JPH0648869Y2 - 冷却構造 - Google Patents
冷却構造Info
- Publication number
- JPH0648869Y2 JPH0648869Y2 JP1989135400U JP13540089U JPH0648869Y2 JP H0648869 Y2 JPH0648869 Y2 JP H0648869Y2 JP 1989135400 U JP1989135400 U JP 1989135400U JP 13540089 U JP13540089 U JP 13540089U JP H0648869 Y2 JPH0648869 Y2 JP H0648869Y2
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- integrated circuit
- heat
- circuit element
- heat conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/877—Bump connectors and die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989135400U JPH0648869Y2 (ja) | 1989-11-24 | 1989-11-24 | 冷却構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989135400U JPH0648869Y2 (ja) | 1989-11-24 | 1989-11-24 | 冷却構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0375543U JPH0375543U (enExample) | 1991-07-29 |
| JPH0648869Y2 true JPH0648869Y2 (ja) | 1994-12-12 |
Family
ID=31682670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989135400U Expired - Fee Related JPH0648869Y2 (ja) | 1989-11-24 | 1989-11-24 | 冷却構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648869Y2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2640640T3 (es) * | 2011-11-14 | 2017-11-03 | Cressall Resistors Limited | Dispositivo de resistencia refrigerado por líquido |
-
1989
- 1989-11-24 JP JP1989135400U patent/JPH0648869Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0375543U (enExample) | 1991-07-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |