JP4420490B2 - ELID surface grinder electrode support apparatus and method - Google Patents

ELID surface grinder electrode support apparatus and method Download PDF

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Publication number
JP4420490B2
JP4420490B2 JP13548299A JP13548299A JP4420490B2 JP 4420490 B2 JP4420490 B2 JP 4420490B2 JP 13548299 A JP13548299 A JP 13548299A JP 13548299 A JP13548299 A JP 13548299A JP 4420490 B2 JP4420490 B2 JP 4420490B2
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electrode
grindstone
gap
electrolyte
elid
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JP2000326206A (en
Inventor
整 大森
伸英 伊藤
晋 清水
紳司 石井
学 山田
清 今井
甲子雄 小嶋
芳次 柿崎
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RIKEN Institute of Physical and Chemical Research
MTEX Matsumura Corp
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RIKEN Institute of Physical and Chemical Research
MTEX Matsumura Corp
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【0001】
【発明の属する技術分野】
本発明は、電解ドレッシングしながらワークを研削するELID平面研削盤の電極支持装置とその方法に関する。
【0002】
【従来の技術】
高精度の磁気ディスク基板を加工するために、従来は主として平面ラップ盤が用いられていた。この平面ラップ盤は、両面同時ラッピング方式のラップ盤であり、ワークを取り付ける取付具の周囲に例えば歯車が切ってあり、中央及び周辺の歯車と噛み合って取付具が自転しながら回転し、上方のシリンダによる圧力をかけ、ラップ(又はラップ盤)と称する工具とワークとの間に遊離研磨材を介在させ、ラップとワークとの相対運動によって加工するものである。
【0003】
しかし、上述した従来のラッピング装置(例えば平面ラップ盤)は、比較的簡単な設備により高い加工精度を得ることができる特徴を有するが、その反面、以下の問題点があった。
(1)遊離研磨材を用いた加工なため、加工速度が非常に遅く(研削加工の1/10以下)、加工に時間がかかる。そのため、通常は大型の設備を用い、複数の磁気ディスク基板を同時に加工しているが、それにもかかわらず1枚当たりの加工時間が長い。
(2)予め基準となるラップ盤を高精度に加工し、これに倣わせてワークを加工するため、ラップ盤自体が摩耗等により精度が低下すると、再度その加工が必要になる。この場合、通常は上下のラップ盤を擦り合わせる「擦合わせ調整」が行われるが、この手段により凹凸部は平坦になるが、回転軸に対する直角度は確保できず、加工後のワークの平行度が低下する。すなわち、定圧ラップ方式では、機上でツルーイング(擦合わせ調整)ができるが、砥石(ラップ盤)の平坦度が向上してもワーク保持治具と砥石との平行度が再調整できないためワーク両面の平行度(厚さ精度)はこの調整で向上させることができない。
【0004】
更に、近年、ハードディスクの破損、特にモータの破損が頻発している。この原因の1つは、磁気ディスク基板の厚さのアンバランスにある。すなわち磁気ディスク基板のアンバランスにより生じる偏心力により、モータの軸受寿命が低下し、短時間にモータが破損するという問題点があった。そのため、ハードディスクの信頼性を高めるために、従来以上に磁気ディスク基板の平行度(厚さ精度)を高めることが強く要望されている。しかし、上述した従来のラップ盤でこれを達成しようとすると、更に加工時間が長くなり、実用的でない問題点があった。
【0005】
上述した種々の問題点を解決するために、本発明の発明者等は、先に、「磁気ディスク基板の鏡面加工装置及び方法」(特願平10136198号、未公開)を創案し出願した。この発明は、図4に模式的に示すように、垂直な軸心Z1を中心に回転し水平な加工面2aを有するメタルボンド砥石2と、この加工面に対向する水平な支持面4aを有し垂直な軸心Z2を中心に回転するワーク保持回転手段4と、前記メタルボンド砥石を陽極とし、メタルボンド砥石の前記加工面に非接触で対設された電極6aを陰極とし、両極間にパルス状電圧を印加する電圧印加手段6と、前記メタルボンド砥石の加工面に導電性研削液を流す研削液供給手段8とを備え、ワーク保持回転手段4は、円板状の磁気ディスク基板1又は円板状のツルーイング砥石を支持面に密着して保持及び回転し、かつ水平及び垂直に移動可能に構成されており、これにより、(A)メタルボンド砥石の加工面2aを機上で平面加工し、次いで、メタルボンド砥石を電解ドレッシングしながら、同時に、(B)ワーク保持回転手段の支持面4aの研削加工と、(C)ワーク保持回転手段に取り付けた磁気ディスク基板1の研削加工とを、交互に機上で行うものである。なお、この図で3,5は駆動装置である。
