JPH0652769B2 - High memory density package - Google Patents

Abstract

HIGH MEMORY DENSITY PACKAGE Disclosed is a high density microelectronic circuit package. The circuit package includes a plurality of IC chips, as memory chips, on a circuitized flexible tape, which is, in turn, bonded to a printed circuit board. The circuitized flexible tape extends outwardly from the printed circuit board and has a plurality of IC chips mounted on I/O pads on the tape. The individual IC chips are in thermal contact with a heat sink means on the surfaces thereof opposite the circuitized flexible tape. The circuitized flexible tape and the heat sink are bonded to a printed circuit board.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION This invention relates to microelectronic circuit packages and, more particularly, to multi-chip memory packages. The circuit package features efficient utilization of input / output circuits, high memory density, and efficient thermal management.

[0002]

2. Description of the Related Art The general structure and manufacturing process of electronic packages are described in, for example, Donald P. Serafin.
P. Seraphim), Ronald Lask
y) and Che-Yo Li's "Principles of Electronic Packagin
g) ”, McGraw-Hill Book Company (McGraw-Hi
ll BookCompany), New York, NY (19
1988), and Rao R. Tumma
la) and Eugene J. Rymasewski
aszewski) "Microelectronic Packaging Handbook" Van
Van NostrandReinhol
d), New York, NY (1988).

As described by Serafin et al. And Zumara et al., An electronic circuit consists of a number of independent electronic circuit components,
For example, it contains thousands or even millions of independent resistors, capacitors, inductors, diodes and transistors. These independent circuit components are interconnected to form a circuit and the individual circuits are interconnected to form a functional device. Power and signal distribution is done through these interconnections. Each functional device requires mechanical support and structural protection. Electrical circuits require the removal of electrical energy to perform a function and thermal energy to maintain a function. Microelectronic packages such as chips, modules, connectors, cables, circuit cards, and circuit boards are used to protect, house, cool, and interconnect circuit components and circuits.

Within integrated circuits, interconnections between circuit components and circuits, heat dissipation and mechanical protection are provided by integrated circuit chips. This chip encapsulated in the module is called the first level package.

There is at least another level of packaging. The second level package is a circuit card. The circuit card serves at least four functions. First, a circuit card is used because the total number of circuits or bit count required to perform the desired function exceeds the bit count of the first level package or chip.
Second, the second level package or circuit card provides a place for components that cannot be easily integrated into the first level package or chip or module. These components include, for example, capacitors, precision resistors, inductors, electromechanical switches, optocouplers, and the like. Third, the circuit card provides the interconnection of signals to other circuit elements. Fourth, the second level package provides heat management or heat dissipation.

Most applications, especially high performance workstations, medium-sized computers, and mainframe computers, have third level packages.
This is a circuit board level package. The circuit board contains connectors for receiving multiple cards, circuits that provide communication between the cards, input / output devices for external communication, and often complex thermal management systems.

With modern application programs, complex operating systems, and multitasking,
A large amount of random access memory can now be used. This continually increases the memory size and memory density. The increase in memory density is accompanied by an increase in circuit density, wiring density, and input / output density, all of which impose a high thermal load on electronic packages.

[0008] Cerafin, Ruski and Lee, "The Principles of Electronic Packaging" (incorporated herein by reference), page 127, "Thermal Management in Electronic Packagin.
g) ”, FE Andros and B
-G. Sammakia states that in order to improve the performance of data processing equipment, the trend of electronic package design is to increase the size of the circuit chip and increase the input / output density per chip. Higher, higher circuit density per chip, and higher system reliability. Chip size,
These increases in input / output density, circuit density, and reliability
In particular, the performance is improved by shortening the electric wire length and the flight time between two points. At the same time, these improvements have also resulted in a significant increase in power density. For example, made by reference,
In the "Electronic Packages" on page 167 of Zumara and Limaseusky's "Miniature Electronic Packaging Handbook," Antonetti (A
ntonetti), Octay and Simons (Sim
ons) reports that a 5 mm x 5 mm chip dissipates 10 watts for a heat flux of 400 kilowatts per square meter.

