JPH0648953Y2 - シ−ルド付フレキシブル配線板 - Google Patents
シ−ルド付フレキシブル配線板Info
- Publication number
- JPH0648953Y2 JPH0648953Y2 JP1986143005U JP14300586U JPH0648953Y2 JP H0648953 Y2 JPH0648953 Y2 JP H0648953Y2 JP 1986143005 U JP1986143005 U JP 1986143005U JP 14300586 U JP14300586 U JP 14300586U JP H0648953 Y2 JPH0648953 Y2 JP H0648953Y2
- Authority
- JP
- Japan
- Prior art keywords
- shield layer
- shield
- circuit
- signal circuit
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010410 layer Substances 0.000 description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 230000000694 effects Effects 0.000 description 14
- 239000011889 copper foil Substances 0.000 description 13
- 239000010408 film Substances 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000012787 coverlay film Substances 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 5
- 229920006332 epoxy adhesive Polymers 0.000 description 4
- 239000011295 pitch Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000003522 acrylic cement Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002165 photosensitisation Effects 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986143005U JPH0648953Y2 (ja) | 1986-09-18 | 1986-09-18 | シ−ルド付フレキシブル配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986143005U JPH0648953Y2 (ja) | 1986-09-18 | 1986-09-18 | シ−ルド付フレキシブル配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6349298U JPS6349298U (enrdf_load_stackoverflow) | 1988-04-04 |
| JPH0648953Y2 true JPH0648953Y2 (ja) | 1994-12-12 |
Family
ID=31052281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986143005U Expired - Lifetime JPH0648953Y2 (ja) | 1986-09-18 | 1986-09-18 | シ−ルド付フレキシブル配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648953Y2 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0820558B2 (ja) * | 1989-04-14 | 1996-03-04 | 株式会社東芝 | 廃液貯留装置 |
| KR101340296B1 (ko) * | 2007-02-02 | 2013-12-11 | 삼성디스플레이 주식회사 | 연성회로필름 및 이를 갖는 표시 장치 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53127167U (enrdf_load_stackoverflow) * | 1977-03-17 | 1978-10-09 | ||
| JPS59121855U (ja) * | 1983-02-02 | 1984-08-16 | 松下電器産業株式会社 | 可撓性プリント配線基板 |
| JPS60121698U (ja) * | 1984-01-26 | 1985-08-16 | 昭和アルミニウム株式会社 | 電磁遮蔽材 |
-
1986
- 1986-09-18 JP JP1986143005U patent/JPH0648953Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6349298U (enrdf_load_stackoverflow) | 1988-04-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5976391A (en) | Continuous Flexible chemically-milled circuit assembly with multiple conductor layers and method of making same | |
| JPH09289378A (ja) | プリント配線板及びその製造方法 | |
| JPS63211692A (ja) | 両面配線基板 | |
| JPS59167096A (ja) | 回路基板 | |
| US4479991A (en) | Plastic coated laminate | |
| JPH0648953Y2 (ja) | シ−ルド付フレキシブル配線板 | |
| JP3226959B2 (ja) | 多層フレキシブルプリント基板の製法 | |
| JPH07122882A (ja) | シールドフレキシブルプリント配線板 | |
| JPH05191056A (ja) | プリント配線基板 | |
| JPH1168313A (ja) | プリント配線基板 | |
| JP3191517B2 (ja) | フレキシブル印刷配線板のシールド装置 | |
| JP2889471B2 (ja) | フレキシブルプリント基板 | |
| JPH0442960Y2 (enrdf_load_stackoverflow) | ||
| JP2002124415A (ja) | 高周波用基板及びその製造方法 | |
| JPS6255991A (ja) | シ−ルド付可撓性プリント回路基板 | |
| JPH07212043A (ja) | プリント配線基板およびマルチワイヤー配線基板 | |
| CN214315728U (zh) | 一种新结构天线内部pcb板 | |
| CN217116493U (zh) | 一种柔性电路板、显示模组及电子设备 | |
| JPS63137498A (ja) | スル−ホ−ルプリント板の製法 | |
| JPS6214717Y2 (enrdf_load_stackoverflow) | ||
| JP3512279B2 (ja) | クロストーク防止用プリント配線基板とその基板を用いた回路ユニット | |
| JP2003017618A (ja) | 配線基板およびこれを用いた半導体装置 | |
| JPH04139799A (ja) | シールド型可撓性回路基板及びその製造法 | |
| JP3208178B2 (ja) | リジッドフレックスプリント配線板 | |
| JPS63153894A (ja) | 多層プリント配線板 |