JPH0651009Y2 - 多層配線装置 - Google Patents

多層配線装置

Info

Publication number
JPH0651009Y2
JPH0651009Y2 JP1988116855U JP11685588U JPH0651009Y2 JP H0651009 Y2 JPH0651009 Y2 JP H0651009Y2 JP 1988116855 U JP1988116855 U JP 1988116855U JP 11685588 U JP11685588 U JP 11685588U JP H0651009 Y2 JPH0651009 Y2 JP H0651009Y2
Authority
JP
Japan
Prior art keywords
insulating film
heat
wiring
layer wiring
wiring device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988116855U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0238775U (en:Method
Inventor
稔夫 杉岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Ltd filed Critical Mitsubishi Heavy Industries Ltd
Priority to JP1988116855U priority Critical patent/JPH0651009Y2/ja
Publication of JPH0238775U publication Critical patent/JPH0238775U/ja
Application granted granted Critical
Publication of JPH0651009Y2 publication Critical patent/JPH0651009Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
JP1988116855U 1988-09-07 1988-09-07 多層配線装置 Expired - Lifetime JPH0651009Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988116855U JPH0651009Y2 (ja) 1988-09-07 1988-09-07 多層配線装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988116855U JPH0651009Y2 (ja) 1988-09-07 1988-09-07 多層配線装置

Publications (2)

Publication Number Publication Date
JPH0238775U JPH0238775U (en:Method) 1990-03-15
JPH0651009Y2 true JPH0651009Y2 (ja) 1994-12-21

Family

ID=31359776

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988116855U Expired - Lifetime JPH0651009Y2 (ja) 1988-09-07 1988-09-07 多層配線装置

Country Status (1)

Country Link
JP (1) JPH0651009Y2 (en:Method)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6298695A (ja) * 1985-10-24 1987-05-08 富士通株式会社 高熱伝導性配線基板の製造方法
JPS6341099A (ja) * 1986-08-06 1988-02-22 住友電気工業株式会社 多層配線基板

Also Published As

Publication number Publication date
JPH0238775U (en:Method) 1990-03-15

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