JPH0288171A - Method and device for polishing - Google Patents
Method and device for polishingInfo
- Publication number
- JPH0288171A JPH0288171A JP63239951A JP23995188A JPH0288171A JP H0288171 A JPH0288171 A JP H0288171A JP 63239951 A JP63239951 A JP 63239951A JP 23995188 A JP23995188 A JP 23995188A JP H0288171 A JPH0288171 A JP H0288171A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- electrode body
- disk
- correction
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 107
- 238000000034 method Methods 0.000 title claims description 19
- 238000012937 correction Methods 0.000 claims abstract description 43
- 239000006061 abrasive grain Substances 0.000 claims abstract description 17
- 239000002184 metal Substances 0.000 claims abstract description 12
- 239000007788 liquid Substances 0.000 claims abstract description 11
- 230000004048 modification Effects 0.000 claims description 5
- 238000012986 modification Methods 0.000 claims description 5
- 230000009471 action Effects 0.000 claims description 3
- 238000012545 processing Methods 0.000 description 8
- 238000003754 machining Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000008439 repair process Effects 0.000 description 5
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 206010011224 Cough Diseases 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/001—Devices or means for dressing or conditioning abrasive surfaces involving the use of electric current
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、金属部品やセラミック部品等の平ｔＯ面を研
摩し、砥石の研摩面が偏摩耗するとそのまま研摩面修正
したうえ研摩を続けることのできる研摩方法及び研摩装
置に関するものである。[Detailed Description of the Invention] (Industrial Application Field) The present invention is a method for polishing flat tO surfaces of metal parts, ceramic parts, etc., and when the polished surface of a grindstone wears unevenly, the polished surface is corrected and the polishing is continued. The present invention relates to a polishing method and a polishing device that allow for polishing.
（従来の技術）
金属部品等の平坦面を研摩する研摩方法としては、アラ
ンダム、カーボランダム等の砥粒を遊離砥粒としである
いはこれら砥粒を固定砥粒として用いたラッピング方式
と、平面研削盤による研削方式が一般に実施されている
。(Prior art) Polishing methods for polishing flat surfaces such as metal parts include lapping methods using abrasive grains such as alundum and carborundum as free abrasive grains or fixed abrasive grains, and flat surface polishing methods. A grinding method using a grinder is generally practiced.
（発明が解決しようとする課題）
しかしながら、従来の遊離砥粒及び固定砥粒によるラッ
ピング方式では、粉塵の発生、ワークの洗浄、固定砥粒
の目すまり、偏摩耗による加工精度や加工効率の低下な
ど種々の問題がある。また、研削方式では機械装置の精
度と研摩砥石の精度が加工精度に影響を及ぼすため、高
精度加工には装置を高価な高精度仕様とする必要があり
、特に、前記砥石の修正には細心の注意を要し、しかも
、専用の装置に研摩ディスクや研摩砥石のような砥石を
つけ替えて行わねばならぬため、手数や時間がかかると
ともに、使用される各種粒度の砥石に対応した修正工具
を必要とし、かつ、これらの修正工具の損耗が激しくて
頻繁に交換を要し、研摩装置としての稼動率の低下をき
たす等の多くの問題点がある。(Problem to be solved by the invention) However, in the conventional lapping method using free abrasive grains and fixed abrasive grains, processing accuracy and processing efficiency are reduced due to dust generation, cleaning of the workpiece, clogging of the fixed abrasive grains, and uneven wear. There are various problems such as decline. In addition, in the grinding method, the precision of the mechanical equipment and the precision of the grinding wheel affect the processing accuracy, so high-precision machining requires expensive high-precision equipment, and in particular, care must be taken when modifying the grinding wheel. In addition, it is necessary to use special equipment to replace grinding wheels such as abrasive discs and grinding wheels, which is laborious and time-consuming. In addition, there are many problems such as the need for frequent replacement of these repair tools due to severe wear and tear, and a decrease in the operating rate of the polishing device.
