JPH0633639Y2 - High frequency relay - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION "Industrial application field" The present invention relates to a high-frequency relay used in a high-frequency circuit or a circuit that handles a high-frequency pulse that sharply rises and falls.

"Prior Art" Fig. 8 shows the structure of a conventional high-frequency relay. In the figure, 1 is an insulating plate, 2A, 2B, 2C are terminals supported by penetrating the insulating plate 1, 3 is a reed relay, 4 is a conductive pipe mounted on the outer periphery of the reed relay 3, and 5 is this conductive pipe. An exciting coil wound around the outer circumference of 4 and a shield case 6 are shown.

The leads 3A and 3B of the reed relay 3 are electrically and mechanically connected to the terminals 2A and 2B planted in the insulating plate 1, and the conductive pipe 4 is used.
Is connected to terminal 2C.

In this way, the leads 3A and 3B of the reed relay 3 and the conductive pipe 4 form a kind of coaxial structure and have a certain characteristic impedance.

The conductive pipe 4 is made of a non-magnetic material such as copper, and the reed relay 3 is controlled by controlling the exciting coil 5 wound around the outer circumference of the conductive pipe 4 in an excited or non-excited state (exciting coil terminals are omitted). It has a structure for turning on and off.

[Problems to be Solved by the Invention] In the conventional high-frequency relay, the portion where the conductive pipe 4 is mounted has the impedance matched to a predetermined impedance, but the portions A and B not covered by the conductive pipe 4 have the impedance matched. I can't take it. For this reason, there is a drawback that reflection or the like occurs at this portion and the waveform is distorted.

For this reason, the portions A and B should be made as short as possible, but especially when the protrusion amount of the terminals 2A and 2B from the insulating plate 1 is made small, expansion and contraction due to thermal expansion of the leads 3A and 3B of the reed relay 3 is absorbed. The inconvenience that it becomes impossible to do occurs.

In other words, since the reed relay 3 uses a glass container as is well known, the leads 3A and 3B pulled out from the glass container are used.
There is a drawback that the glass container will be damaged when a large force is applied to it.

Therefore, conventionally, the leads 3A and 3B of the reed relay 3 are electrically and mechanically coupled to the tips of the terminals protruding from the insulating plate 1, and when the reed relay 3 expands and contracts due to thermal expansion, the terminals 2A and 2B are The reed relay 3 is bent so that a large force is not applied, as shown by the dotted line in FIG.

For this reason, impedance mismatching parts A and B
There is an inconvenience that the length cannot be shortened.

An object of the present invention is to provide a high-frequency relay having a novel structure in which the reed relay is safely protected against expansion and contraction due to thermal expansion, and there is no impedance mismatching portion.

[Means for Solving the Problems] In the present invention, a planar waveguide in which a signal line and a common potential conductor are formed on a flexible insulating plate and the characteristic impedance of the signal line is maintained at a predetermined impedance is provided. The two flexible wiring boards that are held and are arranged so that their plate surfaces face each other, and the leads that are inserted between the two flexible wiring boards and that are led out from one side and the other side are flexible. A reed relay connected to the signal line through a through hole formed in the wiring board; and a conductive pipe mounted on the outer periphery of the reed relay and having terminals formed at both ends connected to a common potential conductor of the flexible wiring board. A high-frequency relay is constituted by an exciting coil wound around the outer circumference of the conductive pipe to control the reed relay.

[Operation] According to the configuration of the present invention, the lead of the reed relay is connected to the signal line formed on the flexible wiring board, and both ends of the conductive pipe are electrically connected to the common potential conductor of the flexible board. .

Since the signal line formed on the flexible wiring board is formed so as to have a predetermined impedance, no mismatched portion is generated.

Further, since both leads of the reed relay are supported by the flexible wiring board, even if the reed relay expands and contracts due to thermal expansion, the flexible wiring board is not deformed and a large stress is not applied to the reed relay.

Therefore, according to the present invention, it is possible to provide a high-frequency relay that has no impedance mismatching portion and can safely protect the reed relay against temperature changes.

"Embodiment" FIGS. 1 to 4 show an embodiment of the present invention.

In FIG. 1, reference numeral 1 indicates an insulating plate. In this invention, the flexible wiring boards 11A and 11B are attached to both end surfaces of the insulating plate 1, and the two flexible wiring boards 11A and 11B are arranged with their plate surfaces facing each other.

The flexible wiring boards 11A and 11B have a signal line 12 formed so that the characteristic impedance maintains a predetermined impedance.
(See FIG. 2) and common potential conductor 13 (see FIG. 3).

That is, the signal line 12 and the common potential conductor 13 form a planar transmission line. In this example, a so-called microstrip line is used in which a strip line forming the signal line 12 is formed on one surface of the flexible dielectric substrate and a common potential conductor 13 is formed on the other surface. In addition to the microstrip line, for example, a coplanar line having a strip line and a common potential line formed on one surface can be used.

