JPH1167040A - Electromagnetic relay - Google Patents

Electromagnetic relay

Info

Publication number
JPH1167040A
JPH1167040A JP23058097A JP23058097A JPH1167040A JP H1167040 A JPH1167040 A JP H1167040A JP 23058097 A JP23058097 A JP 23058097A JP 23058097 A JP23058097 A JP 23058097A JP H1167040 A JPH1167040 A JP H1167040A
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
relay
frequency
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23058097A
Other languages
Japanese (ja)
Inventor
Kazuhisa Fujii
和久 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP23058097A priority Critical patent/JPH1167040A/en
Publication of JPH1167040A publication Critical patent/JPH1167040A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations

Abstract

PROBLEM TO BE SOLVED: To provide an electromagnetic relay, for reducing the consumed quantity of an expensive glass-fluorine substrate to achieve cost down. SOLUTION: This relay is equipped with a relay main body 1 provided with a contact part driven by an electromagnetic part having a coil to open/close a high-frequency signal, a connector 2 connected to the high-frequency circuit of an electric apparatus, and a printed circuit board 3, wherein connectors 2 positioned on one end part 3a side, and a relay main body 1 are mounted, high-frequency circuit patterns 32c are provided on a board surface, and the connectors 2 and the contact part are electrically connected to the pattern 32c. In this case, the printed circuit board 3 is provided with a first printed circuit board 31 positioned on another end part 3b side, and a second printed circuit board 32 providing at least the patterns 32c, and having smaller dielectric loss compared with the first printed circuit board 31.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、高周波回路に用い
られる電磁継電器に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electromagnetic relay used for a high-frequency circuit.

【0002】[0002]

【従来の技術】従来、この種の電磁継電器として、コイ
ルを有した電磁石部によって駆動されて高周波信号を開
閉する接点部を設けた継電器本体と、電気機器の高周波
回路に接続されるコネクタと、一端部側へ位置したコネ
クタ及び継電器本体が実装されるとともに、基板面に高
周波回路パターンを設けその高周波回路パターンにコネ
クタ及び接点部が電気的に接続されたプリント基板とを
備えた構成のものが存在する。
2. Description of the Related Art Conventionally, as this kind of electromagnetic relay, a relay main body provided with a contact portion which is driven by an electromagnet portion having a coil to open and close a high-frequency signal, a connector connected to a high-frequency circuit of an electric device, A configuration in which a connector and a relay body located on one end side are mounted, and a high-frequency circuit pattern is provided on a substrate surface, and a printed circuit board in which the connector and the contact portion are electrically connected to the high-frequency circuit pattern. Exists.

【0003】さらに詳しくは、プリント基板は分割され
ることなく1枚で構成されて、高周波信号が高周波回路
パターンに伝達されるとき減衰しないよう、又はその高
周波信号に起因する発熱が小さくなるよう、誘電損失の
小さい材質が使用される。
More specifically, the printed circuit board is formed of one sheet without being divided, so that a high-frequency signal is not attenuated when transmitted to a high-frequency circuit pattern, or heat generated by the high-frequency signal is reduced. A material having a small dielectric loss is used.

【0004】[0004]

【発明が解決しようとする課題】上記した従来の電磁継
電器では、誘電損失の小さいプリント基板を使用して高
周波信号の減衰、又は発熱を防止したうえで、接点部が
開閉した高周波信号を高周波回路パターン及びコネクタ
を介して、そのコネクタに接続される電気機器の高周波
回路に伝達できる。
In the above-mentioned conventional electromagnetic relay, a high-frequency signal whose contact portion is opened and closed is prevented by using a printed circuit board having a small dielectric loss to prevent attenuation or heat generation of the high-frequency signal. Via the pattern and the connector, it can be transmitted to a high-frequency circuit of an electric device connected to the connector.