（課題を解決するための手段）
本発明は前記のような問題点を解決した研摩方法及び研
摩装置に関するもので、水平回転する円盤状の砥石の上
面にワークを載せて加圧しながらワークの表面を仕上加
工する固定砥粒ラッピング式の研摩方法において、前記
砥石として上面をメタルボンド固定砥粒による研摩面と
した研摩ディスクを用い且つ前記研摩ディスクの一側上
面に回転自在な研摩面の修正用電極体を対向させて回転
する該研摩ディスクと修正用電極体を電源装置の陽極と
陰極に接続させながら導電性液体を前記研摩ディスクと
修正用電極体との間に供給してその間に生ずる電解作用
により研摩ディスクの研摩面の修正を行うことを特徴と
する研摩方法を第１の発明とし、上面をメタルボンド固
定砥粒による研摩面とした水平回転自在な研摩ディスク
と、咳研摩ディスクの研摩面にワークを押し付けるワー
ク保持装置と、前記研摩ディスクの研摩面修正を行う研
摩面修正装置とが同一の機台に組み込まれており、該研
摩面修正装置は研摩ディスクの一側上面に対向させた回
転自在な修正用電極体と、該修正用電極体と前記研摩デ
ィスクを回転可能に陽極と陰極に接続させる電源装置と
、研摩ディスクと修正用電極体間に導電性液体を供給す
るノズルとよりなることを特徴とする研摩装置を第２の
発明とするものである。(Means for Solving the Problems) The present invention relates to a polishing method and a polishing device that solve the above-mentioned problems, in which a workpiece is placed on the upper surface of a horizontally rotating disk-shaped grindstone, and the surface of the workpiece is polished while applying pressure. In a fixed abrasive lapping type polishing method for finishing, a polishing disk whose upper surface is a polishing surface made of metal bonded fixed abrasive grains is used as the grindstone, and one side of the polishing disk has a rotatable polishing surface on the upper surface for correction. Electrolysis occurs by supplying a conductive liquid between the polishing disk and the repair electrode body while connecting the polishing disk and the repair electrode body, which rotate with the electrode bodies facing each other, to the anode and cathode of a power supply device. The first invention is a polishing method characterized in that the polishing surface of the polishing disk is corrected by action, and the polishing disk is horizontally rotatable and the upper surface is a polishing surface made of metal bonded abrasive grains, and the polishing of the cough polishing disk is provided. A workpiece holding device for pressing a workpiece against a surface and a polishing surface modification device for modifying the polishing surface of the polishing disk are built into the same machine base, and the polishing surface modification device is arranged opposite to the upper surface of one side of the polishing disk. a rotatable correction electrode body, a power supply unit for rotatably connecting the correction electrode body and the polishing disk to an anode and a cathode, and a nozzle for supplying a conductive liquid between the polishing disk and the correction electrode body. A second invention is a polishing apparatus characterized by the following.
（実施例）
次に、本発明を図示の研摩装置を実施例として詳細に説
明する。(Example) Next, the present invention will be described in detail using the illustrated polishing apparatus as an example.
（１）は箱状の機台で、その・内部に傾斜して張設した
上面板（２）には、第２図に示すよ・うに、研摩ディス
ク（３）がモータ（４）により■プーリ、■ベルト等の
伝動機構を経て水平回転可能に取付けである。なお、研
摩ディスク（３）は金属製の基盤（５）の上面をメタル
ボンド固定砥粒による研摩面（６）とされたものとして
いる。（７）は機台（１）に設けられるワークの殿人出
装置で、該搬入山装置（７）は上面板（２）に立設した
支柱（８）に水平１工勤自在に取付けられた揺動アーム
（９）を有し、その下方にはワークを着脱可能とするワ
ーク保持装置０［Ｄが取付けてあり、該ワーク保持装置
０１１）は搬入用装置（７）によりワーク供給位置から
加工位置である研摩ディスク（３）の上方を経てワーク
搬出位置に間歇的に移動可能となっている。(1) is a box-shaped machine base, and on the top plate (2) installed at an angle inside the machine, as shown in Fig. 2, a polishing disc (3) is driven by a motor (4). It is installed so that it can be rotated horizontally via a transmission mechanism such as a pulley or belt. The polishing disk (3) has a metal base (5) whose upper surface is a polishing surface (6) with metal bonded abrasive grains. (7) is a workpiece loading device installed on the machine base (1), and the loading device (7) is installed horizontally on a support (8) erected on the top plate (2). The workpiece holding device 0 [D] is attached to the lower part of the swinging arm (9), and the workpiece holding device 011) is moved from the workpiece supply position by the loading device (7). It can be moved intermittently to the workpiece unloading position via above the polishing disk (3) which is the processing position.