In this example, the flexible wiring boards 11A and 11B are connected to the common potential conductor 1
The case where the surfaces on which 3 is formed face each other are attached to the insulating plate 1.

Therefore, a hole 14 (see FIG. 4) penetrating the back side is formed in the portion of the signal line 12 formed on the front side, and the leads 3A and 3B of the reed relay 3 are inserted through this hole to connect the reed relay 3 to the signal line 1.
Electrically connect to 2. In this case, the hole 14 is a through hole as shown in FIG. 5, and the leads 3A, 3 of the reed switch 3 are used.
It can be configured so that the connection between B and the signal line 12 is surely made.

The conductive pipe 4 has terminals 4A at both ends as shown in FIG.
And the terminal 4A is inserted into the hole 15 formed in the common potential conductor 13, and the conductive pipe 4 is formed by, for example, soldering.
Are electrically and mechanically attached to the common potential conductor 13.

On the front side of the flexible wiring boards 11A and 11B, as shown in FIGS. 2 and 3, in addition to the signal line 12, a common potential terminal 16 connected to a common potential conductor 13 formed on the back surface by a through hole is formed.
And exciting terminals 5A and 5B for applying an exciting current to the exciting coil 5 are formed. In this example, as shown in FIG. 1, the exciting coil 5 is wound around the insulating bobbin 17, and the conductive pipe 4 is inserted into the through hole of the insulating bobbin 17.

Further, as shown in FIG. 3, a cover 18 is attached to the gaps between the flexible wiring boards 11A and 11B facing each other, and a signal line 21 in which a signal line 12 and a common potential conductor 13 are formed on a printed wiring board 19;
Connected to the common potential pattern 22 and the exciting current supply terminal 23 respectively, a high-frequency relay with a surface mount structure is printed wiring board.
Can be implemented in 19.

As shown in FIG. 5, the common potential conductor 13 is placed close to the through hole 14 through which the leads 3A and 3B of the reed relay 3 are penetrated.
It is conceivable to provide a compensation through hole 23 connected to the.

By providing this compensation through hole 23, the characteristic impedance of the through hole 14 through which the leads 3A and 3B of the reed relay 3 pass can be made closer to the impedance of other portions.

In other words, the reeds 3A and 3B of the reed relay 3 can be made to have a desired impedance by the coaxial structure with the conductive pipe 4, and the signal line 12 formed on the flexible wiring boards 11A and 11B can be made to have a desired impedance by the planar transmission line structure. it can.

However, the portion of the through hole 14 is a small section but does not have an impedance matching structure. Therefore, the through hole 23 that has a common potential close to the through hole 23
By providing, the impedance of the through hole 14 can be made equal to the impedance of the other portions and matched.

"Modified Embodiment" FIGS. 6A and 7 show a modified embodiment of the present invention. FIG. 6 shows a structure in which a plurality of reed relays are mounted between two flexible wiring boards 11A and 11B.

Further, in the embodiment of FIG. 7, the case where the notch 24 is formed in the lead connecting portion of the reed relay 3 is shown. By forming the cutouts 24 in this way, the stress absorption of the reed relay 3 is improved, and the reed relay 3 can be protected more safely.

[Advantage of Invention] As described above, according to this invention, it is possible to obtain a high-frequency relay that has a function of absorbing the stress caused by the thermal expansion of the reed relay 3 and has a good impedance matching.

Therefore, it is possible to provide a high-frequency relay that has high durability against temperature fluctuations and the like and that does not give waveform distortion to a high-frequency pulse signal.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a side view thereof, FIG. 3 is a perspective view, FIG. 4 is an exploded perspective view for explaining the structure of a main part, and FIG. FIG. 6 is an enlarged sectional view of a through hole portion, FIGS. 6 and 7 are views showing a modified embodiment of the present invention, and FIGS. 8 and 9 are views for explaining a conventional technique. 1: Insulation plate, 3: Reed relay, 4: Conductive pipe, 5: Excitation coil, 11A, 11B: Flexible wiring board, 12: Signal line, 13: Common potential conductor, 14: Through hole.

Claims (1)

[Scope of utility model registration request] 1. A. A signal line and a common potential conductor are formed on a flexible insulating plate, and a planar waveguide having a characteristic impedance of the signal line maintained at a predetermined impedance is provided, and the plate surfaces are mutually B. Two flexible wiring boards placed facing each other, and B. Leads inserted between the two flexible wiring boards and led out from one side and the other side are formed on the flexible wiring board. A reed relay connected to the signal line through the through hole, and C. a conductive pipe mounted on the outer periphery of the reed relay and having terminals formed at both ends connected to the common potential conductor of the flexible wiring board. , D. A high-frequency relay comprising an exciting coil wound around the outer circumference of the conductive pipe to control the reed relay.