JPH0650131Y2 - Polishing equipment - Google Patents

Description

[Detailed Description of the Invention] (Industrial field of application) The present invention corrects uneven wear of the polishing surface of the polishing disk caused by polishing the flat surface of metal parts, ceramic parts, etc. by the electrolytic method. The present invention relates to a polishing device having a mechanism.

(Prior Art) Equipped with a horizontally rotatable polishing disc whose upper surface is a polishing surface with fixed abrasive grains, a work holding device for pressing a work against the polishing surface, and a correction grindstone for correcting the polishing surface facing the polishing surface. A polishing device in which a modified whetstone holding device is incorporated in the same machine base is already known from JP-A-63-64859, and a correction device by electrolytic polishing is also practically used.
It is already known from, for example, the −63297 publication.

(Problems to be solved by the invention) However, in this type of conventional polishing apparatus, uneven wear, unevenness, etc. of the polishing surface become large in the case of high-speed processing, heavy processing, etc., so it is necessary to correct uneven wear in a short time. Cannot be done during polishing work. Therefore, it may be possible to correct uneven wear in a short time during polishing work by incorporating a correction device by electrolytic polishing into the polishing device as described above, but the device becomes a large scale and it is widely installed. It requires space and is hardly practical.

(Means for Solving the Problem) The present invention relates to a compact polishing apparatus that solves the above problems, and includes a horizontally rotatable polishing disk whose upper surface is a polishing surface with fixed metal bond abrasive grains, A work holding device for pressing a work against the polishing surface, a correction grindstone holding device equipped with a correction grindstone for correcting the polishing surface facing the polishing surface, and a lower end of a rotary shaft that can be moved up and down mounted via an electric insulator And a polishing surface correcting device for connecting the rotating correction electrode body that is lowered to an eccentric position on the polishing surface and the polishing disk to a power supply device to electrolytically finish the polishing surface under the supply of a conductive liquid. It is incorporated in the same machine base, the correction grindstone is adjustable in tilt angle, and is vertically movable at a different eccentric position from the correction electrode body above the polishing surface. The mount is attached to a swing arm that moves from a work supply position outside the polishing surface to a work unloading position through an eccentric position different from the respective installation positions of the correction electrode body and the correction grindstone above the polishing surface, which is the processing position. It is characterized by having been made.

(Operation) In such a polishing device, after rotating the polishing disk, the work is held by the work holding device, the work is positioned on the polishing surface, the work is rotated, and the pressure is adjusted to the polishing surface. Pressing and polishing. Then, if uneven wear or the like occurs on the polishing surface due to this polishing work, the motor of the correction grindstone holding device is driven to rotate the correction grindstone whose levelness has been adjusted in advance, and then descend while rotating the correction grindstone. Correct the rough finish of the polished surface. Next, the polishing surface correction device is operated to rotate the correction electrode body,
This is lowered by an elevating mechanism (not shown), and when a predetermined gap is formed between the polishing surface and the polishing surface, this lowering is stopped and the conductive liquid is supplied from the nozzle to the gap. Then, a predetermined voltage is applied between the polishing disk and the correction electrode body from the power supply device to electropolish the polished surface, and the polishing surface is trued and dressed in a short time by the correction grindstone and the correction electrode body to form a predetermined polishing surface. Is played.

(Example) Next, this invention is demonstrated in detail about the Example shown in figure.

