JPH0634985A - Electrode structure of liquid crystal panel - Google Patents

Abstract

PURPOSE:To suppress the decrease in the number of the substrate parts of liquid crystal display panels to be taken from a wafer by forming many electrode patterns on both sides of the desired cutting lines in the wafer and specifying the pitches and electrical connecting method thereof. CONSTITUTION:The one side of the turning back part of the zigzag patterns formed to successively cross the desired cutting lines 1 in the wafer is connected to the electrode patterns 3 connecting to the driving wiring lines within the respective liquid crystal panels by matching the pitches. The other side is connected to the electrode patterns 4 to be inputted with signals for driving ICs. The desired number of cutting between the adjacent glass substrate parts is easily reduced to one piece in the case of taking of the plural glass substrate parts from one sheet of wafer glass 2 by setting the pitch of the electrode patterns 4 at integer times the pitch of the electrode patterns 3 connecting to the driving wiring lines within the liquid crystal panel. The product spaces which are wasted by the desired cutting lines 1 are eliminated and the number of the glass substrate parts to be taken is increased.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of an electrode pattern for a liquid crystal panel such as a pocket TV, a wall-mounted TV, a projection TV, a laptop computer, a game machine and the like.

[0002]

2. Description of the Related Art Conventionally, connection terminals have been relatively facing each other such as connecting a semiconductor or a semiconductor component to a liquid crystal panel or connecting an integrated circuit to an optical sensor, and further connecting a surface mount component to various circuit boards. As a connection method in the case of lining up with a fine pitch,
Recently, there has been adopted a method of connecting the electrode pad of the IC to the electrode pattern formed on the liquid crystal panel facing the electrode pad of C in a face-down manner. On the other hand, liquid crystal panels can be broadly classified into active panels and passive panels. In many cases, a thin film pattern made of metal is formed in an active panel, and then anodic oxidation is performed to form an oxide insulating film. When the electrode pad of the above IC is connected face-down to the electrode pattern on the liquid crystal panel formed opposite to the electrode pad of the IC driving the above liquid crystal panel in the active panel, a thin metal film is used. In the conventional liquid crystal panel electrode structure, it is necessary to form a dedicated electric conduction line outside the glass substrate component in the wafer glass in order to form a pattern and then perform anodic oxidation to form an oxide insulating film. It was

A driver IC for driving a liquid crystal panel
There are generally 80 to 160 output signal pins, while there are 15 to 30 pins supplying input signals for driving the IC. The connecting circuit on the substrate of the liquid crystal panel connected to the pins of the IC for supplying such an input signal and the electrode pattern connected to the circuit generally have a wider array pitch than the drive wiring pattern inside the liquid crystal panel.

FIG. 4 is a plan view of an essential part of an example of an electrode structure of a conventional liquid crystal panel. In FIG. 4, 21 is a planned cutting line,
22 is a wafer glass, 23 is an electrode pattern connected to a drive wiring line inside the liquid crystal panel, and 24 is an electrode pattern for inputting a signal for driving an IC.

[0005]

First, an outline of a conventional method for forming an electrode structure of a liquid crystal panel in FIG. 4 will be described. First, a thin metal film of Ta or the like is formed on the wafer glass in a solid form, then a resist is applied thereon and the resist is patterned by a photo process, and then the Ta film is etched according to the shape of the resist. Ta
An electrode pattern made of a thin film will be formed. Further subsequently, the anodic oxide film is formed on the Ta electrode pattern by immersing the Ta electrode pattern in a certain acid while applying a direct current. In FIG. 4, there are two planned cutting lines between the glass substrate parts, and one linear electrode pattern is formed between these two planned cutting lines. An electrode pattern 23 connected to a drive wiring line inside the liquid crystal panel and an electrode pattern 24 for inputting a signal for driving the IC are derived and connected in a branch shape from the.