【0005】しかしながら、発明者が特願平8−272
636号にて出願したように、高周波信号の減衰、又は
プリント基板の発熱を防止するために、誘電損失が小さ
く高周波特性の良好なガラスフッソ基板がプリント基板
として用いられる。一方、ガラスエポキシ基板又は紙エ
ポキシ基板は、ガラスフッソ基板と比較して安価である
が誘電損失が大きい。したがって、高価であるにもかか
わらず、誘電損失の小さいガラスフッソ基板をプリント
基板として使用せざるを得ず、このことがコスト高の要
因の一つになっていた。
[0005] However, the inventor disclosed in Japanese Patent Application No. 8-272.
As filed in Japanese Patent Application No. 636, in order to prevent attenuation of a high-frequency signal or heat generation of a printed circuit board, a glass fluorine substrate having a small dielectric loss and good high-frequency characteristics is used as a printed circuit board. On the other hand, a glass epoxy substrate or a paper epoxy substrate is inexpensive as compared with a glass fluorine substrate, but has a large dielectric loss. Therefore, despite being expensive, a glass fluorine substrate having a small dielectric loss has to be used as a printed circuit board, which has been one of the factors of high cost.

【0006】本発明は、上記問題点に鑑みてなしたもの
で、その目的とするところは、高価なガラスフッソ基板
の使用量を減らして、コストダウンを達成できる電磁継
電器を提供することにある。
SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide an electromagnetic relay capable of achieving cost reduction by reducing the amount of expensive glass fluorine substrate used. .

【0007】[0007]

【課題を解決するための手段】上記した課題を解決する
ために、請求項1記載のものは、コイルを有した電磁石
部によって駆動されて高周波信号を開閉する接点部を設
けた継電器本体と、電気機器の高周波回路に接続される
コネクタと、一端部側へ位置したコネクタ及び継電器本
体が実装されるとともに、基板面に高周波回路パターン
を設けその高周波回路パターンにコネクタ及び接点部が
電気的に接続されたプリント基板とを備えた電磁継電器
において、前記プリント基板は他端部側へ位置した第1
プリント基板と、少なくとも前記高周波回路パターンを
設け誘電損失が第1プリント基板と比較して小さい第2
プリント基板とで構成してある。
In order to solve the above-mentioned problem, the present invention is directed to a relay body having a contact portion which is driven by an electromagnet portion having a coil to open and close a high-frequency signal, A connector to be connected to the high-frequency circuit of the electrical equipment, a connector and a relay body located on one end side are mounted, and a high-frequency circuit pattern is provided on the board surface, and the connector and the contact portion are electrically connected to the high-frequency circuit pattern. The printed circuit board, wherein the printed circuit board is located on the other end side.
A printed circuit board, and a second circuit board provided with at least the high-frequency circuit pattern and having a dielectric loss smaller than that of the first printed circuit board.
It consists of a printed circuit board.

【0008】請求項2記載のものは、請求項1記載のも
のにおいて、前記継電器本体は前記コイルと接続したコ
イル端子及びそのコイル端子の反対側へ位置して前記接
点部と接続した接点端子がそれぞれ並設されたものであ
って、コイル端子が前記第1プリント基板に接点端子が
前記第2プリント基板にそれぞれ半田実装された構成に
してある。
According to a second aspect of the present invention, in the first aspect, the relay main body has a coil terminal connected to the coil and a contact terminal located on the opposite side of the coil terminal and connected to the contact portion. The coil terminals are arranged side by side, and the coil terminals are mounted on the first printed circuit board, and the contact terminals are mounted on the second printed circuit board, respectively.

【0009】請求項3記載のものは、請求項1又は請求
項2記載のものにおいて、前記継電器本体の電磁石部を
制御する制御用集積回路部に接続した制御回路用配線パ
ターンが、前記第1プリント基板に形成された構成にし
てある。
According to a third aspect of the present invention, in the first or second aspect, the control circuit wiring pattern connected to the control integrated circuit section for controlling the electromagnet section of the relay main body is the first pattern. It is configured to be formed on a printed circuit board.

【0010】[0010]

【発明の実施の形態】本発明の一実施形態を図1乃至図
3に基づいて以下に説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS.