(1) is a box-shaped machine base, and a polishing disc (3) is attached to a support frame (2) in the machine base (1). The polishing disc (3) is driven by a motor (4). It is horizontally rotated through a transmission mechanism such as a V belt and a V pulley. The lower side of the polishing disk (3) is composed of a metal base (5) on which a polishing abrasive grain layer of metal bond fixed abrasives is formed, the upper surface of which is the polishing surface (6). It is said that. Further, a work loading / unloading and gripping processing device (7) is provided on the support frame (2) of the machine base (1), and its support (8).
A swinging arm (9) is swingably held by the swinging arm (9), and a work piece is attached / detached and a polishing surface (6) is provided below the tip of the swinging arm (9).
A work holding device (10) for pressing the work is attached to the work holding device (10), which is driven by a motor (11) attached to an upper bracket, and which is moved from a work supply position to a polishing position by a swing arm (9). It is possible to move to the work unloading position via the eccentric position on the surface (6). Further, a polishing surface correction device (12) is provided on the side wall (1a) of the machine base (1).
Has a rotary shaft (13) attached to it so that it can be raised and lowered. A cup-shaped correction electrode body (15) is fixed to the lower end of the rotary shaft (13) through an electric insulator (14), and the lower surface thereof is polished. Surface (6)
It is arranged so as to face the eccentric position on the upper surface.
Further, the rotary shaft (13) is swingable around the upper side thereof, and the correction electrode body (15) at the lower end is configured to be able to adjust the levelness with respect to the polishing surface (6). Further, the anode side of the power supply device (16) attached to the machine base (1) is connected to the base (5) of the polishing disk (3) via the power supply brush (17), and the cathode side is connected to the power supply brush (18). Through the correction electrode body (1
5) and is connected to the polishing surface (6) and the correction electrode body (1).
In the vicinity of the boundary with 5), a nozzle (19) capable of supplying a conductive liquid to the boundary surface is attached to the end of the pipe provided on the machine base (1). Furthermore, a correction grindstone holding device (20) is attached to the side wall (1b) at the front rear of the machine base (1) in the same manner as the polishing surface correction device (12), and the correction grindstone (21) is a general vitrified As with a grindstone, a metal bond grindstone, etc., the processing position and the correction electrode body (15) are defined so that the polishing surface (6) between the work holding device (10) and the polishing surface correction device (12) can be polished. It is located at a different eccentric position. That is, as shown in FIG. 2, the correction grindstone holding device (20) has a vertical feed screw shaft (23) axially supported by a holding device main body (22) attached to a side wall (1b), and a feed screw The upper end of the shaft (23) is connected to the drive shaft of the motor (24) attached to the holding device body (22), and the nut fixed to the lifting bracket (25) is attached to the lower side of the feed screw shaft (23). (26) is screwed on and lift bracket (25)
One side of the motor (24) is slidably engaged with a sliding guide portion (not shown) provided on the side wall (1b) in the vertical direction.
The raising / lowering bracket (25) is configured to be raised and lowered by the feed screw shaft (23) which is rotated by driving the nut and the nut (26) screwed to the feed screw shaft (23), and further, the tubular portion (27) of the raising and lowering bracket (25). A spherical seat (28) is formed on the upper end surface of the.
Reference numeral (29) is a holding tube inserted into the tubular portion (27) with a slight gap, and an upper flange (30) is fixed to the upper end of the holding tube (29), and the lower portion of the outer periphery thereof is fixed. Is the spherical seat (2
8) is formed with a spherical seat (31), and since the holding cylinder (29) has its spherical seat (31) engaged with the spherical seat (28), The holding cylinder (29) is swingably held by the lifting bracket (25). Further, a lower flange (32) is fixed to the lower end of the holding cylinder (29), and an appropriate number of vertical adjusting bolts (33) are screwed around the outer periphery of the lower flange (32). 25), the tilting of the holding cylinder (29) suspended by the spherical seat (28) with respect to the vertical direction is adjusted by the adjustment bolt (33) coming in and out, and the adjustment bolt (33) is adjusted. The holding cylinder (29) is fixed to the elevating bracket (25) in a predetermined inclined state by tightening. The upper and lower bearings (3
4), the rotary shaft (35) pivotally supported by (34) is inserted, the upper end of which is connected to the drive shaft of the motor (36) and the lower end is fixed with the above-mentioned correction grindstone (21). (37) is a pressurizing force adjuster provided in the work holding device (10), and W is a work.

With this construction, as shown in FIG. 3, the work W held by swinging the swing arm (9) of the work holding device (10) is used as the polishing surface of the polishing disk (3). (6) Place the motor in the upper machining position and
1) is driven to rotate the work W. Subsequently, the pressurizing force adjuster (37) of the work holding device (10) is actuated to bring the rotating work W to the polishing surface (6) of the polishing disk (3) rotated by the motor (4) in a predetermined manner. Press at the pressure of, and add a suitable coolant to polish the work. If uneven polishing, unevenness, etc. occur on the polishing surface (6) as the work W is polished, and the correction is required, the eccentricity different from the processing position on the polishing surface (6) on the same machine base (1). The motor (36) of the correction grindstone holding device (20) incorporated so that the correction grindstone (21) is located at the position drives the rotation shaft (35) to rotate the lower correction grindstone (21). The correction grindstone (21) has its levelness adjusted in advance, and the lower surface thereof is tilted according to the inclination of the polishing surface (6). This is done by adjusting the adjustment bolts (33)
The spherical seat (3) is attached to the spherical seat (28) of the lifting bracket (25).
The holding cylinder (29) engaged and held by 1) swings due to the slip on the engagement surface between the spherical seat (28) and the spherical seat (31), which also swings the rotary shaft (35). Then, the lower surface of the correction grindstone (21) at the lower end is tilted, and the adjustment bolt (33) is positioned and fixed where this corresponds to the inclination of the polishing surface (6). Next, the motor (24) is driven to rotate the feed screw shaft (23), the lifting bracket (32) is lowered via the nut (26), and the correction grindstone (21) is moved to the polishing surface (6) in a predetermined manner. The polishing surface (6) is corrected and polished while lowering to the notch position and supplying the coolant. This later, the processing position on the polishing surface (6) and the correction grindstone (21)
The correction electrode body (12), which is installed at an eccentric position different from the installation position of (1), is actuated to adjust the levelness to a state along the inclination of the polishing surface (6) in the same manner as described above ( 15) is rotated and lowered, and when the opposing gap between the lower surface and the polishing surface (6) reaches a predetermined value, the lowering is stopped and the conductive liquid is pumped by a pump device (not shown) from the nozzle (19) to the gap portion. It is supplied and the space between them is filled with a conductive liquid. Next, if a predetermined voltage is applied between the polishing disk (3) and the correction electrode body (15) via the power supply brushes (17) and (18) by the power supply device (16), the polishing surface (6) and the correction electrode (6) Electrolytic action occurs between the bodies (15), and the polishing surface (6) is electrolytically polished. At this time, the correction electrode body (15) is attached to the lower end of a rotating shaft (13) which can be moved up and down via an electric insulator (14), and is rotatable down to an eccentric position on the polishing surface (6). Since it is provided, the lower surface and the polished surface (6) are easily parallel to each other, and stable electrolysis is possible.

