JP2517201B2 - Cooking device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooker for automatically heating and cooking food, and more particularly to mounting an atmosphere sensor for use.

[0002]

2. Description of the Related Art In a conventional cooker as a high frequency heating device shown in FIG. 2, for example, a food 11 is placed in a heating chamber 15 and a door 1
2 is closed, and after pressing the key 13 for selecting automatic cooking, the start button 14 is pressed to heat the food 11 and the cooking device is stopped when the food 11 reaches an optimum heating state. It has become. Here, the atmosphere sensor 1 detects the heating state of the food,
As shown in FIG. 3, it is fixed to the exhaust guide 18 of the cooker. The information on the exhaust gas from the heating chamber detected by the atmosphere sensor is transmitted to the printed circuit board 10 via the signal lead wire 16. Then, it is further transmitted from the printed circuit board 10 to a control printed circuit board 17 for controlling the entire cooking device by a lead wire.

As shown in FIG. 4, the lead wire 16 of the atmosphere sensor 1 is connected to the printed circuit board 10 by soldering.

The lead wire 16 is connected to the printed circuit board 10 by inserting the lead wire 16 into a hole provided in the printed circuit board 10 and passing it through a solder dip bath.
And the copper foil on the printed circuit board 10 are connected by soldering.

Further, as shown in FIG. 5, the atmosphere sensor 1 and the lead wire 16 are connected to each other by handing the electrode pin 2 of the atmosphere sensor 1 in a state where a lead wire 16 is formed into a ring shape with a core wire and solder coated. After inserting the wires one by one by the work, as shown in FIG. 6, the solder 19 is melted between the lead wire 16 and the electrode pin 2 with a thread soldering iron to realize the connection and fixing of both. What
The electrode pin 2 is mounted on the resin molded base 21 between the four pins.
The distance is maintained, and at the same time, the sensor element is
The child and the heater for heating the child are held by the electrode pin 2.
It

[0006]

However, in the above configuration, since the lead wire 16 connecting the atmosphere sensor 1 and the atmosphere sensor dedicated printed circuit board 10 is long, it is easy for high frequency electromagnetic waves to be superimposed on the signal of the atmosphere sensor 1. May disturb. As a result, the automatic cooking may malfunction.

[0007] The present invention solves the above-mentioned conventional problems, and an object thereof is to eliminate the lead wire 16 which serves as an antenna for high frequency electromagnetic waves.

[0008]

In order to solve the above-mentioned problems, the cooking device of the present invention eliminates the lead wire for signal transmission used between the conventional atmosphere sensor and the printed circuit board and prints the atmosphere sensor only. A substrate is provided and the atmosphere sensor is directly attached and fixed to the substrate.

[0009]

According to the present invention, since the antenna portion on which the high frequency electromagnetic wave is superimposed on the atmosphere sensor circuit is small, the influence of the high frequency electromagnetic wave for heating food of the cooker on the atmosphere sensor signal is reduced.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG. The same components as those in the conventional example used the same signals.

In the present invention, the signal transmission lead wire 16 used between the atmosphere sensor 1 and the printed circuit board 10 in the conventional example.
Is eliminated, and the atmosphere sensor 1 is soldered and fixed to the atmosphere sensor dedicated printed circuit board 20.
Specifically, the through holes 3 and the solder lands thereof are provided at the same pitch as the pitch of the electrode pins 2 of the atmosphere sensor 1 on the atmosphere sensor printed board 20 on which the semiconductor 5, the resistor 8, the capacitor 7, etc. are simultaneously fixed. After inserting the electrode pin 2 of the atmosphere sensor 1 into this hole, it is fixed by soldering. This allows the atmosphere sensor 1 and the atmosphere sensor-dedicated printed circuit board 20 to be integrated.

[0012] In addition, the solder land and the cell in which the above-mentioned soldering
In order to ensure insulation from the copper foil pattern connected to the semiconductor 5, the resistor 8 and the capacitor 7 for relaying the processing of the sensor signal, an insulating film is usually provided on the copper foil pattern. Furthermore, when the distance between the electrode pins of the atmosphere sensor 1 is short and the insulation strength is not sufficiently secured, an insulating coating is provided on the exposed portions of the electrode pins or slits 4 are provided between the electrode pins to increase the creepage distance between the electrode pins. Yes (practically, the creepage distance is 3 mm or more), etc. to reinforce the insulation strength.

According to the structure of this embodiment, the atmosphere sensor
To semiconductor electronic parts for relaying processing of sensor and sensor signals
Since the lead wire for circuit connection is eliminated, high-frequency electromagnetic noise is less likely to be superimposed on the signal of the atmosphere sensor, and malfunction of automatic cooking can be prevented. Further, since the lead wire is not required, the material cost can be reduced, and the man-hour for connecting the lead wire can be reduced, so that the price can be reduced.

[0014]

As described above, according to the cooker of the present invention,
The following effects are obtained.

There is no lead wire for circuit connection between the atmosphere sensor and the semiconductor element, resistor, capacitor, etc. on the atmosphere sensor-dedicated printed circuit board, and there is a leaked electric wave from a microwave oven.
Electromagnetic noise due to a surge current of a relay, a switch, a coil, or the like is less likely to be superimposed on the signal of the atmosphere sensor, and a malfunction of automatic cooking can be prevented.

[Brief description of drawings]

FIG. 1 is a perspective view of a printed circuit board dedicated to an atmosphere sensor according to an embodiment of the present invention.

FIG. 2 is a front view of a conventional cooking device with a door opened.

FIG. 3 is a rear perspective view of the cooking device with the outer shell removed.

FIG. 4 is a perspective view of the same atmosphere, sensor, lead wire, and printed circuit board.

FIG. 5 is an exploded perspective view showing a connection configuration of the same atmosphere sensor and a lead wire.

FIG. 6 is a perspective view in which the same atmosphere sensor and a lead wire are connected by soldering.

[Explanation of symbols]

 1 Atmosphere sensor 20 Printed circuit board for atmosphere sensor

Claims (1)

(57) [Claims] 1. A heating chamber for heating food, a heating source for supplying heating energy to the heating chamber, an air blower for feeding air into the heating chamber, and an exhaust pipe for guiding exhaust gas from the heating chamber to the outside of the body. An exhaust guide, an atmosphere sensor fixed to the exhaust guide for detecting the state of exhaust air from the heating chamber, and an atmosphere sensor dedicated printed circuit board for processing and relaying a detection signal obtained by the atmosphere sensor, Cooking with a control printed circuit board that receives a signal from the printed circuit board for exclusive use of the atmosphere sensor and controls the operation of the heating source to adjust the heating condition of foods vessel.