また、ワーク保持装置θ山には加圧力調整機（１１）が
取付けてあり、これは研摩初期と研摩終期とてはワーク
の加工圧が変わるようワーク保持装置（１０を昇降動さ
せるもので、すなわち、ワークは研摩初期に研摩終期よ
り高めの加工圧が加えられて短時間で所定寸法近くまで
の荒研磨が行われ、研摩終期には加工圧は減圧されて仕
上げ精度と寸法精度の高い精密仕上げが行われるように
なっている。In addition, a pressurizing force regulator (11) is attached to the workpiece holding device θ, which moves the workpiece holding device (10 up and down) so that the machining pressure of the workpiece changes between the initial stage and the final stage of polishing. In other words, a higher processing pressure is applied to the workpiece at the beginning of polishing than at the end of polishing, and the workpiece is roughly polished to near the predetermined dimensions in a short period of time, and at the end of polishing, the processing pressure is reduced to achieve precision finishing with high finishing accuracy and dimensional accuracy. The finishing touches are about to take place.
０２）は機台（１）の側壁部に設けた案内部材（１３）
に上下摺動自在に組み付けられた研摩面修正装置で、該
研摩面修正装置（１２）は第４図に示すように縦形の支
持軸（１４）を有し、該支持軸（１４）にはその下端に
電気絶縁体（１５）を介して取付けられたカップ状をし
た研摩面の修正用電極体（１６）が研摩ディスク（３）
の研摩面（６）の一側上面に対向して臨むように配設さ
れている。そして支持軸（１４）は−例が案内部材（１
３）に係合されて上下摺動する保持筒（１７）に軸受（
１８）、（１８）を介して回転自在に保持され、該保持
筒（１７）に形成した上部フランジ（１９）の下面には
球面座（２０）を設けるとともに下部フランジ（２１）
には修正用電極体（１６）の水平度調整における保持筒
（１７）の位置決め用の３個の１１節ボルト（２２）が
その上端を後記する昇降プラケッ） （３２）の下端に
当接可能として螺挿しである。更に、支持軸（１４）の
上端は保持筒（１７）上に取付けたモータ（２３）と軸
継手（２４）を介して接続されて下端の修正用電極体（
１６）は回転可能な構成としである。（２５）は案内部
材（１３）の側壁に固定された昇降装置で、該昇降装置
（２５）は第４図に示すように、その本体（２６）に取
付けたモータ（２７）に軸継手（２８）を介して連結さ
れるとともに軸受部（３０）により軸支された縦形の送
りねじ（２９）を備え、該送りねしく２９）にはナラ）
（３１）が螺着させである。そして、ナツト（３１）
には昇降ブラケット（３２）が螺着固定してあり、その
一側には前記保持筒（１７）が細隙を残して遊嵌されて
おり、かつ、昇降ブラケッＩ−（３２）の上端面には、
前記球面座（２０）に対応する球面受座（３３）が形成
してあり、該球面受座（３３）に球面座（２０）を当接
支持させることにより、保持筒（１７）は前記両者によ
る球面状保合部を基準として昇降プラケッ） （３２）
に対し傾動可能に吊下げ保持されることとなり、従って
、保持筒（１７）の支持軸（１４）の下端の修正用電極
体（１６）も揺動してその水平度の調整が可能とされる
とともに、送りねじ（２９）の回動により案内部材（１
３）に案内されて昇降可能とされている。また、修正用
電極体く１６）の水平調整時は複数個の調節ボルト（２
２）のそれぞれを移動させて先端を昇降ブラケット（３
２）の下面に当接させるとことにより保持筒（１７）は
所定の傾きとされて固定され、修正用電極体（１６）は
所望の水平度に調節されて位置決めされる。02) is a guide member (13) provided on the side wall of the machine base (1)
As shown in FIG. 4, this polishing surface modification device (12) has a vertical support shaft (14), and the support shaft (14) has a A cup-shaped polishing surface correction electrode body (16) attached to the lower end of the polishing disk (3) via an electrical insulator (15) is attached to the polishing disk (3).
