JPH0651333A - Liquid crystal display device - Google Patents

Abstract

PURPOSE:To miniaturize a liquid crystal display device by enabling a connection lead part to reach an edge while keeping an inclined state. CONSTITUTION:The connection lead part 3 formed from a driving circuit element 2 toward a liquid crystal display element 1 is enabled to reach the edge 5a of the element 1 while keeping the inclined state, and the edge 8a of a wiring material 8 laminated on the lead part 3 is formed in a direction perpendicular to the longitudinal direction of the lead part 3. Since the vertical part of the lead part 3 does not exist near the edge 5a of the element 1 and a situation that the edge of the wiring material 8 touches the adjacent lead part 3 to cause short circuit is prevented, the miniaturized liquid crystal display device is produced with high yield.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device, and more particularly to a structure of a connecting lead portion for connecting a liquid crystal display element and a driving circuit element in a COG (chip on glass) type liquid crystal display device.

[0002]

2. Description of the Related Art In a COG type liquid crystal display device,
A liquid crystal display element is configured by bonding two glass substrates and enclosing a liquid crystal material between them, and an IC that is a driving circuit element is mounted on one glass substrate. Each terminal portion of the IC is connected to the corresponding electrode of the liquid crystal display element by a plurality of connection lead portions, and the connection lead portion is continuously formed on the same glass substrate from the ITO electrode of the liquid crystal display element without interruption. This is a structure in which a wiring material such as Al is laminated on the formed pattern. Since the liquid crystal display element is considerably larger than the IC, the connection lead portion is formed in a shape that spreads radially from the IC toward the liquid crystal display element. .

FIG. 4 shows a conventional example as described above. 11 is a liquid crystal display element, 12 is an IC, 13 is a connecting lead portion, 14 and 15 are glass substrates, and 16 is an ITO of the liquid crystal display element 11. Etc. are electrodes. The electrode 16 is patterned on the glass substrate 14, and the connection lead portion 13 is formed on the pattern 16a continuously and continuously formed from the electrode 16 via an intermediate metal layer 17 of Cr or the like, for example. The wiring material 18 such as Al is laminated. The connection lead portion 13 is formed in a state of being radially inclined from the IC 12 with respect to the edge 15a of the glass substrate 15, but near the edge 15a, it is a vertical portion 13a perpendicular to the edge 15a.

The connection lead portion 13 has a structure in which the wiring material 18 is laminated on the pattern 16a made of the same material as the electrode 16 in order to minimize the wiring resistance.
The intermediate metal layer 17 is provided to enhance the adhesiveness of the wiring material 18. Since these are quite thick, the portions immediately before entering between the glass substrates 14 and 15 are removed by etching, so that the edges 17a and 18a in the direction parallel to the edge 15a of the glass substrate 15 are vertical. It occurs in the portion 13a. It should be noted that the intermediate metal layer 17 and the wiring material 18 have been removed for the sake of easy understanding.
Although only TO is not shown in the cross section, it is shown with diagonal lines.

The reason why the vertical portion 13a is provided on the connecting lead portion 13 is as follows. That is, in general, the intermediate metal layer 1
Cr used for 7 is Al used for the wiring material 18.
Since it is more likely to be etched than the edges of the intermediate metal layer 17 and the like, the edge 18a of the wiring material 18 is projected more than the edge 17a of the intermediate metal layer 17 as shown in FIG. 18a loses its support and becomes a free end. Therefore, if there is no vertical portion 13a and the edge 15a of the glass substrate 15 is located at the inclined portion of the connecting lead portion 13 as shown by the chain double-dashed line in FIG. Edges 17a, 1 of the layer 17 and the wiring material 18
When 8a is formed, when the edge 18a is turned upside down, it may stick out laterally as shown by the chain line in FIG. 3C and may come into contact with the adjacent connection lead portion 13 to cause a short circuit defect. Therefore, the vertical portion 13a is provided so that even if the end edge 18a is turned upside down, it does not protrude laterally, thereby preventing contact with the adjacent connection lead portion 13.

[0006]

As described above, conventionally, by providing the vertical portion 13a, an extra space corresponding to the length L is required, which is one of the factors that hinders the miniaturization of the liquid crystal display device. . In view of this point, the present invention has been made to solve the problem of miniaturizing the liquid crystal display device by eliminating the vertical portion.

[0007]

In order to solve the above-mentioned problems, according to the present invention, in the above-mentioned liquid crystal display device, the connecting lead portion spreads from the driving circuit element and is formed on the edge of the other glass substrate. The edge of the wiring material laminated on the connecting lead portion reaches the vicinity of the edge of the glass substrate in an inclined state, and the edge of the wiring material laminated on the connecting lead portion is inclined at right angles to the longitudinal direction of the connecting lead portion. Alternatively, they are formed in a substantially perpendicular direction.

[0008]

Since the connecting lead portion reaches the edge of the glass substrate while the connecting lead portion is inclined and the vertical portion is not formed, the space for providing the vertical portion is not required and the liquid crystal display device is downsized. . Further, since the edge of the wiring material laminated on the connection lead portion is formed at a right angle or a substantially right angle to the longitudinal direction of the connection lead portion, the edge of the wiring material becomes a free end by overetching. Also, even if the adjacent connection lead portions are touched, they will not be turned inside out, and a short circuit defect can be prevented.