【0011】1は継電器本体で、ベース(図示せず)に
載置されてコイル(図示せず)を有した電磁石部(図示
せず)及び接点部(図示せず)がケース1aに収納され
た構成を有する。コイルと接続した2個のコイル端子1
1と、そのコイル端子11の反対側へ位置して接点部に
電気的に接続された3個の接点端子12、及び4個のグ
ランド端子(図示せず)とがそれぞれ両側へ位置して並
設された状態で、ベースから導出される。ここで、接点
端子12がコモン端子、常開端子、及び常閉端子の3個
で構成され、接点部が電磁石部によって駆動されて、コ
モン端子と常閉端子、及びコモン端子と常開端子との間
で高周波信号を開閉する。
Reference numeral 1 denotes a relay main body. An electromagnet section (not shown) mounted on a base (not shown) and having a coil (not shown) and a contact section (not shown) are housed in a case 1a. It has a configuration. Two coil terminals 1 connected to a coil
1, three contact terminals 12 located on the opposite side of the coil terminal 11 and electrically connected to the contact portions, and four ground terminals (not shown) are located on both sides and are arranged side by side. Once installed, it is derived from the base. Here, the contact terminal 12 is composed of three parts: a common terminal, a normally open terminal, and a normally closed terminal, and the contact part is driven by the electromagnet part, and the common terminal and the normally closed terminal, and the common terminal and the normally open terminal are connected to each other. Open and close high frequency signals between

【0012】2はコネクタで、円筒状の中心導体と、同
軸的に円筒状に形成され接地される外側導体とを備え、
4個のアース端子21及び中心導体と電気的に接続した
信号端子22がそれぞれ導出されている。そして、後述
するプリント基板3の一端部3a側へ位置した状態で実
装されて、ケース本体2aの側面に形成した透孔を通し
て、継電器本体1と共にカバーされる器体23の外側面
に一部が突出して、電気機器の高周波回路に接続され
る。また、3個設けられて、各コネクタ2が器体23の
一面に露出するよう一列に並設されて、外側導体が接地
側であるからケース本体2aと接触させてある。
Reference numeral 2 denotes a connector having a cylindrical central conductor, an outer conductor formed coaxially in a cylindrical shape and grounded,
The four ground terminals 21 and the signal terminals 22 electrically connected to the center conductor are led out. Then, it is mounted in a state where it is positioned on one end 3a side of the printed circuit board 3 described later, and a part is formed on an outer surface of the body 23 covered with the relay body 1 through a through hole formed on a side surface of the case body 2a. It protrudes and is connected to the high frequency circuit of the electric device. In addition, three connectors are provided, and the connectors 2 are arranged in a line so as to be exposed on one surface of the body 23, and are in contact with the case body 2a because the outer conductor is on the ground side.

【0013】3はプリント基板で、一端部3a及び他端
部3bを有し、図1におけるラインLを境界にして他端
部3b側へ位置した第1プリント基板31と、一端部3
a側へ位置した第2プリント基板32とで構成される。
第1プリント基板31は、薄板状に形成され、ガラス繊
維又は紙にそれぞれエポキシ樹脂を含浸した安価なガラ
スエポキシ基板又は紙エポキシ基板により、継電器本体
1のコイル端子11を挿入するコイル端子挿入孔31a
が2個設けられる。さらに、コイル端子挿入孔31aを
外囲するとともに、継電器本体1の電磁石部を駆動して
接点部を開閉させる制御回路用配線パターン31bが、
基板面の一面3c側へ形成される。ここで、ガラスエポ
キシ基板又は紙エポキシ基板が高寸法精度で配線パター
ンを形成しやすいので、高精度で微細な制御回路用配線
パターン31bが容易にに形成される。
A printed circuit board 3 has one end 3a and the other end 3b. The first printed circuit board 31 is located on the other end 3b side with respect to the line L in FIG.
and the second printed circuit board 32 located on the side a.
The first printed circuit board 31 is formed in a thin plate shape, and is made of an inexpensive glass epoxy paper or paper epoxy board in which glass fiber or paper is impregnated with an epoxy resin, and a coil terminal insertion hole 31a for inserting the coil terminal 11 of the relay body 1.
Are provided. Further, a control circuit wiring pattern 31b which surrounds the coil terminal insertion hole 31a and drives the electromagnet portion of the relay main body 1 to open and close the contact portion is provided.
It is formed on one surface 3c side of the substrate surface. Here, since the glass epoxy board or the paper epoxy board can easily form a wiring pattern with high dimensional accuracy, a fine and precise control circuit wiring pattern 31b can be easily formed.