The polishing surface (6) is disposed so as to face the upper surface of one side of the polishing surface (6). and the support shaft (14) - for example the guide member (1
A bearing (
18) and (18), and a spherical seat (20) is provided on the lower surface of an upper flange (19) formed on the holding cylinder (17), and a lower flange (21)
The upper end of the three 11-bar bolts (22) for positioning the holding cylinder (17) in adjusting the horizontality of the correction electrode body (16) can come into contact with the lower end of the elevating bracket (32) (to be described later). It is a screw insert. Further, the upper end of the support shaft (14) is connected to the motor (23) mounted on the holding cylinder (17) via the shaft coupling (24), and the lower end is connected to the correction electrode body (
16) has a rotatable configuration. (25) is a lifting device fixed to the side wall of the guide member (13), and as shown in FIG. 4, the lifting device (25) is connected to a shaft coupling ( A vertical feed screw (29) is connected via a bearing (30) and is pivotally supported by a bearing (30),
(31) is screwed. And Natsuto (31)
A lifting bracket (32) is screwed and fixed to one side, and the holding cylinder (17) is loosely fitted on one side with a gap left, and the upper end surface of the lifting bracket I-(32) for,
A spherical seat (33) corresponding to the spherical seat (20) is formed, and by abutting and supporting the spherical seat (20) on the spherical seat (33), the holding cylinder (17) (32)
Therefore, the correction electrode body (16) at the lower end of the support shaft (14) of the holding cylinder (17) can also be swung to adjust its levelness. At the same time, the guide member (1) is rotated by the rotation of the feed screw (29).
3) It is possible to go up and down by being guided by. Also, when adjusting the level of the correction electrode body (16), use multiple adjustment bolts (2).
2) and move the tip to the lifting bracket (3).
2), the holding cylinder (17) is fixed at a predetermined inclination, and the correction electrode body (16) is adjusted to a desired level and positioned.
なお、修正用電極体（１６）としてはメタルボンド砥石
を使用することもできる。 （３４）は研摩面修正装置
：（１２）における別設の電源装置で、その陽極は給電
ブラシ（３５）を介して研摩ディスク（３）の基盤（５
）へ接続され、また、陰極は別の給電ブラシ（３６）を
介して修正用電極体（１６）へ接続され、（３７）は一
般に使用される水溶性研削液のような導電性液体を研摩
面（６）と修正用電極体（１６）との境界面へ供給する
ノズルで、前記境界面へ導電性液体を常時溝たすことが
できるように機台（１）内に配設してあり、（３８）は
その供給配管、（３９）はワーク保持装置ａＯを駆動す
るモータである。Note that a metal bond grindstone can also be used as the correction electrode body (16). (34) is a separately installed power supply device in the polishing surface correction device (12), the anode of which is connected to the base (5) of the polishing disk (3) via the power supply brush (35).
), and the cathode is connected via another power supply brush (36) to a retouching electrode body (16), (37) which is used for polishing conductive liquids such as commonly used water-soluble abrasive fluids. A nozzle that supplies the interface between the surface (6) and the correction electrode body (16), and is arranged in the machine base (1) so as to be able to constantly fill a groove with conductive liquid on the interface. (38) is its supply pipe, and (39) is a motor that drives the workpiece holding device aO.