As is apparent from FIG. 4, the electrode structure of the conventional liquid crystal panel has the following problems. First, in a liquid crystal panel wafer glass having a structure in which a plurality of glass substrate parts are taken from one wafer glass, there are two planned cutting lines between adjacent glass substrate parts, and the two planned cutting lines are described above. It is not used for anything other than anodic oxidation of the Ta electrode pattern, and is not used for the product space. Therefore,
The number of glass substrate parts to be taken from one wafer glass is reduced by the amount between the two planned cutting lines, and the manufacturing cost of the glass substrate parts is increased. Alternatively, if it is attempted not to reduce the number of glass substrate parts to be taken from one wafer glass, the size of one glass substrate part, and consequently the screen size of the liquid crystal panel, will be reduced. The commercial value of will also be reduced.

The electrode pattern for connecting the circuit for inputting the signal for driving the IC must have a wide pitch simply, and if the arrangement is freely arranged, the anodic oxidation line wiring can be arranged. Therefore, the above two planned cutting lines are indispensable.

Further, in a liquid crystal panel wafer glass having a structure in which a plurality of glass substrate parts are taken from one wafer glass, there are two planned cutting lines between adjacent glass substrate parts, and as described above, one wafer glass is preferably used. To avoid reducing the number of glass substrate parts taken from
If the reduction in the size of the glass substrate part is to be suppressed as much as possible, the distance between the two planned cutting lines becomes narrower than necessary, and it becomes extremely difficult to break the individual parts in terms of work.

Further, in a liquid crystal panel wafer glass having a structure in which a plurality of glass substrate parts are taken from one wafer glass, there are two planned cutting lines between adjacent glass substrate parts, and as described above, one wafer glass is preferable. In order not to reduce the number of glass substrate parts taken from the LCD panel, it is unavoidable to reduce the size of the glass substrate parts to some extent. The distance between and becomes extremely short, which adversely affects the liquid crystal panel image in the peripheral portion of the liquid crystal panel.

Therefore, the present invention solves the above-mentioned drawbacks of the prior art, suppresses the reduction of the number of glass substrate parts of the liquid crystal panel taken from the wafer glass, suppresses the size reduction of the glass substrate parts, and further the liquid crystal panel The purpose is to prevent deterioration of image quality.

[0011]

According to the electrode structure of a liquid crystal panel according to the present invention, an IC chip is phased on a substrate of a liquid crystal panel in which a liquid crystal layer is sandwiched between two upper and lower substrates made of glass or resin. In the liquid crystal panel module mounted in the down state, a connection circuit formed opposite to the connection electrode of the IC chip is formed on the substrate of the liquid crystal panel on which the IC chip is mounted. Some of them are connected to a drive wiring pattern inside the liquid crystal panel, and some of them are connected to an electrode pattern for connecting a circuit for inputting a signal for driving an IC. There is a wafer glass in which glass substrate parts of the above liquid crystal panel are formed in a plurality of wafer glasses and a thin film pattern is formed on the wafer glass, or after a certain process is performed, the glass substrate parts are cut and separated. A large number of electrode patterns connected to the drive wiring lines inside the liquid crystal panel are formed at a constant pitch on one of both sides of the planned cutting line of the wafer glass to the glass substrate component, and the other one of the above I
An electrode pattern for inputting a signal for driving C is formed, and the electrode pattern for inputting a signal for driving the IC is fixed at an integer multiple pitch of the electrode pattern connected to the drive wiring line inside the liquid crystal panel or It is characterized in that they are arranged at a plurality of types of pitches.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an example of a plan view of an electrode structure of a liquid crystal panel according to the present invention, showing a main part thereof.
In FIG. 1, reference numeral 1 is a planned cutting line, 2 is a wafer glass, 3 is an electrode pattern connected to a drive wiring line inside a liquid crystal panel, 4 is an electrode pattern for inputting a signal for driving an IC, and 5 is electrical for anodic oxidation. 2 shows a meandering wiring pattern that can be electrically connected.

Further, FIG. 2 shows the wafer glass of the electrode structure of the liquid crystal panel of FIG. 1 cut along a planned cutting line. Figure 2
As shown in, the pitch of the electrode pattern for connecting the circuit for inputting the signal for driving the IC is the electrode connected to the drive wiring line inside the liquid crystal panel of one of the planned cutting lines to the glass substrate part of the wafer glass. It is an integer multiple of the pattern pitch. In FIG. 2, the pitch of the electrode patterns connecting the circuits for inputting the signals for driving the IC is constant. 3 shows another embodiment of the electrode structure of the liquid crystal panel according to the present invention, in which the pitch of the electrode pattern for connecting the circuit for inputting the signal for driving the IC is set to the glass substrate part of the wafer glass. It is an indefinite pitch, although it is an integral multiple of the pitch of the electrode pattern connected to the drive wiring line inside the liquid crystal panel on one of the cut planned lines.

First, an outline of a method for forming an electrode structure of a liquid crystal panel according to the present invention in FIG. 1 will be described. First, a thin metal film of Ta or the like is formed on the wafer glass in a solid form, then a resist is applied thereon and the resist is patterned by a photo process, and then the Ta film is etched according to the shape of the resist. An electrode pattern made of a Ta thin film will be formed. Further subsequently, the anodic oxide film is formed on the Ta electrode pattern by immersing the Ta electrode pattern in a certain acid while applying a direct current. Each electrode pattern on the wafer glass cannot be anodized unless it is formed so as to be electrically conductive. In the present invention, a meandering pattern is formed so as to sequentially traverse the planned cutting line for anodizing. One side of the folded portion of the meandering pattern is connected with the electrode pattern connected to the drive wiring line inside the liquid crystal panel at the same pitch. Further, the other side of the folded portion of the meandering pattern is partially connected to an electrode pattern for inputting a signal for driving an IC, and the arrangement pitch of the electrode pattern for inputting a signal for driving an IC is generally a liquid crystal. It is larger than the electrode pattern connected to the drive wiring line inside the panel, and the electrode pattern for inputting the signal for driving this IC is not connected to all the folded portions of the meandering pattern. The meandering pattern may be connected to an electrode pattern for inputting a signal for driving one IC.

Further, in the electrode structure of the liquid crystal panel according to the present invention, the electrode pattern connected to the drive wiring line inside the liquid crystal panel is arranged at a constant pitch on one side of the planned cutting line. An electrode pattern for inputting a signal for driving an IC is connected to the opposite sides across the planned cutting line at an integral multiple pitch of the electrode pattern connected to the drive wiring line inside the liquid crystal panel.

The present invention has several features as described below. First, a signal for driving an IC on the side opposite to the planned cutting line is input with respect to the arrangement pitch of the electrode patterns connected to the drive wiring lines inside the liquid crystal panel on one side of the planned cutting line. Since the pitch of the electrode patterns is an integral multiple, the planned cutting lines are sequentially formed for anodic oxidation between the electrode pattern connected to the drive wiring line inside the liquid crystal panel and the electrode pattern for inputting the signal for driving the IC. A meandering pattern can be formed so as to traverse, and an electrode pattern connected to a drive wiring line inside the liquid crystal panel and an electrode pattern for inputting a signal for driving an IC are provided on one side of the folded portion of the meandering pattern. Can be connected with matching pitch.
The arrangement pitch of the electrode patterns for inputting the signals for driving the IC is generally larger than the electrode patterns connected to the drive wiring lines inside the liquid crystal panel, and is an integral multiple, so that one wafer glass to a plurality of glass plates is used. In a liquid crystal panel wafer glass configured to take board components, it is easy to make at most one cutting line between adjacent glass substrate parts, and what is wasted product space due to this cutting line? Nor. Therefore, the number of glass substrate parts to be taken from one wafer glass increases, and the manufacturing cost of the glass substrate parts can be reduced. Alternatively, when trying not to increase the number of glass substrate components taken from one wafer glass,
It is possible to increase the size of one glass substrate component, and consequently the screen size of the liquid crystal panel, and thus increase the commercial value of the liquid crystal panel.