【0014】第2プリント基板32は、薄板状に形成さ
れ、ガラス繊維にテフロン等のフッソ樹脂を含浸した高
価なガラスフッソ基板により、誘電損失が第1プリント
基板31と比較して小さく高周波特性が良好であって、
一端部3a側へコネクタ2が3個並設される。
The second printed circuit board 32 is formed in a thin plate shape, and is made of an expensive glass fluorine substrate in which glass fiber is impregnated with a fluorine resin such as Teflon. Good,
Three connectors 2 are arranged side by side on one end 3a side.

【0015】継電器本体1の接点端子12が挿入される
接点端子挿入孔32a、及びコネクタ2の信号端子22
が挿入される信号端子挿入孔32bが3個設けられて、
その接点端子挿入孔32a及び信号端子挿入孔32bを
外囲した高周波回路パターン32cが基板面の一面3c
側へ形成され、接点部及び信号端子22を電気的に接続
する。そして、高周波回路パターン32cが3個設けら
れて、中央の一個が略I字型に、両側の2個が略L字型
にそれぞれ形成される。
A contact terminal insertion hole 32a into which the contact terminal 12 of the relay body 1 is inserted, and the signal terminal 22 of the connector 2
Are provided with three signal terminal insertion holes 32b into which
The high-frequency circuit pattern 32c surrounding the contact terminal insertion hole 32a and the signal terminal insertion hole 32b is formed on one surface 3c of the substrate surface.
Side, and electrically connects the contact portion and the signal terminal 22. Then, three high-frequency circuit patterns 32c are provided, and one at the center is formed in a substantially I-shape, and two on both sides are formed in a substantially L-shape.

【0016】また、各コネクタ2に対応して4個のアー
ス端子挿入孔32dが設けられ、各コネクタ2のアース
端子21が挿入される。さらに、4個のグランド端子挿
入孔32eが設けられ、継電器本体1のグランド端子が
挿入される。各アース端子挿入孔32d及び各グランド
端子挿入孔32eを外囲したアースパターン32fが、
高周波回路パターン32cを残して他の部分のほぼ全面
に亙って基板面の一面3cに形成される。つまり、高周
波回路パターン32cの周囲を全周に亙って囲む形でア
ースパターン32fが形成されて、高周波信号の輻射や
外部からのノイズの影響を軽減する。
Also, four ground terminal insertion holes 32d are provided corresponding to each connector 2, and the ground terminal 21 of each connector 2 is inserted. Further, four ground terminal insertion holes 32e are provided, into which the ground terminals of the relay main body 1 are inserted. A ground pattern 32f surrounding each ground terminal insertion hole 32d and each ground terminal insertion hole 32e is
Except for the high-frequency circuit pattern 32c, it is formed on one surface 3c of the substrate surface over substantially the entire other portion. That is, the ground pattern 32f is formed so as to surround the high-frequency circuit pattern 32c over the entire circumference, thereby reducing the influence of high-frequency signal radiation and external noise.

【0017】4は制御用集積回路部で、第1プリント基
板31の他面3d側基板面に実装され、基板面の一面3
c側へ形成された制御回路用配線パターン31bに接続
されて、継電器本体1のコイルを励磁し電磁石部を駆動
し制御して接点部を開閉させる。樹脂カバー5は、樹脂
により、平板状に形成され、挿通孔が設けられる。
Reference numeral 4 denotes a control integrated circuit portion, which is mounted on the other surface 3d side substrate surface of the first printed circuit board 31 and is connected to one surface 3 of the substrate surface.
Connected to the control circuit wiring pattern 31b formed on the c side, the coil of the relay main body 1 is excited to drive and control the electromagnet section to open and close the contact section. The resin cover 5 is formed in a flat plate shape with resin, and is provided with an insertion hole.