（作用）
このように構成されたものは、ワーク保持装置０■を第
３図に示すようにワーク供給位置へ揺動アーム（９）の
揺動により位置させてこれにワークを保持させ、この保
持装置（１６）を同じ機台（１）内のワーク加工位置で
ある研摩ディスク（３）の研摩面（６）上まで移動させ
るとともにモータ（３９）を駆動させてワークを回転さ
せる。その後、ワーク保持装置（１０の加圧力調整機（
１１）を作動して回転しているワークをモータ（４）に
より回転駆動されている研摩ディスク（３）の研摩面（
６）へ所定の圧力で圧接し、適当なり−ラントの使用の
下にワーク研摩を行う、そして、ワークの研摩加工につ
れて研摩面（６）に偏摩耗や凹凸部等を生じて修正を要
することとなったら、同じ機台（１）に組込まれている
研摩面修正装置（１２）のモータ（２３）を駆動して支
持軸（１４）と共に修正用電極体（１６）を回転させる
とともに、あらかじめ所定の水平度に調整しである修正
用電極体（１６）を昇降装置（２５）のモータ（２７）
を駆動することにより送りねしく２９）、ナツト（３１
）、昇降ブラケット（３２）及び保持筒（１７）を経て
下降させる。そして修正用電極体（１６）と研摩ディス
ク（３）の研摩面（６）との対向間隙が所定値となった
ら、モータ（２７）を停止させるとともに導電性液体を
図示されないポンプ装置により供給配管（３８）、ノズ
ル（３７）を経て前記間隙部へ供給してその間を導電性
液体により満たす０次いで、を源装置（３４）により給
電ブラシ（３５）、（３６）を介して研摩ディスク（３
）と修正用７ｆｔ極体（１６）間に所定電圧をかければ
、これによりメタルボンド固定砥粒より構成される研摩
面（６）と修正用電極体（１６）間に電解作用を生じ、
研摩面（６）が電解研摩される、このとき、修正用電極
体（１６）は回転しているので研摩面（６）は全面的に
均等に処理されて偏摩耗等が除かれ、研摩面（６）の加
工精度が正しく維持される。また、本実施例では前記ワ
ーク加工位置におけるワーク加工において、ワーク研摩
の終期に加圧力調整機（１１）により加工圧を減圧させ
、ワークの仕上面精度を高めるとともに寸法精度も向上
させて研摩ディスク（３）を交換することなく最終的な
仕上げも行えるようになっている。このようにして研摩
ディスク（３）の研摩面（６）の修正が終了したら、電
源装置（３４）を切るとともにノズル（３７）よりの導
電性液体の噴出も停止させ、必要に応じ昇降装置（２５
）のモータ（２７）を回転させてｙ降ブラケット（３２
）と共に修正用電極体（１６）を上昇、復帰させておく
、また、研摩ディスク（３）の交換により研摩面（６）
の傾斜状態等が変わったら、各調節ボルト（２２）を調
節しなおして保持筒（１７）を昇降ブラケット（３２）
に対し所定の傾斜度、すなわち修正用電極体（１６）を
研摩面（６）に対し所定の水平度とし、再び各調節ポル
ｌ−（２２）を締めて保持筒（１７）を昇降ブラケツト
（３２）に固定し、所定の水平度に保持する。なお、木
方式は一般のドレッシング作業にも適用できることは勿
論である。(Function) In the device configured as described above, the workpiece holding device 0■ is positioned at the workpiece supply position by swinging the swinging arm (9) as shown in Fig. 3, and the workpiece is held there. The holding device (16) is moved to the polishing surface (6) of the polishing disk (3), which is the workpiece processing position in the same machine stand (1), and the motor (39) is driven to rotate the workpiece. After that, the work holding device (10 pressurizing force regulators)
11) to rotate the workpiece, the polishing surface (
6) with a predetermined pressure and polish the workpiece using an appropriate runt, and as the workpiece is polished, uneven wear or irregularities occur on the polished surface (6), which requires correction. Then, drive the motor (23) of the polishing surface correction device (12) built into the same machine base (1) to rotate the correction electrode body (16) together with the support shaft (14), and The motor (27) of the lifting device (25) adjusts the correction electrode body (16) to a predetermined level.
By driving the nut (29), the nut (31
), the lifting bracket (32) and the holding cylinder (17). When the facing gap between the correction electrode body (16) and the polishing surface (6) of the polishing disk (3) reaches a predetermined value, the motor (27) is stopped and conductive liquid is supplied to the supply pipe by a pump device (not shown). (38), the conductive liquid is supplied to the gap through the nozzle (37) to fill the gap therebetween, and then the source device (34) supplies power to the abrasive disk (3) via the brushes (35) and (36).
) and the 7ft repairing electrode body (16), this causes an electrolytic action between the polishing surface (6) composed of metal bonded fixed abrasive grains and the repairing electrode body (16),
The polished surface (6) is electrolytically polished. At this time, since the correction electrode body (16) is rotating, the polished surface (6) is treated evenly over the entire surface, uneven wear etc. are removed, and the polished surface (6) Machining accuracy is maintained correctly. In addition, in this embodiment, in the workpiece machining at the workpiece machining position, the machining pressure is reduced by the pressurizing force regulator (11) at the final stage of workpiece polishing, thereby increasing the finished surface accuracy of the workpiece and also improving the dimensional accuracy. Final finishing can be done without replacing (3). When the polishing surface (6) of the polishing disk (3) has been corrected in this way, the power supply (34) is turned off and the ejection of the conductive liquid from the nozzle (37) is also stopped. 25
) to rotate the motor (27) of the y-lowering bracket (32).
), the correction electrode body (16) is raised and returned to its original position, and the polishing surface (6) is removed by replacing the polishing disk (3).
If the inclination condition of the
Adjust the correction electrode body (16) to a predetermined horizontality with respect to the polishing surface (6), tighten each adjustment pole l-(22) again, and lift the holding cylinder (17) up and down. 32) and maintain it at a predetermined level. It goes without saying that the tree method can also be applied to general dressing work.
今、前記方式において、直径２５０ｍｍ、幅８０鵬のダ
イヤモンド砥粒によるメタルボンド系研摩ディスクを直
径１２５ｍｍ、高さ１５ｍｍのカップ状の修正用電極体
により、両者間の間隔２鴫、印加電圧６０〜８０Ｖで１
サイクル毎に修正を行った結果、研摩面表面に生じた偏
摩耗は全くなくなり、平坦な研摩面が再生されて］ （
１００サイクル以上長時間持続された。また、修正用電
極体の消耗度は０．（１０５μｍ／ｌイクｈ以下で極め
て長時間使用できた。Now, in the above method, a metal bonded abrasive disk made of diamond abrasive grains with a diameter of 250 mm and a width of 80 mm is connected to a cup-shaped correction electrode body with a diameter of 125 mm and a height of 15 mm, with a distance of 2 mm between the two, and an applied voltage of 60 to 60 mm. 1 at 80V
As a result of making corrections every cycle, the uneven wear that had occurred on the polished surface completely disappeared, and a flat polished surface was regenerated] (
It lasted for over 100 cycles. Moreover, the degree of wear of the correction electrode body is 0. (It could be used for an extremely long time at less than 105 μm/l current.
（発明の効果）
本発明は前記説明から明らかなように、上面をメタルボ
ンド固定砥粒による研摩面とした研摩ディスクを使用し
ているため、ラッピング方式のような粉塵発生がなくて
作業環境が改善されるうえワークの洗浄が不要となり、
また、研摩ディスクとワーク保持装置及び研摩面修正装
置とが同一の機台に組み込まれていて研摩面は研摩作業
中においても適時修正可能であるから、研摩面は偏摩耗
等の異常な摩耗を生ずる前に修正されて平坦面が維持で
き、高い加工能率及び稼動率が得られる。(Effects of the Invention) As is clear from the above description, the present invention uses an abrasive disk whose upper surface is abrasive with metal-bond fixed abrasive grains, so there is no dust generation unlike the lapping method, and the work environment is improved. This is improved and eliminates the need to clean the workpiece.
In addition, since the abrasive disk, workpiece holding device, and abrasive surface correction device are built into the same machine base, the abrasive surface can be corrected at any time during the polishing operation, so the abrasive surface is free from abnormal wear such as uneven wear. It is possible to maintain a flat surface by correcting it before it occurs, resulting in high processing efficiency and operation rate.
しかも、研摩面の修正は修正用電極体による電解研摩方
式であるため、従来のように使用砥石の精度に応じて修
正工具をその都度交換する必要がなくて一種のみの修正
用電極体でよく、そのうえ微細粒度の砥石に対する修正
工具は製作が困難で高価となるのに比べて修正用電極体
は自由に選択できて容易に製作できる。また、修正用電
極体は回転するので研摩面に対する電解効果は全面的に
均一に分布されて均一な修正効果が得られるとともに、
修正程度は電圧、電流値等の設定値の調整により簡単に
制御できるので使用上極めて便利である。そして電解研
摩方式による修正方式であるため、研摩面における砥粒
突出効果が良好でその微小砥粒の突出量調整も容易であ
るとともに研削屑の除去効果もよく、かつ、修正用電極
体の消耗はツルーイング砥石に比べて極めて少ないので
従来のように頻繁に交換する必要がなく、更に、修正用
電極体は研摩面に対し水平度調整可能であるから常に最
良の状態で研摩面に対向位置させることができるととも
に研摩面を所望の形状に精度よく修正できる。また、前
記したように研摩面修正装置が研摩ディスク等と同一機
台に組込まれているため、コンパクトな設計となるうえ
に常時修正が可能であるから装置本体を高精度仕様とす
る必要がなくて安価に提供できる等の多くの利点を有す
るもので、従来のこの種研摩方法および研摩装置の問題
点を全て解決でき、業界の発展に寄与するところ極めて
大きいものがある。Moreover, since the polishing surface is corrected by electrolytic polishing using a correction electrode body, there is no need to replace the correction tool each time depending on the accuracy of the grindstone used, as in the past, and only one type of correction electrode body is required. In addition, a repairing tool for fine-grained grindstones is difficult and expensive to manufacture, whereas a repairing electrode body can be freely selected and easily manufactured. In addition, since the correction electrode body rotates, the electrolytic effect on the polished surface is uniformly distributed over the entire surface, and a uniform correction effect can be obtained.
The degree of correction can be easily controlled by adjusting set values such as voltage and current values, making it extremely convenient to use. Since the repair method is based on electrolytic polishing, the abrasive grain protrusion effect on the polished surface is good, the protrusion amount of the micro abrasive grains can be easily adjusted, and the removal effect of grinding debris is also good, and the repair electrode body wears out. Compared to the truing wheel, there is no need to replace it as frequently as in the case of conventional grinding wheels.Furthermore, the correction electrode body can be adjusted to be horizontal with respect to the polishing surface, so it can always be positioned facing the polishing surface in the best possible condition. In addition, the polished surface can be precisely corrected into the desired shape. In addition, as mentioned above, since the polishing surface correction device is built into the same machine as the polishing disk, etc., the design is compact and corrections can be made at any time, so there is no need for the device itself to have high precision specifications. It has many advantages such as being able to be provided at a low cost, and it can solve all of the problems of conventional polishing methods and devices of this type, making it an extremely significant contribution to the development of the industry.
第１図は本発明装置の実施例を示す正面図、第２図は同
じく一部切欠側面図、第３図は同じく一部切欠平面図、
第４図は本発明装置における研摩面修正装置の一部切欠
側面図である。
（１）二機台、（３）：研摩ディスク、（６）：研摩面
、（１０）： ワーク保持装置、（１２） ：研摩面修
正装置、（１６）：修正用電極体、＜３４） ：電源装
置、（３７）：ノズル。FIG. 1 is a front view showing an embodiment of the device of the present invention, FIG. 2 is a partially cutaway side view, and FIG. 3 is a partially cutaway plan view.