Further, a signal for driving the IC on the side opposite to the array pitch of the electrode patterns connected to the drive wiring lines inside the liquid crystal panel on one side of the planned cut line, with the planned cut line interposed therebetween. Since the pitch of the electrode pattern for inputting is an integer multiple, in a liquid crystal panel wafer glass in which a plurality of glass substrate parts are taken from one wafer glass, the number of cutting lines between adjacent glass substrate parts is at most one. When cutting and separating glass substrate parts by cutting, the planned cutting line is marked and the glass parts are broken with a size large enough for work, so the workability of cutting and separating is greatly improved and the work cost is reduced. It is something you can do.

Further, a signal for driving an IC on the side opposite to the arrangement pitch of the electrode patterns connected to the drive wiring lines inside the liquid crystal panel on one side of the planned cutting line with the planned cutting line interposed therebetween. Since the pitch of the electrode pattern for inputting is an integer multiple, in a liquid crystal panel wafer glass in which a plurality of glass substrate parts are taken from one wafer glass, the number of cutting lines between adjacent glass substrate parts is at most one. It is possible to reduce the number of glass substrate parts taken from one wafer glass as much as possible, and even if the screen size is further increased while preventing the size of the glass substrate parts from decreasing, It is possible to secure a sufficient distance between the seal part and the actual screen area, and prevent adverse effects on the liquid crystal panel image around the liquid crystal panel. The Rukoto.

[0019]

As described above, according to the present invention, in a liquid crystal panel wafer glass having a constitution in which a plurality of glass substrate parts are taken, the number of cutting lines between adjacent glass substrate parts can be at most one. This has the effects of increasing the number of board components and increasing the size of glass substrate components, and not deteriorating the image display characteristics of the liquid crystal panel made of glass substrate components.

[Brief description of drawings]

FIG. 1 is a plan view of a main part in an embodiment of the present invention.

FIG. 2 is a plan view of an essential part showing a state after cutting and separating in an example of the present invention.

FIG. 3 is a plan view of an essential part showing a state after cutting and separating in another embodiment of the present invention.

FIG. 4 is a plan view of a main part of a conventional example.

[Explanation of symbols]

1, 21 Planned cutting line 2, 22 Wafer glass 3, 23 Electrode pattern connected to drive wiring line inside liquid crystal panel 4, 24 Electrode pattern for inputting signal to drive IC 5 Electrically conductive for anodic oxidation Serpentine wiring pattern

Claims (1)

[Claims] 1. A liquid crystal panel module in which an IC chip is mounted in a phase down manner on a substrate of a liquid crystal panel in which a liquid crystal layer is sandwiched between two upper and lower substrates made of glass or resin. On the substrate of the liquid crystal panel to be mounted, a connecting circuit formed opposite to the connecting electrodes of the IC chip is formed. Part of the connecting circuit is connected to the drive wiring pattern inside the liquid crystal panel. In addition, a part is connected to an electrode pattern for connecting a circuit for inputting a signal for driving the IC. There is a wafer glass in which glass substrate parts of the above liquid crystal panel are formed in a plurality of wafer glasses and a thin film pattern is formed on the wafer glass, or after a certain process is performed, the glass substrate parts are cut and separated. A plurality of electrode patterns connected to drive wiring lines inside the liquid crystal panel are formed at a constant pitch on one of both sides of a planned cutting line of the wafer glass to the glass substrate component, and the other side is formed of the IC.
An electrode pattern for inputting a signal for driving the IC is formed, and an electrode pattern for inputting a signal for driving the IC is at a pitch of an integral multiple of the electrode pattern connected to the drive wiring line inside the liquid crystal panel and is constant or plural. An electrode structure of a liquid crystal panel, which is arranged at a certain pitch.