るOB領域の占める面積を小さくするために、OB領
域、すなわちOB部の光電変換部と垂直電荷転送部、お
よびOB部の垂直電荷転送部に接続される水平電荷転送
部もしくはその一部を省略したものであり、水平電荷転
送部の信号出力の基準レベルとして水平電荷転送部のか
ら送り時の信号出力を使用するようにしたものである。
In order to achieve this object, the solid-state image pickup device of the present invention is designed to reduce the area occupied by the OB region, which is the reference level of signal output, in order to reduce the photoelectric conversion of the OB region, that is, the OB portion. The horizontal charge transfer unit connected to the conversion unit and the vertical charge transfer unit, and the vertical charge transfer unit of the OB unit or a part thereof is omitted, and the horizontal charge transfer unit is used as a reference level of the signal output of the horizontal charge transfer unit. It is designed to use the signal output at the time of feeding.

【0007】[0007]

【作用】この構成によって、チップ面積の小さい固体撮
像装置を実現することができるとともに、水平電荷転送
部での転送に必要なパルス以上のパルスにより発生する
から送り時の信号を基準パルスとすることにより信号出
力の信号処理に支障をきたすようなことはない。
With this configuration, it is possible to realize a solid-state image pickup device having a small chip area, and a signal at the time of sending is used as a reference pulse because it is generated by a pulse more than the pulse required for transfer in the horizontal charge transfer section. Therefore, the signal processing of the signal output is not hindered.

【0008】[0008]

【実施例】以下本発明の一実施例について、図面を参照
しながら説明する。図1は、本発明の一実施例の固体撮
像装置の平面模式図を示す。図1において、11は光信
号を信号電荷に変換し変換した信号電荷を蓄積するする
光電変換部、12は信号電荷を垂直方向へ転送する垂直
電荷転送部、13は垂直転送されてきた信号電荷を水平
方向へ転送する水平電荷転送部、14は水平転送されて
きた信号電荷を出力する信号出力部である。15の領域
は光電変換部21と垂直電荷転送部22を行列状に配列
した撮像部であり、従来のような、OB部の光電変換部
と垂直電荷転送部、およびOB部の垂直電荷転送部に接
続されている水平電荷転送部は省略されている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows a schematic plan view of a solid-state imaging device according to an embodiment of the present invention. In FIG. 1, 11 is a photoelectric conversion unit that converts an optical signal into a signal charge and stores the converted signal charge, 12 is a vertical charge transfer unit that vertically transfers the signal charge, and 13 is a vertically transferred signal charge. Is a horizontal charge transfer section for transferring in the horizontal direction, and 14 is a signal output section for outputting the signal charges transferred horizontally. A region 15 is an image pickup unit in which the photoelectric conversion units 21 and the vertical charge transfer units 22 are arranged in a matrix, and the photoelectric conversion unit and the vertical charge transfer units of the OB unit and the vertical charge transfer unit of the OB unit as in the related art. The horizontal charge transfer section connected to is omitted.

【0009】このように構成された固体撮像装置につい
て、以下その動作を説明する。まず光電変換部11で光
信号が光電変換され信号電荷として蓄積される。光電変
換部11に蓄積された信号電荷は垂直電荷転送部12に
読み出され、順次水平電荷転送部13を経由して信号出
力部14より出力される。このとき、水平電荷転送部1
3での転送に必要なパルス以上のパルスを用いることに
より、この余分のパルスで、から送りが発生し、このか
ら送り時の信号出力を基準レベルとして信号出力部14
での信号処理を行う。
The operation of the solid-state image pickup device having the above structure will be described below. First, the photoelectric conversion unit 11 photoelectrically converts the optical signal and accumulates it as a signal charge. The signal charges accumulated in the photoelectric conversion unit 11 are read out to the vertical charge transfer unit 12 and sequentially output from the signal output unit 14 via the horizontal charge transfer unit 13. At this time, the horizontal charge transfer unit 1
By using a pulse more than the pulse necessary for the transfer in No. 3, the extra pulse causes the feed, and the signal output unit 14 sets the signal output at the time of the feed as the reference level.
Signal processing in.