【0018】ここで、継電器本体1及びコネクタ2はプ
リント基板3の一面3c側基板面にそれぞれ半田実装さ
れる。すなわち、継電器本体1は2個のコイル端子11
が第1プリント基板31のコイル端子挿入孔31aに挿
入され半田付けされて、制御回路用配線パターン31b
と接続する。
Here, the relay body 1 and the connector 2 are mounted on the printed circuit board 3 on one surface 3c side by soldering, respectively. That is, the relay main body 1 has two coil terminals 11.
Is inserted into the coil terminal insertion hole 31a of the first printed circuit board 31 and soldered to form the control circuit wiring pattern 31b.
Connect with

【0019】また、3個の接点端子12が第2プリント
基板32の接点端子挿入孔32aに挿入され半田付けさ
れて、コモン端子が中央の高周波回路パターン32c
に、常開端子及び常閉端子が両側の高周波回路パターン
32cにそれぞれ接続される。また、4個のグランド端
子が第2プリント基板32のグランド端子挿入孔32e
に挿入され半田付けされて、アースパターン32fと接
続する。このようにして、第1プリント基板31及び第
2プリント基板32が、継電器本体1でもってそれぞれ
一体化されて結合される。
The three contact terminals 12 are inserted into the contact terminal insertion holes 32a of the second printed circuit board 32 and soldered, and the common terminal is connected to the central high-frequency circuit pattern 32c.
The normally open terminal and the normally closed terminal are respectively connected to the high frequency circuit patterns 32c on both sides. Also, four ground terminals are provided in the ground terminal insertion holes 32e of the second printed circuit board 32.
And soldered to connect to the ground pattern 32f. In this way, the first printed circuit board 31 and the second printed circuit board 32 are integrated and connected by the relay body 1 respectively.

【0020】各コネクタ2は信号端子22が、第2プリ
ント基板32の信号端子挿入孔32bに挿入され半田付
けされて、高周波回路パターン32cと接続して、継電
器本体1の接点部と電気的に接続する。また、4個のア
ース端子21が第2プリント基板32のアース端子挿入
孔32dに挿入され半田付けされて、アースパターン3
2fと接続する。このようにして、プリント基板3の一
端部3a側へ位置した状態で並設される。そして、樹脂
カバー5はコイル端子11、接点端子12、アース端子
21及び信号端子22が挿通孔に挿通された状態で、プ
リント基板3の他面3d側に実装される。
In each connector 2, the signal terminal 22 is inserted into the signal terminal insertion hole 32b of the second printed circuit board 32, soldered, connected to the high frequency circuit pattern 32c, and electrically connected to the contact portion of the relay main body 1. Connecting. The four ground terminals 21 are inserted into the ground terminal insertion holes 32d of the second printed circuit board 32 and soldered to form the ground pattern 3.
Connect to 2f. In this way, the printed circuit boards 3 are juxtaposed while being positioned on the one end 3a side. The resin cover 5 is mounted on the other surface 3d of the printed circuit board 3 with the coil terminals 11, the contact terminals 12, the ground terminals 21 and the signal terminals 22 inserted through the insertion holes.

【0021】このものの動作を説明する。第1プリント
基板31に実装された制御用集積回路部4は、継電器本
体1の電磁石部を励磁し駆動すると、接点部は接点端子
12間、つまりコモン端子と常閉端子、及びコモン端子
と常開端子との間で高周波信号を開閉する。高周波信号
は接点端子12、及び高周波回路パターン32cを介し
て各コネクタ2の信号端子22に伝達されて、その各コ
ネクタ2に接続された電気機器の高周波回路に伝達され
る。
The operation of the above will be described. When the control integrated circuit unit 4 mounted on the first printed board 31 excites and drives the electromagnet unit of the relay main body 1, the contact unit is between the contact terminals 12, that is, the common terminal and the normally closed terminal, and the common terminal is normally connected to the common terminal. Opens and closes high-frequency signals with the open terminal. The high-frequency signal is transmitted to the signal terminal 22 of each connector 2 via the contact terminal 12 and the high-frequency circuit pattern 32c, and transmitted to the high-frequency circuit of the electric device connected to each connector 2.