Despite the sharp decrease in the power demand of individual devices, there is a very rapid increase in chip and package level thermal loading. This is because the density and the degree of integration of devices are more rapid. When solid state devices were first announced,
It was thought that the state device would require minimal, if not eliminate, thermal management issues due to the lower individual power requirements compared to vacuum tubes and iron core memories. In reality, this was not the case, because the packing density of the integrated circuit and its associated power density increased exponentially over the years. For example, while the power demand per device for CMOS devices is less than that for bipolar devices, the number of CMOS devices per modern CMOS integrated circuit is many times the number of bipolar devices per older bipolar integrated circuit. ing.

It should be noted that the package design, that is, the card and board design, needs to accommodate the ever-increasing density of logic circuits and memories mentioned above in a smaller area, and the attendant increase in interconnections. Has been promoted by. As Andros and Samakia note, these high density cards and boards have high power densities and therefore require complex thermal management.

Package-level thermal management is particularly important because integrated circuit failure rates increase by a factor of 2 for every 10 ° C. increase in operating temperature. As Andros and Samakia point out, reliability at all levels of the package is directly proportional to temperature. For example, high operating temperatures accelerate failure mechanisms such as creep, corrosion, interdiffusion, and electromigration. Similarly, Andros and Samakia point out that the temperature difference generated in the system circulates between the power-on state and the power-off state, and fatigue in composite structures formed mainly of materials with different coefficients of thermal expansion. This significantly affects the reliability of electronic components.

As stated by Antonetti, Octay and Simons, it is a requirement that the thermal management of the electronic package meet some or all of the following performance criteria:

* The temperature of an integrated circuit device is "worst"
It must be kept below the maximum permissible limit under operating conditions (ie, worst case values of device and module power and thermal resistance, refrigerant flow, environmental conditions, etc.).

* The temperature of the integrated circuit device experienced under normal operating conditions must be such that reliability goals can be achieved.

* Temperature fluctuations of devices belonging to the same signal network must be kept within acceptable limits.

* The reliability of the thermal management approach must be acceptable.

The electronic noise limit must be met.

The purpose of any thermal management design is to allow the flow of thermal energy from a heat source, ie, an integrated circuit memory chip, to a heat sink, ie, the external environment, within specified temperature and heat flux constraints. , To achieve this goal. Ideally, this would be achieved by a combination of conduction and natural or forced convection, or both.

The purpose of the memory package is to combine efficient thermal management with high memory capacity and memory density.

[0020]

The main object of the present invention is to:
It is to provide a microelectronic package adapted to high memory capacities and densities and, incidentally, to enable the use of, for example, double sided surface mount technology (SMT) assemblies.

Another object of the present invention is to provide a microelectronic package having high input / output capacity including high address bus capacity and high data bus capacity.

Yet another object of the present invention is to provide a microelectronic package having a thermal management capacity that matches the memory capacity and input / output capacity contemplated by the present invention.

Yet another object of the present invention is to provide a circuitized flexible tape carrier for a memory having individually bonded, assembled and tested memory chips, and a multi-chip Is to remove the rework.

Yet another object of the present invention is to reduce the area of the package occupied by common control and data lines and discrete devices.

[0025]

A high density microelectronic circuit package is disclosed. The circuit package includes a plurality of IC memory chips adhered to a circuitized flexible tape and then adhered to a printed circuit board. The circuitized flexible tape extends outward from the printed circuit board and has a plurality of IC chips such as memory chips mounted on the input / output pads.

The I / O pads on the circuitized flexible tape are organized into at least first and second groups. The first group of input / output pads are connected to the common bus of the first connector. The first common bus terminates at the I / O contact pin array at the edge of the flexible tape.

A second group of I / O pads are connected to a second group of connectors, the groups of connectors extending outwardly from the I / O chip to the I / O contact pin array. The input / output contact pin array of the circuitized flexible tape is aligned with and adhered to the array of contact pads on the printed circuit board.

[0028]

EXAMPLE A high density microminiature electronic circuit package 1 described herein. The circuit package 1 includes a plurality of IC memory chips 11 bonded to a circuitized flexible tape substrate 21 and heat-transfer bonded to a heat sink 41. Circuitized flexible tape 21 and heat
The sink 41 is then glued to the printed circuit board 31. The circuitized flexible tape 21 and heat sink 41 extend substantially outward from the printed circuit board 31.
A plurality of IC chips 11 such as memory chips are attached to the input / output pads. The memory chips 11 may be arranged in a single row or in multiple rows on the circuitized flexible tape 21 (eg, 11a and 11b in FIGS. 4 and 5). ).

The circuitized flexible tape 21 includes a first array of input / output contact pads. The first input / output contact pad array can receive and is bonded to the input / output terminal array on the input / output contact (first) surface of the IC chip 11. Although described for a single contact array, data ³ i / ³ o, address input, and may be a plurality contact pad array to a control. The circuitized flexible tape 21 also includes a second array of input / output contact pads. The second array of I / O contact pads can receive and is bonded to an array of I / O pads 34 on the printed circuit board 31.

The input / output pads of the circuitized flexible tape 21 can be arranged in a plurality of arrays, for example, at least the first group 22a and the second group 22b. The input / output pads 22a of the first group are connected to the common bus 23a of the first conductor. This first common bus 23
A terminates at the input / output contact pad array 24a at the edge of the flexible tape 21. This first contact pad array 24a is then adhered to the matching first contact pad array 34 on the printed circuit board 31.

The second group of input / output pads 22b is the second
The second conductor is connected to the common bus 23b of the conductors.
Extends outwardly from the C-chip toward the second input / output contact pad array 24b on the edge of the circuitized flexible tape 21. The second input / output contact pad array 24b of the circuitized flexible tape 21 is aligned with and adhered to the second array of contact pads 34 on the printed circuit board 31. The contact pad arrays 24a and 24b may be on the right edges of the circuitized flexible tape 21.

Another embodiment, shown in FIG. 4, provides higher input / output density. In this embodiment, the circuitized flexible tape 21 includes a first input / output contact pad array 22a (not shown) on one surface thereof. The first input / output contact pad array 22a can receive the input / output terminal array on the input / output contact (first) surface 15 of the IC chip 11 and is adhered thereto. The circuitized flexible tape 21 may include a second array of input / output contact pads on the back side thereof. The second input / output contact pad array is connected to the first input / output contact pad array 22a by a via. The second I / O contact pad array is capable of receiving and connected to an array of I / O pads on the printed circuit board 31. In this way, separate buses are provided for the data and address lines.

The heat management is performed by the heat sink structure 41. The heat sink structure is mechanically separated from the flexible tape 21 formed into a circuit, but the individual IC chips. 11 is heat-transfer bonded.
More specifically, the heat sink means 41 extends outward from the printed circuit board 31 substantially vertically, and
Each of 1 is an input / output contact first surface 15 and a thermal contact second surface 17
have. The IC chip 11 is bonded to the circuitized flexible tape 21 via the input / output contact (first) surface 15 and to the heat sink means 41 via the IC chip hot contact (second) surface 17. Has been done.

This structure is generally shown in FIGS. 1, 4 and 5. As described above, the microminiature electronic package 1 of the present invention extends substantially vertically outward from the printed circuit board 31, and the input / output pad array 24 on the flexible tape 21 and the printed circuit board 31. It is electrically connected to the printed circuit board 31 through the input / output pad array 34. An important aspect of the present invention is the heat sink 41.
Is the connection of the IC chip 11 with respect to. The microminiature electronic package 1 is thermally connected to the printed circuit board 31 via the heat transfer (second) surface 17 of the IC chip 11. These IC chip heat transfer surfaces 17 are coupled to heat sink means to allow heat transfer between them.

The various IC chips 11 can be connected to the heat sink 41 using various methods. These include soldering, thermal grease, thermal paste, etc., but these are for illustrative purposes only and are not limiting. Thermal greases and pastes include (1) liquid polymer / thixotropic suspensions of heat transfer agents, and (2)
Included are oils such as silicone oils (eg, diphenylene siloxanes or dimethylene siloxanes) or hydrocarbon oils mixed with small amounts of thixotropic solids (such as fumed silica, clays and soaps). The thermal grease and paste act as flexible heat conductors, maintaining the heat conduction path in the limit of thermal expansion and contraction.

The IC chip 11 and the circuitized flexible tape 21 may extend along a single side or surface of the heat sink means 41, as shown in FIGS. As shown in FIGS. 4 and 5, it may extend along both sides of the heat sink means 41. Therefore, in the embodiment shown in FIGS. 4 and 5, each of the IC chips is heated by the heat transfer (second) surface 17 of the IC chip 11.
It is adhered to the sink means 41. At least one I
The C chip 11 is adhered to one surface of the heat sink means 41, and at least one other IC chip 11 is adhered to the opposite surface of the heat sink means 41. In this configuration, the IC chip 11 has a back-to-back configuration.

When the IC chip 11 is bonded to the heat sink means 41 in a back-to-back configuration as shown in FIGS. 4 and 5, these are combined into a single flexible circuit as shown in FIG. Flexible tape 21 having a plurality of circuits, as shown in FIG.
It can also be attached to (21a, 21b).

FIG. 4 shows the individual IC chips 11 (11a, 1a, 1a).
1b) and the printed circuit board 31 are electrically connected to one another via a single circuitized flexible tape 21. This single tape 21 surrounds the heat sink means 41 and the IC chip 11.

FIG. 5 shows individual IC chips 11 (11a, 1a).
1b) and the printed circuit board 31 are electrically connected to each other via a pair of circuitized flexible tapes 21a, 21b. These plurality of tapes 21a, 21b are arranged on both sides of the heat sink means 41 and therefore the heat sink means 41
And surrounds the IC chip 11 (11a, 11b). In this embodiment, the individual IC chips 11 (11
a, 11b) and the printed circuit board 31 are electrically connected to each other via a pair of circuitized flexible tapes 21a, 21b. One circuitized flexible tape 2
1a is adhered to the IC chip 11b on one surface of the heat sink means 41, and the other circuitized flexible tape 21b is adhered to the IC chip 11a on the opposite surface of the heat sink means 41. There is.

Yet another embodiment of the present invention is shown in FIG.
In this embodiment, the memory IC chip 11, the circuitized flexible tape 21 and the heat sink 41 are module units, and the circuitized flexible tape 21 is the IC chip 11 and the heat sink. It is wound around the means 41 and surrounds the base of the heat sink means 41 so that the heat sink means 41 is connected to the printed circuit board 31 through the opening of the circuitized flexible tape 21. . This modular unit, for example,
Vapor soldering of the contact pads 24 on the flexible tape 21 and the contact pads 34 of the printed circuit board 31 allows for batch soldering on the printed circuit board 31. In the embodiment shown in FIG. 6, the heat sink means 41 is finned.

Although the structures have been illustrated and described with respect to various packaging techniques, it should be understood that various direct chip attach (DCA) methods can be used to adhere the IC chip 11 to the circuitized flexible tape 21. . Typically, the individual chips 11 are bonded to a patterned metal on a tape (such as copper or polyimide), eg, by thermocompression bonding, and the structure is then bonded to a flexible circuitized tape 21. , Tape Automated Bonding (TAB) bonded by, for example, external lead bonding
Is. One of the advantages of DCA using TAB is that it provides intermediate processing such as testing, encapsulation, and burn-in.
What can be done before adhering the TAB assembly to the circuitized flexible tape 21. Other DCA and thin film chip connection methods can be utilized without departing from the inventive concept.

The apparatus and structure of the present invention results in a microelectronic package of high memory capacity and density with minimal area occupied by common control and data lines and discrete devices. Additionally, the package of the present invention enables double sided surface mount technology (SMT) assembly. The disclosed microelectronic packages have high I / O capacities, including high address bus capacities and high data bus capacities with thermal management capacities compatible with the disclosed memory capacities and I / O capacities. The present invention is a digital I
Although described with respect to the C chip, it should be noted that passive components such as resistors, capacitors and inductors are present in the microelectronic package 1 as well as the analog IC chip.

As described herein, microelectronic circuit package 1 includes a circuitized flexible tape carrier 21 for memory chips, to which memory chips 11 are individually bonded. Assembled and tested, this avoids multiple chip rework.

[0044]

The present invention provides a microelectronic package adapted for high memory capacities and densities, and may additionally enable the use of, for example, double sided surface mount technology (SMT) assemblies.

[Brief description of drawings]

FIG. 1 is an isometric view of a printed circuit board having a plurality of outwardly extending microminiature electronic packages.

FIG. 2 is a diagram of a microelectronic package of the present invention including a flexible strip substrate having two aspects of circuitry, a data circuit and an address circuit.