【0006】
この装置及び方法により、従来のラッピング装置に比較して磁気ディスク基板の加工速度を大幅に高めることができ、かつ両面の平行度(厚さ精度)及び表面粗さを従来以上に高めることができるようになった。
【0007】
【発明が解決しようとする課題】
上述した鏡面加工装置において、電極6aは、砥石2の加工面2aに非接触で対設し、かつその間隙を例えば0.10.15mmの範囲で精密に設定する必要がある。そのため、従来は電極挟持装置により電極を水平に固定していた。しかし、砥石は、電解ドレッシングにより徐々に薄くなるため、隙間を随時再調整する必要があった。また、砥石磨耗時にシム等によって再調整が必要になるばかりでなく、砥石の交換や清掃、電極の取外し等の際にもその度、隙間の調整が必要であった。そのため、これらの作業に時間を要し全体の加工能率が低下する問題点があった。また、この調整に熟練を要するため、経験が不十分な場合に間隙の再現性が悪く、研削性能が悪化する問題点があった。
【0008】
本発明は、かかる問題点を解決するために創案されたものである。すなわち、本発明の目的は、熟練を要することなく、砥石の加工面との間隙を容易に調整することができ、かつ砥石の磨耗,交換,清掃時等にも、再調整の必要のないELID平面研削盤の電極支持装置とその方法を提供することにある。
【0009】
【課題を解決するための手段】
本発明によれば、垂直な軸心を中心に回転する導電性砥石(10)の水平な加工面(10a)に対向して電極(16a)を支持する電極支持装置であって、電極を上下動可能に支持する電極ガイド(18)と、電極と砥石の間に電解液を供給する電解液供給手段(20)と、前記電極(16a)の砥石側に取付けられ、電極と砥石の所望の間隙よりも薄い絶縁物質からなる接触防止材(17)と、前記加工面に電解液を流してハイドロプレーニングによる電極の浮き上がりにより電極と砥石の間隙を調整する手段とを備える、ことを特徴とするELID平面研削盤の電極支持装置が提供される。
【0010】
また、本発明によれば、垂直な軸心を中心に回転する導電性砥石(10)の水平な加工面(10a)に対向して電極(16a)を支持する電極支持方法であって、電極を上下動可能に支持し、前記電極(16a)の砥石側に電極と砥石の所望の間隙よりも薄い絶縁物質からなる接触防止材(17)を取付け、前記加工面に電解液を流してハイドロプレーニングにより電極を浮き上がらせ、その間に所定の間隙を形成する、ことを特徴とするELID平面研削盤の電極支持方法が提供される。
【0011】
上記本発明の装置及び方法によれば、電極ガイド(18)により電極を上下動可能に支持し、電解液供給手段(20)により電極と砥石の間に電解液を供給してハイドロプレーニングにより電極を浮き上がらせ、その間に所定の間隙を形成する。この間隙は、電解液の供給量にほぼ比例することから、この供給量を適切に保持することにより、間隙を維持することができる。従って熟練は不要であり、間隙を流量制御により容易に調整でき、かつ砥石の磨耗,交換,清掃時等にも、再調整が不要となる。
【0012】
また、この構成により、異常時(例えば砥石の異常停止時)に隙間が急減しても極間ショートを防止することかできる。
【0013】
また、前記電極と砥石の間隙を調整する手段は、電極と砥石の間隙を計測する隙間検知器(21)と、電解液の流量を制御する電解液流量制御弁(22)とを備え、隙間検知器で検知された間隙が所定の一定値を保持するように電解液の流量を制御することが好ましい。この構成により、間隙の自動調整が可能となる。
【0014】
更に、(A)電極と砥石の間に電解液を供給しハイドロプレーニングにより電極を浮き上がらせた後に、電極と砥石の間に電圧を印加し、(B)電解液の供給停止及び/又は砥石の回転停止の際に、前記電圧印加を中止する、ことが好ましい。この構成により、接触防止材なしでも、異常時(例えば砥石の異常停止時)の極間ショートを防止することができる。
【0015】
【発明の実施の形態】
以下、本発明の好ましい実施形態を図面を参照して説明する。なお、各図において共通の部材には同一の符号を付し重複した説明を省略する。
本発明の発明者等は、電解インプロセスドレッシング研削法(Electrolytic Inprocess Dressing:ELID研削法)と称する「導電性砥石の電解ドレッシング方法および装置」を創案した(特公平6075823号)。この方法及び装置は、導電性砥石に電圧を印加して、導電性砥石を電解でドレッシングすることにより、良好な鏡面並びに平滑平面を、高能率かつ高速で得られるようにしたものである。
このELID研削法は、電解ドレッシングにより砥石に目詰まりが生じないので、砥粒を細かくすれば鏡面のような極めて優れた加工面を研削加工で得ることができ、かつ遊離研磨材を使用するラッピング等と比較すると、数十倍の速度で鏡面を加工することができる。本発明は、かかるELID研削法を更に発展させ、高精度化したものである。
【0016】
図1は、本発明の電極支持装置を備えたELID平面研削装置の全体構成図である。このELID平面研削装置は、水平な加工面10aを有するメタルボンド砥石10、メタルボンド砥石10の加工面10aに対向する水平な支持面4aを有するワーク保持回転手段4、電圧印加手段16及び電解液供給手段20を備える。
【0017】
メタルボンド砥石10は、駆動装置3により、垂直な軸心Z1を中心に回転駆動される。このメタルボンド砥石10は、酸化セリウム砥粒もしくはCBN砥粒と、鋳鉄およびコバルトを成分とする結合部からなり、結合部を電解させて砥粒の目立てを行う「電解ドレッシング」ができるようになっている。
