JPH0652981A - Cooking apparatus - Google Patents

Abstract

PURPOSE:To prevent automatic heating and cooking from being erroneously affected by disturbance in an atmospheric sensor caused by high frequency electromagnetic waves, in a cooking apparatus having and atmospheric sensor. CONSTITUTION:A printed board 20 exdusively used for an atmospheric sensor, on which the atmospheric sensor 1 is mounted is disposed and the atmospheric sensor 1 is directly mounted on and fixed to this board. This arrangement leads to a reduced area of an antenna where high frequency electromagnetic waves are superimosed on an atmospheric sensor circuit. Accordingly, the high frequency electromagnetic waves have a reduced effect on the atmospheric sensor, and hence it is possible to prevent automatic heating and cooking from being erroneously performed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooker for automatically heating and cooking food, and more particularly to mounting an atmosphere sensor for use.

[0002]

2. Description of the Related Art In a conventional cooker as a high frequency heating device shown in FIG. 2, for example, a food 11 is placed in a heating chamber 15 and a door 1
2 is closed, and after pressing the key 13 for selecting automatic cooking, the start button 14 is pressed to heat the food 11 and the cooking device stops operating when the food 11 reaches an optimum heating state. It has become. Here, the atmosphere sensor 1 detects the heating state of the food,
As shown in FIG. 3, it is fixed to the exhaust guide 18 of the cooker. The information on the exhaust gas from the heating chamber detected by the atmosphere sensor is transmitted to the printed circuit board 10 via the signal lead wire 16. Then, it is further transmitted from the printed circuit board 10 to a control printed circuit board 17 for controlling the entire cooking device by a lead wire.

As shown in FIG. 4, the lead wire 16 of the atmosphere sensor 1 is connected to the printed circuit board 10 by soldering.

The connection between the printed circuit board 10 and the lead wire 16 is performed by inserting the lead wire 16 into a hole provided in the printed circuit board 10 and passing it through a solder dip bath.
And the copper foil on the printed circuit board 10 are connected by soldering.

Further, as shown in FIG. 5, the atmosphere sensor 1 and the lead wire 16 are connected to each other by handing the electrode pin 2 of the atmosphere sensor 1 in a state in which a lead wire 16 is formed into a ring shape with a core wire and solder coated. After inserting them one by one by the work, as shown in FIG. 6, the solder 19 is melted between the lead wire 16 and the electrode pin 2 with a thread soldering iron to realize the connection and fixation of both.

[0006]

However, in the above-mentioned structure, since the lead wire 16 connecting the atmosphere sensor 1 and the atmosphere sensor dedicated printed circuit board 10 is long, high-frequency electromagnetic waves are likely to be superposed and the signal of the atmosphere sensor 1 is easily superimposed. May disturb. As a result, the automatic cooking may malfunction.

[0007] The present invention solves the above-mentioned conventional problems, and an object thereof is to eliminate the lead wire 16 which serves as an antenna for high frequency electromagnetic waves.

[0008]

In order to solve the above problems, the cooking device of the present invention eliminates the lead wire for signal transmission used between the conventional atmosphere sensor and the printed circuit board and prints the atmosphere sensor only. A substrate is provided and the atmosphere sensor is directly attached and fixed to the substrate.

[0009]

According to the present invention, since the antenna portion on which the high frequency electromagnetic wave is superimposed on the atmosphere sensor circuit is small, the influence of the high frequency electromagnetic wave for heating food of the cooker on the atmosphere sensor signal is reduced.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG. The same components as those in the conventional example used the same signals.

In the present invention, the signal transmission lead wire 16 used between the atmosphere sensor 1 and the printed circuit board 10 in the conventional example.
Is eliminated, and the atmosphere sensor 1 is soldered and fixed to the atmosphere sensor dedicated printed circuit board 20.
Specifically, the through holes 3 and the solder lands thereof are provided at the same pitch interval as the pitch of the electrode pins 2 of the atmosphere sensor 1 on the atmosphere sensor printed board 20 on which the semiconductor 5, the resistor 8, the capacitor 7, etc. are fixed at the same time. After inserting the electrode pin 2 of the atmosphere sensor 1 into this hole, it is fixed by soldering. This allows the atmosphere sensor 1 and the atmosphere sensor-dedicated printed circuit board 20 to be integrated.

Further, the soldered solder land, the semiconductor 5 for signal relay, the resistor 8 and the capacitor 7 are also provided.
An insulating film is usually provided on the copper foil pattern in order to ensure insulation with the copper foil pattern connected to the copper foil pattern. Furthermore, when the distance between the electrode pins of the atmosphere sensor 1 is short and the insulation strength is not sufficiently secured, an insulating coating is provided on the exposed portions of the electrode pins or slits 4 are provided between the electrode pins to increase the creepage distance between the electrode pins. Yes (practically, the creepage distance is 3 mm or more), etc. to reinforce the insulation strength.

According to the structure of this embodiment, since the lead wire for circuit connection is not required, the high frequency electromagnetic wave noise is less likely to be superimposed on the signal of the atmosphere sensor, and the malfunction of the automatic cooking can be prevented. Further, since the lead wire is unnecessary, the material cost can be reduced, and
It is possible to reduce the number of steps for connecting the lead wires, and it is possible to reduce the price.

[0014]

As described above, according to the cooker of the present invention,
The following effects are obtained.

The lead wire for circuit connection between the atmosphere sensor and the semiconductor element, the resistor, the capacitor, etc. on the atmosphere-sensor-dedicated printed circuit board disappears, and the electric wave leaking from the microwave oven becomes
Electromagnetic noise due to a surge current of a relay, a switch, a coil, or the like is less likely to be superimposed on the signal of the atmosphere sensor, and a malfunction of automatic cooking can be prevented.

[Brief description of drawings]

FIG. 1 is a perspective view of a printed circuit board dedicated to an atmosphere sensor according to an embodiment of the present invention.

FIG. 2 is a front view of a conventional cooking device with a door opened.

FIG. 3 is a rear perspective view of the cooking device with the outer shell removed.

FIG. 4 is a perspective view of the same atmosphere, sensor, lead wire, and printed circuit board.

FIG. 5 is an exploded perspective view showing a connection configuration of the same atmosphere sensor and a lead wire.

FIG. 6 is a perspective view in which the same atmosphere sensor and a lead wire are connected by soldering.

[Explanation of symbols]

 1 Atmosphere sensor 20 Printed circuit board for atmosphere sensor

Claims (1)

[Claims] 1. A heating chamber for heating food, a heating source for supplying heating energy to the heating chamber, an air blower for feeding air into the heating chamber, and an exhaust pipe for guiding exhaust air from the heating chamber to the outside of the body. An exhaust guide, an atmosphere sensor fixed to the exhaust guide to detect the state of exhaust air from the heating chamber, an atmosphere sensor dedicated printed circuit board for relaying a detection signal obtained by the atmosphere sensor, A cooker that includes a control printed circuit board that receives a signal from a printed circuit board dedicated to the atmosphere sensor to control the operation of a heating source and adjusts the heating condition of food, and the integrated atmosphere sensor is attached to the printed circuit board dedicated to the atmosphere sensor. .