FIG. 3 is a diagram of an area of a microelectronic circuit package in which an IC chip is mounted on a flexible strip substrate with first and second leads extending therefrom.

FIG. 4 is a diagram of one embodiment of the invention in which a sheet of flexible circuitized tape is wrapped around a heat sink.

FIG. 5 is a diagram of another embodiment of the invention having a pair of flexible circuitized substrates on each side of the heat sink.

FIG. 6 is yet another implementation of the invention in which the memory IC chip, the circuitized flexible tape, and the heat sink are modular units that can be batch soldered to a printed circuit board, for example by vapor phase soldering. FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 High-density microminiature electronic circuit package 11 IC memory chip 21 Flexible tape substrate 22a, 22b First input / output contact pad array 24, 24a, 24b Second input / output contact pad array 31 Printed circuit board 34 Input / output Pad 41 heat sink

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Jose Agustin Barbosa 3619 United States, Royal Road, Endwell, New York 3619 (72) Inventor Eric Paul Dable, United States 13760, Endicott, NY, Massachusetts Avenue 408 (72) Inventor Joseph Funari, USA 13850, Vestal, NY, 149 Meeker Road (72) Inventor John Stephen Cresgue, United States 13905, Binghamton, NY 40, Lathrop Avenue (72) ) Inventor Charles Robert Lamb Ironwood, Endwell, NY 13760, USA D. Drive 2929 (72) Inventor Richard Gerald Murphy United States 13905, Borland Road, Binghamton, NY 14 (72) Inventor Scott David Reynolds United States 13760, Endwell, NY Rosewood Terrace 844 (72) Inventor Burgat Garlev Samakia, USA 13811, Newark Valley, NY, Bailey Hollow Road, PO Box 218 (72) Inventor, Tamer Alan Scholz, United States 13760, West Endicott, NY, West Main Street 504-27 (72) Inventor Wayne Russell Stall, Jr. Randolph Road Earl Dee, Number 54, No. 54, Great Bend, PA 18821, USA

Claims (21)