ワーク保持回転手段4も、別の駆動装置5により、メタルボンド砥石10の軸心Z1に対して高精度に平行に構成された垂直な軸心Z2を中心に回転駆動される。またワーク保持回転手段4は、円板状の部材、すなわち被加工物である磁気ディスク基板1、或いはこれと同様な形状のツルーイング砥石を支持面4aに密着して保持及び回転し、かつ水平及び垂直に移動可能に構成されている。このワーク保持回転手段4は、例えば、真空チャック装置又は機械式チャック装置であるのがよい。
【0018】
電圧印加手段16は、メタルボンド砥石10の加工面10aに非接触で対設された電極16a、電解ドレッシング用の電源(ELID電源16b)、メタルボンド砥石10に給電する給電体16c、及びこれらを電気的に接続する給電線16dからなり、メタルボンド砥石10を陽極とし、電極16aを陰極とし、両極間にパルス状電圧を印加するようになっている。
更に、研削液供給手段20は、研削液用のノズル20a、供給装置20b及びこれらを連通する配管20cからなり、メタルボンド砥石10の加工面10a、すなわち、加工面10aと電極16a、支持面4a、及び磁気ディスク基板1との間にそれぞれ導電性研削液を流すようになっている。
上述した構成により、メタルボンド砥石10の加工面10aを電解ドレッシングしながら、同時に、ワーク保持回転手段4の支持面4aの研削加工と、ワーク保持回転手段4に取り付けた磁気ディスク基板1の研削加工とを、交互に機上で行う、ことができる。
【0019】
図2は、図1のI矢視図であり、図3は、図2のIIII'線における断面図である。これらの図に示すように、本発明の電極支持装置は、電極16aを上下動可能に支持する電極ガイド18と、電極16aと砥石10の間に電解液を供給する前述した電解液供給手段20とからなる。電極ガイド18は、この例では、内端ガイド18aと外端ガイド18bとからなる。内端ガイド18aと外端ガイド18bは、電極16aの内端及び外端から十分な隙間を隔てた半径方向内面と、電極16aの周方向両端をわずかな隙間で案内する周方向案内面とを有している。この構成により、電極16aは周方向には移動せず、上下方向には自由に上下動することができる。なお、電極ガイドはこの構成に限定されず、電極16aを上下動可能に支持する範囲で、他の構造、例えば薄い平バネで電極を下方又は上方に付勢する構造を用いてもよい。
【0020】
更に、電極16aの砥石側(この例では下面)に、接触防止材17が貼付け等により取付けられている。この接触防止材17は、電極16aと砥石10の所望の間隙(例えば、0.10.15mm)よりも薄い絶縁物質からなる。この絶縁物質には、例えばセラミックス箔を用いることができる。
【0021】
図2に示すように、本発明の電極支持装置は更に、電極16aと砥石10の間隙を計測する隙間検知器21と、電解液の流量を制御する電解液流量制御弁22とを備え、隙間検知器21で検知された間隙が所定の一定値(例えば0.10.15mm)を保持するように電解液の流量を制御するようになっている。隙間検知器21には、例えば光反射式センサを用いることができる。
【0022】
上述した本発明の装置及び方法によれば、電極ガイド18により電極16aを上下動可能に支持し、電解液供給手段20により電極と砥石の間に電解液を供給してハイドロプレーニングにより電極16aを浮き上がらせ、その間に所定の間隙を形成する。この間隙は、電解液の供給量にほぼ比例することから、この供給量を適切に保持することにより、間隙を電極16aの全面にわたり一定に維持することができる。従って熟練は不要であり、間隙を流量制御により容易に調整でき、かつ砥石の磨耗,交換,清掃時等にも、再調整が不要となる。
【0023】
また、接触防止材17により、異常時(例えば砥石の異常停止時)に隙間が急減しても極間ショートを防止することかできる。
更に、隙間検知器21と電解液流量制御弁22を備えて電解液の流量を制御することにより、間隙の自動調整が可能となる。
【0024】
更に、上述したELID平面研削盤の電極支持装置を用いて、(A)電極と砥石の間に電解液を供給しハイドロプレーニングにより電極を浮き上がらせた後に、電極と砥石の間に電圧を印加し、(B)電解液の供給停止及び/又は砥石の回転停止の際に、前記電圧印加を中止することにより、接触防止材なしでも、異常時(例えば砥石の異常停止時)の極間ショートを防止することができる。
【0025】
【実施例】
図2に示した電極支持装置を用いて、ハイドロプレーニングによる電極の浮き上り量を実測した。砥石の回転速度を100rpm、電解液の供給量を約2リットル/分とし、砥石上面の電極より約10cm前の位置に、先端を細長くした1対のノズルを用いて、砥石面に電解液を平均に流した。この際に電解液の表面に波がほとんどできないように、調整した。
【0026】
実測したフローティング浮き量、すなわち電極と砥石の間隙は、光反射測定の結果、0.15mm~0.2mmの範囲で電極全面にわたり、安定に維持され、砥石の電解ドレッシングも良好に行うことができることが確認された。
【0027】
なお本発明は、上述した実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲で種々の変更が可能である。例えば、上述した実施形態では、ワークの片面を加工する場合について詳述したが、本発明はこれに限定されず、両面研削にも同様に適用することができる。
【0028】
【発明の効果】
上述したように、本発明のELID平面研削盤の電極支持装置とその方法は、熟練を要することなく、砥石の加工面との間隙を容易に調整することができ、かつ砥石の磨耗,交換,清掃時等にも、再調整が不要となる等の優れた効果を有する。
【図面の簡単な説明】
【図1】本発明の電極支持装置を備えたELID平面研削装置の全体構成図である。
【図2】図1のI矢視図である。
【図3】図2のIIII'線における断面図である。
【図4】先行出願にかかる未公開の鏡面加工装置の模式図である。
