JPH0648869Y2 - 冷却構造 - Google Patents

冷却構造

Info

Publication number
JPH0648869Y2
JPH0648869Y2 JP1989135400U JP13540089U JPH0648869Y2 JP H0648869 Y2 JPH0648869 Y2 JP H0648869Y2 JP 1989135400 U JP1989135400 U JP 1989135400U JP 13540089 U JP13540089 U JP 13540089U JP H0648869 Y2 JPH0648869 Y2 JP H0648869Y2
Authority
JP
Japan
Prior art keywords
cooling
integrated circuit
heat
circuit element
heat conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1989135400U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0375543U (enExample
Inventor
俊一 菊池
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1989135400U priority Critical patent/JPH0648869Y2/ja
Publication of JPH0375543U publication Critical patent/JPH0375543U/ja
Application granted granted Critical
Publication of JPH0648869Y2 publication Critical patent/JPH0648869Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/877Bump connectors and die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1989135400U 1989-11-24 1989-11-24 冷却構造 Expired - Fee Related JPH0648869Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989135400U JPH0648869Y2 (ja) 1989-11-24 1989-11-24 冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989135400U JPH0648869Y2 (ja) 1989-11-24 1989-11-24 冷却構造

Publications (2)

Publication Number Publication Date
JPH0375543U JPH0375543U (enExample) 1991-07-29
JPH0648869Y2 true JPH0648869Y2 (ja) 1994-12-12

Family

ID=31682670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989135400U Expired - Fee Related JPH0648869Y2 (ja) 1989-11-24 1989-11-24 冷却構造

Country Status (1)

Country Link
JP (1) JPH0648869Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2640640T3 (es) * 2011-11-14 2017-11-03 Cressall Resistors Limited Dispositivo de resistencia refrigerado por líquido

Also Published As

Publication number Publication date
JPH0375543U (enExample) 1991-07-29

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees