JPH0648884Y2 - 半導体装置の封止構造 - Google Patents

半導体装置の封止構造

Info

Publication number
JPH0648884Y2
JPH0648884Y2 JP1987071846U JP7184687U JPH0648884Y2 JP H0648884 Y2 JPH0648884 Y2 JP H0648884Y2 JP 1987071846 U JP1987071846 U JP 1987071846U JP 7184687 U JP7184687 U JP 7184687U JP H0648884 Y2 JPH0648884 Y2 JP H0648884Y2
Authority
JP
Japan
Prior art keywords
semiconductor device
semiconductor element
moisture
prism
sealing structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987071846U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63180953U (enExample
Inventor
修 松田
和徳 槻木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP1987071846U priority Critical patent/JPH0648884Y2/ja
Publication of JPS63180953U publication Critical patent/JPS63180953U/ja
Application granted granted Critical
Publication of JPH0648884Y2 publication Critical patent/JPH0648884Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
JP1987071846U 1987-05-14 1987-05-14 半導体装置の封止構造 Expired - Lifetime JPH0648884Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987071846U JPH0648884Y2 (ja) 1987-05-14 1987-05-14 半導体装置の封止構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987071846U JPH0648884Y2 (ja) 1987-05-14 1987-05-14 半導体装置の封止構造

Publications (2)

Publication Number Publication Date
JPS63180953U JPS63180953U (enExample) 1988-11-22
JPH0648884Y2 true JPH0648884Y2 (ja) 1994-12-12

Family

ID=30914769

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987071846U Expired - Lifetime JPH0648884Y2 (ja) 1987-05-14 1987-05-14 半導体装置の封止構造

Country Status (1)

Country Link
JP (1) JPH0648884Y2 (enExample)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57121285A (en) * 1981-01-20 1982-07-28 Fujitsu General Ltd Light coupling device

Also Published As

Publication number Publication date
JPS63180953U (enExample) 1988-11-22

Similar Documents

Publication Publication Date Title
US5852320A (en) Semiconductor sensor with protective cap covering exposed conductive through-holes
US11855035B2 (en) Stack of electrical components and method of producing the same
JPH0648884Y2 (ja) 半導体装置の封止構造
JPH01161736A (ja) 半導体装置用パッケージ
JP2511148Y2 (ja) 光結合素子
JPS62195Y2 (enExample)
JPS63147339A (ja) 半導体装置
JPS6020956Y2 (ja) 半導体受光素子
KR0167285B1 (ko) 비엘피 패키지
JPH065928A (ja) 樹脂封止型電子部品
JPH0444171U (enExample)
JPS62219541A (ja) 半導体装置
JPH0546980B2 (enExample)
JPS60262434A (ja) 半導体装置
JPS59155151A (ja) 樹脂封止半導体装置
JPH0732224B2 (ja) 半導体装置
JPH08306744A (ja) 電子部品
JPS63217646A (ja) プラスチツクパツケ−ジ部品
JPH083013Y2 (ja) 固体撮像装置
JPS6133644Y2 (enExample)
JPS6232636A (ja) 半導体装置
JPH0823007A (ja) 半導体集積回路装置および半導体集積回路装置の製造方法
JPS636742U (enExample)
JPS63114238A (ja) 半導体パツケ−ジ
JPH06283645A (ja) 半導体装置