【符号の説明】
1 ワーク(磁気ディスク基板)
2 メタルボンド砥石
2a 加工面
3,5 駆動装置
4 ワーク保持回転手段
4a 支持面
6a 電極
6 電圧印加手段
8 研削液供給手段
10 導電性砥石
10a 加工面
16 電圧印加手段
16a 電極
16b 電源(ELID電源)
16c 給電体
17 接触防止材
18 電極ガイド
18a 内端ガイド
18b 外端ガイド
20 電解液供給手段
20a ノズル
20b 供給装置
20c 配管
21 隙間検知器
22 電解液流量制御弁
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electrode support apparatus and method for an ELID surface grinder that grinds a workpiece while performing electrolytic dressing.
[0002]
[Prior art]
Conventionally, a flat lapping machine has been mainly used to process a high-precision magnetic disk substrate. This flat lapping machine is a lapping machine of a double-sided simultaneous lapping system, for example, gears are cut around the fixture to which the workpiece is attached, meshed with the central and peripheral gears and rotated while the fixture rotates, Pressure is applied by a cylinder, and a free abrasive is interposed between a tool called a lapping (or lapping machine) and a workpiece, and machining is performed by relative movement between the lapping and the workpiece.
[0003]
However, the above-described conventional lapping apparatus (for example, a flat lapping machine) has a feature that high processing accuracy can be obtained with relatively simple equipment, but has the following problems.
(1) Since processing is performed using a free abrasive, the processing speed is very slow (1/10 or less of grinding), and processing takes time. For this reason, usually, a large facility is used to process a plurality of magnetic disk substrates at the same time, but the processing time per sheet is nevertheless long.
(2) Since the reference lapping machine is processed with high accuracy in advance and the workpiece is processed in accordance with this, if the accuracy of the lapping machine itself decreases due to wear or the like, the machining is required again. In this case, the “rubbing adjustment” is usually performed by rubbing the upper and lower lapping machines. However, this method makes the uneven part flat, but the perpendicularity to the rotation axis cannot be secured, and the parallelism of the workpiece after machining Decreases. In other words, with the constant pressure lap method, truing (rubbing adjustment) can be performed on the machine, but even if the flatness of the grindstone (lapping machine) is improved, the parallelism between the workpiece holding jig and the grindstone cannot be readjusted, so both sides of the workpiece The parallelism (thickness accuracy) cannot be improved by this adjustment.
[0004]
Furthermore, in recent years, hard disk damage, particularly motor damage, has frequently occurred. One cause of this is an unbalance in the thickness of the magnetic disk substrate. That is, the eccentric force generated by the unbalance of the magnetic disk substrate has a problem that the bearing life of the motor is reduced and the motor is damaged in a short time. Therefore, in order to increase the reliability of the hard disk, it is strongly desired to increase the parallelism (thickness accuracy) of the magnetic disk substrate more than before. However, when this is attempted to be achieved with the above-described conventional lapping machine, the processing time becomes longer and there is a problem that is not practical.
[0005]
In order to solve the various problems described above, inventors of the present invention, previously, "mirror finishing apparatus and method for magnetic disk substrates" - invented (Japanese Patent Application No. 10 136 198, unpublished) the applicant did. As schematically shown in FIG. 4, the present invention includes a metal bond grindstone 2 that rotates around a vertical axis Z1 and has a horizontal machining surface 2a, and a horizontal support surface 4a that faces the machining surface. The workpiece holding and rotating means 4 that rotates about the vertical axis Z2 and the metal bond grindstone as an anode, the electrode 6a that is non-contactingly facing the processed surface of the metal bond grindstone as a cathode, and between the two electrodes A voltage application means 6 for applying a pulsed voltage and a grinding liquid supply means 8 for supplying a conductive grinding liquid to the processed surface of the metal bond grindstone are provided. The work holding and rotating means 4 is a disc-shaped magnetic disk substrate 1. Alternatively, the disc-shaped truing grindstone is configured to be held and rotated in close contact with the support surface, and to be movable horizontally and vertically, whereby (A) the processing surface 2a of the metal bond grindstone is flat on the machine. Processed, then metal Simultaneously (B) grinding of the support surface 4a of the work holding and rotating means and (C) grinding of the magnetic disk substrate 1 attached to the work holding and rotating means while electrolytically dressing the grinding wheel. Is what you do. In this figure, reference numerals 3 and 5 denote driving devices.
[0006]
By this apparatus and method, the processing speed of the magnetic disk substrate can be greatly increased as compared with the conventional lapping apparatus, and the parallelism (thickness accuracy) and surface roughness of both surfaces can be increased more than before. It became so.
[0007]
[Problems to be solved by the invention]
In mirror-processing apparatus described above, the electrode 6a is against set in a non-contact on the processed surface 2a of the grinding wheel 2, and the gap for example 0.1 - must be set precisely within a range of 0.15 mm. Therefore, conventionally, the electrodes have been fixed horizontally by an electrode clamping device. However, since the grindstone gradually becomes thinner due to the electrolytic dressing, it was necessary to readjust the gap as needed. Further, not only re-adjustment with a shim or the like is required when the grindstone is worn, but also the gap needs to be adjusted each time when exchanging or cleaning the grindstone or removing the electrode. For this reason, there is a problem that these operations require time and the overall processing efficiency is lowered. Further, since this adjustment requires skill, there is a problem that the reproducibility of the gap is poor and the grinding performance is deteriorated when experience is insufficient.
[0008]
The present invention has been developed to solve such problems. That is, the object of the present invention is to make it possible to easily adjust the gap between the processing surface of the grindstone without requiring skill, and to eliminate the need for readjustment even when the grindstone is worn, replaced, or cleaned. An object of the present invention is to provide an electrode support apparatus and method for a surface grinder.
[0009]
[Means for Solving the Problems]
According to the present invention, there is provided an electrode support device for supporting an electrode (16a) opposite to a horizontal processing surface (10a) of a conductive grindstone (10) rotating about a vertical axis, wherein the electrode is moved up and down. An electrode guide (18) that is movably supported, an electrolytic solution supply means (20) that supplies an electrolytic solution between the electrode and the grindstone, and is mounted on the grindstone side of the electrode (16a). A contact prevention material (17) made of an insulating material thinner than the gap; and means for adjusting the gap between the electrode and the grindstone by flowing an electrolytic solution on the processed surface and lifting the electrode by hydroplaning. An electrode support device for an ELID surface grinder is provided.
[0010]
According to the present invention, there is also provided an electrode support method for supporting an electrode (16a) opposite to a horizontal processing surface (10a) of a conductive grindstone (10) rotating about a vertical axis, Is attached to the grindstone side of the electrode (16a), and a contact prevention material (17) made of an insulating material thinner than a desired gap between the electrode and the grindstone is attached to the electrode (16a). An electrode support method for an ELID surface grinder is provided, in which electrodes are lifted by planing and a predetermined gap is formed therebetween.
[0011]
According to the apparatus and method of the present invention, the electrode is supported by the electrode guide (18) so as to move up and down, and the electrolyte is supplied between the electrode and the grindstone by the electrolyte supply means (20), and the electrode is obtained by hydroplaning. And a predetermined gap is formed between them. Since this gap is substantially proportional to the supply amount of the electrolytic solution, the gap can be maintained by appropriately maintaining this supply amount. Therefore, no skill is required, the gap can be easily adjusted by controlling the flow rate, and readjustment is unnecessary even when the wheel is worn, replaced, or cleaned.
[0012]
Further, this configuration, the gap at the time of abnormality (e.g., abnormal stop of the grinding wheel) can either be prevented interpolar short even plummeted.
[0013]
The means for adjusting the gap between the electrode and the grindstone includes a gap detector (21) for measuring the gap between the electrode and the grindstone, and an electrolyte flow rate control valve (22) for controlling the flow rate of the electrolyte. It is preferable to control the flow rate of the electrolyte so that the gap detected by the detector maintains a predetermined constant value. With this configuration, the gap can be automatically adjusted.
[0014]
Further, (A) an electrolyte is supplied between the electrode and the grindstone, and the electrode is lifted by hydroplaning, and then a voltage is applied between the electrode and the grindstone. (B) supply of the electrolyte is stopped and / or It is preferable to stop the voltage application when the rotation is stopped. With this configuration, it is possible to prevent a short-circuit between the electrodes when there is an abnormality (for example, when the grindstone is abnormally stopped) without a contact prevention material.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. In addition, in each figure, the same code | symbol is attached | subjected to a common member and the overlapping description is abbreviate | omitted.
The inventors of the present invention, the electrolytic in-process dressing grinding method (Electrolytic Inprocess Dressing: ELID grinding method) referred to as "electrolytic dressing method and apparatus for conducting grindstone" was invented and (Kokoku 6 - No. 075823). In this method and apparatus, a voltage is applied to a conductive grindstone, and the conductive grindstone is dressed by electrolysis so that a good mirror surface and a smooth flat surface can be obtained at high efficiency and high speed.
This ELID grinding method does not cause clogging of the grindstone due to electrolytic dressing, so if the abrasive grains are made fine, an extremely excellent machining surface such as a mirror surface can be obtained by grinding and lapping using a free abrasive The mirror surface can be machined at a speed several tens of times higher than the above. The present invention is a further development of such an ELID grinding method to improve accuracy.
[0016]
FIG. 1 is an overall configuration diagram of an ELID surface grinding apparatus provided with an electrode support device of the present invention. The ELID surface grinding apparatus includes a metal bond grindstone 10 having a horizontal machining surface 10a, a work holding / rotating means 4 having a horizontal support surface 4a opposite to the machining surface 10a of the metal bond grindstone 10, a voltage applying means 16, and an electrolytic solution. Supply means 20 is provided.
[0017]
The metal bond grindstone 10 is driven to rotate about a vertical axis Z1 by the driving device 3. This metal bond grindstone 10 is composed of a cerium oxide abrasive grain or CBN abrasive grain and a joint part containing cast iron and cobalt as components, and an “electrolytic dressing” can be performed in which the joint part is electrolyzed to sharpen the abrasive grain. ing.
The work holding and rotating means 4 is also rotationally driven by another drive device 5 around a vertical axis Z2 that is configured in parallel with high accuracy to the axis Z1 of the metal bond grindstone 10. Further, the work holding and rotating means 4 holds and rotates a disk-shaped member, that is, a magnetic disk substrate 1 as a workpiece, or a truing grindstone having a shape similar to this, in close contact with the support surface 4a. It is configured to be movable vertically. The work holding / rotating means 4 may be, for example, a vacuum chuck device or a mechanical chuck device.
[0018]
The voltage application means 16 includes an electrode 16a that is not contacted with the processing surface 10a of the metal bond grindstone 10, a power supply for electrolytic dressing (ELID power supply 16b), a power supply body 16c that feeds the metal bond grindstone 10, and these. The power supply line 16d is electrically connected. The metal bond grindstone 10 is used as an anode, the electrode 16a is used as a cathode, and a pulse voltage is applied between both electrodes.
Further, the grinding fluid supply means 20 comprises a nozzle 20a for grinding fluid, a supply device 20b, and a pipe 20c that communicates these, and the processing surface 10a of the metal bond grindstone 10, that is, the processing surface 10a, the electrode 16a, and the support surface 4a. In addition, a conductive grinding fluid is allowed to flow between the magnetic disk substrate 1 and the magnetic disk substrate 1.
With the above-described configuration, the processing surface 10a of the metal bond grindstone 10 is electrolytically dressed, and at the same time, the support surface 4a of the work holding and rotating means 4 is ground and the magnetic disk substrate 1 attached to the work holding and rotating means 4 is ground. Can be alternately performed on the machine.