【0022】第2プリント基板32は高周波回路パター
ン32cとアースパターン32fとを、すなわち少なく
とも高周波回路パターン32cを設け、その高周波回路
パターン32cに高周波信号が流れたとき、第1プリン
ト基板31と比較して誘電損失が小さく高周波特性が良
好であるので、高周波信号が減衰することなく伝達され
て、かつ発熱が生じることもない。
The second printed circuit board 32 is provided with a high-frequency circuit pattern 32c and an earth pattern 32f, that is, at least a high-frequency circuit pattern 32c. When a high-frequency signal flows through the high-frequency circuit pattern 32c, the second printed circuit board 32 is compared with the first printed circuit board 31. Since the dielectric loss is small and the high-frequency characteristics are good, the high-frequency signal is transmitted without attenuation and no heat is generated.

【0023】一方、第1プリント基板31は第2プリン
ト基板32と比較して、誘電損失が大きいガラスエポキ
シ基板又は紙エポキシ基板であるが、高周波信号が流れ
ず、したがって発熱が生じることもない。
On the other hand, the first printed board 31 is a glass epoxy board or a paper epoxy board having a larger dielectric loss than the second printed board 32. However, no high-frequency signal flows and therefore no heat is generated.

【0024】かかる一実施形態の電磁継電器にあって
は、上記したように、第1プリント基板31と、誘電損
失が第1プリント基板31に比較して小さく少なくとも
高周波回路パターン32cを設けた第2プリント基板3
2とでプリント基板3が構成されたから、高周波信号が
高周波回路パターン32cに伝達されても、高周波信号
の減衰又はその高周波信号に起因した発熱を防止できる
とともに、第1プリント基板31を誘電損失が大きいが
安価なガラスエポキシ基板又は紙エポキシ樹脂基板でも
って形成して、高価なガラスフッソ基板の使用量を減ら
しコストダウンを達成することができる。
In the electromagnetic relay of this embodiment, as described above, the first printed circuit board 31 and the second printed circuit board having at least the high-frequency circuit pattern 32c having a smaller dielectric loss than the first printed circuit board 31 are provided. Printed circuit board 3
2, the printed circuit board 3 is constituted, so that even if a high-frequency signal is transmitted to the high-frequency circuit pattern 32c, attenuation of the high-frequency signal or heat generation due to the high-frequency signal can be prevented, and the first printed circuit board 31 has dielectric loss. By using a large but inexpensive glass epoxy substrate or paper epoxy resin substrate, it is possible to reduce the amount of expensive glass fluoro substrate used and achieve cost reduction.

【0025】また、継電器本体1がコイルと接続したコ
イル端子11、及びそのコイル端子11の反対側へ位置
して接点部と接続した接点端子12がそれぞれ並設され
たものであれば、コイル端子11が第1プリント基板3
1に、接点端子12が第2プリント基板32にそれぞれ
半田実装されたから、第1プリント基板31と第2プリ
ント基板32とを継電器本体1でもって、締結部品を用
いることなく一体化し結合することができる。
If the relay terminal 1 has a coil terminal 11 connected to a coil and a contact terminal 12 located on the opposite side of the coil terminal 11 and connected to a contact portion, the coil terminal 11 is provided in parallel. 11 is the first printed circuit board 3
First, since the contact terminals 12 are each solder-mounted on the second printed circuit board 32, the first printed circuit board 31 and the second printed circuit board 32 can be integrated and connected with the relay main body 1 without using fastening parts. it can.

【0026】また、制御用集積回路部4に接続した制御
回路用配線パターン31bが第1プリント基板31に形
成されたから、第1プリント基板31が高寸法精度で配
線パターンを形成しやすいガラスエポキシ基板又は紙エ
ポキシ基板であるので、制御回路用配線パターン31b
を容易に高精度化し微細化することができる。
Further, since the control circuit wiring pattern 31b connected to the control integrated circuit section 4 is formed on the first printed circuit board 31, the first printed circuit board 31 is a glass epoxy substrate on which the wiring pattern can be easily formed with high dimensional accuracy. Or, since it is a paper epoxy board, the control circuit wiring pattern 31b
Can be easily refined and miniaturized.