[Claims] 1. (a) Each IC chip is a first input / output contact.
A plurality of IC chips having a surface and a second surface of a thermal contact, (b) a printed circuit board, (c) extending outward from the printed circuit board, and having first and second input / output thereon. A circuitized flexure having pads, the IC chip attached to the first I / O pads, and the second I / O pads aligned with and bonded to the array of contact pads on the printed circuit board. Tape and (d) heat sink means extending outwardly from the printed circuit board, the IC chip being adhered to a flexible tape circuitized by the first surface of the input / output contact, and the IC chip A high density microelectronic circuit package comprising a heat sink means adhered to the heat sink means by a second surface of the heat contact. 2. (a) An IC chip is adhered to a heat sink means on the heat transfer second surface, and at least one IC chip is adhered to one surface of the heat sink means, and at least one other Is bonded to the other surface of the heat sink means, the IC chip has a back-to-back configuration, and (b) the IC chip and the printed circuit board surround the heat sink means and the IC chip. Electrically bonded together via a single circuitized flexible tape,
The high-density microminiature electronic circuit package according to claim 1. 3. (a) An IC chip is adhered to a heat sink means on the heat transfer second surface, and at least one IC chip is adhered to one surface of the heat sink means, and at least one other. The IC chip is adhered to the other surface of the heat sink means, the IC chip has a back-to-back structure, and (b) the IC chip and the printed circuit board are a pair of circuitized flexible tapes. Electrically bonded to each other via a tape, one of the tapes being bonded to one surface of the heat sink means and the other of the tapes being bonded to the other surface of the heat sink means. The high-density ultra-small electronic circuit package described in 2. 4. A circuitized flexible tape on one side capable of receiving (a) an input / output terminal array on a first side of an input / output contact of an IC chip and being adhered thereto. A first array of input / output contact pads, and (b) connected to the first array of input / output contact pads by vias, capable of receiving and bonded to an array of input / output pads on a printed circuit board. The high density microelectronic circuit package of claim 1, including a second array of input / output contact pads on the other side of the circuitized flexible tape. 5. A package extending outwardly from a printed circuit board, and (a) a second array of input / output pads on a circuitized flexible tape, and an input / output pad on the printed circuit board. Electrically connected to the printed circuit board via the (b) heat transfer surface of the IC chip adhered to the heat sink means, and thermally connected to the printed circuit board. 1. The high-density microminiature electronic circuit package described in 1. 6. The automatic input / output tape bonding of said input / output pad on a circuitized flexible tape.
The described microminiature electronic circuit package. 7. The microelectronic circuit package of claim 1, including a thermal adhesive between at least one of said integrated circuit chips and said heat sink means. 8. The microminiature electronic circuit package of claim 7, wherein the thermal adhesive comprises solder. 9. The microminiature electronic circuit package of claim 7, wherein the thermal adhesive comprises thermal grease. 10. A circuitized flexible tape extends underneath the heat sink means, the heat sink means being bonded to the printed circuit board via the circuitized flexible tape. The high-density microminiature electronic circuit package according to claim 1. 11. A high density microminiature electronic circuit package comprising: (a) a plurality of IC memory chips; (b) a printed circuit board; and (c) a circuitized flexible tape. d) A circuitized flexible tape extends outward from the printed circuit board, and a plurality of IC chips are attached to the input / output pads on the printed circuit board. Are arranged in a second group, and (1) a first group of input / output pads is connected to a common bus of a first connector, the common bus being an input / output contact pad at an edge of a flexible tape. And (2) a second group of I / O pads is connected to a second group of conductors extending outwardly from the I / O chip towards the I / O pad array, e) circuitized flexibility The input / output pad array on the tape aligns with the array of contact pads on the printed circuit board,
And a high-density micro-miniature electronic circuit package adhered to it. 12. A heat sink means extending outwardly from a printed circuit board, and (b) each having an input / output contact first surface and a heat contact second surface. 12. The IC chip of claim 11, including an IC chip adhered to the flexible tape circuitized by the output contact first surface and bonded to the heat sink means by the IC chip thermal contact second surface. Ultra-small density electronic circuit package. 13. A first insert of a circuitized flexible tape which is capable of receiving (a) an input / output terminal array on a first surface of an input / output contact of an IC chip and adhered thereto. A first I / O contact pad array on one side of the output contact pad array, and (b) receiving an array of I / O pads on the printed circuit board connected by vias to the first I / O contact pad array. And a second I / O contact pad array on the other side of the circuitized flexible tape that is capable of being connected to the high density microminiature electronic circuit package. . 14. A package extends outwardly from a printed circuit board via: (a) a second array of input / output pads on a circuitized flexible tape and an input / output pad on the printed circuit board. Electrically connected to the printed circuit board, and (b) thermally connected to the printed circuit board via the heat transfer surface of the IC chip adhered to the heat sink means,
The high-density microminiature electronic circuit package according to claim 13. 15. (a) Each IC chip is adhered to the heat sink means on the heat second surface, and at least one IC chip is provided.
The C chip is adhered to one surface of the heat sink means, and at least one IC chip is adhered to the other surface of the heat sink means, and the IC chips have a back-to-back structure. 15. The high density super according to claim 14, wherein the IC chip and the printed circuit board are electrically connected to each other via a single circuitized flexible tape surrounding the heat sink means and the IC chip. Small electronic circuit package. 16. (a) Each IC chip is adhered to a heat sink means on a heat second surface, and at least one I
The C chip is adhered to one surface of the heat sink means, and at least one IC chip is adhered to the other surface of the heat sink means, and the IC chips have a back-to-back structure. IC chips are electrically bonded to each other via a pair of circuitized flexible tapes, one of the tapes being bonded to one surface of the heat sink means,
15. The high density microelectronic circuit package of claim 14, wherein the other side of the tape is adhered to the other side of the heat sink means. 17. The circuitized flexible tape contact pad array is tape self-bonded.
The high-density microminiature electronic circuit package according to claim 11. 18. A thermal adhesive between at least one of said integrated circuit chips and said heat sink means.
The microminiature electronic circuit package according to claim 12. 19. The thermal adhesive comprises solder.
The microminiature electronic circuit package according to claim 18. 20. The microminiature electronic circuit package of claim 18, wherein the thermal adhesive comprises thermal grease. 21. A circuitized flexible tape extends underneath the heat sink means, the heat sink means being bonded to the printed circuit board via the circuitized flexible tape. The high-density microminiature electronic circuit package according to claim 11.