[0019]
2 is a view taken in the direction of arrow I in FIG. 1, and FIG. 3 is a cross-sectional view taken along the line II - II ′ in FIG. As shown in these drawings, the electrode support device of the present invention includes an electrode guide 18 that supports the electrode 16a so as to be movable up and down, and the above-described electrolyte supply means 20 that supplies the electrolyte between the electrode 16a and the grindstone 10. It consists of. In this example, the electrode guide 18 includes an inner end guide 18a and an outer end guide 18b. The inner end guide 18a and the outer end guide 18b have a radial inner surface that is sufficiently spaced from the inner and outer ends of the electrode 16a, and a circumferential guide surface that guides both ends in the circumferential direction of the electrode 16a with a slight gap. Have. With this configuration, the electrode 16a does not move in the circumferential direction and can freely move up and down in the vertical direction. The electrode guide is not limited to this configuration, and another structure, for example, a structure that urges the electrode downward or upward with a thin flat spring may be used as long as the electrode 16a is supported so as to be movable up and down.
[0020]
Furthermore, the contact preventing material 17 is attached to the grindstone side (the lower surface in this example) of the electrode 16a by pasting or the like. The contact prevention member 17 is desired gap electrode 16a and the grinding wheel 10 (e.g., 0.1 - 0.15 mm) made of a thin insulating material than. As this insulating material, for example, a ceramic foil can be used.
[0021]
As shown in FIG. 2, the electrode support apparatus of the present invention further includes a gap detector 21 that measures the gap between the electrode 16a and the grindstone 10, and an electrolyte flow rate control valve 22 that controls the flow rate of the electrolyte, detected by the detector 21 gaps predetermined constant value (e.g., 0.1 - 0.15 mm) so as to control the flow rate of the electrolyte to hold. As the gap detector 21, for example, a light reflection sensor can be used.
[0022]
According to the apparatus and method of the present invention described above, the electrode 16a is supported by the electrode guide 18 so as to be movable up and down, the electrolyte solution is supplied between the electrode and the grindstone by the electrolyte solution supply means 20, and the electrode 16a is formed by hydroplaning. It floats and a predetermined gap is formed between them. Since this gap is substantially proportional to the supply amount of the electrolytic solution, the gap can be kept constant over the entire surface of the electrode 16a by appropriately maintaining this supply amount. Therefore, no skill is required, the gap can be easily adjusted by controlling the flow rate, and readjustment is unnecessary even when the wheel is worn, replaced, or cleaned.
[0023]
Further, the contact prevention material 17 can prevent a short circuit between the electrodes even when the gap is suddenly reduced in an abnormal state (for example, when the grindstone is abnormally stopped).
Furthermore, the gap can be automatically adjusted by providing the gap detector 21 and the electrolyte flow rate control valve 22 to control the flow rate of the electrolyte.
[0024]
Further, using the electrode support device of the ELID surface grinding machine described above, (A) after supplying the electrolyte between the electrode and the grindstone and lifting the electrode by hydroplaning, a voltage is applied between the electrode and the grindstone. (B) When the supply of the electrolyte solution is stopped and / or the rotation of the grindstone is stopped, the voltage application is stopped, so that even when there is no contact preventive material, a short-circuit between the electrodes can be performed at the time of abnormality (for example, when the grindstone is abnormally stopped). Can be prevented.
[0025]
【Example】
Using the electrode support device shown in FIG. 2, the amount of lift of the electrode by hydroplaning was measured. Using a pair of nozzles with elongated tips at a position approximately 10 cm ahead of the electrode on the upper surface of the grinding wheel, the electrolytic solution is applied to the grinding wheel surface at a rotation speed of the grinding wheel of 100 rpm and an electrolyte supply amount of about 2 liters / minute. Flowed to the average. At this time, adjustment was made so that almost no wave was generated on the surface of the electrolytic solution.
[0026]
The measured floating float, that is, the gap between the electrode and the grindstone, was confirmed to be stable over the entire surface of the electrode in the range of 0.15 mm to 0.2 mm as a result of light reflection measurement, and it was confirmed that the electrolytic dressing of the grindstone could be performed well. It was done.
[0027]
The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention. For example, in the above-described embodiment, the case where one side of the workpiece is machined has been described in detail. However, the present invention is not limited to this and can be similarly applied to double-side grinding.
[0028]
【The invention's effect】
As described above, the ELID surface grinder electrode support apparatus and method of the present invention can easily adjust the gap between the grindstone processing surface without requiring skill, and the grindstone can be worn and replaced. Even when cleaning, etc., it has an excellent effect that readjustment is unnecessary.
[Brief description of the drawings]
FIG. 1 is an overall configuration diagram of an ELID surface grinding apparatus provided with an electrode support device of the present invention.