[0009]

EXAMPLES Next, examples of the present invention will be described.
1 and 2, 1 is a liquid crystal display element, 2 is an IC which is a driving circuit element, 3 is a connecting lead portion, 4 and 5 are glass substrates, and 6 is an electrode such as ITO of the liquid crystal display element 1. The basic structure of this embodiment is similar to that of the conventional example described with reference to FIG. 4, and the electrode 6 formed on the glass substrate 4 is used.
Pattern 6a made of ITO, etc. continuously formed without breaks
As shown in FIG. 2, an intermediate metal layer 7 made of Cr or the like is laminated thereon, and a wiring material 8 such as Al is further laminated thereon to form the connection lead portion 3. Reference numerals 7a and 8a are edges of the intermediate metal layer 7 and the wiring material 8 which are generated in the vicinity of the edge 5a of the glass substrate 5 by removing unnecessary portions by etching.

The connecting lead portions 3 are formed radially from the IC 2 and reach the end edge 5a while being inclined with respect to the end edge 5a of the glass substrate 5 except the one located at the central portion, and the outside. What is positioned has a pattern in which the inclined portion slightly exceeds the edge 5a of the glass substrate 5 and enters between the glass substrates 4 and 5. The edge 8a of the wiring material 8 on each connection lead portion 3 is the edge 5a of the glass substrate 5.
However, the direction in which the individual edges 8a are formed is not parallel to the edges 5a, but is a direction that is perpendicular or nearly perpendicular to the longitudinal direction of the connecting lead portion 3. There is. The slanted line indicates the portion where only ITO is formed from the edge 8a.

This embodiment is constructed as described above, and a portion corresponding to the vertical portion 13a in FIG. 4 is formed which reaches the end edge 5a of the glass substrate 5 while the connecting lead portion 3 is inclined. Therefore, a space for providing such a vertical portion is unnecessary, and the liquid crystal display device can be downsized. In addition, the edge 8a of the wiring material 8
2 are formed at right angles to the connection lead portions 3 or at angles close thereto, even if the edge 8a, which is a free end due to overetching, may be turned upside down, ), It only overlaps with its own connecting lead portion 3. For this reason, the short circuit is prevented because the connecting lead portion does not stick out to the side and touch the adjacent connecting lead portion.

FIG. 3 shows another embodiment, which is a connecting lead portion 3.
According to the inclination of (a), the edges 8a of the wiring material 8 are arranged in an inverted V shape in (a), and the edges 8a are arranged in an arc shape in (b). That is, in order to arrange the edges 8a in a straight line as shown in FIG. 1 and to form the individual edges 8a at right angles to the connecting lead portions 3, the etching mask has a complicated shape and is difficult to manufacture. However, if the arrangement is as shown in FIG. 3, the edge of the mask may be linear or arcuate along the arrangement of the end edges 8a, which has the advantage of simplifying the shape of the mask.

[0013]

As is apparent from the above-described embodiments, in the present invention, in the liquid crystal display device, the connection lead portion formed on one glass substrate spreads from the driving circuit element to the edge of the other glass substrate. The end of the wiring material laminated on the connecting lead is inclined and the edge of the wiring material laminated to the connecting lead is inclined, and the connecting lead is perpendicular or nearly perpendicular to the longitudinal direction of the connecting lead. It is formed in the direction. Therefore, there is no need for a space for forming the vertical portion of the connecting lead portion near the edge of the glass substrate, and moreover, the edge of the wiring material does not come into contact with the adjacent connecting lead portion to cause a short circuit. It becomes easy to manufacture the manufactured liquid crystal display device with a high yield.

[Brief description of drawings]

FIG. 1 is a plan view of a main part of an embodiment of the present invention.

2A and 2B are a sectional view and an operation explanatory view taken along the connection lead portion of the embodiment.

FIG. 3 is a plan view of a main part of another embodiment.

FIG. 4 is a plan view of a main part of a conventional example, a cross-sectional view taken along a connecting lead part, and an explanatory view of a cause of a defect.

[Explanation of symbols]

 1, 11 Liquid crystal display element 2, 12 IC (driving circuit element) 3, 13 Connection lead part 13a Vertical part 4, 5, 14, 15 Glass substrate 5a, 15a Edge of glass substrate 6,16 Electrode 8,18 Wiring Material 8a, 18a Edge of wiring material

Claims (1)

[Claims] 1. A driving circuit element is mounted on one of two glass substrates constituting a liquid crystal display element, and each terminal portion of the driving circuit element is connected to a plurality of connection lead portions formed on the same glass substrate. A wiring material such as Al is laminated on a pattern in which the electrodes of the corresponding liquid crystal display element are respectively connected and the connection lead portions are continuously formed from the electrodes such as ITO of the liquid crystal display element without interruption. In the liquid crystal display device having the above structure, the connection lead portion reaches the vicinity of the edge of the glass substrate while expanding from the driving circuit element while being inclined with respect to the edge of the other glass substrate, and A liquid crystal characterized in that the wiring material laminated on the connecting lead portion is formed in the connecting lead portion having an inclined edge at a right angle or a substantially right angle to the longitudinal direction of the connecting lead portion. Display device.