【0027】なお、本実施形態では、継電器本体の電磁
石部を制御する制御用集積回路部4を第1プリント基板
31に実装するとともに、その制御用集積回路部4に接
続した制御回路用配線パターン31bを第1プリント基
板31に形成したが、制御用集積回路部4が別のプリン
ト基板に実装されるときは、制御回路用配線パターン3
1bを第1プリント基板に形成しなくてもよく、限定さ
れない。
In this embodiment, the control integrated circuit section 4 for controlling the electromagnet section of the relay body is mounted on the first printed circuit board 31 and the control circuit wiring pattern connected to the control integrated circuit section 4 is mounted. 31b is formed on the first printed circuit board 31, but when the control integrated circuit section 4 is mounted on another printed circuit board, the control circuit wiring pattern 3
1b may not be formed on the first printed circuit board, and is not limited.

【0028】[0028]

【発明の効果】請求項1記載のものは、第1プリント基
板と、誘電損失が第1プリント基板に比較して小さく少
なくとも高周波回路パターンを設けた第2プリント基板
とでプリント基板が構成されたから、高周波信号が高周
波回路パターンに伝達されても、高周波信号の減衰又は
その高周波信号に起因した発熱を防止できるとともに、
第1プリント基板を誘電損失が大きいが安価なガラスエ
ポキシ基板又は紙エポキシ樹脂基板でもって形成して、
高価なガラスフッソ基板の使用量を減らしコストダウン
を達成することができる。
According to the first aspect of the present invention, the printed circuit board is composed of the first printed circuit board and the second printed circuit board provided with at least a high-frequency circuit pattern having a smaller dielectric loss than the first printed circuit board. Even if the high-frequency signal is transmitted to the high-frequency circuit pattern, it is possible to prevent the attenuation of the high-frequency signal or the heat generated by the high-frequency signal,
The first printed circuit board is formed by a glass epoxy board or a paper epoxy resin board which has a large dielectric loss but is inexpensive,
The cost can be reduced by reducing the amount of expensive glass fluorine substrate used.

【0029】請求項2記載のものは、請求項1記載のも
のの効果に加えて、継電器本体がコイルと接続したコイ
ル端子、及びそのコイル端子の反対側へ位置して接点部
と接続した接点端子がそれぞれ並設されたものであれ
ば、コイル端子が第1プリント基板に、接点端子が第2
プリント基板にそれぞれ半田実装されたから、第1プリ
ント基板と第2プリント基板とを継電器本体でもって、
締結部品を用いることなく一体化し結合することができ
る。
According to a second aspect of the present invention, in addition to the effect of the first aspect, a coil terminal in which a relay main body is connected to a coil, and a contact terminal which is located on the opposite side of the coil terminal and is connected to a contact portion. Are arranged side by side, the coil terminal is on the first printed circuit board, and the contact terminal is on the second printed circuit board.
Since the first printed circuit board and the second printed circuit board were respectively mounted on the printed circuit board by soldering,
It can be integrated and connected without using fastening parts.

【0030】請求項3記載のものは、請求項1又は請求
項2記載のものの効果に加えて、制御用集積回路部に接
続した制御回路用配線パターンが第1プリント基板に形
成されたから、第1プリント基板が高寸法精度で配線パ
ターンを形成しやすいガラスエポキシ基板又は紙エポキ
シ基板で形成して、制御回路用配線パターン3を容易に
高精度化し微細化することができる。
According to the third aspect, in addition to the effects of the first or second aspect, the control circuit wiring pattern connected to the control integrated circuit portion is formed on the first printed circuit board. Since one printed circuit board is formed of a glass epoxy board or a paper epoxy board on which a wiring pattern can be easily formed with high dimensional accuracy, the control circuit wiring pattern 3 can be easily made highly precise and miniaturized.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施形態を示すプリント基板の平面
図である。
FIG. 1 is a plan view of a printed circuit board according to an embodiment of the present invention.

【図2】同上の継電器本体及びコネクタがプリント基板
に実装された状態の正面図である。
FIG. 2 is a front view showing a state where the relay main body and the connector are mounted on a printed circuit board.

【図3】同上の平面図である。FIG. 3 is a plan view of the same.