As described above, the polishing surface (6) is rough-polished by a predetermined amount by the correction grindstone (21), then finely polished by the correction electrode body (15), and the abrasive grains on the polishing surface (6) are evenly projected. The surface is regenerated to a predetermined polished surface (6) which is adjusted to the above condition and is free from uneven wear and uneven portions. In addition, the correction grindstone (21) is appropriately stopped depending on the correction condition of the polishing surface (6) and the correction electrode body (15) is
Although the electrolytic fine finishing is performed by the above, both can be operated simultaneously.

(Effects of the Invention) As is apparent from the above description, the present invention adds a correction grindstone holding device to a polishing device for truing and dressing the polishing surface by the electrolytic polishing method, and enables polishing surface correction processing by the correction grindstone. Therefore, even if uneven wear is large, rough finishing can be performed with a correction grindstone and fine finishing can be performed by electrolytic work with the correction electrode body, so truing and dressing can be performed in a short time, resulting in uneven wear and unevenness on the polished surface. It can be applied to high-speed polishing and many other polishing methods, and because all the mechanisms are built into the same machine base, the polishing surface can be corrected in a timely manner even during polishing work, thus improving productivity. In addition, the swinging arm enables the work holding device to move from the work supply position outside the polishing surface to the processing position at the eccentric position on the polishing surface. Not only can it be made extremely compact by providing the correction electrode body and the correction grindstone at an eccentric position different from the above-mentioned processing position on the polishing surface, so not only can it be provided at a low cost, but it also has many advantages such as a small installation area. It has an extremely high practical value as a solution to the problems of the conventional polishing apparatus of this kind.

[Brief description of drawings]

FIG. 1 is a front view showing an embodiment of the present invention, FIG. 2 is a partially cutaway front view of a correction grindstone holding device in the present invention, and FIG. 3 is a position of a work, a correction grindstone, and a correction electrode body on a polishing disk. It is a schematic explanatory drawing which shows an example of a relationship. (1): Machine stand, (3): Abrasive disc, (6): Abrasive surface, (9): Swing arm, (10): Work holding device, (12): Abrasive surface correction device,
(13): rotating shaft, (14): electrical insulator, (15): repairing electrode assembly, (16): power supply device, (20): repairing grindstone holding device, (21): repairing grindstone.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Takeo Nakagawa, creator 4-2 Nakatsubo, Nakahara-ku, Kawasaki-shi, Kanagawa 4-216 Musashi-Kosugi View Heights (72) Sei Omori 6-41-16 Maeno-cho, Itabashi-ku, Tokyo Nishio Room 10

Claims (1)

[Scope of utility model registration request] 1. A horizontally rotatable polishing disk (3) having an upper surface as a polishing surface (6) with fixed metal bond abrasive grains, a work holding device (10) for pressing a work against the polishing surface (6), and A correction grindstone holding device (20) provided with a correction grindstone (21) for correcting the polishing surface facing the polishing surface (6), and an electric insulator (14) at the lower end of a rotating shaft (13) which can be moved up and down. Is attached to the polishing surface (6) and is lowered to an eccentric position on the polishing surface (6) and the polishing disk (3) is connected to a power supply device (16) to supply a conductive liquid. And a polishing surface correction device (12) for electrolytically finishing the polishing surface (6) are incorporated in the same machine base (1), and the correction whetstone (21) is provided with an adjustable tilt angle. It is arranged so as to be able to move up and down at an eccentric position different from the upper correction electrode body (15). The workpiece holding device (10)
Indicates a work from a work supply position outside the polishing surface (6) through an eccentric position different from the respective installation positions of the correction electrode body (15) and the correction grindstone (21) above the polishing surface (6) which is a processing position. A polishing device, characterized in that it is attached to a swinging arm (9) which is moved to a carry-out position.