FIG. 2 is a view taken in the direction of arrow I in FIG.
3 is a cross-sectional view taken along the line II - II ′ of FIG.
FIG. 4 is a schematic diagram of an unpublished mirror surface processing apparatus according to a prior application.
[Explanation of symbols]
1 Workpiece (magnetic disk substrate)
2 Metal bond grindstone 2a Work surface 3, 5 Drive device 4 Work holding rotation means 4a Support surface 6a Electrode 6 Voltage application means 8 Grinding fluid supply means 10 Conductive grindstone 10a Work surface 16 Voltage application means 16a Electrode 16b Power supply (ELID power supply)
16c Feeder 17 Contact prevention material 18 Electrode guide 18a Inner end guide 18b Outer end guide 20 Electrolyte supply means 20a Nozzle 20b Supply device 20c Pipe 21 Gap detector 22 Electrolyte flow control valve

Claims (4)

垂直な軸心を中心に回転する導電性砥石(10)の水平な加工面(10a)に対向して電極(16a)を支持する電極支持装置であって、電極を上下動可能に支持する電極ガイド(18)と、電極と砥石の間に電解液を供給する電解液供給手段(20)と、前記電極(16a)の砥石側に取付けられ、電極と砥石の所望の間隙よりも薄い絶縁物質からなる接触防止材(17)と、前記加工面に電解液を流してハイドロプレーニングによる電極の浮き上がりにより電極と砥石の間隙を調整する手段とを備える、ことを特徴とするELID平面研削盤の電極支持装置。An electrode support device that supports an electrode (16a) opposite to a horizontal processing surface (10a) of a conductive grindstone (10) that rotates about a vertical axis, and that supports the electrode so as to move up and down A guide (18), an electrolyte supply means (20) for supplying an electrolyte between the electrode and the grindstone, and an insulating material attached to the grindstone side of the electrode (16a) and thinner than a desired gap between the electrode and the grindstone An electrode for an ELID surface grinder , comprising: a contact prevention material (17) comprising: means for adjusting the gap between the electrode and the grindstone by flowing an electrolytic solution over the processed surface and lifting the electrode by hydroplaning Support device. 前記電極と砥石の間隙を調整する手段は、電極と砥石の間隙を計測する隙間検知器(21)と、電解液の流量を制御する電解液流量制御弁(22)とを備え、隙間検知器で検知された間隙が所定の一定値を保持するように電解液の流量を制御する、ことを特徴とする請求項に記載のELID平面研削盤の電極支持装置。The means for adjusting the gap between the electrode and the grindstone includes a gap detector (21) for measuring the gap between the electrode and the grindstone, and an electrolyte flow rate control valve (22) for controlling the flow rate of the electrolyte, and the gap detector in the sensed gap to control the flow rate of the electrolyte to maintain a predetermined constant value, it ELID surface grinder of the electrode support device according to claim 1, wherein the. 垂直な軸心を中心に回転する導電性砥石(10)の水平な加工面(10a)に対向して電極(16a)を支持する電極支持方法であって、電極を上下動可能に支持し、前記電極(16a)の砥石側に電極と砥石の所望の間隙よりも薄い絶縁物質からなる接触防止材(17)を取付け、前記加工面に電解液を流してハイドロプレーニングにより電極を浮き上がらせ、その間に所定の間隙を形成する、ことを特徴とするELID平面研削盤の電極支持方法。An electrode support method for supporting an electrode (16a) facing a horizontal processing surface (10a) of a conductive grindstone (10) rotating about a vertical axis, the electrode being supported so as to be movable up and down, A contact prevention material (17) made of an insulating material thinner than a desired gap between the electrode and the grindstone is attached to the grindstone side of the electrode (16a), and the electrode is floated by hydroplaning by flowing an electrolyte on the processed surface. An electrode support method for an ELID surface grinder, wherein a predetermined gap is formed in the ELID surface grinder. (A)電極と砥石の間に電解液を供給しハイドロプレーニングにより電極を浮き上がらせた後に、電極と砥石の間に電圧を印加し、(B)電解液の供給停止及び/又は砥石の回転停止の際に、前記電圧印加を中止する、ことを特徴とする請求項に記載のELID平面研削盤の電極支持方法。(A) After supplying an electrolyte between the electrode and the grindstone and lifting the electrode by hydroplaning, a voltage is applied between the electrode and the grindstone, and (B) supply of the electrolyte is stopped and / or rotation of the grindstone is stopped. 4. The electrode support method for an ELID surface grinder according to claim 3 , wherein the voltage application is stopped at the time.
JP13548299A 1999-05-17 1999-05-17 ELID surface grinder electrode support apparatus and method Expired - Fee Related JP4420490B2 (en)

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