JPH0652141U - Semiconductor heat treatment equipment - Google Patents

Abstract

(57) [Abstract] [Purpose] To simplify the handling work of the wafer support device. Reduces the risk of damage during handling. Improves boat production accuracy. Prevents damage to the boat during the cleaning process for removing the film adhering to the heat barrier structure during the heat treatment. The heat barrier structure is common to a plurality of types of semiconductor heat treatment apparatuses, and the cost is reduced. A semiconductor heat treatment apparatus is provided with a process tube having a lower end opened and an upper end closed, and a wafer support device 2 that is vertically movable and is located in the process tube at a raised position. Wafer support device 2
Is formed separately from the heat barrier structure 3 that is located in the lower end opening of the process tube in its raised position, and is detachably mounted on the heat barrier structure 3 and attached to the wafer. And a boat 4 for supporting.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention comprises a semiconductor heat treatment apparatus, and more specifically, a process tube having an open lower end and a closed upper end, and a wafer support device that can be moved up and down and is located in the process tube in a raised position. The present invention relates to a semiconductor heat treatment apparatus used for heat-treating a wafer for manufacturing.

[0002]

[Prior art]

 Conventionally, as this kind of semiconductor heat treatment apparatus, one provided with a wafer supporting device in which a heat barrier structure and a boat on the heat barrier structure are integrally formed of quartz is used.

[0003]

[Problems to be solved by the device]

 However, the conventional semiconductor heat treatment apparatus has the following problems because it has the wafer supporting device in which the heat barrier structure and the boat are integrally formed.

That is, since the size and weight of the wafer support device increase, handling is difficult. Moreover, since it is difficult to handle, there is a risk that the wafer supporting device may be hit by another object and damaged during mounting and removal of the wafer supporting device to the lifting device. Therefore, the installation and removal work must be done carefully and is time consuming. Further, the size of the wafer supporting device becomes large, so that the boat portion cannot be manufactured with high precision. Furthermore, since a film adheres to the surface of the heat barrier structure when heat-treating the wafer, it needs to be removed by cleaning, but the cleaning process also needs to be applied to the boat, which may damage the boat. is there.

An object of the present invention is to provide a semiconductor heat treatment apparatus that solves the above problems.

[0006]

[Means for Solving the Problems]

 The semiconductor heat treatment apparatus according to the present invention is a semiconductor heat treatment apparatus having a process tube having an open lower end and a closed upper end, and a wafer support device that is vertically movable and is located in the process tube in a raised position. The wafer supporting device is formed separately from the heat barrier structure, which is located in the lower end opening of the process tube in its raised position, and is detachably mounted on the heat barrier structure. And a boat for supporting the wafer.

[0007]

[Action]

 The wafer supporting device is formed separately from the heat barrier structure, which is located in the lower opening of the process tube in the raised position of the wafer supporting device, and is detachably mounted on the heat barrier structure. With the boat mounted and supporting the wafer, the heat barrier structure and the boat can be handled separately, which reduces the size and weight of the handled product and simplifies handling. Moreover, since the handling work is simple, the risk of damage during installation and removal of the lifting device is reduced. In addition, since the size of the boat is reduced, its manufacturing accuracy is improved. Further, since the cleaning treatment for removing the film adhered to the heat barrier structure during the heat treatment only needs to be performed on the heat barrier structure, damage to the boat during the cleaning treatment can be prevented. Further, since the heat barrier structure can be common to a plurality of types of semiconductor heat treatment devices, the cost can be reduced.

[0008]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings.

The semiconductor heat treatment apparatus comprises a quartz vertical process tube (1) which is arranged in a furnace body (not shown) and whose lower end is open and whose upper end is closed. ), And a wafer supporting device (2) located inside.

The wafer support device (2) is separated from the heat barrier structure (3) made of quartz, which is located in the lower end opening of the process tube (1) in its raised position, separately from the heat barrier structure (3). The quartz boat (4) is formed and removably mounted on the heat barrier structure (3) to support the wafer. The heat barrier structure (3) is cylindrical with both ends open, and an annular inward protruding wall (5) is integrally formed at a height position near the upper end of the inner peripheral surface thereof. Above the inwardly projecting wall (5), a notch (6) is formed from the upper end of the peripheral wall of the heat barrier structure (3). A positioning piece (7) protruding outward is integrally formed at the lower end of the outer peripheral surface of the heat barrier structure (3).

The boat (4) is provided at its lower end with an annular body (8) having an outer diameter equal to the inner diameter of the heat barrier structure (3). A positioning piece (9), which protrudes in the radial direction and fits into the notch (6), is integrally formed on the outer peripheral portion of the annular body (8).

The heat barrier structure (3) is placed on a disc-shaped lifting table (10) of a lifting device (not shown). In the raised position, the lift table (10) closes the lower end opening of the process tube (1). An annular upward projecting wall (11) having an inner diameter equal to the outer diameter of the heat barrier structure (3) is integrally formed on the upper surface of the lift table (10). The upper projecting wall (11) is formed with a notch (12) into which the positioning piece (7) fits from the upper end thereof. In addition, inside the heat barrier structure (3), as shown in FIG. 2, a cylindrical heat barrier structure (13) made of English may be placed on the lift table (10).

In such a configuration, when mounting the wafer support device (2) on the lift table (10), first, the wafer structure (3) is moved by the upper protruding wall (11) on the lift table (10). Place the locating piece (7) in the notch (12) on the enclosed part. Then, the boat (4) is placed on the inward protruding wall (5) of the heat barrier structure (3) with the annular body (8) at the lower end of the boat (4) and the positioning piece (9) inside the notch (6). It is placed on the heat barrier structure (3) so that it fits in. Thus, the wafer support device (2) is installed on the lift table (10). Removal of the wafer support device (2) from the lift table (10) is performed in the reverse order of the above.

In the above-described embodiment, the boat (4) is positioned with respect to the heat barrier structure (3) by the notch (6) formed in the peripheral wall of the heat barrier structure (3) and the boat (4). The positioning piece (9) formed on the annular body (8) is used, but the positioning of both (3) and (4) is not limited to the above means, but can be changed as appropriate. Also, the positioning of the heat barrier structure (3) with respect to the lift table (10) is not limited to the above.

[0015]

[Effect of device]

 According to the semiconductor heat treatment apparatus of the present invention, as described above, the size and weight of the object to be handled are reduced, and the handling work is simplified. Moreover, since the handling work is simple, the risk of damage during installation and removal of the lifting device is reduced. Further, since the size of the boat is reduced, its manufacturing accuracy is improved. In addition, it is possible to prevent the boat from being damaged during the cleaning process for removing the film adhering to the heat barrier structure during the heat treatment. Further, since the heat barrier structure can be common to a plurality of types of semiconductor heat treatment apparatuses, the cost can be reduced.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a wafer supporting device of a semiconductor heat treatment apparatus according to the present invention.

FIG. 2 is a vertical sectional view of a semiconductor heat treatment apparatus according to the present invention.

[Explanation of symbols]

 1 Process Tube 2 Wafer Support Device 3 Heat Barrier Structure 4 Boat

Claims (1)

[Scope of utility model registration request] 1. A semiconductor heat treatment apparatus comprising: a process tube having a lower end opened and an upper end closed; and a wafer heat treatment device that is vertically movable and is positioned in the process tube at a raised position. Of the heat barrier structure, which is located in the lower end opening of the process tube in its raised position, is formed separately from the heat barrier structure, and is detachably mounted on the heat barrier structure to support the wafer. Semiconductor heat treatment equipment consisting of a boat.