【0010】このような固体撮像装置では、撮像部の約
5%の面積を必要とする従来のようなOB部が不要とな
るため、チップ面積を小さくすることができる。以上の
ように本実施例によれば、水平電荷転送部のから送り時
の信号出力を基準レベルとすることで、OB部を省略
し、チップ面積を小さくできる。
In such a solid-state image pickup device, the conventional OB portion, which requires an area of about 5% of the image pickup portion, is not required, so that the chip area can be reduced. As described above, according to the present embodiment, the signal output at the time of sending from the horizontal charge transfer section is set to the reference level, so that the OB section can be omitted and the chip area can be reduced.

【0011】なお、本発明の実施例においては、OB部
の光電変換部と垂直電荷転送部、およびOB部の垂直電
荷転送部に接続される水平電荷転送部を設けない構成と
なっているが、OB部の垂直電荷転送部に接続される水
平電荷転送部の一部のみが省略される構成でもよい。
In the embodiment of the present invention, the photoelectric conversion section and the vertical charge transfer section of the OB section and the horizontal charge transfer section connected to the vertical charge transfer section of the OB section are not provided. , The horizontal charge transfer section connected to the vertical charge transfer section of the OB section may be omitted.

【0012】[0012]

【発明の効果】以上のように本発明によれば、水平電荷
転送部のから送り時の信号出力を基準レベルとすること
で、OB部を省略し、チップ面積の小さい固体撮像素子
を実現することができる。
As described above, according to the present invention, the signal output at the time of sending from the horizontal charge transfer section is used as the reference level, so that the OB section is omitted and a solid-state image pickup device having a small chip area is realized. be able to.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例の固体撮像装置の平面模式図FIG. 1 is a schematic plan view of a solid-state imaging device according to an embodiment of the present invention.

【図2】従来の固体撮像装置の平面模式図FIG. 2 is a schematic plan view of a conventional solid-state imaging device.

【符号の説明】 11 光電変換部 12 垂直電荷転送部 13 水平電荷転送部 14 信号出力部 15 撮像部[Description of Reference Signs] 11 photoelectric conversion unit 12 vertical charge transfer unit 13 horizontal charge transfer unit 14 signal output unit 15 imaging unit

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 行列状に配列された光電変換部と垂直電
荷転送部と水平電荷転送部と信号出力部よりなる固体撮
像装置であって、信号出力の基準レベルとなるOB(オ
プティカルブラック)領域を省略してなり、水平電荷転
送部のから送り時の信号出力を基準レベルとするように
構成したことを特徴とする固体撮像装置。
1. A solid-state imaging device including a photoelectric conversion unit, a vertical charge transfer unit, a horizontal charge transfer unit, and a signal output unit arranged in a matrix, wherein an OB (optical black) region serving as a reference level of signal output. The solid-state imaging device is characterized in that the signal output at the time of sending from the horizontal charge transfer unit is set to the reference level.
【請求項2】 OB領域の光電変換部・垂直電荷転送部
とOB領域の前記垂直電荷転送部に接続される水平電荷
転送部を設けないことを特徴とする請求項1記載の固体
撮像装置。
2. The solid-state imaging device according to claim 1, wherein the photoelectric conversion unit / vertical charge transfer unit in the OB region and the horizontal charge transfer unit connected to the vertical charge transfer unit in the OB region are not provided.
JP4206312A 1992-08-03 1992-08-03 Solid state image sensor Pending JPH0653452A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4206312A JPH0653452A (en) 1992-08-03 1992-08-03 Solid state image sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4206312A JPH0653452A (en) 1992-08-03 1992-08-03 Solid state image sensor

Publications (1)

Publication Number Publication Date
JPH0653452A true JPH0653452A (en) 1994-02-25

Family

ID=16521220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4206312A Pending JPH0653452A (en) 1992-08-03 1992-08-03 Solid state image sensor

Country Status (1)

Country Link
JP (1) JPH0653452A (en)

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