【符号の説明】[Explanation of symbols]

1 継電器本体 11 コイル端子 12 接点端子 2 コネクタ 3 プリント基板 3a 一端部 3b 他端部 31 第1プリント基板 31b 制御回路用配線パターン 32 第2プリント基板 32c 高周波回路パターン 4 制御用集積回路部 REFERENCE SIGNS LIST 1 relay body 11 coil terminal 12 contact terminal 2 connector 3 printed board 3 a one end 3 b other end 31 first printed board 31 b wiring pattern for control circuit 32 second printed board 32 c high-frequency circuit pattern 4 integrated circuit section for control

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 コイルを有した電磁石部によって駆動さ
れて高周波信号を開閉する接点部を設けた継電器本体
と、電気機器の高周波回路に接続されるコネクタと、一
端部側へ位置したコネクタ及び継電器本体が実装される
とともに、基板面に高周波回路パターンを設けその高周
波回路パターンにコネクタ及び接点部が電気的に接続さ
れたプリント基板とを備えた電磁継電器において、 前記プリント基板は他端部側へ位置した第1プリント基
板と、少なくとも前記高周波回路パターンを設け誘電損
失が第1プリント基板と比較して小さい第2プリント基
板とで構成されたことを特徴とする電磁継電器。
1. A relay body provided with a contact portion driven by an electromagnet portion having a coil to open and close a high-frequency signal, a connector connected to a high-frequency circuit of an electric device, a connector located on one end side, and a relay. A printed circuit board on which the main body is mounted and a high-frequency circuit pattern is provided on the board surface, and a connector and a contact portion are electrically connected to the high-frequency circuit pattern. An electromagnetic relay comprising: a first printed circuit board located at a position; and a second printed circuit board provided with at least the high-frequency circuit pattern and having a smaller dielectric loss than the first printed circuit board.
【請求項2】 前記継電器本体は前記コイルと接続した
コイル端子及びそのコイル端子の反対側へ位置して前記
接点部と接続した接点端子がそれぞれ並設されたもので
あって、コイル端子が前記第1プリント基板に接点端子
が前記第2プリント基板にそれぞれ半田実装されたこと
を特徴とする請求項1記載の電磁継電器。
2. The relay body, wherein a coil terminal connected to the coil and a contact terminal located on the opposite side of the coil terminal and connected to the contact portion are arranged side by side. The electromagnetic relay according to claim 1, wherein the contact terminals are mounted on the first printed circuit board by soldering, respectively.
【請求項3】 前記継電器本体の電磁石部を制御する制
御用集積回路部に接続した制御回路用配線パターンが、
前記第1プリント基板に形成されたことを特徴とする請
求項1又は請求項2記載の電磁継電器。
3. A control circuit wiring pattern connected to a control integrated circuit section for controlling an electromagnet section of the relay main body,
The electromagnetic relay according to claim 1, wherein the electromagnetic relay is formed on the first printed circuit board.
JP23058097A 1997-08-27 1997-08-27 Electromagnetic relay Pending JPH1167040A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23058097A JPH1167040A (en) 1997-08-27 1997-08-27 Electromagnetic relay

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23058097A JPH1167040A (en) 1997-08-27 1997-08-27 Electromagnetic relay

Publications (1)

Publication Number Publication Date
JPH1167040A true JPH1167040A (en) 1999-03-09

Family

ID=16909976

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23058097A Pending JPH1167040A (en) 1997-08-27 1997-08-27 Electromagnetic relay

Country Status (1)

Country Link
JP (1) JPH1167040A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150373847A1 (en) * 2014-06-18 2015-12-24 Intel Corporation Modular printed circuit board
US9900983B2 (en) 2014-06-18 2018-02-20 Intel Corporation Modular printed circuit board electrical integrity and uses

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150373847A1 (en) * 2014-06-18 2015-12-24 Intel Corporation Modular printed circuit board
US9829915B2 (en) * 2014-06-18 2017-11-28 Intel Corporation Modular printed circuit board
US9900983B2 (en) 2014-06-18 2018-02-20 Intel Corporation Modular printed circuit board electrical integrity and uses

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