FIG. 4 is a partially cutaway side view of the polishing surface correction device in the apparatus of the present invention. (1) Two machines, (3): Polishing disk, (6): Polishing surface, (10): Work holding device, (12): Polishing surface correction device, (16): Correction electrode body, <34) : Power supply device, (37): Nozzle.
Claims (1)
加圧しながらワークの表面を仕上加工する固定砥粒ラッ
ピング式の研摩方法において、前記砥石として上面をメ
タルボンド固定砥粒による研摩面とした研摩ディスクを
用い且つ前記研摩ディスクの一側上面に回転自在な研摩
面の修正用電極体を対向させて回転する該研摩ディスク
と修正用電極体を電源装置の陽極と陰極に接続させなが
ら導電性液体を前記研摩ディスクと修正用電極体との間
に供給してその間に生ずる電解作用により研摩ディスク
の研摩面の修正を行うことを特徴とする研摩方法。 ２、上面をメタルボンド固定砥粒による研摩面（６）と
した水平回転自在な研摩ディスク（３）と、該研摩ディ
スク（３）の研摩面（６）にワークを押し付けるワーク
保持装置（１０）と、前記研摩ディスク（３）の研摩面
修正を行う研摩面修正装置（１２）とが同一の機台（１
）に組み込まれており、該研摩面修正装置（１２）は研
摩ディスク（３）の一側上面に対向させた回転自在な修
正用電極体（１６）と、該修正用電極体（１６）と前記
研摩ディスク（３）を回転可能に陽極と陰極に接続させ
る電源装置（３４）と、研摩ディスク（３）と修正用電
極体（１６）間に導電性液体を供給するノズル（３７）
とよりなることを特徴とする研摩装置。[Scope of Claims] 1. In a fixed abrasive lapping polishing method in which a workpiece is placed on the upper surface of a horizontally rotating disc-shaped grindstone and the surface of the workpiece is finished while being pressurized, the upper surface of the grindstone is fixed with a metal bond. A polishing disk having a polished surface with abrasive grains is used, and a rotatable polishing surface repairing electrode body is opposed to the top surface of one side of the polishing disk, and the rotating polishing disk and the repairing electrode body are used as an anode of a power supply device. A polishing method characterized in that a conductive liquid is supplied between the polishing disk and the correction electrode body while being connected to a cathode, and the polished surface of the polishing disk is corrected by the electrolytic action generated therebetween. 2. A horizontally rotatable polishing disk (3) whose upper surface is a polishing surface (6) made of metal bonded abrasive grains, and a workpiece holding device (10) that presses a workpiece against the polishing surface (6) of the polishing disk (3). and the polishing surface correction device (12) for modifying the polishing surface of the polishing disk (3) are installed on the same machine (1).
), and the polishing surface modification device (12) includes a rotatable modification electrode body (16) facing the upper surface of one side of the polishing disk (3); a power supply (34) for rotatably connecting the abrasive disk (3) to an anode and a cathode; and a nozzle (37) for supplying a conductive liquid between the abrasive disk (3) and the correction electrode body (16).
A polishing device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63239951A JPH0288171A (en) | 1988-09-26 | 1988-09-26 | Method and device for polishing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63239951A JPH0288171A (en) | 1988-09-26 | 1988-09-26 | Method and device for polishing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0288171A true JPH0288171A (en) | 1990-03-28 |
Family
ID=17052252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63239951A Pending JPH0288171A (en) | 1988-09-26 | 1988-09-26 | Method and device for polishing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0288171A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6176259A (en) * | 1984-09-20 | 1986-04-18 | Toshiba Corp | Polishing method |
| JPS62114876A (en) * | 1985-11-09 | 1987-05-26 | Mitsubishi Heavy Ind Ltd | Dressing method for metal bond grindstone |
-
1988
- 1988-09-26 JP JP63239951A patent/JPH0288171A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6176259A (en) * | 1984-09-20 | 1986-04-18 | Toshiba Corp | Polishing method |
| JPS62114876A (en) * | 1985-11-09 | 1987-05-26 | Mitsubishi Heavy Ind Ltd | Dressing method for metal bond grindstone |
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